Circuit board with high heat dissipation and low energy consumption

Abstract

The utility model relates to the technical field of circuit boards, and discloses a high-heat-dissipation low-energy-consumption circuit board which comprises a circuit board body, mounting holes are formed in the four corners of the upper surface of the circuit board body, a heat conduction plate is arranged on the upper surface of the circuit board body, and a heat dissipation plate is fixedly connected to the upper surface of the heat conduction plate. Flow guide plates are fixedly connected to the front end and the rear end of the heat dissipation plate, flow guide side plates are fixedly connected to the surfaces of the left side and the right side of the heat dissipation plate, pressing plates are arranged above the sides, away from the heat dissipation plate, of the flow guide plates, and the pressing plates are detachably connected with the circuit board body. According to the utility model, through the cooperation of the heat conduction plate, the heat dissipation plate, the flow guide plate, the flow guide side plate, the pressing plate, the bolts and the screw holes, the heat dissipation area of high-power-consumption elements on the circuit board main body can be increased, the heat dissipation efficiency can be improved, and when the elements on the circuit board need to be disassembled and replaced, the heat dissipation efficiency can be improved. And the heat dissipation plate, the flow guide plate and other structures can be disassembled by directly unscrewing the bolts.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a high heat dissipation and low energy consumption circuit board. Background Technology

[0002] The control circuit board for air conditioning is the core component of the air conditioning system. It is responsible for the control and coordination of the entire air conditioning system. It receives signals from the remote control and controls the operating status of the air conditioner according to these signals, such as turning it on and off, adjusting the temperature, and setting the fan speed. The microprocessor on the circuit board processes and sends out corresponding control signals to ensure that the air conditioner operates according to the user's needs. They ensure the normal operation and efficient operation of the equipment by providing current and voltage control.

[0003] A search revealed that Chinese Patent Publication No. CN219678783U discloses a high heat dissipation and low energy consumption circuit board, which includes a heat sink for dissipating heat from transformer components, thereby improving the overall heat dissipation performance and reducing energy consumption. The overall temperature is low, further reducing energy consumption. A riser is used to elevate the bottom of the circuit board, making it less likely to be blocked by other installed objects, thereby increasing the area on which heat is carried away by the flowing air and improving its heat dissipation performance.

[0004] In actual use, the heat sink structure of the aforementioned circuit board needs to be soldered to ensure its structural stability when hot. If any component on the circuit board is damaged and needs to be repaired or replaced, the heat sink must be desoldered before the damaged part can be repaired. After the repair is completed, the heat sink needs to be resoldered, which increases the difficulty of operation. Therefore, a high heat dissipation and low energy consumption circuit board is proposed to solve the above problems. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a high heat dissipation and low energy consumption circuit board, which aims to improve the problem in the prior art that the heat sink must be desoldered before the components on the circuit board can be repaired or replaced, which increases the difficulty of operation.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a high heat dissipation and low energy consumption circuit board, comprising a circuit board body, mounting holes at the four corners of the upper surface of the circuit board body, a heat-conducting plate on the upper surface of the circuit board body, a heat dissipation plate fixedly connected to the upper surface of the heat-conducting plate, guide plates fixedly connected to both the front and rear ends of the heat dissipation plate, guide side plates fixedly connected to both the left and right sides of the heat dissipation plate, a pressure plate disposed above the side of the guide plate away from the heat dissipation plate, the pressure plate being detachably connected to the circuit board body, and a guide unit disposed on the outer side of the pressure plate, the guide unit being used to guide the gas flow passing through the pressure plate.

[0007] As a further description of the above technical solution:

[0008] Bolts are provided above the pressure plate, and screw holes are provided on the upper surface of the circuit board body.

[0009] As a further description of the above technical solution:

[0010] The bottom end of the bolt passes through the pressure plate, and the bottom end of the bolt is connected to the internal thread of the bolt hole.

[0011] As a further description of the above technical solution:

[0012] The flow guiding unit includes a through groove, which is formed on the surface of the pressure plate near the heat sink. Both the upper and lower sides of the through groove near the heat sink are chamfered.

[0013] As a further description of the above technical solution:

[0014] The end of the guide plate away from the heat sink is inclined toward the upper surface of the circuit board body.

[0015] As a further description of the above technical solution:

[0016] The bottom surface of the heat-conducting plate is in contact with the upper surface of the circuit board body.

[0017] As a further description of the above technical solution:

[0018] The bottom surface of the pressure plate is in contact with the upper surface of the guide plate.

[0019] As a further description of the above technical solution:

[0020] The front and rear sides of the flow guide plate are fixedly connected to the outer wall of the flow guide plate.

[0021] This utility model has the following beneficial effects:

[0022] 1. In this utility model, the heat dissipation area of ​​high-power components on the circuit board body can be increased and the heat dissipation efficiency can be improved by cooperating with the heat conduction plate, heat dissipation plate, flow guide plate, flow guide side plate, pressure plate, bolts and screw holes. When it is necessary to disassemble and replace the components on the circuit board, the heat dissipation plate, flow guide plate and other structures can be disassembled by simply unscrewing the bolts. Compared with desoldering operation, it is simple and quick, and avoids the need to desolder the heat sink before maintenance.

[0023] 2. In this utility model, the combination of the through groove and the chamfer reduces the impact of the pressure plate wall thickness on the heat dissipation of the components on the circuit board body. When the circuit board is used with a fan, the airflow driven by the fan can be guided, so that the airflow can quickly carry away the heat on the guide plate and the heat sink, further improving the heat dissipation effect. It can provide the same heat dissipation efficiency for the circuit board body while reducing the fan energy consumption, thus reducing energy consumption. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall high heat dissipation and low energy consumption circuit board proposed in this utility model.

[0025] Figure 2 This is a schematic diagram of the main body of a high heat dissipation and low energy consumption circuit board according to the present invention.

[0026] Figure 3 This is a schematic diagram of a heat-conducting plate, a heat-dissipating plate, a flow-guiding plate, a flow-guiding side plate, and a pressure plate for a high heat dissipation and low energy consumption circuit board proposed in this utility model.

[0027] Figure 4 This is a schematic diagram of the pressure plate and bolts of a high heat dissipation and low energy consumption circuit board proposed in this utility model.

[0028] Legend:

[0029] 1. Circuit board body; 2. Mounting holes; 3. Heat-conducting plate; 4. Heat sink; 5. Flow guide plate; 6. Flow guide side plate; 7. Pressure plate; 8. Through groove; 9. Chamfer; 10. Bolt; 11. Screw hole. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Reference Figures 1-2This utility model provides an embodiment of a high heat dissipation and low energy consumption circuit board, including a circuit board body 1. Mounting holes 2 are provided at the four corners of the upper surface of the circuit board body 1, allowing screws to be used to fix the circuit board body 1. A number of heat-conducting plates 3 are arranged on the upper surface of the circuit board body 1 in a linear array and placed on the surfaces of high-power electronic components on the circuit board body 1. The bottom surface of the heat-conducting plates 3 is in contact with the upper surface of the circuit board body 1. A heat sink 4 is fixedly connected to the upper surface of the heat-conducting plates 3. The heat generated by the high-power components during operation can be transferred to the heat sink 4 through the heat-conducting plates 3, increasing the heat dissipation area and improving heat exchange efficiency, thus enhancing heat dissipation efficiency.

[0032] Reference Figures 1-3 The heat sink 4 has guide plates 5 fixedly connected to both the front and rear ends. The guide plates 5 can further increase the overall heat dissipation area and improve the heat dissipation efficiency. The end of the guide plate 5 away from the heat sink 4 is inclined towards the upper surface of the circuit board body 1. The left and right sides of the heat sink 4 are fixedly connected to guide side plates 6. The front and rear sides of the guide side plates 6 are fixedly connected to the outer wall of the guide plate 5. When the circuit board body 1 is used with a fan, the fan starts to exhaust heat at the front of the circuit board body 1. At this time, the airflow on the front and rear sides of the circuit board body 1 can flow towards the heat sink 4 along the inclined surface of the guide plate 5, and then flow towards the fan, so that the airflow can quickly carry away the heat on the guide plate 5 and the heat sink 4, further improving the heat dissipation effect. It can provide the same heat dissipation efficiency for the circuit board body 1 while reducing the energy consumption of the fan, thus reducing energy consumption. The guide side plates 6 can gather the airflow flowing through the guide plate 5 and the heat sink 4, so that the airflow flows as close as possible to the guide plate 5 and the heat sink 4.

[0033] A pressure plate 7 is provided above the side of the guide plate 5 away from the heat sink 4. The bottom surface of the pressure plate 7 is in contact with the upper surface of the guide plate 5. The pressure plate 7 is detachably connected to the circuit board body 1. When the pressure plate 7 is in contact with the guide plate 5 and the circuit board body 1 for detachable connection, the end of the guide plate 5 can be squeezed and clamped, so that the guide plate 5 and the heat sink 4 are placed stably. When it is necessary to replace or repair the components on the circuit board body 1, the pressure plate 7 can be removed directly to complete the disassembly of the guide plate 5, the heat sink 4 and the heat conduction plate 3. The operation is simple, no desoldering is required, and the operation difficulty is reduced.

[0034] A flow guiding unit is provided on the outer side of the pressure plate 7. The flow guiding unit includes a through groove 8. The through groove 8 is opened on the surface of the pressure plate 7 near the heat sink 4. Chamfers 9 are opened on both the upper and lower sides of the through groove 8 near the heat sink 4. When the fan starts and works with the circuit board body 1 to exhaust and dissipate heat, the air outside the circuit board body 1 can flow through the through groove 8 to the flow guiding plate 5. At the same time, the suction force generated by the fan can act on the air outside the circuit board body 1 along the inclined surface of the chamfer 9, reducing the impact of the wall thickness of the pressure plate 7 on the heat dissipation of the components on the circuit board body 1.

[0035] Reference Figures 2-4 A bolt 10 is provided above the pressure plate 7, and a screw hole 11 is provided on the upper surface of the circuit board body 1. The bottom end of the bolt 10 passes through the pressure plate 7 and is connected to the internal thread of the screw hole 11. The pressure plate 7 is fixed to the circuit board body 1 by the bolt 10 and the screw hole 11. When it is necessary to repair or replace the components on the surface of the circuit board body 1, the bolt 10 can be unscrewed to disassemble the heat sink 4, the guide plate 5 and other structures. Compared with desoldering, it is simple and quick.

[0036] Working principle: When the circuit board body 1 is running, the heat generated by the high-power components can be transferred to the heat sink 4 through the heat conduction plate 3, increasing the heat dissipation area and improving the heat dissipation efficiency. When the circuit board body 1 is used in conjunction with a fan, the fan starts to exhaust heat on the front side of the circuit board body 1. At this time, the airflow on the front and rear sides of the circuit board body 1 can flow through the channel 8 to the guide plate 5, and then flow towards the heat sink 4 along the inclined surface of the guide plate 5 and the convergence of the guide side plate 6, carrying away the heat on the guide plate 5 and the heat sink 4, further improving the heat dissipation effect. Finally, it flows towards the fan, which can provide the same heat dissipation efficiency for the circuit board body 1 while reducing the fan's energy consumption, thus reducing energy consumption.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high heat dissipation and low energy consumption circuit board, comprising a circuit board body (1), characterized in that: Mounting holes (2) are provided at the four corners of the upper surface of the circuit board body (1). A heat-conducting plate (3) is provided on the upper surface of the circuit board body (1). A heat sink (4) is fixedly connected to the upper surface of the heat-conducting plate (3). A flow guide plate (5) is fixedly connected to both the front and rear ends of the heat sink (4). A flow guide side plate (6) is fixedly connected to both the left and right sides of the heat sink (4). A pressure plate (7) is provided above the side of the flow guide plate (5) away from the heat sink (4). The pressure plate (7) is detachably connected to the circuit board body (1). A flow guide unit is provided on the outside of the pressure plate (7). The flow guide unit is used to guide the gas flow through the pressure plate (7).

2. The high heat dissipation and low power consumption circuit board according to claim 1, characterized in that: A bolt (10) is provided above the pressure plate (7), and a screw hole (11) is provided on the upper surface of the circuit board body (1).

3. The high heat dissipation and low power consumption circuit board according to claim 2, characterized in that: The bottom end of the bolt (10) passes through the pressure plate (7), and the bottom end of the bolt (10) is connected to the internal thread of the screw hole (11).

4. The high heat dissipation and low power consumption circuit board according to claim 1, characterized in that: The flow guiding unit includes a through groove (8), which is opened on the surface of the pressure plate (7) near the heat sink (4). The upper and lower sides of the through groove (8) near the heat sink (4) are chamfered (9).

5. The high heat dissipation and low power consumption circuit board according to claim 1, characterized in that: The end of the guide plate (5) away from the heat sink (4) is inclined toward the upper surface of the circuit board body (1).

6. The high heat dissipation and low power consumption circuit board according to claim 1, characterized in that: The bottom surface of the heat-conducting plate (3) is in contact with the upper surface of the circuit board body (1).

7. The high heat dissipation and low power consumption circuit board according to claim 1, characterized in that: The bottom surface of the pressure plate (7) is in contact with the upper surface of the guide plate (5).

8. A high heat dissipation, low power consumption circuit board according to claim 1, characterized in that: The front and rear sides of the flow guide plate (6) are fixedly connected to the outer wall of the flow guide plate (5).

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