PCB capable of resisting electromagnetic interference

By installing fins and S-shaped heat pipes on the electromagnetic shielding cover of the PCB circuit board, the problem of reduced heat dissipation caused by the electromagnetic shielding cover is solved, achieving efficient heat dissipation of the circuit board and extending its service life.

CN223872461UActive Publication Date: 2026-02-03SHENZHEN YILIANXIN ELECTRONICS CO LTD
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Patent Information

Application Number
CN202520056315.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-10
Publication Date
2026-02-03
Estimated Expiration
2035-01-10

AI Technical Summary

Technical Problem

When an electromagnetic shield is installed on a PCB circuit board, it reduces heat dissipation, causes heat to accumulate, and affects the lifespan of the circuit board.

Method used

Multiple fins and S-shaped heat dissipation pipes are installed on the top of the cover. The fins have internal grooves and heat dissipation holes. Combined with the copper fins and heat dissipation pipes, rapid heat dissipation is achieved.

Benefits of technology

The design of fins and heat pipes effectively improves the heat dissipation of the electromagnetic shield, avoids heat accumulation, and extends the service life of the circuit board.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223872461U_ABST
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Abstract

The utility model relates to the technical field of PCBs, and discloses a PCB capable of resisting electromagnetic interference, which comprises a board body and a cover body, the cover body is arranged at the top of the board body, a plurality of notches are uniformly arranged at the top of the cover body, a fin is fixedly arranged in each notch, a through hole is arranged on the side surface of one staggered end of each fin, and the through holes are communicated with the board body and the cover body. A radiating pipe is fixedly installed at the top of the cover body, the radiating pipe is distributed in an S shape, the radiating pipe sequentially penetrates through a through opening in one end of each fin, an inner groove is formed in each fin, an opening of the inner groove in each fin is located in the bottom of the fin, and a plurality of radiating openings communicated with the inner grooves are evenly formed in the two sides of each fin. The fins and the heat dissipation pipes are arranged at the top of the cover body, heat dissipation of the cover body can be accelerated, the inner grooves and the heat dissipation holes are formed in the fins, heat in the cover body can be dissipated, and therefore the situation that the temperature in the cover body is too high due to the fact that the heat cannot be discharged is avoided.
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Description

Technical Field

[0001] This utility model belongs to the field of PCB circuit board technology, specifically a PCB circuit board that can achieve electromagnetic interference resistance. Background Technology

[0002] Circuit boards are named as follows: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed circuit board (copper etching technology), etc. Circuit boards make circuits miniaturized and intuitive, playing an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. In order to protect circuit boards from electromagnetic interference, an electromagnetic shielding cover is usually installed on the circuit board. However, after the electromagnetic shielding cover is installed on the circuit board, it will greatly affect the heat dissipation effect of the circuit board, resulting in a significant reduction in the heat dissipation effect of the circuit board. A large amount of heat will accumulate inside the electromagnetic shielding cover, causing the temperature inside the electromagnetic shielding cover to be too high, which will reduce the service life of the circuit board. Therefore, this application proposes a PCB circuit board that can achieve electromagnetic interference resistance. Utility Model Content

[0003] To address the problems mentioned in the background art, this utility model provides the following technical solution: a PCB circuit board capable of resisting electromagnetic interference, comprising a board body and a cover body. The cover body is installed on the top of the board body, and multiple slots are evenly opened on the top of the cover body. A fin is fixedly installed in each slot, and an opening is opened on one side of each fin that is staggered with each other. A heat dissipation pipe is fixedly installed on the top of the cover body. The heat dissipation pipe is distributed in an S-shape, and the heat dissipation pipe passes through the opening at one end of each fin in sequence. An inner groove is opened inside each fin, and the opening of the inner groove in each fin is located at its bottom. Multiple heat dissipation ports communicating with the inner groove are evenly opened on both sides of each fin.

[0004] Furthermore, the opening at the bottom of the inner groove in each fin is connected to the cover.

[0005] Furthermore, fixing blocks are fixedly installed at the four corners of the top of the plate, and a screw groove is opened at the top of each fixing block. Fixing rods are fixedly installed at the four corners inside the cover, and a groove is opened at the bottom of each fixing rod. A screw hole communicating with the groove is opened at the top of each fixing rod. A bolt is inserted into each screw hole, and each bolt passes through the screw hole and is threaded into the screw groove at the top of the corresponding fixing block.

[0006] Furthermore, the height of the fixing rod is the same as the height of the cover, and the groove at the bottom of the fixing rod can be fitted onto the fixing block at the top of the plate.

[0007] Furthermore, both the fins and heat pipes are made of copper.

[0008] Furthermore, the bottom of the heat pipe is set as a flat surface, and the flat surface of the bottom of the heat pipe is fully fitted with the top of the cover.

[0009] Compared with the prior art, the beneficial effects of this utility model are:

[0010] By setting multiple fins and heat dissipation pipes on the top of the enclosure, the heat dissipation of the enclosure can be accelerated. Each fin is equipped with an inner groove and heat dissipation holes, which can allow the heat inside the enclosure to dissipate, thereby preventing the heat from being unable to escape and causing the internal temperature of the enclosure to become too high. Attached Figure Description

[0011] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0013] Figure 2 This is a schematic diagram of the structure of the cover and fins of this utility model;

[0014] Figure 3 This is a schematic diagram of the structure of the bottom of the cover of this utility model;

[0015] Figure 4 This is a schematic diagram of the structure of the plate body of this utility model;

[0016] Figure 5 This is a schematic diagram of the structure of the fixing rod of this utility model;

[0017] Figure 6 This is a schematic diagram of the structure of the cover of this utility model;

[0018] Figure 7 This is a cross-sectional structural diagram of the heat dissipation pipe of this utility model;

[0019] Figure 8 This is a cross-sectional structural diagram of the fin of this utility model;

[0020] In the diagram: 1. Plate; 2. Cover; 3. Fixing block; 4. Fixing rod; 5. Groove; 6. Screw hole; 7. Bolt; 8. Slot; 9. Fin; 10. Through; 11. Heat dissipation pipe; 12. Inner groove; 13. Heat dissipation vent. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0022] Depend on Figure 1-8 The present invention includes a plate 1 and a cover 2. The cover 2 is installed on the top of the plate 1. Multiple slots 8 are evenly opened on the top of the cover 2. A fin 9 is fixedly installed in each slot 8. A through-hole 10 is opened on one side of each fin 9 that is staggered with each other. A heat dissipation pipe 11 is fixedly installed on the top of the cover 2. The heat dissipation pipe 11 is distributed in an S-shape and passes through the through-hole 10 at one end of each fin 9. An inner groove 12 is opened inside each fin 9. The opening of the inner groove 12 in each fin 9 is located at its bottom. Multiple heat dissipation ports 13 communicating with the inner groove 12 are evenly opened on both sides of each fin 9. The heat dissipation pipe 11 and the fin 9 can achieve a good heat dissipation effect on the cover 2.

[0023] like Figure 2 and Figure 3 As shown, the opening at the bottom of the inner groove 12 in each fin 9 is connected to the cover 2, so that the heat inside the cover 2 can be discharged through the inner groove 12 and the heat dissipation vent 13 on the side.

[0024] like Figure 3 and Figure 4 As shown, fixing blocks 3 are fixedly installed at the four corners of the top of the plate 1. Each fixing block 3 has a screw groove on its top. Fixing rods 4 are fixedly installed at the four corners inside the cover 2. Each fixing rod 4 has a groove 5 at its bottom and a screw hole 6 communicating with the groove 5 at its top. Each screw hole 6 has a bolt 7 inserted into it. Each bolt 7 passes through the screw hole 6 and is threaded into the screw groove on the top of the corresponding fixing block 3. The fixing rod 4 and the fixing block 3 can be connected by the bolt 7, so that the cover 2 can be fixedly installed on the top of the plate 1.

[0025] like Figure 3 As shown, the height of the fixing rod 4 is the same as the height of the cover 2, and the groove 5 at the bottom of the fixing rod 4 can be fitted onto the fixing block 3 at the top of the plate 1. In this way, when the groove 5 at the bottom of the fixing rod 4 is fitted onto the fixing block 3, the bottom of the cover 2 can fit against the top of the plate 1, so the cover 2 can play a good anti-electromagnetic role at the top of the plate 1.

[0026] like Figure 1 and Figure 2As shown, both the fins 9 and the heat sink 11 are made of copper. Copper has good thermal conductivity, and the fins 9 and the heat sink 11 can quickly remove the heat from the cover 2.

[0027] like Figure 1 As shown, the bottom of the heat pipe 11 is set as a plane, and the plane at the bottom of the heat pipe 11 is fully in contact with the top of the cover 2, so that the heat pipe 11 can carry away more heat from the cover 2.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A PCB circuit board capable of resisting electromagnetic interference, comprising a board body (1) and a cover body (2), characterized in that: The cover (2) is installed on the top of the plate (1). Multiple slots (8) are evenly opened on the top of the cover (2). A fin (9) is fixedly installed in each slot (8). A through-hole (10) is opened on one side of each fin (9) that is staggered with each other. A heat dissipation pipe (11) is fixedly installed on the top of the cover (2). The heat dissipation pipe (11) is distributed in an S-shape and passes through the through-hole (10) at one end of each fin (9) in sequence. An inner groove (12) is opened inside each fin (9). The opening of the inner groove (12) in each fin (9) is located at its bottom. Multiple heat dissipation ports (13) communicating with the inner groove (12) are evenly opened on both sides of each fin (9).

2. The PCB circuit board capable of electromagnetic interference immunity according to claim 1, characterized in that: The opening at the bottom of the inner groove (12) in each of the fins (9) is connected to the cover (2).

3. A PCB circuit board capable of electromagnetic interference immunity according to claim 1, characterized in that: Fixing blocks (3) are fixedly installed at the four corners of the top of the plate (1). Each fixing block (3) has a screw groove at the top. Fixing rods (4) are fixedly installed at the four corners inside the cover (2). Each fixing rod (4) has a groove (5) at the bottom. Each fixing rod (4) has a screw hole (6) connected to the groove (5) at the top. Each screw hole (6) has a bolt (7) inserted into it. Each bolt (7) passes through the screw hole (6) and is threaded into the screw groove at the top of the corresponding fixing block (3).

4. A PCB circuit board capable of electromagnetic interference immunity according to claim 3, characterized in that: The height of the fixing rod (4) is the same as the height of the cover (2), and the groove (5) at the bottom of the fixing rod (4) can be fitted onto the fixing block (3) at the top of the plate (1).

5. A PCB circuit board capable of electromagnetic interference immunity according to claim 1, characterized in that: Both the fins (9) and the heat sink (11) are made of copper.

6. A PCB circuit board capable of electromagnetic interference immunity according to claim 1, characterized in that: The bottom of the heat dissipation pipe (11) is set as a plane, and the plane at the bottom of the heat dissipation pipe (11) is fully in contact with the top of the cover (2).