Processing equipment for processing panel

Abstract

The utility model provides processing equipment for processing a panel, the panel is divided into a plurality of sub-panels, the sub-panels are constructed into component bearing parts or a plurality of component bearing parts to be singulated, the processing equipment comprises a fixing unit, a plurality of processing units and a plurality of processing units, the fixing unit is constructed to fix the panel, and the processing units are constructed to be used for processing the panel. The lifting unit is located below the panel, and the lifting unit is configured to enable the panel to be separated from the fixing unit when the panel is lifted; a pick-up unit that moves above the panel to pick up and transport the panel; and a collection unit configured to receive the sub-panel of the panel conveyed by the pickup unit and to store the sub-panel in the collection unit.

Description

Technical Field

[0001] This utility model relates to the field of electronic devices, and in particular to a processing device for processing panels. Background Technology

[0002] With the rapid development of electronic devices, the demand for circuit boards is increasing. As the functionality of products equipped with one or more electronic components continues to grow, as these components become increasingly miniaturized, and as the number of components mounted on component carriers such as printed circuit boards continues to increase, the requirements for the integrity and precision of circuit board structures are becoming increasingly stringent.

[0003] In the existing technology, during the manufacturing process of circuit boards, the circuit boards need to be transported to various processing stations for processing. To ensure the integrity and precision of the circuit board structure, avoid damage to the circuit board structure caused by accidental scratches or squeezing during transportation, and prevent foreign matter adhering to the circuit board surface from contaminating the circuit board circuit, a component is usually placed on one main surface of the circuit board, and a protective film is placed on the opposite main surface of the circuit board to support and protect the circuit board, preventing it from being scratched or damaged during transportation.

[0004] However, before further processing, the electronic boards need to have their surface components and / or protective films removed, and the boards divided into multiple sub-parts placed in a stacked manner in a transport vehicle before being transported to another processing station. In the prior art, these operations are all done manually, which is not only time-consuming and labor-intensive, but also very likely to damage the surface of the electronic boards during manual operation, resulting in a decrease in product yield.

[0005] Therefore, a safe, reliable, and automated device is needed for processing and transporting circuit boards. Utility Model Content

[0006] The purpose of this invention is to provide a processing apparatus for processing panels, so as to at least solve the defects described above in the prior art.

[0007] According to an exemplary embodiment of the present invention, a processing device for processing a panel is provided, the panel being divided into multiple sub-panels, the sub-panels being configured as component carriers or multiple component carriers to be individualized, the processing device including: a fixing unit configured to fix the panel; a lifting unit located below the panel, the lifting unit being configured to cause the panel to detach from the fixing unit when the panel is lifted; a picking unit movable above the panel to pick up and transport the panel; and a collecting unit configured to receive the sub-panels of the panel transported by the picking unit and store the sub-panels in the collecting unit.

[0008] In the context of this application, the term "panel" can be divided into multiple parts, which can be referred to as "sub-panels." These sub-panels can be configured as component carriers or multiple component carriers to be individualized. Typically, before being fed into the processing equipment of this application, the panel undergoes a shaping process, in which it is mechanically cut into multiple sub-panels. After being processed, for example, by preliminary processing (such as mechanical cutting), the multiple "sub-panels" do not detach from the fixed unit but remain laid flat on the supporting fixed unit, such as a plate, thus forming a "panel" on the supporting plate for easy transport. Preferably, during or after preliminary processing, a protective film can be applied to the multiple "sub-panels" to prevent dust and foreign matter generated during production from adhering to the surface of the panel or sub-panels and affecting product quality. When further processing is required, the processing equipment of this invention can re-divide a larger panel into multiple sub-panels. Preferably, the multiple sub-panels are split to form a stacked assembly. Then, the stacked components of multiple sub-panels are transported manually or automatically by a transport device to other processes for further processing.

[0009] The panels transported to the processing equipment are placed in the processing area for processing. After the coordinated operation of the lifting unit and the movable pickup unit, the original panel can be divided into multiple smaller sub-panels. Each sub-panel can be transported by the pickup device of the movable pickup unit and stored in the collection unit. When the original panel is divided into multiple smaller sub-panels, the area of ​​the collection unit used to store the sub-panels can be designed to be smaller than the area of ​​the lifting unit used to store the original panels, making the overall processing equipment more compact and occupying less space.

[0010] In the context of this application, the term "component carrier" may specifically refer to any support structure capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical connection. In other words, a component carrier can be constructed as a mechanical and / or electronic carrier of a component. In particular, a component carrier can be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. A component carrier can also be a hybrid board combining different carriers of the above types of component carriers.

[0011] In the context of this application, the term "component carrier structure" may specifically refer to a prefabricated component carrier currently being manufactured. Specifically, a component carrier structure may include multiple component carriers or prefabricated components that remain integrally connected, and these component carriers or prefabricated components may be manufactured in a batch process prior to individualization. In particular, a component carrier structure may be a panel (e.g., having a size of 18 inches × 24 inches or larger) or an array (e.g., an array of six component carriers currently being manufactured). For example, the manufactured component carrier may be a printed circuit board or an IC substrate.

[0012] In alternative embodiments, the manufactured component carrier may include a stack of at least one electrically insulating layer structure and / or at least one conductive layer structure. For example, the component carrier may be a laminate of electrically insulating and conductive layer structures, particularly formed by applying mechanical pressure and / or heat. A “stack” can provide a plate-like component carrier that offers a large mounting surface for other components while remaining very thin and compact. The term “layer structure” may specifically refer to a continuous layer, a patterned layer, or multiple discontinuous islands within a common plane.

[0013] In the context of this application, the term "printed circuit board" (PCB) can specifically refer to a board-shaped component carrier formed by laminating several conductive layer structures with several electrically insulating layer structures, for example by applying pressure and / or by providing heat. As the preferred material for PCB technology, the conductive layer structures are made of copper, while the electrically insulating layer structures can consist of resin and / or glass fiber, i.e., so-called prepreg or FR4 material. Various conductive layer structures can be formed with through-holes in the laminate, for example by laser drilling or mechanical drilling, and connected to each other in the desired manner by filling them with a conductive material (particularly copper), thus forming through-hole connections. In addition to one or more components that can be embedded in the PCB, PCBs are generally constructed to accommodate one or more components on one or two opposing surfaces of the board-shaped PCB. They can be soldered to their respective main surfaces. The dielectric portion of the PCB can consist of resin and reinforcing fibers (such as glass fiber).

[0014] In the context of this application, the term "substrate" can specifically refer to a small component carrier. In the case of a PCB, a substrate can be a relatively small component carrier on which one or more components can be mounted, and can act as a connection medium between one or more chips and another PCB. For example, a substrate can have substantially the same dimensions as the components (particularly electronic components) to be mounted thereon (e.g., in the case of chip-scale packages (CSP)). More specifically, a substrate can be understood as a carrier of electrical connections or electrical networks, and a component carrier equivalent to a printed circuit board (PCB), but with a considerably high density of lateral and / or vertical interconnects. For example, lateral connections are conductive channels, while vertical connections may be drilled holes. These lateral and / or vertical connections are arranged within the substrate and can be used to provide electrical, thermal, and / or mechanical connections between packaged or unpackaged components (such as bare molds), particularly IC chips, and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes "IC substrate." The dielectric portion of the substrate can be composed of resin with reinforcing particles (e.g., reinforcing spheres, particularly glass spheres).

[0015] The substrate or interlayer may include or consist of at least one layer of glass, silicon (Si), or photo-imaging or dry-etching organic material such as epoxy-based stacked materials (e.g., epoxy-based stacked films) or polymer compounds such as polyimide, polybenzoxazole, or benzocyclobutene functionalized polymers.

[0016] In alternative embodiments, at least one electrical insulating layer structure may include at least one of the following: resin (e.g., reinforced or unreinforced resin, such as epoxy or bis(methylenediamide)-trinitride resin), cyanate ester resin, polystyrene derivative, glass (particularly glass fiber, multilayer glass, glass-like materials), prepreg (e.g., FR-4 or FR-5), polyimide, polyamide, liquid crystal polymer (LCP), epoxy-based constructed film, polytetrafluoroethylene (PTFE, Teflon), ceramic, metal oxide. Reinforcing structures such as fiber webs, fibers, or spheres, made of glass (multilayer glass), may also be used. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based deposited films or photo-imaging dielectric materials, may also be used. For high-frequency applications, high-frequency materials such as PTFE, liquid crystal polymers and / or cyanate ester resins, low-temperature co-fired ceramics (LTCC), or other low, very low, or ultra-low DK materials may be implemented as electrical insulating layer structures in component carriers.

[0017] In the context of this application, the term "support plate" can specifically refer to a plate that holds and supports a panel during panel transportation and handling. A support plate typically includes a back plate and a pad. The back plate is a plate that directly contacts and supports the panel, while the pad specifically refers to a plate used to support and carry both the back plate and the panel. Generally, one main surface of the back plate contacts the panel, and the other main surface contacts the pad. Therefore, the back plate is usually smooth and made of a flexible material to avoid damaging the panel on it. In contrast, the pad has one main surface in contact with the back plate, and the other main surface typically contacts external devices such as conveyor belts, the walls of transport containers, or clamps. Therefore, the pad is usually made of a harder material to maintain support while preventing damage to the panel from transport devices during transit.

[0018] In the foregoing of this application, the terms “longitudinal” and “longitudinal direction” may specifically refer to the transport direction of the processing equipment or a direction parallel to the transport direction; the terms “lateral” and “lateral direction” may specifically refer to a direction perpendicular to the transport direction of the processing equipment and parallel to the ground on which the processing equipment is installed; and the terms “vertical” and “vertical direction” may specifically describe a direction perpendicular or approximately perpendicular to the ground on which the processing equipment is installed.

[0019] Other example implementations of the processing apparatus for processing panels will be described below.

[0020] In an optional implementation, the lifting unit may be configured to perform reciprocating motion between an initial position and a raised position. In the initial position, the lifting unit may be located below the panel. As the lifting unit moves upward from the initial position to the raised position, the lifting unit raises the panel. After the panel is picked up by the picking unit, the lifting unit may return downward to the initial position.

[0021] In an optional embodiment, the fixing unit may include a first fixing device. A support plate for supporting the panel may be provided below the panel, and the support plate may include a back plate and a pad. The back plate is placed on the pad and directly contacts the lower surface of the panel. The first fixing device may be disposed on the pad of the support plate and pass through a first hole in the panel and a third hole in the back plate of the support plate, ensuring that the panel remains fixed during mechanical cutting and improving cutting accuracy. The support plate is reusable.

[0022] In an optional embodiment, the lifting unit may include at least one lifting platform, and the fixing unit may include a second fixing device. The second fixing device may be disposed on the lifting platform. When it is necessary to lift the panel, the second fixing device may pass through a second hole provided in the pad of the support plate and contact the back plate, thereby lifting the panel and the back plate, so that the panel and the back plate are disengaged from the first fixing device.

[0023] In an optional embodiment, the pickup unit may include at least one suction device, which may be configured such that a negative pressure is formed inside the suction device when it contacts the surface of the panel, thereby firmly adhering to the surface of the panel.

[0024] In an optional embodiment, the processing device may further include a cleaning unit, which may be located in the loading area and / or unloading area of ​​the processing device to clean the surfaces of products entering and / or leaving the processing device.

[0025] In an optional embodiment, the processing equipment may further include a transport unit, which may include a first transport device and a second transport device. The first transport device may be configured to transport products to be processed to the processing equipment and / or transport processed products away from the processing equipment, and the second transport device may be configured to transport the products to various areas of the processing equipment.

[0026] In an optional implementation, multiple sub-panels can be stored in the collection unit in a stacked manner.

[0027] In an optional embodiment, the first fixing device and the second fixing device of at least one fixing unit may each include at least one pin.

[0028] In optional embodiments, the pins of the first fixing device and the second fixing device may be the same or different. Preferably, the length of the pin of the second fixing device is greater than the length of the pin of the first fixing device. Preferably, the diameter of the pin of the second fixing device is greater than the diameter of the pin of the first fixing device.

[0029] In an alternative implementation, the pickup unit may be configured to be positionally adjustable to accommodate panels of different sizes.

[0030] In an optional embodiment, the pickup unit may include a suction cup. The suction cup may be configured to directly contact the surface of the protective element or panel and adhere to the surface of the protective element or panel through a vacuum effect.

[0031] In an optional embodiment, the surface of the panel may also be covered with a protective element, and the pickup unit is configured to pick up and remove the protective element before picking it up again onto the surface of the panel. The removed protective element may be placed by the pickup unit in a second collection area of ​​the collection unit.

[0032] In an optional implementation, the protective element may include a protective film.

[0033] In an optional embodiment, the protective element may further include a weight component, which may be disposed on the protective film to increase the weight of the protective film when it is peeled off. Typically, panels containing metal (e.g., copper) are heavier than the protective film. By increasing the weight of the protective film with the weight component, the protective film or panel can be picked up efficiently without adjusting the negative pressure parameters in the pickup device.

[0034] In an alternative implementation, the cleaning unit may include a brush and a vacuum suction device.

[0035] In an optional embodiment, the first transport device may include a trolley configured to transport the sub-panel, which will be processed by the processing device, to other processing steps. The second transport device may include a conveyor belt.

[0036] In an optional implementation, the lifting unit may be driven by a drive mechanism.

[0037] In an optional implementation, the drive mechanism may be an electric motor.

[0038] In an optional implementation, the lifting unit may be configured such that, in the initial position, the lifting unit is located below the panel and at a predetermined distance; and in the raised position, the lifting unit is always in contact with the pad.

[0039] In an optional embodiment, the lifting unit, the first fixing device, and the second fixing device can be configured such that after the lifting unit enters the lifted position, the second fixing device detaches the panel from the first fixing device and supports the panel, initiating the pickup process. Specifically, the lifting unit, the first fixing device, and the second fixing device can be configured such that after the second fixing device passes through a second hole in the pad of the support plate, contacts and supports the back plate of the support plate, the lifting unit continues to move upward in the vertical direction, lifting the back plate and the panel placed on the back plate. After the panel is raised to the point of being completely detached from the first fixing device, the second fixing device supports the back plate and the panel and keeps them stationary, initiating the pickup process.

[0040] In an optional embodiment, spacers are provided at the top and bottom of each stacked sub-panel. These spacers also prevent damage to the circuit board structure from accidental scratches or compression during transportation, and prevent foreign matter adhering to the circuit board surface from contaminating the circuitry.

[0041] A processing apparatus for processing a panel according to an embodiment of the present invention includes: a fixing unit configured to fix the panel; a lifting unit located below the panel, configured to lift the panel so that, when the panel is lifted, the panel is detached from the fixing unit, particularly detached from the fixing of a first fixing device of the fixing unit; a picking unit that moves above the panel to pick up and transport the panel; and a collecting unit configured to receive the sub-panels of the panel transported by the picking unit and store the sub-panels in the collecting unit.

[0042] This processing equipment employs a novel lifting unit for releasing panels from the fixing device, high-precision sensors for identifying the picked-up objects, and an automatically moving pickup unit. This allows the panels to be automatically divided into multiple sub-panels, reducing the risk of scratches and damage during separation and transportation. This automated separation and transportation method is safe, reliable, and time-saving, significantly increasing production capacity. Furthermore, the backplates, pads, and spacers used to support the panels are all reusable. Attached Figure Description

[0043] The above-defined aspects and other aspects of the present invention will become apparent from the embodiments described below with reference to the accompanying drawings. The present invention will be described below with reference to the embodiments, but the present invention is not limited to the described embodiments.

[0044] Figure 1 A processing apparatus for processing a panel according to an embodiment of the present invention is shown schematically.

[0045] Figure 2 A panel according to an embodiment of the present application is schematically shown, the panel being supported by a support plate including, for example, a back plate and a pad, and the surface of the panel being covered with a protective member including, for example, a protective film and a weight.

[0046] Figures 3a to 3c The panel, back plate, and pad are schematically shown according to an embodiment of this application, wherein... Figure 3a A schematic planar structure of the pad is shown. Figure 3b A schematic planar structure of the back panel is shown, and Figure 3c A schematic planar structure of the panel is shown;

[0047] Figure 4 The front panel, back panel, and pad are schematically shown in an isometric sectional view in a fixed state according to an embodiment of this application.

[0048] Figure 5 The diagram schematically illustrates a processing area for placing a lifting unit according to an embodiment of the present application, wherein a movable picking unit is picking up a sub-panel.

[0049] Figure 6 The lifting unit according to an embodiment of this application is illustrated schematically;

[0050] Figure 7 This schematic diagram illustrates the structure of the pad, back plate, and panel to be processed placed in the processing area when the raised platform is in its initial position.

[0051] Figure 8 The structure of the pickup unit according to an embodiment of this application is schematically shown;

[0052] Figure 9 An isometric view schematically shown in the first fixing device state where the panel is detached from the fixing unit when the lifting platform is in the raised position;

[0053] Figure 10 This is a schematic diagram of a group of pickup units picking up sub-panels;

[0054] Figure 11 It is a schematic diagram of a group of pickup units picking up spacers; and

[0055] Figure 12 This is a schematic diagram of the cleaning unit.

[0056] Explanation of reference numerals in the attached figures

[0057] 1. Processing equipment; 10. Panel; 102. First hole; 10'. Sub-panel; 12. Support plate; 122. Second hole; 124. Third hole; 126. Pad; 128. Back plate; 14. Protective component; 16. Protective film; 18. Weight component; 19. Spacer; 2. Fixing unit; 22. First fixing device; 24. Second fixing device; 3. Lifting unit; 32. Lifting platform; 4. Picking unit; 42. Suction device; 422. Suction cup; 5. Collection unit; 52. First collection area; 54. Second collection area; 6. Cleaning unit; 62. Brush; 64. Vacuum suction device; 7. Transport unit; 72. First transport device; 74. Second transport device; 8. Stop device; 9. Sensor. Detailed Implementation

[0058] The illustrations in the accompanying drawings are schematic. It should be noted that in different drawings, similar or identical elements or features are given the same reference numerals or reference numerals that differ only in the first digit. To avoid unnecessary repetition, elements or features already described with respect to the foregoing embodiments will not be described again in subsequent descriptions.

[0059] Furthermore, spatially related terms, such as "front" and "back," "up" and "down," "left" and "right," are used to describe the relationship between one element and another as shown in the figures. Thus, spatially related terms can be applied to orientations in use that differ from those illustrated in the figures. Clearly, all such spatially related terms refer only to the orientations shown in the figures for ease of description and are not necessarily limiting, as the device according to the embodiments of this invention may be assumed to have orientations different from those illustrated in the figures during use. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0060] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0061] Figure 1 A processing apparatus 1 for processing a panel 10 according to an embodiment of the present invention is schematically shown. The panel 10 can be divided into a plurality of sub-panels 10', and the sub-panels 10' can be configured as component carriers or a plurality of component carriers to be individualized.

[0062] The processing device 1 for processing the panel 10 may include: a fixing unit 2, a lifting unit 3 located below the panel 10, a picking unit 4, and a collecting unit 5.

[0063] In some embodiments, the fixing unit 2 may be configured to fix and / or support the panel 10. The lifting unit 3 may be configured to disengage the panel 10 from the fixing unit 2 when the panel 10 is lifted. The picking unit 4 may move above the panel 10 to pick up and transport the panel 10. The collecting unit 5 may be configured to receive the sub-panel 10' of the panel 10 transported by the picking unit 4 and store the sub-panel 10' in the collecting unit 5.

[0064] In the context of this application, the longitudinal direction may specifically refer to the transport direction of the processing device 1 or a direction parallel to the transport direction, the transverse direction may specifically refer to a direction perpendicular to the transport direction of the processing device 1, and the vertical direction may specifically refer to a direction perpendicular or approximately perpendicular to the ground on which the processing device 1 is installed.

[0065] In some embodiments, the fixing unit 2 may include a first fixing device 22, and a support plate 12 for supporting the panel 10 may be provided below the panel 10. The support plate 12 may include a back plate 128 and a pad 126. The back plate 128 is placed on the pad 126 and directly contacts the lower surface of the panel 10. The first fixing device 22 may be provided on the pad 126 of the support plate 12 and pass through the first hole 102 provided in the panel 10 and the third hole 124 on the back plate 128 of the support plate 12.

[0066] For example, in Figures 2 to 4 As schematically shown, the panel 10 to be processed can be supported by a support plate 12, which includes a back plate 128 and a pad 126. Specifically, one main surface of the back plate 128 contacts the panel 10 and the other main surface contacts the pad 126. Therefore, the back plate 128 is typically smooth and made of a flexible material to avoid damaging the panel 10 on the back plate 128. In contrast, the pad 126 has one main surface in contact with the back plate 128, and the other main surface typically contacts external devices such as conveyor belts, the walls of transport containers, or clamps. Therefore, the pad 126 is typically made of a harder material to maintain support while preventing damage to the panel 10 during transport. The back plate 128 and the pad 126 can be made of different materials or the same material; for example, both the back plate 128 and the pad 126 can be made of plastic.

[0067] As in Figure 2 As shown, the panel 10 fabricated on the back plate 128 may include twelve sub-panels 10' that will be separated. The number of sub-panels 10' is merely illustrative, and panels 10 including more sub-panels 10' may be placed on different pads 126.

[0068] As in Figures 3a to 3c as well as Figure 4As shown, the panel 10 may have multiple first holes 102, the back plate 128 may have multiple third holes 124, and the pad 126 may have multiple second holes 122. Furthermore, a first fixing device 22 is provided on the main surface of the pad 126 that contacts the back plate 128. The first fixing device 22 can be configured such that when the panel 10 and the back plate 128 are placed on the pad 126, the first fixing device 22 passes through the third holes 124 of the back plate 128 and the first holes 102 of the panel 10, thereby firmly fixing the panel 10 and the back plate 128 to the surface of the pad 126, ensuring stability during mechanical cutting and transportation.

[0069] The second hole 122 of the pad 126 is configured to allow the second fixing device 24 disposed on the lifting unit 3 to pass through when the lifting unit 3 is close to the pad 126. The specific cooperation between the second hole 122 and the second fixing device 24 will be described below.

[0070] exist Figures 3a to 3c as well as Figure 4 In the embodiment shown, the first fixing device 22 includes eight pins, the panel 10 is provided with eight first holes 102 and the back plate 128 is provided with eight third holes 124, and the positions of the pins of the first fixing device 22 correspond one-to-one with the positions of the first holes 102 and the third holes 124.

[0071] It is understood that the number and position of the pins, first holes 102, and third holes 124 shown here are merely illustrative and can be varied according to the size of the panel 10 and specific operational requirements. For example, 4, 5, 6, 7, 9, 10, or 20 pins, first holes 102, and third holes 124 can be provided. Furthermore, the pins, first holes 102, and third holes 124 can not only be provided around the perimeter of the panel, but also, in cases where the panel 10 has a large area, at least partially in the central area of ​​the panel. The specific number and placement can be adjusted according to requirements to ensure that the panel 10 does not warp during processing due to too few or too many pins.

[0072] Furthermore, the number of the first hole 102 and the third hole 124 can be set to be different from the number of pins, so that more types of pads 126 can be used.

[0073] In some embodiments, the diameter of the pin of the first fixing device 22 and the diameter of the first hole 102 and the third hole 124 can be set in the range of 1mm-7mm, for example, 2mm, 3mm, 4mm, 5mm, 6mm.

[0074] In some embodiments, the pin of the first fixing device 22 has a radial gap with the first hole 102 and the third hole 124 through which it passes, to avoid cracks on the panel 10 caused by the interference fit between the pin and the first hole 102 and the third hole 124. Preferably, the gap can be 50 μm.

[0075] In some embodiments, the surface of the panel 10 may also be covered with a protective element 14. The pickup unit 4 is configured to pick up and remove the protective element 14 before picking it up again onto the surface of the panel 10. The removed protective element 14 may be placed by the pickup unit 4 into the second collection area 54 of the collection unit 5. For example, the panel 10 to be processed may also be covered with a protective film 16.

[0076] In some embodiments, in addition to the protective film 16, a weight 18 covering the protective film 16 may also be provided on the panel 10. The weight 18 increases the weight of the protective film 16 when it is peeled off, slightly increasing its weight to ensure that the protective film 16 can be stably placed into the second collection area 54 of the collection unit 5 for reuse after removal, without falling outside the collection unit 5 and causing waste. Furthermore, typically, the panel 10 containing metal (e.g., copper) is heavier than the protective film 16. By increasing the weight of the protective film 16 with the weight 18, the protective film 16 or the panel 10 can be picked up efficiently without adjusting the parameters in the pickup unit 4. In some embodiments, the weight 18 can be a plastic frame or a foam board.

[0077] In some implementations, the collection unit 5 can be positioned next to the processing area, for example in... Figure 1 The lifting unit 3, where the panel 10 is placed in the lateral direction, can be placed next to the area, or it can be placed in other easily accessible areas. For example, the collection unit 5 can be a collection basket.

[0078] In some embodiments, the lifting unit 3 may include at least one lifting platform 32, and the fixing unit 2 may include a second fixing device 24. The second fixing device 24 may be disposed on the lifting platform 32. When it is necessary to raise the panel 10, the second fixing device 24 may pass through the second hole 122 provided in the pad 126 of the support plate 12 and contact the back plate 128 to raise the panel 10.

[0079] For example, in reference Figure 6 In the illustrated embodiment, the raising unit 3 may include at least one raising platform 32 and at least one second fixing device 24 disposed on each raising platform 32. (See reference) Figure 6The schematic diagram shown illustrates the lifting unit 3, which includes four lifting platforms 32, and each lifting platform 32 is equipped with four second fixing devices 24. It is understood that the number of lifting platforms 32 and their second fixing devices 24 is merely illustrative, and those skilled in the art can select more or fewer lifting platforms 32 and second fixing devices 24 according to specific operational requirements.

[0080] For example, three, five, six, or more second fixing devices 24 can be selected on each raised platform 32. In some embodiments, the diameter of the second fixing device 24 can be 10 mm, or it can be set to other diameters according to the plate processing requirements, such as 8 mm, 9 mm, 11 mm, or 12 mm. Preferably, the diameter of the second fixing device 24 on the raised platform 32 can be greater than or equal to the diameter of the pin of the first fixing device 22.

[0081] It can be noted that the number of second fixing devices 24 is consistent with the number of second holes 122 provided in the pad 126, so that when the lifting platform 32 moves upward in the vertical direction and approaches the pad 126, the second fixing devices 24 can pass through the second holes 122 in the pad 126. As the lifting platform 32 continues to move, the tips of the second fixing devices 24 contact the surface of the back plate 128 and lift the back plate 128 and the panel 10 upward, separating the back plate 128 and the panel 10 from the pad 126. After separation, the back plate 128 and the panel 10 change from being supported by the pad 126 to being supported and lifted by the second fixing devices 24, so as to be picked up by the picking unit 4 located above the panel 10.

[0082] In some embodiments, the distance the tip of the second fixing device 24 continues to move upward after contacting the surface of the back plate 128 should be greater than or equal to the length of the pin of the first fixing device 22. That is, the length of the pin of the second fixing device 24 should be greater than the length of the pin of the first fixing device 22. In particular, considering that the second fixing device 24 raises the back plate 128 and the panel 10 by passing through the second hole 122 in the pad 126, the length of the pin of the second fixing device 24 should be greater than or equal to the sum of the thickness of the pad 126 and the length of the pin of the first fixing device 22. For example, if the pin length of the first fixing device 22 is 1 cm, after the tip of the second fixing device 24 on the lifting platform 32 contacts the lower surface of the back plate 128 through the second hole 122, the lifting platform 32 should move upward at least 1 cm in the vertical direction, thereby allowing the panel 10 and the back plate 128 to detach from the first fixing device 22. The thickness of the pad 126 is not specifically limited here. However, those skilled in the art will understand that the length of the second fixing device 24 can be specifically set according to the thickness of different pads 126 and the length of the first fixing device 22.

[0083] Understandably, the number of second holes 122 should be greater than or equal to the number of second fixing devices 24 to ensure that as the lifting platform 32 rises, all the second fixing devices 24 can successfully pass through the pad 126, thereby contacting the back plate 128 and ultimately lifting the back plate 128 and the panel 10 so that the panel 10 can be disengaged from the pin of the first fixing device 22. If the number of second holes 122 is less than the number of second fixing devices 24, then as the lifting unit 3 rises, some of the second fixing devices 24 will abut against the lower surface of the pad 126 but cannot pass through the pad 126. In this case, the pad 126 will also be pushed up by the upward-moving second fixing devices 24, causing the panel 10 and the back plate 128 to be unable to separate from the pad 126. In severe cases, this may cause the pad 126 to tilt, making the panel 10 and the back plate 128 tilt or even warp, or slip off the tilted pad 126, which will have an adverse effect on the product yield.

[0084] In some implementations, the support plate 12 is reusable.

[0085] In some embodiments, the pickup unit 4 may include at least one suction device 42, which may be configured such that a negative pressure is formed inside the suction device 42 when it contacts the surface of the panel 10, thereby firmly adhering to the surface of the panel 10.

[0086] For example, see reference Figure 1 , Figure 5 , Figure 8 and Figure 10 In the exemplary embodiments shown, the suction device 42 can be grouped, for example, into a first suction device and a plurality of second suction devices. The first suction device can be configured to pick up a sub-panel 10' of the panel 10 and transport the sub-panel 10' to a first collection area 52 of the collection unit 5. The second suction devices can be configured to place spacers 19 on the sub-panel 10' as it is transported to the first collection area 52. In the first collection area 52, the sub-panels 10' and spacers 19 can be alternately placed vertically to form a stack, such that every two adjacent sub-panels 10' are separated by spacers 19, preventing frictional damage to the surface of the sub-panels 10' between adjacent sub-panels 10'.

[0087] In some embodiments, the spacer 19 can be a plastic insert plate. Preferably, the surface area of ​​the spacer 19 is larger than the surface area of ​​the sub-panel 10', so as to completely surround the sub-panel 10', avoiding collisions or friction with external structures or adjacent sub-panels 10', thus providing good protection and facilitating the transport of the sub-panel 10' to other processing steps. The spacer 19 can be placed in a position easily accessible to the pickup unit 4, for example, as... Figure 1 and Figure 11As shown, the area where the lifting unit 3 is located, the first collection area 52, and the area where the spacer 19 is placed can be arranged in the horizontal direction, and the first collection area 52 can be located between the area where the lifting unit 3 is located and the area where the spacer 19 is placed.

[0088] In a preferred embodiment, the first suction device and the second suction device can be automated robotic arms.

[0089] According to an embodiment of the present invention, the pickup unit 4 can be configured such that when it contacts the surface of the protective film 16 or panel 10 to be picked up, a negative pressure can be formed inside the pickup unit 4 to firmly adsorb the surface of the protective film 16 or panel 10 to be picked up.

[0090] In some embodiments, the multiple first suction devices can be divided into multiple groups of first suction devices, each group of first suction devices being controlled by an independent drive mechanism to move independently of each other. In some embodiments, the multiple groups of first suction devices can be controlled by their respective drive mechanisms to move to different heights.

[0091] In some embodiments, the first suction device may include a plurality of first suction cups 422 configured to vacuum-adhere to the protective film 16 or the sub-panel 10'. One of the plurality of first suction cups 422 is placed in the central region of the sub-panel 10', and the other suction cups 422 are placed around the edge of the sub-panel 10'. Preferably, the suction cups 422 placed around the edge of the sub-panel 10' may be placed at the corners of the sub-panel 10'.

[0092] Now combine Figure 5 , Figures 8 to 10 The illustrated embodiment describes the operation of the first suction device. It can be seen that in this embodiment, the multiple first suction devices can be grouped into sets of three. Each group of first suction devices can be driven by a single motor; for example, the three first suction devices can be driven by a motor to move synchronously along the longitudinal, lateral, or vertical directions.

[0093] Understandably, the specific grouping of the first suction device can be determined based on the arrangement of panel 10. For example, in Figure 10 In the illustrated embodiment, panel 10 has six rows of sub-panels 10' arranged in the horizontal direction. In this case, the three first suction devices in this group can pick up all six sub-panels 10' in the same row in two steps, which is much more efficient than manually separating the sub-panels 10' one by one. Of course, if the processing area is limited, the two first suction devices can also be grouped together and controlled by a separate motor.

[0094] Each first suction device may include six first suction cups 422. The six first suction cups 422 can adhere around the edge of each sub-panel 10' (e.g., Figure 5 (As shown in the diagram). It is understood that the number and specific placement of the first suction cups 422 can be adjusted. For example, in the case of a larger sub-panel 10', more first suction cups 422 can be provided, such as 7, 8, 9, or more. The arrangement of the first suction cups 422 can be changed according to the size of the sub-panel 10'. All the first suction cups 422 can be arranged at equal intervals around the edge of the sub-panel 10', the first suction cups 422 can be placed at the corners of the sub-panel 10', or at least one first suction cup 422 can be placed in the central area of ​​the sub-panel 10' and the remaining first suction cups 422 can be arranged at equal intervals around the edge of the sub-panel 10'.

[0095] After panel 10 is lifted by lifting unit 3 to detach from first fixing device 22, three first suction devices are driven by drive motors to move above the corresponding three sub-panels 10' and move downwards vertically to approach the upper surface of sub-panels 10'. After first suction cup 422 adsorbs sub-panel 10', the first suction device is driven by drive mechanism to move upwards vertically, then moves horizontally, preferably horizontally in the transverse direction, to the first collection area 52. After reaching the designated position in the first collection area 52, it stops moving horizontally and moves downwards vertically. The first suction cup 422 releases the negative pressure state to place sub-panels 10' into the first collection area 52.

[0096] Now combine Figure 8 and Figure 11 The illustrated embodiment describes the operation of the second suction device. It can be seen that in this embodiment, multiple second suction devices can be grouped into sets of three. Each group of second suction devices can be driven by a single motor; for example, three second suction devices can be driven by a motor to move synchronously in the longitudinal, lateral, or vertical direction.

[0097] Considering that sub-panels 10' and spacers 19 are stacked alternately in the first collection area 52, it is preferable that the grouping method and spacing distance of the multiple first suction devices and multiple second suction devices are consistent, so that the placement of sub-panels 10' and the spacing of spacers 19 can be performed synchronously. For example, in this embodiment, the multiple first suction devices are grouped into groups of three, so it is preferable to group the three second suction devices into groups. In this way, when the three sub-panels 10' are placed in the first collection area 52, the other three second suction devices with the same grouping method and spacing distance as the first suction devices can then accurately place the three spacers 19 on the three sub-panels 10', ultimately forming three aligned stacked pieces.

[0098] Similarly, each second suction device may also include six second suction cups 422. The six second suction cups 422 can adhere around the edge of each spacer 19. It is understood that the number and specific placement of the second suction cups 422 can be adjusted. For example, in the case of a spacer 19 with a larger area, more second suction cups 422 can be provided, such as 7, 8, 9 or more second suction cups 422. The arrangement of the second suction cups 422 can be changed according to the size of the spacer 19. All the second suction cups 422 can be arranged at equal intervals around the edge of the spacer 19, the second suction cups 422 can be arranged at the corners of the spacer 19, or at least one second suction cup 422 can be arranged in the central area of ​​the spacer 19 and the remaining second suction cups 422 can be arranged at equal intervals around the edge of the spacer 19.

[0099] After the three sub-panels 10' are placed in the first collection area 52, the second suction device is driven by the drive motor to move above the corresponding three spacers 19, and moves downward in the vertical direction to approach the upper surface of the spacers 19. After the second suction cup 422 adsorbs the spacers 19, the second suction device is driven by the drive mechanism to move upward in the vertical direction, and then move horizontally, preferably horizontally in the transverse direction, to the first collection area 52. After reaching above the three sub-panels 10' of the first collection area 52, it moves downward in the vertical direction, and the second suction cup 422 releases the negative pressure state to place the spacers 19 onto the sub-panels 10' of the first collection area 52.

[0100] In some embodiments, the drive mechanism that drives the first and second suction devices of the pickup unit 4 can be a commercially available drive motor. For example, a hydraulically driven, pneumatically driven, electrically driven, or mechanically driven motor can be used, depending on the configuration requirements of the production line, site limitations, or other requirements.

[0101] Considering that the pickup unit 4 in this invention picks up lightweight and finely structured electronic devices, an electric drive motor or a pneumatic drive motor is preferably used. Electric drive motors offer convenient power supply, fast response, and large driving force, while also facilitating signal detection, transmission, and processing, and enabling flexible control. Due to the high motor speed, a reduction mechanism (such as harmonic drive, RV cycloidal pinwheel drive, gear drive, screw drive, and multi-bar mechanism) is typically required. Alternatively, a high-torque, low-speed motor without a reduction mechanism can be used for direct drive (DD), simplifying the mechanism and improving control accuracy. Pneumatic drive motors typically consist of a cylinder, valve, air tank, and air compressor, and are characterized by convenient air supply, rapid action, simple structure, low cost, and easy maintenance.

[0102] In some embodiments, the pickup unit 4 may also be equipped with a sensor 9, which may be configured to identify whether the pickup unit 4 has picked up the protective film 16 or the panel 10 and the type of object picked up. In other words, the sensor 9 may be configured to identify whether the pickup unit 4 has picked up an item, and if an item is identified, to determine whether the item is the protective film 16, the panel 10, or another item. For example, the sensor 9 may be a photosensitive sensor, and different optical coating patterns may be provided on the panel 10 and the protective film 16. The photosensitive sensor 9 can sense the optical coating pattern on the item to determine whether the picked-up object is a sub-panel 10' of the panel 10 or the protective film 16. If the protective film 16 is picked up, the pickup unit 4 will transport the protective film 16 to the collection unit 5; and if the sub-panel 10' is picked up, the pickup unit 4 will transport the sub-panel 10' to the first collection area 52.

[0103] In some embodiments, the processing device 1 may also include other types of sensors, such as laser sensors, displacement sensors, pressure sensors, etc. In optional embodiments, the processing device 1 may also include a controller for storing and processing product information, the controller being configured to perform one or more of the following: (a) determining the movement of the pickup unit 4; (b) determining the placement position of the pickup unit 4 based on the distribution and size of the panel 10; and (c) defining a specific suction mode as central suction and / or corner suction, for example, defining whether the suction head is placed in a central position or a corner position to perform the suction action.

[0104] In some embodiments, the area where the lifting unit 3 is located may be referred to as the processing area, and a stop device 8 may be provided on the frame or other support structure in the processing area. The stop device 8 may be provided at one end of the frame of the processing area where the lifting unit 3 is located, along the transport direction. The stop device 8 is configured to stop the support plate 12 carrying the panel 10 when it is transported to a predetermined position in the processing area, so that the support plate 12 stops in the processing area. In some embodiments, the stop device 8 may be a mechanical stop device 8 or an electrical stop device 8, for example, the stop device 8 may be a protrusion on a bracket adjacent to the conveyor belt. The support plate 12 carrying the panel 10 is transported to the processing area by a second transport device 74, such as a conveyor belt or conveyor roller. When it touches the stop device 8, the transport device stops moving and remains stationary in the processing area to allow other units to operate on the panel 10.

[0105] like Figure 5 As shown, the stop device 8 is a protrusion located at the end of the second transport device 74, such as a conveyor belt. When the support plate 12 touches the stop device 8, the conveyor belt stops running, allowing the panel 10 to remain stationary for subsequent processing operations.

[0106] The first transport device 72 of the transport unit 7 may include a trolley, which may be configured to transport stacked sub-panels 10' from the first collection area 52 to other processing processes, or to transport unprocessed panels to the processing equipment 1.

[0107] In some embodiments, the processing device 1 may further include a cleaning unit 6, which may be disposed in the loading area and / or unloading area of ​​the processing device 1 to clean the surfaces of products entering and / or leaving the processing device 1. Figure 12 In the embodiment shown, the cleaning unit 6 may include a brush 62 and a vacuum suction device 64.

[0108] In summary, the operating principle of the processing device 1 for transporting panel 10 provided by the embodiments of this utility model is as follows: The pad 126, along with the panel 10 and back panel 128, which are fixed and vertically stacked on the pad 126 by the first fixing device on the pad 126, are transported to the processing area via the second transport device 74 of the transport unit 7 (e.g., a conveyor belt or conveyor roller). When the pad contacts the stop device 8, it indicates that the designated processing position has been reached, and the processing operation of the panel 10 can begin. Optionally, to facilitate the stability of subsequent operations, the processing device 1 can clamp the edge of the pad 126 using an additional clamping device, such as a clip. First, the lifting unit 3 moves vertically upward, with each lifting platform 32 corresponding to a portion of the panel 10. The second fixing device 24 passes through the second hole 122 in the pad 126 and contacts the back panel 128. At this time, the pad 126 remains stationary on the processing area, for example on the second transport device 74 (such as a conveyor belt) in the processing area. As the lifting unit 3 continues to move vertically upward, the second fixing device 24 passing through the second hole 122 lifts the back plate 128 and the panel 10 together. After the back plate 128 and the panel 10 are completely disengaged from the pin of the first fixing device 22, they remain stationary.

[0109] After panel 10 is lifted by lifting unit 3 to detach from first fixing device 22, three first suction devices are driven by drive motor to move above the corresponding three sub-panels 10' and move downwards in the vertical direction to approach the upper surface of sub-panels 10'. When protective film 16 and / or weight 18 are provided on panel 10, first suction cup 422 first adsorbs protective film 16 and / or weight 18. The first suction device is driven by drive mechanism to move upwards in the vertical direction, and then moves horizontally, preferably horizontally in the transverse direction, to above the second collection area 54 of collection unit 5. First suction cup 422 releases negative pressure to place the adsorbed protective film 16 and / or weight 18 into the second collection area 54 of collection unit 5.

[0110] After the protective film 16 and / or weight 18 on the surface of panel 10 are completely removed, the first suction device begins to pick up panel 10. Specifically, three first suction devices are driven by a drive motor to move above the corresponding three sub-panels 10' and move downwards vertically to approach the upper surface of the sub-panels 10'. After the first suction cup 422 adsorbs the sub-panel 10', the first suction device is driven by a drive mechanism to move upwards vertically, then moves horizontally, preferably horizontally in the lateral direction, to the first collection area 52. After reaching the designated position in the first collection area 52, the horizontal movement stops, and the device moves downwards vertically. The first suction cup 422 releases the negative pressure state to place the sub-panel 10' into the first collection area 52.

[0111] After the three first suction devices have placed the three sub-panels 10', the three second suction devices then pick up the three spacers 19 and place them on the three sub-panels 10' respectively. Specifically, after the three sub-panels 10' are placed in the first collection area 52, the second suction devices are driven by the drive motor to move above the corresponding three spacers 19, and move downwards vertically to approach the upper surface of the spacers 19. After the second suction cup 422 adsorbs the spacers 19, the second suction devices are driven by the drive mechanism to move upwards vertically, and then move horizontally, preferably horizontally in the lateral direction, to the first collection area 52. After reaching above the three sub-panels 10' in the first collection area 52, they move downwards vertically, and the second suction cup 422 releases the negative pressure state to place the spacers 19 on the sub-panels 10' of the first collection area 52.

[0112] Subsequently, the first and second suction devices repeat the picking operation on the sub-panels 10' and spacers 19 until all sub-panels 10' on a panel 10 have been picked up. All sub-panels 10' are placed in the first collection area 52, forming a stack with the spacers 19, and are then transported to subsequent processing. After picking, the first and second suction devices return to their original positions and remain stationary. Since there are no panels 10 on the surface of the back plate 128, the lifting unit 3 moves downward in the vertical direction, and the back plate 128 falls back onto the pad 126 as the lifting unit 3 moves. As the second fixing device 24 completely disengages from the second hole 122 of the pad 126, the back plate 128 contacts the pad 126 and is fixed by the first fixing device 22 on the pad 126. The clamping device in the processing area releases its grip on the pad 126, and the pad 126 and back plate 128 are then transported by conveyor belt to, for example, another collection frame for subsequent reuse. After a new panel 10 is transported to the processing device 1, the above-described automatic separation and transport process is repeated.

[0113] As can be seen, during the entire processing, the lifting unit 3 can perform reciprocating motion between the initial position and the raised position. In the initial position, the lifting unit 3 can be located below the panel 10. During the process of the lifting unit 3 moving upward from the initial position to the raised position, the lifting unit 3 raises the panel 10. After the panel 10 is picked up by the picking unit 4, the lifting unit 3 can return downward to the initial position.

[0114] In addition, it is understood that the above-mentioned transportation direction is only illustrative and can be changed according to the production layout. Automatic separation and automatic transportation can be achieved by cooperating with the lifting unit 3, the picking unit 4, the first fixing device 22 and other structures.

[0115] It will be readily understood by those skilled in the art that the above-described operating sequence of the processing device 1 is not fixed and can be varied according to the structural changes of each unit in the processing device 1.

[0116] The processing device 1 provided in this embodiment of the invention employs a novel lifting unit 3 for releasing the panel 10 from the fixing device, a high-precision sensor for identifying the picked-up object, and an automatically movable picking unit 4, etc., which allows the panel 10 to be automatically divided into multiple sub-panels 10', reducing the risk of the panel 10 being scratched or damaged during separation and transportation. This automatic separation and transportation method is safe, reliable, and time-saving, greatly improving production capacity. Moreover, the back plate 128, pad plate 126, and spacer 19 used to support the panel 10 are all reusable.

[0117] Unless the context explicitly requires it, the word "comprising" and similar terms in the specification and claims are considered inclusive, as opposed to exclusive or comprehensive; that is, meaning "including but not limited to." The use of singular or plural terms also includes both singular and plural forms, respectively. Furthermore, the use of the terms "here," "above," "below," and similar terms in this application refers to the entire application and not any particular part thereof. When the expression "or" is used to refer to a list of two or more items, this expression covers all interpretations of the word below: any item in the list, all items in the list, and any combination of items in the list.

[0118] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A processing apparatus for processing a panel, characterized in that, The panel (10) will be divided into multiple sub-panels (10'), the sub-panels (10') being configured as component carriers or multiple component carriers to be individualized, and the processing device (1) includes: Fixing unit (2), the fixing unit (2) being configured to fix the panel (10); A lifting unit (3) located below the panel (10) is configured to cause the panel (10) to detach from the fixing unit (2) when the panel (10) is lifted. Pick-up unit (4) moves above the panel (10) to pick up and transport the panel (10); Collection unit (5) is configured to receive the sub-panel (10') of the panel (10) transported by the pickup unit (4) and to house the sub-panel (10') in the collection unit (5).

2. The processing apparatus for processing a panel according to claim 1, characterized in that, The lifting unit (3) is configured to perform a reciprocating motion between an initial position and a raised position. In the initial position, the lifting unit (3) is located below the panel (10). During the process of the lifting unit (3) moving upward from the initial position to the raised position, the lifting unit (3) raises the panel (10). After the panel (10) is picked up by the picking unit (4), the lifting unit (3) returns downward to the initial position.

3. The processing apparatus for processing a panel according to claim 2, characterized in that, The fixing unit (2) includes a first fixing device (22). A support plate (12) for supporting the panel (10) is provided below the panel (10). The support plate (12) includes a back plate (128) and a pad plate (126). The back plate (128) is placed on the pad plate (126) and directly contacts the lower surface of the panel (10). The first fixing device (22) is provided on the pad plate (126) of the support plate (12) and passes through the first hole (102) provided on the panel (10) and the third hole (124) on the back plate (128) of the support plate (12).

4. The processing apparatus for processing a panel according to claim 3, characterized in that, The lifting unit (3) includes at least one lifting platform (32), and the fixing unit (2) includes a second fixing device (24). The second fixing device (24) is disposed on the lifting platform (32). When it is necessary to lift the panel (10), the second fixing device (24) passes through the second hole (122) provided in the pad (126) of the support plate (12) and contacts the back plate (128) to lift the panel (10).

5. The processing apparatus for processing a panel according to claim 1, characterized in that, The pickup unit (4) includes at least one suction device (42) configured such that when it contacts the surface of the panel (10), a negative pressure is formed inside the suction device (42) to firmly adhere to the surface of the panel (10).

6. The processing apparatus for processing a panel according to claim 1, characterized in that, The processing device (1) further includes a cleaning unit (6) disposed in the loading area and / or unloading area of ​​the processing device (1) to clean the surface of the products entering and / or leaving the processing device (1).

7. The processing apparatus for processing a panel according to claim 1, characterized in that, The processing equipment (1) further includes a transport unit (7), which includes a first transport device (72) and a second transport device (74). The first transport device (72) is configured to transport the product to be processed to the processing equipment (1) and / or transport the processed product away from the processing equipment (1). The second transport device (74) is configured to transport the product to various areas of the processing equipment (1).

8. The processing apparatus for processing a panel according to claim 1, characterized in that, Multiple sub-panels (10') are stored in the collection unit (5) in an up-down stacked manner.

9. The processing apparatus for processing a panel according to claim 4, characterized in that, The first fixing device (22) and the second fixing device (24) of at least one of the fixing units (2) each include at least one pin.

10. The processing apparatus for processing a panel according to any one of claims 1 to 9, characterized in that, The pickup unit (4) is configured to be adjustable in position to accommodate panels (10) of different sizes.

11. The processing apparatus for processing a panel according to any one of claims 1 to 9, characterized in that, The pickup unit (4) includes a suction cup.

12. The processing apparatus for processing a panel according to any one of claims 1 to 9, characterized in that, The surface of the panel (10) is also covered with a protective element (14), and the pickup unit (4) is configured to pick up and remove the protective element (14) and then pick up the protective element (14) and then pick up the protective element (14) and place it in the second collection area (54) of the collection unit (5).

13. The processing apparatus for processing a panel according to claim 12, characterized in that, The protective element (14) includes a protective film (16).

14. The processing apparatus for processing a panel according to claim 13, characterized in that, The protective element (14) also includes a weight element (18) disposed on the protective film (16) to increase the weight of the protective film (16) when the protective film (16) is peeled off.

15. The processing apparatus for processing a panel according to claim 6, characterized in that, The cleaning unit (6) includes a brush (62) and a vacuum suction device (64).

16. The processing apparatus for processing a panel according to claim 7, characterized in that, The first transport device (72) includes a trolley, and the second transport device (74) includes a conveyor belt.

17. The processing apparatus for processing a panel according to claim 1, characterized in that, The lifting unit (3) is driven by a drive mechanism.

18. The processing apparatus for processing a panel according to claim 17, characterized in that, The drive mechanism is an electric motor.

19. The processing apparatus for processing a panel according to claim 3, characterized in that, The lifting unit (3) is configured such that, in the initial position, the lifting unit (3) is located below the panel (10) and at a predetermined distance; and in the raised position, the lifting unit (3) is always in contact with the back plate (128) of the support plate (12) and holds the panel (10).

20. The processing apparatus for processing a panel according to claim 4, characterized in that, The lifting unit (3), the first fixing device (22), and the second fixing device (24) are configured such that after the lifting unit (3) enters the lifting position, the second fixing device (24) detaches the panel from the first fixing device (22) and supports the panel, and the picking process is initiated.

21. The processing apparatus for processing a panel according to claim 8, characterized in that, Each of the stacked sub-panels (10') has spacers at the top and bottom.

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