Radiating fin assembly and radiator comprising same
By designing heat dissipation fins made of composite metal sheets, using a copper-aluminum hybrid material, and setting through holes and guides on the curved surface to form a curved flow channel, the problem of insufficient heat dissipation of existing heat dissipation fins on high-performance CPUs is solved, achieving efficient heat conduction and heat dissipation as well as environmentally friendly production.
Patent Information
- Application Number
- CN202520370770.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-05
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-03-05
AI Technical Summary
Existing heat sinks are insufficient for heat dissipation on high-performance CPUs and other heat-generating chips, making it difficult to meet the requirements for efficient heat conduction and dissipation.
The heat dissipation fins are designed as composite metal sheets, using a copper-aluminum hybrid material. They are bent into two parallel flat sections and a curved section, with through holes and guide sections set in the curved section to form a curved flow channel to change the airflow direction, increase the contact area and heat exchange efficiency.
It improves heat dissipation efficiency, enhances heat transfer, reduces overall weight and cost, and avoids environmental pollution caused by electroplating processes.
Smart Images
Figure CN223872643U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation fin assembly and a heat sink including the heat dissipation fin assembly. Background Technology
[0002] Heat sinks are devices used to dissipate heat from electronic components in electrical appliances. They are usually made of copper or copper alloys and can be in the form of plates, sheets, or multiple sheets. For example, the CPU (Central Processing Unit) of a computer requires a fairly large heat sink.
[0003] With the continuous development of science and technology, the performance of heat source chips such as CPUs is constantly improving. In order to improve the performance release of heat source chips such as CPUs, higher requirements are placed on the heat conduction and heat dissipation performance of computers. How to optimize heat dissipation fins has become an urgent problem to be solved.
[0004] This application addresses at least one of the aforementioned technical problems. Utility Model Content
[0005] The purpose of this utility model is to provide a heat dissipation fin assembly and a heat sink including the heat dissipation fin assembly. The heat dissipation fin assembly improves the heat conduction and heat dissipation effect of electrical equipment through structural design, thereby improving the performance release of electrical equipment.
[0006] The objective of this utility model is achieved through the following technical solution:
[0007] A first aspect of the present invention provides a heat dissipation fin assembly, the heat dissipation fin assembly comprising a plurality of heat dissipation fin units sequentially overlapped along a first direction, the plurality of heat dissipation fin units being arranged in parallel to each other, characterized in that each heat dissipation fin unit is composed of a composite metal sheet bent into two parallel first planar portions and a second planar portion, and a curved portion located between the first planar portions and the second planar portions, the curved portion being provided with a plurality of through holes.
[0008] The first planar portion has a first end and a second end along the first direction, and the second planar portion has a third end and a fourth end along the first direction; one end of the curved portion is connected to the second end of the first planar portion, and the other end of the curved portion is connected to the second end of the second planar portion.
[0009] In two adjacent heat dissipation fin units, including a first heat dissipation fin unit and a second heat dissipation fin unit, the first end of the first planar portion of the first heat dissipation fin unit overlaps with the second end of the first planar portion of the second heat dissipation fin unit; the first end of the second planar portion of the first heat dissipation fin unit overlaps with the second end of the second planar portion of the second heat dissipation fin unit; the curved portions of the first heat dissipation fin unit and the curved portions of the second heat dissipation fin unit are distributed alternately.
[0010] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0011] By creating curved flow channels on the curved surface, the airflow direction is constantly changed within these channels. This change in flow direction helps break down the air boundary layer, thereby enhancing heat transfer. Simultaneously, this dynamic flow increases the contact area between the air and the surface of the individual heatsink fins, making it easier for heat to be transferred from the air to the fins, thus achieving efficient heat exchange. Furthermore, the curved surface has multiple through-holes. On one hand, these through-holes increase the heat dissipation surface area, allowing heat to be dissipated into the air more effectively. On the other hand, the presence of these holes alters the airflow path, increasing the contact area between the air and the surface of the individual heatsink fins, thereby enhancing heat exchange and improving heat dissipation efficiency.
[0012] In some possible embodiments of the first aspect, the curved surface includes a plurality of arc plates arranged sequentially along a second direction, wherein in two adjacent arc plates including a first arc plate and a second arc plate, the opening direction of the first arc plate is opposite to the opening direction of the second arc plate.
[0013] In some possible embodiments of the first aspect, the curved surface is provided with a guide portion communicating with at least a portion of the through hole, the guide portion surrounding a portion of the outer edge of the through hole.
[0014] In some possible embodiments of the first aspect, the thickness T of the composite metal sheet is 0.08 to 0.2 mm.
[0015] In some possible embodiments of the first aspect, the ratio of the distance D between the curved surface portion of the first heat dissipation fin unit and the curved surface portion of the second heat dissipation fin unit to the thickness T of the composite metal sheet is 6 to 10.
[0016] In some possible embodiments of the first aspect, the composite metal sheet comprises stacked copper and aluminum sheets, wherein in the heat dissipation fin unit, the copper sheet is located on the outer side and the aluminum sheet is located on the inner side.
[0017] In some possible embodiments of the first aspect, the thickness ratio of the copper sheet to the aluminum sheet is 3:17.
[0018] A second aspect of this utility model provides a radiator, comprising:
[0019] A copper plate having a first side and a second side opposite each other along the thickness direction, the first side of the copper plate being used to contact a heat source;
[0020] At least one copper heat pipe, one end of each copper heat pipe being connected to the second side of the copper plate;
[0021] At least one heat dissipation fin assembly as described in the first aspect, wherein a first planar portion or a second planar portion of the heat dissipation fin assembly is connected to the other end of the copper heat pipe in a one-to-one correspondence.
[0022] In some possible embodiments of the second aspect, the second side of the copper plate and the copper heat pipe are connected by solder paste.
[0023] In some possible implementations of the second aspect, a spring clip is riveted to each of the four corners of the first side of the copper plate. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the heat sink assembly according to an embodiment of the present invention;
[0025] Figure 2 This is a side view of a single heat dissipation fin unit according to an embodiment of the present invention. Figure 1 ;
[0026] Figure 3 This is a side view of a single heat dissipation fin unit according to an embodiment of the present invention. Figure 2 ;
[0027] Figure 4 This is a schematic diagram of the heat sink in an embodiment of the present invention.
[0028] In the figure, 10 is a single heat dissipation fin; 11 is a first flat part; 12 is a second flat part; 13 is a curved part; 131 is an arc fin; 14 is a guide part; 15 is a through hole; 100 is a heat dissipation fin assembly; 200 is a copper heat pipe; 300 is a copper plate; and 400 is a spring. Detailed Implementation
[0029] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted.
[0030] Combined with appendix Figure 1-3 As shown, a first aspect of this embodiment provides a heat dissipation fin assembly 100, which includes a plurality of heat dissipation fin units 10 sequentially overlapped along a first direction (the first direction may be the length direction of the heat dissipation fin assembly 100). The plurality of heat dissipation fin units 10 are arranged in parallel to each other. Each heat dissipation fin unit 10 is composed of a composite metal sheet bent into two parallel first planar portions 11 and second planar portions 12, and a curved portion 13 located between the first planar portions 11 and the second planar portions 12.
[0031] It should be noted that, in this embodiment, the composite metal sheet includes stacked copper and aluminum sheets. In the heat dissipation fin unit 10, the copper sheet is located on the outer side and the aluminum sheet is located on the inner side.
[0032] First, copper has a thermal conductivity of about 400 W / m·K, while aluminum has a thermal conductivity of 237 W / m·K. This gives both copper and aluminum fins good thermal conductivity, so the copper-aluminum heat sink unit 10 can quickly absorb and diffuse heat, ensuring efficient heat transfer.
[0033] Secondly, copper has a high density (approximately 8.96 g / cm³). 3 Aluminum has a lower density (2.70 g / cm³), while aluminum has a lower density. 3 By using copper-aluminum heat sink units 10, the overall weight can be reduced while ensuring heat dissipation, which is especially important for portable devices such as laptops.
[0034] Furthermore, since copper is generally more expensive than aluminum, the cost of a single copper heatsink fin is even higher. By using a mixture of copper and aluminum, costs can be reasonably controlled without significantly sacrificing heat dissipation performance, thus achieving the best balance between economy and performance.
[0035] In some specific embodiments, the thickness T of the composite metal sheet is 0.08–0.2 mm, for example, it can be 0.08 mm, 0.09 mm, 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm, or 0.2 mm. For example, the thickness T of the composite metal sheet is 0.18 mm.
[0036] Furthermore, the thickness ratio of the copper sheet to the aluminum sheet is 3:17. For example, the thickness of the copper sheet is 0.27 mm and the thickness of the aluminum sheet is 0.153 mm.
[0037] The heat sink unit 10 of this specification not only has good thermal conductivity and heat dissipation effect, but also enables the application of thinner and lighter heat sinks.
[0038] The following is a detailed introduction to the heat sink unit 10, in conjunction with the attached... Figure 2 and 3 As shown, in each heat dissipation fin unit 10, the first planar portion 11 has a first end and a second end along a first direction, and the second planar portion 12 has a third end and a fourth end along the first direction; one end of the curved portion 13 is connected to the second end of the first planar portion 11, and the other end of the curved portion 13 is connected to the second end of the second planar portion 12.
[0039] The following is a detailed introduction to the heat sink assembly 100, in conjunction with the attached... Figure 1 As shown, in two adjacent heat dissipation fin units 10, including a first heat dissipation fin unit and a second heat dissipation fin unit, the first end of the first flat portion 11 in the first heat dissipation fin unit overlaps with the second end of the first flat portion 11 in the second heat dissipation fin unit; the first end of the second flat portion 12 in the first heat dissipation fin unit overlaps with the second end of the second flat portion 12 in the second heat dissipation fin unit; the curved portion 13 in the first heat dissipation fin unit and the curved portion 13 in the second heat dissipation fin unit are distributed alternately.
[0040] Furthermore, the curved surface 13 has multiple through holes 15, the diameter and number of which can be designed according to actual needs. On the one hand, the through holes 15 on the curved surface 13 increase the heat dissipation surface area, allowing heat to be dissipated into the air more effectively. On the other hand, the presence of these holes can alter the airflow path, increasing the contact area between the air and the surface of the heat dissipation fin unit 10, thereby enhancing heat exchange and improving heat dissipation efficiency.
[0041] In addition, the design of the through hole 15 may also enhance the structural strength of the heat sink fin unit 10. In high-temperature environments, the heat sink fin unit 10 may generate stress due to thermal expansion and contraction. The presence of the through hole 15 can disperse these stresses and prevent the heat sink from being damaged by high temperature.
[0042] In some specific embodiments, the curved surface 13 includes a plurality of arc plates 131 arranged sequentially along a second direction (the second direction may be the height direction of the heat dissipation fin assembly 100) (two arc plates 131 are provided in this embodiment). In two adjacent arc plates 131 including a first arc plate and a second arc plate, the opening direction of the first arc plate is opposite to the opening direction of the second arc plate. For example, the opening direction of the first arc plate is the first direction, and the opening direction of the second arc plate is the opposite direction of the first direction.
[0043] The first and second arc-shaped fins, with their openings facing opposite directions, form a curved flow channel. This causes the air to continuously change its flow direction within the curved channel. This change in flow direction helps break down the air boundary layer, thereby enhancing heat transfer. Specifically, when air flows within the wave-shaped heat dissipation fins, it moves like a roller coaster through the wave-shaped channels. This dynamic flow increases the contact area between the air and the surface of the heat dissipation fin unit 10, making it easier for heat to be transferred from the air to the heat dissipation fin unit 10, thus achieving efficient heat exchange.
[0044] In some specific embodiments, the curved surface 13 is provided with a guide portion 14 that communicates with at least part of the through hole 15. The presence of the guide portion 14 can further optimize the flow path, increase the contact area between air and the surface of the heat dissipation fin unit 10, thereby enhancing the heat exchange effect and improving the heat dissipation efficiency.
[0045] Furthermore, the guide section 14 is partially surrounding the outer edge of the through hole 15. This is to ensure the air diffusion speed, ensure heat exchange efficiency, and take into account the dual optimization design of increasing the heat dissipation surface area and reducing wind resistance.
[0046] In some specific embodiments, the ratio of the distance D between the curved surface portion 13 in the first heat dissipation fin unit 10 and the curved surface portion 13 in the second heat dissipation fin unit 10 to the thickness T of the composite metal sheet is 6 to 10. For example, it can be 6, 7, 8, 9, or 10. Exemplarily, the ratio is 10, and the distance D is 1.8 mm. The heat dissipation fin assembly 100 with this specification not only has good thermal conductivity and heat dissipation capabilities but also reduces wind resistance, ensures airflow, and guarantees heat exchange efficiency.
[0047] The second aspect of this embodiment, in conjunction with the appendix Figure 4 As shown, a heat sink is provided, including a copper plate 300, at least one copper heat pipe 200, and at least one heat dissipation fin assembly 100 in the first aspect.
[0048] The copper plate 300 has a first surface and a second surface opposite each other along the thickness direction, and the first surface of the copper plate 300 is used to contact a heat source.
[0049] It should be noted that the heat source could be the laptop's CPU.
[0050] At least one copper heat pipe 200 is provided, with one end of each copper heat pipe 200 connected to the second surface of a copper plate 300. In this embodiment, two copper heat pipes 200 are symmetrically distributed along the center line of the copper plate 300, wherein the second surface of the copper plate 300 and the copper heat pipes 200 are connected by solder paste.
[0051] At least one heat dissipation fin assembly 100 is provided, and the first planar portion 11 or the second planar portion 12 of the heat dissipation fin assembly 100 is connected to the other end of the copper heat pipe 200 in a one-to-one correspondence. In this embodiment, two heat dissipation fin assemblies 100 are provided, which are symmetrically distributed along the center line of the copper plate 300.
[0052] The CPU generates heat due to its high-efficiency operation. This heat is dissipated to the heat sink assembly 100 through the heat transfer between the copper plate 300 and the copper heat pipe 200. Since the laptop is equipped with a fan to assist in heat dissipation, the airflow direction can be the same as the first direction. At this time, the presence of the through hole 15 in the heat sink assembly 100 can change the airflow path, increase the contact area between the air and the surface of the heat sink unit 10, thereby enhancing the heat exchange effect and improving the heat dissipation efficiency.
[0053] Furthermore, the first and second arc-shaped fins 131, with their opening directions opposite, form a curved flow channel. This causes the air to continuously change its flow direction within the curved channel. This change in flow direction helps break down the air boundary layer, thereby enhancing the heat transfer effect. Specifically, when air flows within the wave-shaped heat dissipation fins, it moves through the wave-shaped channels like a roller coaster. This dynamic flow increases the contact area between the air and the surface of the heat dissipation fin unit 10, making it easier for heat to be transferred from the air to the heat dissipation fin unit 10, thus achieving efficient heat exchange.
[0054] It should be noted that in existing technologies, a copper base combined with aluminum fins is typically used. The copper base is in close contact with the heat source, such as the CPU, for rapid heat conduction. Then, the large-area expansion of the aluminum fins transfers the heat to the air. However, the aluminum fins and copper base are usually combined using electroplating, a process that generates pollution and is very environmentally unfriendly. Therefore, this embodiment combines the copper sheets within the heat sink fin assembly 100 with the copper plate 300 by welding, avoiding the pollution caused by the electroplating process and making it more environmentally friendly.
[0055] In some specific embodiments, a spring clip 400 is riveted to each of the four corners of the first surface of the copper plate 300.
[0056] Since the CPU is connected to the motherboard, there is a height difference between the contact connection between the copper plate 300 and the CPU. The copper plate 300 is fixed to the CPU by a detachable connection (e.g., a threaded connection) with the motherboard through the spring contact 400, ensuring the bonding strength between the copper plate 300 and the CPU, ensuring that the heatsink can play a good role in heat conduction and heat dissipation for the CPU, and ensuring the CPU's performance release.
[0057] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention without departing from the principles and spirit of the present invention, and all such changes should fall within the protection scope of the claims of the present invention.
Claims
1. A heat dissipation fin assembly (100), comprising a plurality of heat dissipation fin units (10) sequentially overlapping each other along a first direction, the plurality of heat dissipation fin units (10) being arranged parallel to each other, characterized in that, Each heat dissipation fin unit (10) is composed of a composite metal sheet bent into two parallel first planar portions (11) and second planar portions (12), and a curved portion (13) located between the first planar portions (11) and the second planar portions (12), wherein the curved portion (13) is provided with a plurality of through holes (15). The first planar portion (11) has a first end and a second end along the first direction, and the second planar portion (12) has a third end and a fourth end along the first direction; one end of the curved portion (13) is connected to the second end of the first planar portion (11), and the other end of the curved portion (13) is connected to the second end of the second planar portion (12); In two adjacent heat dissipation fin units (10), including a first heat dissipation fin unit and a second heat dissipation fin unit, the first end of the first planar portion (11) in the first heat dissipation fin unit overlaps with the second end of the first planar portion (11) in the second heat dissipation fin unit; the first end of the second planar portion (12) in the first heat dissipation fin unit overlaps with the second end of the second planar portion (12) in the second heat dissipation fin unit; the curved portion (13) in the first heat dissipation fin unit and the curved portion (13) in the second heat dissipation fin unit are distributed alternately.
2. The heat dissipation fin assembly according to claim 1, characterized in that, The curved surface (13) includes a plurality of arc plates (131) arranged sequentially along the second direction. In two adjacent arc plates (131) including the first arc plate and the second arc plate, the opening direction of the first arc plate is opposite to the opening direction of the second arc plate.
3. The heat dissipation fin assembly according to claim 1, characterized in that, The curved surface (13) is provided with a guide portion (14) that communicates with at least a portion of the through hole (15), the guide portion (14) surrounding a portion of the outer edge of the through hole (15).
4. The heat dissipation fin assembly according to claim 1, characterized in that, The thickness T of the composite metal sheet is 0.08~0.2mm.
5. The heat dissipation fin assembly according to claim 4, characterized in that, The ratio of the distance D between the curved surface (13) in the first heat dissipation fin unit and the curved surface (13) in the second heat dissipation fin unit to the thickness T of the composite metal sheet is 6~10.
6. The heat dissipation fin assembly according to any one of claims 1-5, characterized in that, The composite metal sheet includes stacked copper and aluminum sheets, with the copper sheet located on the outer side and the aluminum sheet located on the inner side in the heat dissipation fin unit (10).
7. The heat dissipation fin assembly according to claim 6, characterized in that, The thickness ratio of the copper sheet to the aluminum sheet is 3:
17.
8. A radiator, characterized in that, include: A copper plate (300) having a first surface and a second surface opposite each other along the thickness direction, the first surface of the copper plate (300) being used to contact a heat source; At least one copper heat pipe (200), one end of each copper heat pipe (200) being connected to the second side of the copper plate (300); At least one heat sink assembly (100) according to claim 7, wherein the first planar portion (11) or the second planar portion (12) of the heat sink assembly (100) is connected to the other end of the copper heat pipe (200) in a one-to-one correspondence.
9. The radiator according to claim 8, characterized in that, The second side of the copper plate (300) and the copper heat pipe (200) are connected by solder paste.
10. The radiator according to claim 8, characterized in that, A spring clip (400) is riveted to each of the four corners of the first surface of the copper plate (300).