Electronic packaging structure, optical coupler and electronic equipment
By using a fixing component to fix the first and second electronic components on the pin frame in the optocoupler package, the problems of complex packaging process and high process difficulty are solved, and the effects of simplified packaging and improved production efficiency are achieved.
Patent Information
- Application Number
- CN202423323331.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing optocoupler packaging processes are complex and technically challenging, resulting in low production efficiency.
An electronic packaging structure is provided, including a first electronic component, a second electronic component, a fixing member, a first pin header, and a second pin header. The fixing member fixes the first electronic component and the second electronic component on the pin header, ensuring that their relative positions remain unchanged, simplifying the packaging process and reducing the difficulty of manufacturing.
This achieves a simple and reliable packaging structure, reduces the difficulty of the packaging process, and improves production efficiency.
Smart Images
Figure CN223872678U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application belongs to the technical field of semiconductor devices, and particularly relates to an electronic packaging structure, an optical coupler and an electronic device. BACKGROUND
[0002] The optical coupler is also called photoelectric isolator or photoelectric coupler, and is referred to as optical coupler for short. The optical coupler is a device for transmitting electrical signals by using light as a medium. The optical coupler usually includes a transmitting end and a receiving end packaged in the same shell. The transmitting end and the receiving end are respectively infrared transmitting chips and output photosensitive chips. When an electrical signal is input, the infrared transmitting chip emits light, and the output photosensitive chip generates photoelectric current after receiving the light, and the photoelectric current flows out from the output end, thereby realizing the conversion of electrical-optical-electrical. The optical coupler has the advantages of small size, long service life, no contact, strong anti-interference ability, high insulation strength between the output and the input, and one-way signal transmission, and is widely used in digital circuits.
[0003] In the packaging preparation process of the optical coupler, the packaging of the optical coupler needs to first fix any one of the transmitting end and the receiving end, and then align the other one before plastic packaging. However, this packaging method needs to fix the transmitting end and the receiving end respectively, and at the same time, the relative positions of the transmitting end and the receiving end should not change, which leads to a complex packaging process, high process difficulty and low production efficiency. CONTENT OF THE INVENTION
[0004] Embodiments of the present application provide an electronic packaging structure, aiming to solve the problem of low production efficiency caused by the complex packaging process and high process difficulty of the existing electronic packaging structure.
[0005] The embodiments of the present application are implemented in the following manner. An electronic packaging structure is provided, which includes:
[0006] a first electronic component having a first contact point;
[0007] a second electronic component having a second contact point;
[0008] a fixing member, the first electronic component and the second electronic component are arranged on the fixing member, and the first electronic component is used to couple with the second electronic component;
[0009] a first pin holder; and
[0010] a second pin holder;
[0011] The fixing member is arranged on at least one of the first pin holder and the second pin holder, the first contact point is electrically connected with the first pin holder, and the second contact point is electrically connected with the second pin holder.
[0012] Further, the first electronic component is arranged relative to the second electronic component.
[0013] Further, the fixing member is a transparent substrate, the transparent substrate has a first surface and a second surface opposite to the first surface, the first surface is provided with a first mounting position, and the second surface is provided with a second mounting position opposite to the first mounting position.
[0014] The first electronic component is a light emitting component, and the light emitting component is arranged in the first mounting position.
[0015] The second electronic component is a light receiving component, and the light receiving component is arranged in the second mounting position.
[0016] The transparent substrate is arranged on at least one of the first pin frame and the second pin frame.
[0017] Further, at least one of the first pin frame and the second pin frame is provided with an arch part, and the fixing member is attached to the arch part.
[0018] Further, the electronic packaging structure further comprises a shell, the shell is used for plastic packaging the first electronic component, the second electronic component and the fixing member, and the first pin frame and the second pin frame both partially extend out of the shell.
[0019] Further, the first contact and the first pin frame are electrically connected through a bonding wire, and the second contact and the second pin frame are electrically connected through a bonding wire.
[0020] Further, the first pin frame and the second pin frame are arranged in the same plane.
[0021] In a second aspect, the application further provides an optical coupler comprising the electronic packaging structure.
[0022] In a third aspect, the application further provides an electronic device comprising the electronic packaging structure.
[0023] The electronic packaging method provided by the application comprises a first electronic component having a first contact, a second electronic component having a second contact, a fixing member, a first pin frame and a second pin frame. The first electronic component and the second electronic component are arranged on the fixing member, and the first electronic component is used for coupling with the second electronic component. The fixing member is arranged on at least one of the first pin frame and the second pin frame, the first contact is electrically connected with the first pin frame, and the second contact is electrically connected with the second pin frame. The fixing member is arranged on at least one of the first pin frame and the second pin frame, so that the relative position between the first electronic component and the second electronic component will not change, the packaging structure is simple and reliable, the packaging process is low in difficulty, and the production efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS
[0024] Fig. 1 is a structural schematic diagram of an embodiment of the electronic packaging structure provided by the application;
[0025] Fig. 2 is a schematic view of a structure in which a fixing member is fixed to a lead frame according to an embodiment of the electronic package structure provided by the present application;
[0026] Fig. 3 is a schematic view of a structure in which a fixing member is fixed to a lead frame according to another embodiment of the electronic package structure provided by the present application;
[0027] Fig. 4 is a schematic view of a structure including a housing according to an embodiment of the electronic package structure provided by the present application.
[0028] BRIEF DESCRIPTION OF DRAWINGS DETAILED DESCRIPTION
[0029] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. The examples of the embodiments are shown in the drawings, wherein identical or similar labels denote identical or similar elements or elements having identical or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation to the present application. In addition, it should be understood that the specific embodiments described herein are only used to explain the present application, and cannot be used to limit the present application.
[0030] In the description of the present application, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation to the present application.
[0031] In addition, the terms "first", "second" are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.
[0032] In the description of the application, it is necessary to point out that, unless otherwise explicitly specified and limited, the terms "mount", "connect", "connection" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.
[0033] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0034] The following disclosure provides many different embodiments or examples for implementing different structures of the application. In order to simplify the disclosure of the application, the components and arrangements of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the application. In addition, the application can repeatedly refer to numerical values and / or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not in itself indicate a relationship between the various embodiments and / or arrangements being discussed. In addition, the application provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.
[0035] The electronic packaging structure provided by the application comprises a first electronic component, a second electronic component, a fixing member, a first pin frame and a second pin frame. The first electronic component has a first contact, the second electronic component has a second contact, the first electronic component and the second electronic component are arranged on the fixing member, the first electronic component is used to couple with the second electronic component, the fixing member is arranged on at least one of the first pin frame and the second pin frame, the first contact is electrically connected with the first pin frame, and the second contact is electrically connected with the second pin frame. The application fixes the first electronic component and the second electronic component on the fixing member, and the fixing member is arranged on at least one of the first pin frame and the second pin frame, so as to ensure that the relative position between the first electronic component and the second electronic component will not change. The packaging structure is simple and reliable, the packaging process is low in difficulty, and the production efficiency is improved.
[0036] As Figs. 1 to 4As shown, one embodiment of the present application provides an electronic package structure, comprising:
[0037] a first electronic component 100 having a first contact;
[0038] a second electronic component 200 having a second contact;
[0039] a fixing member 300, the first electronic component 100 and the second electronic component 200 are arranged on the fixing member 300, and the first electronic component 100 is used to couple with the second electronic component 200;
[0040] a first pin holder 400; and
[0041] a second pin holder 500;
[0042] the fixing member 300 is arranged on at least one of the first pin holder 400 and the second pin holder 500, the first contact is electrically connected with the first pin holder 400, and the second contact is electrically connected with the second pin holder 500.
[0043] In implementation, the electronic package structure provided by the present application refers to a structure of an electronic component, wherein the fixing member 300 can be regarded as a substrate of the electronic component, and is used to support other components, for example, the fixing member 300 can support the first electronic component 100 and the second electronic component 200.
[0044] The first electronic component 100 and the second electronic component 200 are fixed on two sides of the fixing member 300 to couple the first electronic component 100 and the second electronic component 200.
[0045] Optionally, the first electronic component 100 and the second electronic component 200 can be any one of optical coupling, electromagnetic coupling or energy coupling, without limitation. For example, the first electronic component 100 and the second electronic component 200 can adopt optical coupling components (such as light emitting elements and light receiving elements), inductors or capacitors and other components that can realize coupling between the two, that is, the first electronic component 100 and the second electronic component 200 can be any one of optical coupling, electromagnetic coupling or energy coupling, without limitation. That is, the electronic components composed of the first electronic component 100 and the second electronic component 200 can be optical couplers, inductors, transformers, capacitors and the like.
[0046] In some embodiments, the first electronic component 100 and the second electronic component 200 can be fixed on the fixing member 300 by an adhesive, which includes but is not limited to epoxy resin or other materials with adhesive properties.
[0047] Optionally, the first electronic component 100 has first contacts, which can be seen as pads of the first electronic component 100, and the second electronic component 200 has second contacts, which can be seen as pads of the second electronic component 200, for soldering with external circuits or other structural components to realize electrical connection.
[0048] It should be noted that the number of the first contacts is greater than or equal to 1, and for an optical coupling device, the number of the first contacts is two, and for an inductor coil, the number of the first contacts is also two. Of course, the number of the first electronic components 100 on the fixing member 300 can also be multiple, and the number of the corresponding first contacts is also multiple.
[0049] The electronic packaging structure further comprises a first pin holder 400 and a second pin holder 500, wherein the first pin holder 400 and the second pin holder 500 refer to pin terminals of the electronic components, for electrical connection with external circuits.
[0050] In some embodiments, the first pin holder 400 and the second pin holder 500 are disposed in the same plane, facilitating electrical connection with external circuits.
[0051] In implementation, the fixing member 300 can be fixedly connected with the first pin holder 400, or the fixing member 300 can be fixedly connected with the second pin holder 500, or the fixing member 300 can be fixedly connected with both the first pin holder 400 and the second pin holder 500.
[0052] The first contacts are electrically connected with the first pin holder 400, and the second contacts are electrically connected with the second pin holder 500, for example, the first contacts are soldered with the first pin holder 400, and the second contacts are soldered with the second pin holder 500.
[0053] As a possible implementation, the first contacts and the second contacts can be further provided with solder paste or the like, facilitating soldering connection of the contacts and the corresponding pin holders.
[0054] In some possible embodiments, the first contacts and the first pin holder 400 are electrically connected through bonding wires 600, and the second contacts and the second pin holder 500 are also electrically connected through the bonding wires 600.
[0055] The electronic packaging method provided in the application comprises the following steps: providing a fixing member 300; arranging a first electronic component 100 and a second electronic component 200 on the fixing member 300, the first electronic component 100 being used for coupling with the second electronic component 200, the first electronic component 100 having a first contact, and the second electronic component 200 having a second contact; providing a first pin frame 400 and a second pin frame 500; arranging the fixing member 300 on at least one of the first pin frame 400 and the second pin frame 500, and electrically connecting the first contact with the first pin frame 400 and electrically connecting the second contact with the second pin frame 500. The application can ensure that the relative position between the first electronic component 100 and the second electronic component 200 will not change, simplify the packaging process, reduce the difficulty of the packaging process, and improve the production efficiency by arranging the first electronic component 100 and the second electronic component 200 on the fixing member 300 first, and then arranging the fixing member 300 on at least one of the first pin frame 400 and the second pin frame 500.
[0056] In some embodiments, the first electronic component 100 is arranged relative to the second electronic component 200.
[0057] The relative arrangement of the first electronic component 100 and the second electronic component 200 means that the positions of the first electronic component 100 and the second electronic component 200 at least partially coincide with each other, for example, the first electronic component 100 is arranged on a first side surface of the fixing member 300, and the second electronic component 200 is arranged on a second side surface of the fixing member 300, so that the projection of the first electronic component 100 on the second side surface of the fixing member 300 at least partially coincides with the second electronic component 200, preferably completely coincides with the second electronic component 200.
[0058] Through the above arrangement, the coupling degree between the first electronic component 100 and the second electronic component 200 can be ensured, and the energy loss can be reduced.
[0059] In some embodiments, the fixing member 300 is a transparent substrate, the transparent substrate has a first surface and a second surface arranged opposite to the first surface, the first surface is provided with a first mounting position, and the second surface is provided with a second mounting position, the second mounting position being arranged opposite to the first mounting position.
[0060] The first electronic component 100 is a light-emitting component, and the light-emitting component is arranged on the first mounting position.
[0061] The second electronic component 200 is a light-receiving component, and the light-receiving component is arranged on the second mounting position.
[0062] The transparent substrate is arranged on at least one of the first pin frame 400 and the second pin frame 500.
[0063] The electronic packaging structure provided by the application is an optical coupling, wherein the first electronic component 100 is a light emitting component, for example, the first electronic component 100 is a light emitting diode or other light emitting component, and the second electronic component 200 is a light receiving component, for example, the second electronic component 200 is a photoresistor, a photodiode or a phototriode.
[0064] The fixing member 300 adopts a transparent substrate, so that the light emitted by the light emitting component can be transmitted through the fixing member 300 to the light receiving component, thereby realizing optical coupling between the light emitting component and the light receiving component.
[0065] Optionally, the transparent substrate comprises at least one of a silicone material, an epoxy material, glass and sapphire.
[0066] Optionally, taking the light emitting component as a light emitting diode, the light emitting diode generates light with a peak emission wavelength of 370nm to 490nm, for example, the wavelength of the light emitted by the light emitting diode is 370nm, 380nm, 390nm, 400nm, 410nm, 420nm, 430nm, 440nm, 450nm, 460nm or any value in the range of 370nm to 490nm, without limitation.
[0067] In some embodiments, at least one of the first pin holder 400 and the second pin holder 500 is provided with an arch portion, and the fixing member 300 is attached to the arch portion.
[0068] By providing the arch portion, the fixing member 300 can be better supported to be in a suspended state with the first electronic component 100 and the second electronic component 200, thereby facilitating wiring and soldering.
[0069] In some embodiments, the application further comprises a housing 700, which is used to encapsulate the first electronic component 100, the second electronic component 200 and the fixing member 300, and the first pin holder 400 and the second pin holder 500 are partially extended out of the housing 700.
[0070] In implementation, the housing 700 can adopt plastic, which is low in price and can be freely plasticized.
[0071] Optionally, the housing 700 can also adopt a combination material of aluminum alloy and plastic, wherein the aluminum alloy material has good mechanical properties and corrosion resistance, can ensure the stability and corrosion resistance of the electronic components in a high temperature and high pressure environment, and also has good heat conduction performance, so that the electronic components can be quickly cooled during use and are not prone to overheating.
[0072] In some embodiments, one end of the first pin holder 400 and the second pin holder 500 extends out of the shell 700. Since the shell 700 has a certain thickness, the free end of the first pin holder 400 and the second pin holder 500 can be bent and cut to be flush with the outer surface of the shell 700, so that the free end of the pin holder can be better electrically connected to the pads on the PCB or other circuit lines.
[0073] As a possible implementation, the free end of the pin holder can also be designed to extend beyond the outer surface of the shell 700. When the electronic component is mounted on the circuit board, the free end of the pin holder is electrically connected to the pads on the circuit board, and the shell 700 is lifted to ensure that the electronic component has sufficient heat dissipation space.
[0074] In some alternative embodiments, the present application also provides an optocoupler comprising the electronic packaging structure as described above.
[0075] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the structure and implementation principle of the optocoupler described above can refer to the corresponding structure and implementation principle in the foregoing embodiments, which will not be described here.
[0076] The electronic packaging method provided by the present application comprises the following steps: providing a fixing member 300; arranging a first electronic component 100 and a second electronic component 200 on the fixing member 300, the first electronic component 100 being used to be coupled with the second electronic component 200, the first electronic component 100 having a first contact, and the second electronic component 200 having a second contact; providing a first pin holder 400 and a second pin holder 500; arranging the fixing member 300 on at least one of the first pin holder 400 and the second pin holder 500, and electrically connecting the first contact with the first pin holder 400 and the second contact with the second pin holder 500. The present application first fixes the first electronic component 100 and the second electronic component 200 on the fixing member 300, and then fixes the fixing member 300 on at least one of the first pin holder 400 and the second pin holder 500, so as to ensure that the relative position between the first electronic component 100 and the second electronic component 200 does not change, simplify the packaging process, reduce the difficulty of packaging technology, and improve the production efficiency.
[0077] In some alternative embodiments, the present application also provides an electronic device comprising the electronic packaging structure as described above.
[0078] In implementation, the electronic device includes but is not limited to a communication device, a smart device, a power supply, or a device for automotive electrical equipment, medical equipment, household appliances, and the like, without specific limitation.
[0079] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the structure and implementation principle of the electronic device described above can refer to the corresponding structure and implementation principle in the foregoing embodiments, and will not be repeated here.
[0080] The electronic packaging method provided in the application comprises the following steps: providing a fixing member 300; arranging a first electronic component 100 and a second electronic component 200 on the fixing member 300, the first electronic component 100 being used to be coupled with the second electronic component 200, the first electronic component 100 having a first contact, and the second electronic component 200 having a second contact; providing a first pin frame 400 and a second pin frame 500; arranging the fixing member 300 on at least one of the first pin frame 400 and the second pin frame 500, and electrically connecting the first contact with the first pin frame 400 and electrically connecting the second contact with the second pin frame 500. The application firstly fixes the first electronic component 100 and the second electronic component 200 on the fixing member 300, and then fixes the fixing member 300 on at least one of the first pin frame 400 and the second pin frame 500, so as to ensure that the relative position between the first electronic component 100 and the second electronic component 200 will not change, simplify the packaging process, reduce the packaging process difficulty, and improve the production efficiency.
[0081] The above are only the preferred embodiments of the application, and are not used to limit the application, and any modification, equivalent replacement and improvement made within the spirit and principle of the application should be included in the protection scope of the application.
Claims
1. An electronic packaging structure, characterized in that, include: The first electronic component has a first contact; The second electronic component has a second contact; A fixing member is provided on the fixing member, and the first electronic component and the second electronic component are both disposed on the fixing member. The first electronic component is used to couple with the second electronic component. First pin frame; and Second pin frame; The fixing member is disposed on at least one of the first pin frame and the second pin frame, the first contact is electrically connected to the first pin frame, and the second contact is electrically connected to the second pin frame.
2. The electronic packaging structure as described in claim 1, characterized in that, The first electronic component is positioned relative to the second electronic component.
3. The electronic packaging structure as described in claim 1, characterized in that, The fastener is a transparent substrate, which has a first surface and a second surface opposite to the first surface. The first surface is provided with a first mounting position, and the second surface is provided with a second mounting position, which is opposite to the first mounting position. The first electronic component is a light-emitting component, and the light-emitting component is disposed at the first mounting position; The second electronic component is a light-receiving component, and the light-receiving component is disposed at the second mounting position; The transparent substrate is disposed on at least one of the first pin frame and the second pin frame.
4. The electronic packaging structure as described in claim 1, characterized in that, At least one of the first pin holder and the second pin holder is provided with an arch, and the fastener is attached to the arch.
5. The electronic packaging structure as described in claim 1, characterized in that, It also includes a housing for encapsulating the first electronic component, the second electronic component, and the fixing member, wherein both the first lead frame and the second lead frame partially extend out of the housing.
6. The electronic packaging structure as described in claim 1, characterized in that, The first contact and the first pin frame, as well as the second contact and the second pin frame, are electrically connected by bonding leads.
7. The electronic packaging structure as described in claim 1, characterized in that, Both the first pin holder and the second pin holder are placed on the same plane.
8. An optical coupler, characterized in that, Includes the electronic packaging structure as described in any one of claims 1 to 7.
9. An electronic device, characterized in that, Includes the electronic packaging structure as described in any one of claims 1 to 7.