Packaging equipment for synchronously packaging multiple chips

By designing a packaging device that includes a base, adjustment platform, and mounting bracket, and utilizing a hydraulic rod and sliding block structure, the problems of slow movement speed and insufficient stability of existing chip packaging equipment are solved, achieving efficient and stable chip packaging.

CN223872713UActive Publication Date: 2026-02-03SHANGHAI BENXIN SEMICON TECH CO LTD
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Patent Information

Application Number
CN202520457016.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-17
Publication Date
2026-02-03
Estimated Expiration
2035-03-17

AI Technical Summary

Technical Problem

Existing chip packaging equipment cannot effectively move the chip during packaging, resulting in slow packaging speed and insufficient stability. It is prone to shaking, which affects the packaging accuracy.

Method used

The packaging equipment design includes a base, adjustment platform and mounting bracket. It uses hydraulic rods and sliding block structure to achieve stable chip movement, and improves packaging efficiency and stability through sliding displacement.

Benefits of technology

It achieves efficient movement and stability in chip packaging, improves packaging accuracy, reduces shaking, and enhances the overall performance of packaging equipment.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223872713U_ABST
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Abstract

The utility model discloses packaging equipment for multi-chip synchronous packaging, which comprises a device body, the device body comprises a base device, an adjusting platform device and a mounting rack device, the adjusting platform device is mounted in the base device, and the mounting rack device is mounted at the rear end of the base device; the adjusting platform device comprises a fixing table, a first hydraulic rod and a second hydraulic rod, a sliding block is arranged at the bottom of the fixing table and is of a square structure, a set of sliding openings distributed symmetrically are formed in the side face of the sliding block, and a sliding rod is inserted into the sliding openings in a penetrating mode and is of a cylindrical structure; the bottom of the sliding block is provided with a set of connecting blocks which are symmetrically distributed, the connecting blocks are of a U-shaped structure, the first hydraulic rod and the second hydraulic rod are symmetrically distributed, and the driving end of the first hydraulic rod and the driving end of the second hydraulic rod are connected with the set of connecting blocks correspondingly. According to the device, the chip can be effectively shifted when the chip is packaged, so that the chip packaging efficiency of packaging equipment is improved.
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Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, specifically to a packaging device for simultaneous packaging of multiple chips. Background Technology

[0002] The casing used to mount semiconductor integrated circuit chips serves to house, fix, seal, and protect the chips, as well as enhance their electrical and thermal performance. It also acts as a bridge between the internal world of the chip and external circuits. The contacts on the chip are connected to the pins of the package via wires, and these pins, in turn, connect to other devices via wires on the printed circuit board. Therefore, packaging plays a crucial role in CPUs and other LSI integrated circuits.

[0003] Existing chip packaging equipment has the following drawbacks:

[0004] 1. Existing chip packaging equipment cannot effectively move the chip during packaging, resulting in slow chip packaging speed;

[0005] 2. Existing chip packaging equipment lacks stability, which can easily lead to shaking and affect chip packaging.

[0006] Therefore, a solution is needed. Utility Model Content

[0007] (a) Technical problems to be solved

[0008] In view of the shortcomings of the prior art, this utility model provides a packaging device for multi-chip synchronous packaging, so as to solve the problems mentioned in the background art.

[0009] (II) Technical Solution

[0010] To achieve the above objectives, this utility model provides the following technical solution: a packaging device for multi-chip synchronous packaging, comprising a device body, the device body including a base device, an adjustment platform device, and a mounting bracket device, the adjustment platform device being installed inside the base device, and the mounting bracket device being installed at the rear end of the base device; the adjustment platform device including a fixed platform, a first hydraulic rod, and a second hydraulic rod, the bottom of the fixed platform being provided with a sliding block, the sliding block having a square shape, the side of the sliding block having a set of symmetrically distributed sliding openings, the sliding rods being cylindrical structures inserted into the sliding openings, the bottom of the sliding block having a set of symmetrically distributed connecting blocks, the connecting blocks having a U-shaped structure, the first hydraulic rod and the second hydraulic rod being symmetrically distributed, the driving ends of the first hydraulic rod and the second hydraulic rod being respectively connected to a set of connecting blocks.

[0011] Preferably, a limiting groove is provided on the top of the fixed platform. The limiting groove has a square shape and a plurality of limiting holes are provided inside the limiting groove.

[0012] Preferably, the base device includes a base plate and a support plate. The support plate is provided in a set, and the set of support plates is symmetrically installed on the top of the base plate. Between the base plate and the support plate, there are several sets of reinforcing blocks distributed horizontally at equal intervals. The reinforcing blocks have a triangular shape. The base plate has mounting feet on both the left and right sides. The mounting feet have a trapezoidal shape and several sets of fixing holes on their surface.

[0013] Preferably, the mounting bracket device includes a support frame, a top mounting plate, and a packaging device. The support frame has a U-shaped structure, the top mounting plate is mounted on the top of the support frame, and the packaging device is mounted on the top of the top mounting plate.

[0014] (III) Beneficial Effects

[0015] This invention provides a packaging device for simultaneous multi-chip packaging. It has the following advantages:

[0016] The packaging equipment for multi-chip synchronous packaging in this solution can effectively shift the chip during chip packaging, thereby improving the efficiency of chip packaging. Moreover, this device uses a sliding movement method, which can ensure the stability of movement, reduce shaking, and greatly improve the accuracy of chip packaging. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the adjustment platform device of this utility model;

[0019] Figure 3 This is a schematic diagram of the base device of this utility model.

[0020] In the diagram, 1. Device body; 2. Base device; 3. Adjustment platform device; 4. Mounting frame device; 5. Fixing platform; 6. First hydraulic rod; 7. Second hydraulic rod; 8. Sliding block; 9. Connecting block; 10. Sliding port; 11. Sliding rod; 12. Limiting groove; 13. Limiting hole; 14. Base plate; 15. Support plate; 16. Mounting foot; 17. Reinforcing block; 18. Fixing hole; 19. Support frame; 20. Top mounting plate; 21. Packaging equipment. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-3 This utility model provides a technical solution:

[0023] Example 1

[0024] Regarding the problem 1 that needs to be solved: existing chip packaging equipment cannot effectively move the chip during packaging, resulting in slow chip packaging speed.

[0025] The solution is as follows: A packaging device for multi-chip synchronous packaging includes a device body 1. The device body 1 includes a base device 2, an adjustment platform device 3, and a mounting bracket device 4. The adjustment platform device 3 is installed inside the base device 2, and the mounting bracket device 4 is installed at the rear end of the base device 2. The adjustment platform device 3 includes a fixed platform 5, a first hydraulic rod 6, and a second hydraulic rod 7. The bottom of the fixed platform 5 is provided with a sliding block 8, which has a square shape. The side of the sliding block 8 has a set of symmetrically distributed sliding openings 10, and a sliding rod 11 with a cylindrical structure is inserted into the sliding opening 10. The bottom of the sliding block 8 is provided with a set of symmetrically distributed connecting blocks 9, which have a U-shaped structure. The first hydraulic rod 6 and the second hydraulic rod 7 are symmetrically distributed. The driving ends of the first hydraulic rod 6 and the second hydraulic rod 7 are respectively connected to a set of connecting blocks 9. During packaging, the packaging equipment 21 packages the chip on the motherboard. Then, the first hydraulic rod 6 is activated, and its driving end moves to the right, causing the entire fixed platform 5 to slide to the right on a set of sliding rods 11. When sliding to the right, the driving end of the second hydraulic rod 7 also retracts to the right, thereby improving stability. When the fixed platform 5 moves to the left, the driving end of the second hydraulic rod 7 pushes out to the left, and the first hydraulic rod 6 can retract, thereby causing the entire fixed platform 5 to move to the left. In this way, the chip position can be shifted, making it easier for the packaging equipment to perform the packaging work.

[0026] The top of the fixed platform 5 has a limiting groove 12, which is square in shape. The limiting groove 12 has several sets of limiting holes 13. When in use, the operator can put the motherboard into the limiting groove 12 in the fixed platform 5, and then use screws to insert into the limiting holes 13 to fix the motherboard.

[0027] The base device 2 includes a base plate 14 and a support plate 15. The support plate 15 is provided in a set, and the set of support plates 15 is symmetrically installed on the top of the base plate 14. Between the base plate 14 and the support plate 15, there are several sets of reinforcing blocks 17 distributed in a horizontally equidistant manner. The reinforcing blocks 17 have a triangular shape. The base plate 14 has mounting feet 16 on both the left and right sides. The mounting feet 16 have a trapezoidal shape and several sets of fixing holes 18 on their surface. The set of support plates 15 in the base device 2 is for installing the adjustment platform device 3, while the machine blocks 17 can improve the structural strength between the base plate 14 and the support plate 15.

[0028] The mounting bracket device 4 includes a support frame 19, a top mounting plate 20, and a packaging device 21. The support frame 19 has a U-shaped structure. The top mounting plate 20 is installed on the top of the support frame 19, and the packaging device 21 is installed on the top of the top mounting plate 20. The support frame 19 is for supporting the top mounting plate 20, and the top mounting plate 20 is for installing the packaging device 21, thereby facilitating the packaging device 21 to perform packaging work on the chips on the fixed stage 5.

[0029] Example 2

[0030] Regarding the second problem to be solved above: the existing chip packaging equipment is not stable enough, which can easily cause shaking and affect chip packaging.

[0031] The solution is as follows: This device uses sliding block 8 and sliding block 11 in cooperation to improve the stability of the entire fixed platform 5 during movement, reduce shaking, and improve accuracy.

[0032] Working principle: During operation, the operator places the motherboard into the limiting groove 12 within the fixed platform 5, and then uses screws inserted into the limiting holes 13 to fix the motherboard. The packaging equipment 21 packages the chips on the motherboard. Then, the first hydraulic rod 6 is activated, and its driving end moves to the right, causing the entire fixed platform 5 to slide to the right on a set of sliding rods 11. When sliding to the right, the driving end of the second hydraulic rod 7 also retracts to the right, thereby improving stability. When the fixed platform 5 moves to the left, the driving end of the second hydraulic rod 7 pushes out to the left, and the first hydraulic rod 6 retracts, thereby causing the entire fixed platform 5 to move to the left. In this way, the chip position can be shifted, facilitating the packaging equipment to perform the packaging work.

[0033] The present invention comprises: 1. a device body; 2. a base device; 3. an adjustment platform device; 4. a mounting bracket device; 5. a fixed platform; 6. a first hydraulic rod; 7. a second hydraulic rod; 8. a sliding block; 9. a connecting block; 10. a sliding port; 11. a sliding rod; 12. a limiting groove; 13. a limiting hole; 14. a base plate; 15. a support plate; 16. a mounting foot; 17. a reinforcing block; 18. a fixing hole; 19. a support frame; 20. a top mounting plate; and 21. a packaging device. All components are general standard parts or parts known to those skilled in the art. Their structures and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods. The problem solved by this invention is that existing chip packaging equipment cannot effectively move the chip during packaging, resulting in slow chip packaging speed. This invention, through the combination of the above components, can effectively move the chip during chip packaging, thereby improving the efficiency of the packaging equipment.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0035] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A packaging apparatus for simultaneous multi-chip packaging, characterized in that: The device includes a main body (1), which includes a base device (2), an adjustment platform device (3), and a mounting bracket device (4). The adjustment platform device (3) is installed inside the base device (2), and the mounting bracket device (4) is installed at the rear end of the base device (2). The adjustment platform device (3) includes a fixed platform (5), a first hydraulic rod (6) and a second hydraulic rod (7). The fixed platform (5) has a sliding block (8) at its bottom. The sliding block (8) has a square shape. The sliding block (8) has a set of symmetrically distributed sliding openings (10) on its side. A sliding rod (11) is inserted into the sliding opening (10). The sliding rod (11) has a cylindrical shape. The bottom of the sliding block (8) has a set of symmetrically distributed connecting blocks (9). The connecting blocks (9) have a U-shaped structure. The first hydraulic rod (6) and the second hydraulic rod (7) are symmetrically distributed. The driving ends of the first hydraulic rod (6) and the second hydraulic rod (7) are respectively connected to a set of connecting blocks (9).

2. The packaging equipment for multi-chip synchronous packaging according to claim 1, characterized in that: The top of the fixed platform (5) is provided with a limiting groove (12), which is square in shape, and a number of limiting holes (13) are provided in the limiting groove (12).

3. The packaging equipment for multi-chip synchronous packaging according to claim 1, characterized in that: The base device (2) includes a base plate (14) and a support plate (15). The support plate (15) is provided in a set. The set of support plates (15) is symmetrically installed on the top of the base plate (14). Between the base plate (14) and the support plate (15), there are several sets of reinforcing blocks (17) distributed in a horizontally equidistant manner. The reinforcing blocks (17) have a triangular shape. The base plate (14) has mounting feet (16) on both the left and right sides. The mounting feet (16) have a trapezoidal shape and several sets of fixing holes (18) are opened on the surface.

4. The packaging equipment for multi-chip synchronous packaging according to claim 1, characterized in that: The mounting bracket device (4) includes a support frame (19), a top mounting plate (20), and a packaging device (21). The support frame (19) has a U-shaped structure. The top mounting plate (20) is mounted on the top of the support frame (19), and the packaging device (21) is mounted on the top of the top mounting plate (20).