Detection device for integrated circuit packaging

Abstract

The utility model discloses a detection device for integrated circuit packaging, which relates to the field of integrated circuit packaging detection and comprises a supporting assembly, a carrying assembly is arranged in the supporting assembly, and the carrying assembly can carry integrated circuit packaging needing to be detected. The carrying assembly comprises a fixing box fixedly installed on the top of the supporting assembly. The first limiting rod penetrates through the fixed box and is fixedly connected with the inner wall of the fixed box; the first sliding rod penetrates through the top of the fixed box and is in sliding connection with the inner wall of the fixed box; the first connecting plate is fixedly arranged on the outer side of the first sliding rod in a sleeving manner; according to the detection device for integrated circuit packaging, parts needing to be detected are put into the detection box through the carrying assembly for automatic detection, the detected parts are moved out after detection is completed, and waste of manpower and material resources is reduced.

Description

Technical Field

[0001] This utility model relates to integrated circuit packaging and testing technology, specifically to a testing device for integrated circuit packaging. Background Technology

[0002] Integrated circuit packaging refers to the process of encapsulating an integrated circuit (IC) chip to protect the chip and provide suitable pin connections and external connection interfaces. The following is a detailed analysis of integrated circuit packaging:

[0003] I. The role of encapsulation

[0004] Physical protection: The package provides the chip with a shell that offers mechanical strength and temperature resistance, preventing the chip from being damaged by physical factors such as scratches and impacts.

[0005] Environmental protection: Packaging can prevent impurities and moisture in the air from corroding the chip circuitry, ensuring the stability and reliability of the chip.

[0006] Pin connections: The package provides the chip with a suitable pin layout and connection method, enabling it to be effectively connected to other electronic devices or systems.

[0007] Heat dissipation: The selection and design of packaging materials help dissipate heat from the chip, preventing overheating that could lead to performance degradation or damage.

[0008] II. The Development History of Packaging

[0009] Integrated circuit packaging originated in the 1950s. With the development of integrated circuit technology, packaging technology has also made rapid progress. From the early metal circular shell packaging, to the later flat packaging, dual in-line packaging, and then to modern chip carrier packaging, quad flat package, ball grid array (BGA) packaging, and carrier automatic soldering packaging, the packaging form has continued to evolve to adapt to the needs of different fields and applications.

[0010] III. Main Packaging Forms

[0011] Plastic encapsulation: Using plastic materials with good insulation properties, mechanical strength, and heat resistance as the outer shell, it is one of the most common and widely used encapsulation forms. It has advantages such as light weight, low cost, and simple manufacturing process, making it suitable for mass production and consumer electronics products.

[0012] Ceramic encapsulation: This type of enclosure uses ceramic materials and features high mechanical strength, good thermal conductivity, and stable chemical properties. It is suitable for high-performance and high-reliability applications, such as military aerospace and medical devices. However, it is generally more expensive than plastic encapsulation.

[0013] BGA package: A surface-mount package type that connects leads to pads on a printed circuit board by placing leads on metal ball pillars at the bottom. It features high lead density, good thermal conductivity, and reliable electrical connections, making it suitable for large-scale integrated circuits and high-speed communication applications.

[0014] CSP packaging: A form of extremely small packaging, almost the size of the chip itself. It uses a method of directly soldering the bare die onto the printed circuit board, offering advantages such as small size, light weight, and low power consumption. It is commonly used in small electronic devices such as mobile phones and smart cards.

[0015] IV. Packaging Materials

[0016] Packaging materials can be categorized according to their application in the packaging process into carrier materials, circuit connection materials, molding and protection materials, adhesive materials, other functional materials, ceramic packaging materials, and packaging process materials. Among these, carrier materials, such as lead frames and packaging substrates, circuit connection materials, such as bonding wires and solder balls, and molding and protection materials, such as epoxy molding compounds, all play crucial roles in the packaging process.

[0017] V. Packaging Process Flow

[0018] The semiconductor integrated circuit packaging process typically includes steps such as substrate preparation, dielectric bonding, chip soldering, encapsulation material coating, thermal curing, metallization, and testing. Each step requires strict control of process parameters and quality requirements to ensure the reliability and performance of the package.

[0019] VI. Development Trends of Packaging Technology

[0020] With the continuous advancement of technology and the increasing demand for miniaturization and multifunctionality in electronic products, integrated circuit packaging technology is also constantly evolving and innovating. Future trends in packaging technology may include advanced technologies such as 3D heterogeneous integration, wafer-level packaging, flip-chip packaging, 3D packaging, and system-in-package (SISP). These technologies will help improve the performance of integrated circuits, reduce power consumption, and meet a wider range of application needs.

[0021] In conclusion, integrated circuit packaging plays a crucial role in modern electronics. It not only provides protection and connectivity for integrated circuits but also influences chip performance, reliability, and adaptability. With continuous advancements and innovations in packaging technology, more high-performance, miniaturized, and low-power integrated circuit products will emerge in the future.

[0022] Existing testing equipment for integrated circuit packaging mostly requires manual inspection of packaged products, which wastes a lot of manpower and resources and is not conducive to efficient production. Utility Model Content

[0023] The purpose of this invention is to provide a testing device for integrated circuit packaging, in order to solve the shortcomings of the existing technology, which mostly involves manual testing of packaged products, wasting a lot of manpower and resources and hindering efficient production.

[0024] To achieve the above objectives, this utility model provides the following technical solution: a testing device for integrated circuit packaging, comprising:

[0025] A support assembly, wherein a transport assembly is installed inside the support assembly, the transport assembly being able to transport the integrated circuit package to be tested;

[0026] The transport component includes:

[0027] A fixed box, which is fixedly installed on top of the support assembly;

[0028] Limiting rod one, which passes through the fixed box and is fixedly connected to the inner wall of the fixed box;

[0029] The first sliding rod passes through the top of the fixed box and is slidably connected to the inner wall of the fixed box;

[0030] Connecting plate one is fixedly sleeved on the outside of sliding rod one.

[0031] Furthermore, the conveying assembly also includes:

[0032] The suction cup is fixedly connected to the inner wall of the connecting plate.

[0033] Slide rod two is fixedly installed on top of slide rod one.

[0034] A receiving tube, which is sleeved on the outside of slide rod two;

[0035] The drive assembly is mounted at the bottom of the receiving tube.

[0036] Furthermore, the conveying assembly also includes:

[0037] A chute, which is formed through the receiving tube;

[0038] Slide groove two is located on the outside of slide rod two;

[0039] Limiting rod two is fixedly installed on the outside of sliding rod two, and it is slidably connected to the inner wall of sliding groove one;

[0040] The driven wheel is sleeved on the outside of the receiving tube.

[0041] Furthermore, the driving component includes:

[0042] A fixed shaft is fixedly installed at the bottom of the receiving tube;

[0043] A fixed groove, which is rotatably sleeved on the outside of a fixed shaft;

[0044] A rack is slidably connected to the inner wall of a fixed groove and meshes with a driven wheel;

[0045] A connecting shaft passes through one end of the rack and is rotatably connected to the inner wall of the rack.

[0046] Furthermore, the driving component also includes:

[0047] Connecting plate two is fixedly installed on the outside of the connecting shaft;

[0048] The rotating shaft is fixedly installed on the top of the connecting plate 2;

[0049] A rotating power component, which is fixedly mounted on the top of the rotating shaft;

[0050] The fixed pile is fixedly installed at the bottom of the rotating power component, and one end of it is fixedly connected to the inner wall of the support component.

[0051] Furthermore, the support component includes:

[0052] The support box is fixedly installed at the bottom of the fixed box;

[0053] A conveyor belt, which is installed on one side of the support box;

[0054] The test box is installed on the other side of the support box.

[0055] Furthermore, the limiting rod one is slidably connected to the inner wall of the sliding groove two.

[0056] Compared with the prior art, the present invention provides a testing device for integrated circuit packaging, which automatically places the parts to be tested into the inspection box by a transport component, performs automatic testing, and removes the tested parts after testing, thereby reducing the waste of manpower and material resources. Attached Figure Description

[0057] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0058] Figure 1 A perspective view of the overall structure provided for an embodiment of this utility model;

[0059] Figure 2 A perspective view of the transport component structure provided in an embodiment of this utility model;

[0060] Figure 3 A partial longitudinal sectional perspective view of the transport component structure provided in an embodiment of this utility model;

[0061] Figure 4 A longitudinal sectional perspective view of the transport component structure provided in an embodiment of this utility model;

[0062] Figure 5 A partial perspective view of the transport component structure provided in an embodiment of this utility model;

[0063] Figure 6 A schematic diagram of the frame-type FC (EMC, film) product structure provided for an embodiment of this utility model;

[0064] Figure 7 A schematic diagram of the frame-type WB product structure provided for an embodiment of this utility model;

[0065] Figure 8 A schematic diagram of the structure of a substrate-type FC (EMC, adhesive film) product provided in an embodiment of this utility model;

[0066] Figure 9 A schematic diagram of the substrate-type WB product structure provided for an embodiment of this utility model.

[0067] Explanation of reference numerals in the attached figures:

[0068] 1. Support assembly; 11. Support box; 12. Conveyor belt; 13. Test box; 2. Handling assembly; 21. Fixed box; 22. Limiting rod one; 23. Slide rod one; 24. Connecting plate one; 25. Suction cup; 26. Receiving tube; 27. Drive assembly; 271. Fixed groove; 272. Rotating power component; 273. Fixed pile; 274. Connecting plate two; 275. Connecting shaft; 276. Rack; 277. Fixed shaft; 278. Rotating shaft; 28. Slide rod two; 29. ​​Limiting rod two; 210. Slide groove one; 211. Driven wheel; 212. Slide groove two. Detailed Implementation

[0069] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0070] Example 1:

[0071] Please see Figure 1 - Figure 5 A testing device for integrated circuit packaging, comprising:

[0072] Support component 1, inside which a transfer component 2 is installed, the transfer component 2 can transfer the integrated circuit package to be tested;

[0073] Transport component 2 includes:

[0074] The fixed box 21 is fixedly installed on the top of the support assembly 1;

[0075] Limiting rod 22 passes through the fixed box 21 and is fixedly connected to the inner wall of the fixed box 21;

[0076] Slide rod 23 extends through the top of the fixed box 21 and is slidably connected to the inner wall of the fixed box 21;

[0077] Connecting plate 24 is fixedly sleeved on the outside of slide rod 23.

[0078] In a specific implementation, the connecting plate 24 is made of stainless steel, which has good corrosion resistance and high strength.

[0079] Transport component 2 also includes:

[0080] Suction cup 25, which is fixedly connected to the inner wall of connecting plate 24;

[0081] Slide rod 28 is fixedly installed on the top of slide rod 1 23.

[0082] The receiving tube 26 is sleeved on the outside of the slide rod 28;

[0083] Drive assembly 27 is mounted at the bottom of receiving tube 26;

[0084] A chute 210 is formed through the receiving tube 26;

[0085] Slide groove 212 is located on the outside of slide bar 28;

[0086] Limiting rod 29 is fixedly installed on the outside of sliding rod 28 and is slidably connected to the inner wall of sliding groove 210;

[0087] Driven wheel 211 is sleeved on the outside of receiving tube 26.

[0088] In a specific implementation, the suction cup 25 can be replaced with different specifications according to the size of the part being inspected, the first limiting rod 22 is slidably connected to the inner wall of the second sliding groove 212, and the second limiting rod 29 is slidably connected to the inner wall of the first sliding groove 210.

[0089] Driver component 27 includes:

[0090] Fixed shaft 277 is fixedly installed at the bottom of receiving tube 26;

[0091] The fixing groove 271 is rotatably sleeved on the outside of the fixing shaft 277;

[0092] The rack 276 is slidably connected to the inner wall of the fixed groove 271 and meshes with the driven wheel 211;

[0093] A connecting shaft 275 passes through one end of a rack 276 and is rotatably connected to the inner wall of the rack 276;

[0094] Connecting plate 274 is fixedly installed on the outside of connecting shaft 275;

[0095] Rotating shaft 278 is fixedly installed on the top of connecting plate 274;

[0096] Rotational power component 272 is fixedly mounted on the top of rotational shaft 278;

[0097] The fixed pile 273 is fixedly installed at the bottom of the rotating power component 272, and one end of it is fixedly connected to the inner wall of the support component 1.

[0098] In a specific implementation, the rotating power component 272 includes, but is not limited to, an asynchronous motor, which is electrically connected to an external power source and controlled by an external PLC programming program. The output end of the rotating power component 272 has a coupling, which is fixedly connected to the rotating shaft 278 through the coupling, and is used to drive the rotating shaft 278 to rotate.

[0099] Support component 1 includes:

[0100] Support box 11 is fixedly installed at the bottom of fixed box 21;

[0101] Conveyor belt 12 is installed on one side of support box 11;

[0102] Test box 13 is installed on the other side of support box 11.

[0103] Example 2:

[0104] Please see Figures 6-9 This embodiment provides an implementation method based on Embodiment 1. In order to simplify the Modifying process technology of FC packaging technology products, realize the localization of pipeline materials, and get rid of EMC dependence on imports, this invention provides an integrated circuit packaging structure and method, and introduces a film encapsulation process to achieve the above objectives.

[0105] To achieve the above objectives, the present invention employs the following technical solution:

[0106] (1) The upstream frame or substrate manufacturing process is a mature process. The frame or substrate has special requirements for frame electroplating, such as copper + nickel + silver layer.

[0107] (3) The adhesive film is a special film material, which consists of a carbon black layer, an adhesive layer, a release film layer, etc. The adhesive layer of the film material is relatively thick, which allows the adhesive film to completely fill the bottom of the chip and the hollowed-out position of the frame.

[0108] (4) After the product is printed with solder paste, die bonded and reflow soldered, it is directly pressed and cured using a special hot press equipment (with adjustable temperature, adjustable pressure, adjustable vacuum value and adjustable UV irradiation energy) to complete the encapsulation.

[0109] (5) After the adhesive layer has fully cured, cut, separate, test, sort, tape, package and put into storage.

[0110] Working principle: During use, the parts to be tested are transported to the designated position via conveyor belt 12. The rotating power component 272 is activated, which drives the rotating shaft 278 to rotate via a coupling. The rotating shaft 278 drives the connecting plate 274 to rotate, and further drives the rack 276 to reciprocate via connecting shaft 275. This causes the rack 276 to drive the driven wheel 211 to reciprocate, which in turn causes the receiving tube 26 to reciprocate. When the limiting rod 29 slides to the lowest point of the slide groove 210, the sliding rod 28 moves down under the action of the slide groove 212 and picks up the parts through the suction cup 25. At this time, the receiving tube 26 continues to rotate, driving the sliding rod 28 to rotate. When the limiting rod 29 slides to the other bottom end of the slide groove 210, the sliding rod 28 also rotates 180°. At this time, under the action of the slide groove 212, the parts are inserted into the test box 13 for testing. After the testing process is completed, the parts are sent back to the top of the conveyor belt 12 through the above process for the next part to be tested.

[0111] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A testing device for integrated circuit packaging, characterized in that, include: A support component (1) is provided, and a transport component (2) is installed inside the support component (1). The transport component (2) can transport the integrated circuit package to be tested. The transport component (2) includes: The fixed box (21) is fixedly installed on the top of the support assembly (1); Limiting rod 1 (22) passes through the fixed box (21) and is fixedly connected to the inner wall of the fixed box (21); A sliding rod (23) passes through the top of the fixed box (21) and is slidably connected to the inner wall of the fixed box (21); Connecting plate 1 (24) is fixedly sleeved on the outside of sliding rod 1 (23).

2. The testing device for integrated circuit packaging according to claim 1, characterized in that, The transport component (2) further includes: The suction cup (25) is fixedly connected to the inner wall of the connecting plate (24); Slide rod two (28) is fixedly installed on the top of slide rod one (23). The receiving tube (26) is sleeved on the outside of the slide bar two (28); The drive assembly (27) is mounted at the bottom of the receiving tube (26).

3. The testing device for integrated circuit packaging according to claim 2, characterized in that, The transport component (2) further includes: A chute (210) is formed through the receiving tube (26). Slide groove two (212) is located on the outside of slide bar two (28); Limiting rod two (29) is fixedly installed on the outside of sliding rod two (28) and is slidably connected to the inner wall of sliding groove one (210); Driven wheel (211) is sleeved on the outside of receiving tube (26).

4. The testing device for integrated circuit packaging according to claim 3, characterized in that, The driving component (27) includes: A fixed shaft (277) is fixedly installed at the bottom of the receiving tube (26); The fixed groove (271) is rotatably sleeved on the outside of the fixed shaft (277); A rack (276) is slidably connected to the inner wall of a fixed groove (271) and meshes with a driven wheel (211); A connecting shaft (275) passes through one end of the rack (276) and is rotatably connected to the inner wall of the rack (276).

5. The testing device for integrated circuit packaging according to claim 4, characterized in that, The drive component (27) also includes: Connecting plate two (274) is fixedly installed on the outside of connecting shaft (275); A rotating shaft (278) is fixedly mounted on the top of connecting plate two (274); A rotating power component (272) is fixedly mounted on the top of a rotating shaft (278); The fixed pile (273) is fixedly installed at the bottom of the rotating power component (272), and one end of it is fixedly connected to the inner wall of the support component (1).

6. The testing device for integrated circuit packaging according to claim 1, characterized in that, The support component (1) includes: Support box (11), which is fixedly installed at the bottom of fixed box (21); A conveyor belt (12) is installed on one side of the support box (11); The test box (13) is mounted on the other side of the support box (11).

7. The testing device for integrated circuit packaging according to claim 3, characterized in that, The limiting rod one (22) is slidably connected to the inner wall of the sliding groove two (212).

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