Semiconductor wafer bearing structure

Abstract

The utility model relates to the technical field of semiconductor device processing, in particular to a semiconductor wafer bearing structure. The clamping device comprises a driving assembly, a clamping assembly and a shell, the driving assembly comprises a driving rod and a transmission rod, the driving rod is sleeved with a transmission bevel gear, the driving rod is provided with a driving bevel gear matched with the transmission bevel gear, the clamping assembly comprises a cam, an ejector rod and a sliding block, and the transmission rod is sleeved with the cam; the end, close to the cam, of the ejector rod is provided with a pulley capable of sliding along the edge of the cam, the ejector rod is provided with a wedge-shaped block, and the sliding block comprises an inclined face. Clamping grooves are formed in the surface of the shell, guide notches are formed in the side walls of the clamping grooves, each clamping groove is correspondingly provided with a clamping assembly, the upper surface of the shell abuts against the sliding block, and the driving assembly drives the cam to rotate through the driving rod and the transmission rod so that the pulley on the ejector rod can slide along the edge of the cam and push the sliding block to slide in the direction where the semiconductor is located. Therefore, the semiconductor is fixed. According to the design, a function of fixing semiconductors with different thicknesses is realized through a simple mechanical structure.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor device processing, in particular to a semiconductor wafer bearing structure. BACKGROUND

[0002] The semiconductor wafer bearing structure is an important device for fixing and supporting semiconductor elements and plays a key role in the electronic manufacturing and testing process. With the rapid development of semiconductor technology, the requirements for the semiconductor wafer bearing structure are becoming higher and higher, not only to ensure the safe fixation of semiconductor elements, but also to have good operability and reliability.

[0003] In the processing of semiconductors, the wafer formed by cutting the crystal bar is usually 100-500 microns thick. The semiconductor wafer bearing structure provided by the related technology is only suitable for a single thickness of semiconductor. When the thickness of the semiconductor is small, the semiconductor wafer bearing structure cannot stably fix the semiconductor, which leads to the semiconductor tilting and scratching the bottom of the semiconductor wafer bearing structure, causing damage to the semiconductor. Especially during the processing and transportation of the semiconductor, the shaking of the semiconductor cannot be ignored. CONTENT OF THE INVENTION

[0004] The purpose of the present application is to overcome the above technical problems, and a semiconductor wafer bearing structure is provided.

[0005] A semiconductor wafer bearing structure comprises:

[0006] A driving assembly comprising a driving rod and a plurality of transmission rods, a plurality of driving bevel gears are arrayed on the driving rod, each transmission rod is perpendicular to the driving rod and has a transmission bevel gear at one end matched with the driving bevel gear, and the driving rod can drive the transmission rod to rotate by rotating;

[0007] A clamping assembly comprising a cam, a top rod and a sliding block, the cam is sleeved on the transmission rod, the top rod has a pulley at one end close to the cam which can slide along the edge of the cam, the top rod has a wedge at the other end away from the cam, the sliding block comprises an inclined surface matched with the wedge, and

[0008] An outer shell covering the driving assembly and the clamping assembly, the surface of the outer shell is arrayed with clamping grooves capable of accommodating semiconductors, each clamping groove is provided with a clamping assembly, the side wall of the clamping groove is provided with a guide notch, and the driving assembly can drive the sliding block to slide along the guide notch so that the sliding block limits the semiconductor in the clamping groove.

[0009] By adopting the above solution, when the semiconductor is inserted into the slot, the drive rod drives the transmission rod to rotate, the transmission rod drives the cam to rotate, the cam protrusion pushes the top rod to move upward, and the inclined surface of the wedge pushes the slider to slide in the direction of the semiconductor and then abut against the semiconductor to fix the semiconductor in the slot. This allows the semiconductor wafer support structure to fix semiconductors of different thicknesses and prevents the semiconductor from tilting in the slot, thus avoiding scratches.

[0010] In one embodiment, the slider includes a limiting part and a sliding part. The limiting part is symmetrically disposed on both sides of the sliding part. The two opposite surfaces of the limiting part can be in contact with the two sides of the wedge block. The sliding part includes an inclined surface that cooperates with the wedge block.

[0011] By adopting the above solution, the wedge block and the slider are more closely matched, preventing the wedge block from shifting during movement and causing jamming.

[0012] In one embodiment, the side of the slider facing the slot is provided with a soft rubber pad.

[0013] By adopting the above solution, hard contact between the slider and the semiconductor is avoided, thus preventing the slider from damaging the semiconductor.

[0014] The outer casing includes an upper shell, a partition, and a lower shell. The upper shell has an insertion hole on its surface. The partition has a limiting rib that mates with the edge of the insertion hole. The partition is located between the upper shell and the lower shell. The limiting rib abuts against the upper shell. The limiting rib mates with the insertion hole to form the slot. The drive assembly is housed in the lower shell. The top rod passes through the partition.

[0015] By adopting the above solution, the partition supports the bottom surface of the semiconductor, separates the driving components, protects the structure of the driving components, and limits the position of the push rod.

[0016] In one embodiment, the partition further includes a reset rib located on the side of the wedge block away from the slider, and the side of the reset rib facing the slider is provided with an elastic reset member connected to the slider.

[0017] By adopting the above solution, the slider can automatically reset when the semiconductor is pulled out of the slot.

[0018] In one embodiment, the lower housing is provided with reinforcing ribs, which are vertically arranged on the bottom surface of the housing and perpendicular to the transmission rod and the drive rod, respectively. The transmission rod and the drive rod are both passed through the reinforcing ribs.

[0019] By adopting the above solution, the reinforcing ribs play a limiting role for the transmission rod and the drive rod.

[0020] In one embodiment, the reinforcing rib extends toward the side wall of the lower housing and is perpendicular to the side wall of the lower housing, and the reinforcing rib abuts against the bottom surface of the partition.

[0021] By adopting the above scheme, the reinforcing ribs increase the stability of the semiconductor wafer support structure.

[0022] In one embodiment, the drive rod includes a drive section and a handle section, the drive bevel gear is sleeved on the drive section, the handle section is rotatably connected to one end of the drive section and a torsion spring is sleeved at the connection, and the torsion arms at both ends of the torsion spring are respectively embedded in the drive section and the handle section.

[0023] By adopting the above solution, when the semiconductor is thick, excessive rotation of the drive rod can be avoided, which would cause the slider to exert excessive clamping force on the semiconductor, resulting in damage to the semiconductor.

[0024] In one embodiment, the lower housing is provided with a locking hole, the locking sidewalls are arrayed with locking grooves, the handle section passes through the locking hole and is detachably connected to the knob, and the knob is provided with a limiting protrusion that cooperates with the locking groove.

[0025] By adopting the above solution, the rotary knob can be used to drive the drive rod to rotate. When the drive rod rotates to a certain angle, the limiting protrusion engages with the locking groove, and the drive rod will not rotate even when the knob is released.

[0026] In one embodiment, the end of the transmission rod away from the drive rod and the end of the drive section away from the handle section both pass through the lower housing. The contact surfaces of the transmission rod and the drive section with the lower housing are provided with limiting flanges, and the lower housing is provided with limiting grooves that cooperate with the limiting flanges.

[0027] By adopting the above scheme, the transmission rod and the drive rod are initially limited to ensure that the bevel gears of the transmission rod and the drive rod can make stable contact, thus ensuring the stability of the transmission.

[0028] In summary, this application includes at least one of the following beneficial technical effects:

[0029] 1. By mounting a cam on the transmission rod, when the drive rod rotates the transmission rod, the cam lifts the push rod, and the wedge block pushes the slider to translate in the direction of the slot. When a semiconductor is placed in the slot, since the semiconductor is prone to tilting in the slot, the distance the wedge block pushes the slider can be controlled by controlling the rotation angle of the drive rod, thereby supporting semiconductors of different thicknesses and preventing the semiconductor from tilting and scratching.

[0030] 2. By installing a torsion spring between the drive section and the handle section, and placing a soft rubber pad on the side of the slider facing the slot, when the semiconductor is thick and the force of rotating the drive rod is too large, the force applied by the drive rod to the transmission rod is the restoring force of the torsion spring. The soft rubber pad prevents the slider from making hard contact with the semiconductor, thus avoiding damage to the semiconductor by the slider.

[0031] 3. By setting a locking hole with a locking groove on the lower housing, and setting a limiting protrusion on the knob that cooperates with the locking groove, the drive rod is rotated by turning the knob. During the rotation of the drive rod, the limiting protrusion on the knob cooperates with the locking groove, so that the knob and the drive rod will not rotate arbitrarily, and the semiconductor wafer support structure can stably fix the semiconductor. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of a semiconductor wafer carrier structure provided in this application.

[0033] Figure 2 This is an exploded view of a semiconductor wafer support structure provided in this application.

[0034] Figure 3 yes Figure 2 A magnified view of region A in the middle.

[0035] Figure 4 This is a schematic diagram showing the connection relationship between the drive component and the clamping component.

[0036] Figure 5 This is a schematic diagram of the clamping assembly structure.

[0037] Figure 6 This is a schematic diagram of the clamping state of a semiconductor wafer carrier structure provided in this application.

[0038] Figure 7 This is a schematic diagram of the natural state of a semiconductor wafer carrier structure provided in this application.

[0039] Figure 8 This is a schematic diagram showing the connection between the knob and the lower housing.

[0040] Explanation of reference numerals in the attached drawings: 1. Drive assembly; 11. Drive rod; 111. Drive bevel gear; 112. Drive section; 113. Handle section; 12. Transmission rod; 121. Transmission bevel gear; 13. Limiting flange; 2. Clamping assembly; 21. Cam; 22. Push rod; 221. Pulley; 222. Wedge block; 23. Slider; 231. Limiting part; 232. Sliding part; 233. Soft rubber pad; 3. Housing; 31. Upper housing; 311. Insertion hole; 32. Partition; 321. Limiting rib; 322. Reset rib; 33. Lower housing; 331. Reinforcing rib; 332. Locking hole; 3321. Locking groove; 334. Limiting groove; 34. Slot; 341. Guide notch; 4. Torsion spring; 5. Knob; 51. Limiting protrusion; 6. Elastic reset component. Detailed Implementation

[0041] Therefore, it is necessary to provide a semiconductor wafer support structure that can fix semiconductors of different thicknesses.

[0042] Please see Figures 1-3 , Figure 1 This application provides a schematic diagram of a semiconductor wafer carrier structure, which includes a driving component 1, a clamping component 2, and a housing 3.

[0043] Please refer to the following: Figure 4 , Figure 4 The diagram illustrates the connection between the drive assembly and the clamping assembly. The drive assembly 1 includes a drive rod 11 and multiple transmission rods 12. Multiple drive bevel gears 111 are arranged in an array on the drive rod 11. Each transmission rod 12 has a transmission bevel gear 121 at one end that meshes with the drive bevel gear 111. The transmission rod 12 is perpendicular to the drive rod 11. The drive bevel gear 111 and the transmission bevel gear 121 mesh with each other, so that the rotation of the drive rod 11 can drive the rotation of the transmission rod 12. Both the drive rod 11 and the transmission rod 12 can be solid cylinders made of steel or hollow tubular structures made of aluminum.

[0044] Please refer to the following: Figure 5 , Figure 5The diagram shows the clamping assembly 2, which includes a cam 21, a push rod 22, and a slider 23. The cam 21 can be a circular steel cam or an elliptical plastic cam. The cam 21 is mounted on the transmission rod 12 and can be fixed by a key connection or interference fit. The push rod 22 can be a steel cylinder or a slender rod made of aluminum alloy. A pulley 221 is provided at the end of the push rod 22 near the cam 21; the pulley 221 can be a steel ball bearing or a nylon pulley. A wedge block 222 is provided at the end of the push rod 22 away from the cam 21; the wedge block 222 can be a steel triangular block or a plastic trapezoidal block. The inclined surface of the wedge block 222 engages with the inclined surface of the slider 23, allowing the slider 23 to slide along the guide notch 341.

[0045] The slider 23 includes a limiting part 231 and a sliding part 232. The limiting part 231 is symmetrically arranged on both sides of the sliding part 232. The sliding part 232 is wedge-shaped and includes an inclined surface that cooperates with the wedge block 222. The angle of the inclined surface can be from 15 degrees to 30 degrees. When the wedge block 222 is in contact with the inclined surface of the sliding part 232, the two opposite surfaces of the limiting part 231 are in contact with the two sides of the wedge block 222, limiting the wedge block 222 and preventing it from shifting during movement. The side of the slider 23 facing the slot 34 is provided with a soft rubber pad 233. The soft rubber pad 233 can be a thin sheet made of silicone rubber or a cushioning pad made of polyurethane.

[0046] Please refer to the following: Figure 6 , Figure 6This application provides a schematic diagram of a semiconductor wafer support structure in a clamping state. The outer shell 3 includes an upper shell 31, a partition 32, and a lower shell 33. The upper shell 33 has an insertion hole 311 on its upper surface. The partition 32 has a limiting rib 321 that engages with the edge of the insertion hole 311. The partition 32 is located between the upper shell 31 and the lower shell 33. The upper surface of the limiting rib 321 abuts against the upper shell 31. The limiting rib 321 and the insertion hole 311 cooperate to form a slot 34. The limiting rib 321 is the sidewall of the slot 34, and the insertion hole 311 is the insertion point of the slot 34. The upper surface of the partition 32 is the bottom surface of the slot 34, used to support the semiconductor wafer. A push rod 22 passes through the partition 32. The partition 32 has a reset rib 322 on the side of the push rod 22 away from the slider 23. The reset rib 322 is parallel to the slot 34, and its bottom surface is in contact with the upper surface of the partition 32. The partition 32 is provided with an elastic reset member 6 that connects to the slider 23. The elastic reset member 6 can be a spring or a rubber strip. When the elastic reset member 6 is in its natural state, the slider 23 is flush with the side wall of the slot 34, preventing the elastic reset member 6 from sliding freely in the guide notch 341. The interior of the lower housing 33 is provided with reinforcing ribs 331. The reinforcing ribs 331 are vertically arranged on the bottom surface of the lower housing 33 and are perpendicular to the transmission rod 12 and the drive rod 11, respectively. The transmission rod 12 and the drive rod 11 are both passed through the reinforcing ribs 331. The reinforcing ribs 331 extend towards the side wall of the lower housing 33 and are perpendicular to the side wall of the lower housing 33. The transmission rod 12 and the drive rod 11 are limited by the reinforcing ribs 331 to prevent them from shaking during movement and to ensure the smooth operation of each component. At the same time, the reinforcing ribs 331 also serve as reinforcing ribs, making the structure of the semiconductor wafer support structure more stable.

[0047] Please refer to the following: Figure 7 , Figure 7 This application provides a schematic diagram of a semiconductor wafer support structure in its natural state. The working principle of the semiconductor wafer support structure is as follows: During use, the semiconductor is first placed in the slot 34. Turning the knob 5 rotates the drive rod 11. The drive rod 11 drives the transmission helical gear to rotate via the drive helical gear, causing the transmission rod 12 to rotate along with the drive rod 11. During rotation, the transmission rod 12 drives the cam 21 to rotate. The pulley 221 rolls along the edge of the cam 21, reducing the friction between the push rod 22 and the cam 21. When the cam 21's convex... When the output part rotates in the direction of the push rod 22, the pulley 221 moves upward, thereby driving the push rod 22 to move upward. The push rod 22 drives the wedge block 222 to move upward. The wedge block 222 and the inclined surface of the slider 23 are relatively displaced, thereby driving the slider 23 to move towards the position of the semiconductor until the soft rubber pad 233 on the slider 23 comes into contact with the semiconductor, and the semiconductor is locked in the slot 34. The soft rubber pad 233 can provide a buffer and anti-slip effect when the slider 23 contacts the semiconductor, preventing the semiconductor from being damaged during the fixing process.

[0048] Please refer to the following: Figure 8 , Figure 8 The diagram shows the connection between the knob and the lower housing. The handle section 113 is located at the extended end of the drive section 112 and has an outer diameter larger than the drive section 112. The drive bevel gears 111 are all sleeved on the drive section 112. The handle section 113 passes through the outer housing 3 and is connected to the knob 5. The connection between the handle section 113 and the drive section 112 is provided with a connection hole that mates with the drive section 112. The drive section 112 is sleeved in the connection hole and can rotate within the connection hole. The drive section 112 is provided with a raised edge. A torsion spring 4 is sleeved between the raised edge of the drive section 112 and the handle section 113. The torsion arms at both ends of the torsion spring 4 are respectively embedded in the raised edge of the drive section 112 and the handle section 113.

[0049] The end of the transmission rod 12 facing away from the drive rod 11 and the end of the drive section 112 facing away from the handle section 113 both pass through the lower housing 33. The contact surfaces of the transmission rod 12 and the drive section 112 with the lower housing 33 are provided with limiting flanges 13. The lower housing 33 is provided with limiting grooves 334 that mate with the limiting flanges 13, preventing the transmission rod 12 and the drive rod 11 from moving along the rotation axis. The side of the lower housing 33 is provided with locking holes 332, and locking grooves 3321 are arrayed on the sidewalls of the locking holes 332. The end of the handle section 113 facing away from the drive section 112 passes through the locking holes 332 and is plugged into or threaded into the knob 5. The knob 5 is provided with limiting protrusions 51 that mate with the locking grooves 3321.

[0050] The working principle of the torsion spring 4 and the knob 5 is as follows: When the semiconductor is thick, excessive twisting of the knob 5 causes excessive clamping force of the slider 23 on the semiconductor. The torsion spring 4 between the drive section 112 and the handle section 113 twists to prevent the drive shaft from rotating excessively with the knob 5. At this time, the elastic force generated by the torsion spring 4 is converted into the clamping force of the slider 23 on the semiconductor, preventing damage to the semiconductor due to excessive clamping force of the slider 23. When the semiconductor is fixed in the slot 34, the knob 5 is released. The limiting protrusion 51 on the knob 5 cooperates with the locking groove 3321, and the knob 5 is limited and no longer rotates. At this time, the torsion spring still has elastic force, allowing the slider 23 to continue to clamp the semiconductor. When it is necessary to remove the semiconductor from the slot 34, the knob 5 can be twisted in the opposite direction to restore the torsion spring 4 to its natural state. Alternatively, the knob 5 can be directly removed from the handle section 113, causing the torsion spring 4 to automatically reset and stop providing elastic force. The slider 23 is pulled back to its original position by the elastic reset member 6, at which point the semiconductor can be easily removed from the slot 34.

[0051] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A semiconductor wafer carrier structure, characterized in that, include: The drive assembly (1) includes a drive rod (11) and multiple transmission rods (12). Multiple drive bevel gears (111) are arranged in an array on the drive rod (11). Each transmission rod (12) is perpendicular to the drive rod (11) and has a transmission bevel gear (121) at one end that cooperates with the drive bevel gear (111). The rotation of the drive rod (11) can drive the transmission rod (12) to rotate. A clamping assembly (2) includes a cam (21), a push rod (22), and a slider (23). The cam (21) is sleeved on the transmission rod (12). One end of the push rod (22) near the cam (21) has a pulley (221) that can slide along the edge of the cam (21). The other end of the push rod (22) away from the cam (21) has a wedge (222). The slider (23) includes an inclined surface that can cooperate with the wedge (222). The housing (3) covers the driving assembly (1) and the clamping assembly (2). The surface of the housing (3) is provided with an array of slots (34) for accommodating semiconductors. Each slot (34) is provided with a clamping assembly (2). The sidewall of the slot (34) is provided with a guide notch (341). The driving assembly (1) can drive the slider (23) to slide along the guide notch (341) so that the slider (23) confines the semiconductor in the slot (34).

2. The semiconductor wafer carrier structure according to claim 1, characterized in that: The slider (23) includes a limiting part (231) and a sliding part (232). The limiting part (231) is symmetrically arranged on both sides of the sliding part (232). The two opposite surfaces of the limiting part (231) can be in contact with the two sides of the wedge block (222). The sliding part (232) includes an inclined surface that cooperates with the wedge block (222).

3. The semiconductor wafer carrier structure according to claim 2, characterized in that: The slider (23) facing the slot (34) is provided with a soft rubber pad (233).

4. The semiconductor wafer carrier structure according to claim 1, characterized in that: The outer shell (3) includes an upper shell (31), a partition (32) and a lower shell (33). The upper shell (31) has a socket (311) on its surface. The partition (32) has a limiting rib (321) that cooperates with the edge of the socket (311). The partition (32) is located between the upper shell (31) and the lower shell (33). The limiting rib (321) abuts against the upper shell (31). The limiting rib (321) cooperates with the socket (311) to form the slot (34). The top rod (22) passes through the partition (32).

5. A semiconductor wafer carrier structure according to claim 4, characterized in that: The partition (32) also includes a reset rib (322), which is located on the side of the wedge block (222) away from the slider (23). The side of the reset rib (322) facing the slider (23) is provided with an elastic reset member (6) connected to the slider (23).

6. A semiconductor wafer carrier structure according to claim 5, characterized in that: The lower housing (33) is provided with reinforcing ribs (331). The reinforcing ribs (331) are vertically arranged on the bottom surface of the outer shell (3) and are perpendicular to the transmission rod (12) and the drive rod (11) respectively. The transmission rod (12) and the drive rod (11) are both passed through the reinforcing ribs (331).

7. A semiconductor wafer carrier structure according to claim 6, characterized in that: The reinforcing rib (331) extends toward the side wall of the lower housing (33) and is perpendicular to the side wall of the lower housing (33). The reinforcing rib (331) abuts against the bottom surface of the partition (32).

8. A semiconductor wafer carrier structure according to claim 4, characterized in that: The drive assembly (1) is housed in the lower housing (33). The drive rod (11) includes a drive section (112) and a handle section (113). The drive bevel gear (111) is sleeved on the drive section (112). The handle section (113) is rotatably connected to one end of the drive section (112), and a torsion spring (4) is sleeved at the connection. The torsion arms at both ends of the torsion spring (4) are respectively embedded in the drive section (112) and the handle section (113).

9. A semiconductor wafer carrier structure according to claim 8, characterized in that: The lower housing (33) has a locking hole (332) on its side, and the locking hole (332) has an array of locking grooves (3321) distributed on its side wall. The handle section (113) passes through the locking hole (332) and is detachably connected to the knob (5). The knob (5) has a limiting protrusion (51) that cooperates with the locking groove (3321).

10. A semiconductor wafer carrier structure according to claim 9, characterized in that: The end of the transmission rod (12) away from the drive rod (11) and the end of the drive section (112) away from the handle section (113) both pass through the lower housing (33). The contact surfaces of the transmission rod (12) and the drive section (112) with the lower housing (33) are provided with limiting flanges (13). The lower housing (33) is provided with limiting grooves (334) that cooperate with the limiting flanges (13).

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