Die bonding head device and die bonding equipment

Abstract

The utility model is suitable for the technical field of semiconductor production, and provides a die bonding head device and die bonding equipment. The die bonding head device comprises a bonding head connecting seat, a suction nozzle structure, a first driving unit and a pressurizing unit. The die bonding equipment comprises any one of the die bonding head devices. The suction nozzle structure is slidably connected to the bonding head connecting seat, so that the suction nozzle structure can be prevented from shaking due to the existence of the swing arm, and the movement of the suction nozzle structure is more stable and accurate. Meanwhile, when the suction nozzle structure carries out die bonding, pressure in the first direction can be applied to the suction nozzle structure through the pressurizing unit, then the pressure is transmitted to the chip and the product through the suction nozzle structure, and the pressure applied to the suction nozzle structure by the pressurizing unit can be adjusted; and on the premise of ensuring the die bonding pressure, the adjusting range of the die bonding pressure is enlarged, so that the applicability of the equipment is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of semiconductor technology especially relates to a fixed crystal bond head device and fixed crystal equipment. BACKGROUND

[0002] The fixed crystal machine is one of the devices for manufacturing semiconductor devices, which is used for connecting semiconductor wafers and other components together. In the working process of the fixed crystal machine, the crystal ring is usually supported by the crystal supply platform, the chip on the crystal ring is separated from the blue film through the needle device, and then the chip on the crystal ring is sucked through the bond head device and transported to the welding point on the packaging substrate for bonding to realize fixed crystal. However, the existing fixed crystal bond head device has the problems of small fixed crystal pressure adjustment range and poor applicability in the working process. SUMMARY

[0003] The utility model discloses a fixed crystal bond head device and fixed crystal equipment, which aims to solve the technical problem of small fixed crystal pressure adjustment range of the existing fixed crystal bond head device in use.

[0004] The utility model discloses a fixed crystal bond head device, the fixed crystal bond head device includes bond head connecting seat, suction nozzle structure, first drive unit and pressurizing unit, suction nozzle structure is connected on the bond head connecting seat slidingly, first drive unit sets up on the bond head connecting seat, first drive unit is used for driving suction nozzle structure reciprocating motion along the first direction, pressurizing unit sets up on the bond head connecting seat, pressurizing unit is used for when the suction nozzle structure fixed crystal, the pressure along the first direction is applied to suction nozzle structure.

[0005] In an optional embodiment, the suction nozzle structure includes a sliding seat and a suction nozzle body, the sliding seat is slidingly connected to the bond head connecting seat along the first direction, and the suction nozzle body is arranged on the sliding seat along the first direction. The driving end of the first drive unit is connected to the sliding seat, and the driving end of the pressurizing unit abuts or is connected to the sliding seat.

[0006] In an optional embodiment, the sliding seat includes a seat body, an adapter and a pressure sensor, the seat body is slidingly connected to the bond head connecting seat, the adapter is connected to the driving end of the first drive unit, and the driving end of the pressurizing unit also abuts or is connected to the adapter, and the pressure sensor is connected between the seat body and the adapter. The pressure sensor is used to detect the pressure received by the seat body along the first direction.

[0007] In one optional embodiment, the seat body has a first mounting surface that is perpendicular to the first direction, the adapter has a second mounting surface that is parallel to the first mounting surface, the first mounting surface and the second mounting surface are spaced apart from each other, and the pressure sensor is located between the first mounting surface and the second mounting surface.

[0008] In an optional embodiment, the driving end of the pressurizing unit abuts against the adapter, the adapter having an abutment plane perpendicular to the first direction, and the driving end of the pressurizing unit also having a spherical structure for contacting the abutment plane.

[0009] In an optional embodiment, a cross guide rail assembly for guiding the sliding of the seat body is further provided between the seat body and the connector seat.

[0010] In an optional embodiment, the nozzle body is movably mounted on the sliding seat, and the nozzle body has only one degree of freedom to rotate about its own axis relative to the sliding seat. The connector is provided with a second drive unit for driving the nozzle body to rotate, and a transmission structure is also provided between the drive end of the second drive unit and the nozzle body.

[0011] In an alternative embodiment, the die bonding head device further includes a displacement measuring component for detecting the displacement of the nozzle structure.

[0012] In one alternative embodiment,

[0013] The first drive unit includes a voice coil motor;

[0014] And / or, the pressurization unit includes a drive cylinder or a drive hydraulic cylinder.

[0015] In a second aspect, a die bonding apparatus is provided, comprising the die bonding head device described in any of the preceding claims.

[0016] The technical advantages of this invention compared to existing technologies are as follows: By sliding the nozzle structure onto the bonding head connector, and driving the nozzle structure along a first direction via a first driving unit mounted on the bonding head connector, the nozzle structure is coordinated to perform chip pick-up and installation. Simultaneously, a pressure unit is provided on the bonding head connector to apply pressure along the first direction to the nozzle structure during die bonding. Compared to the existing technology that uses a swing arm structure to drive the nozzle structure, the slidable connection of the nozzle structure to the bonding head connector avoids vibration caused by the swing arm, resulting in more stable and precise movement of the nozzle structure. Furthermore, during die bonding, the pressure unit applies pressure along the first direction to the nozzle structure, which is then transmitted to the chip and the product. The pressure applied by the pressure unit to the nozzle structure can be adjusted, increasing the pressure adjustment range during die bonding and improving the applicability of the equipment.

[0017] It is understandable that the beneficial effects of the second aspect mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the die bonding head device provided in this embodiment of the utility model. Figure 1 ;

[0020] Figure 2 This is a schematic diagram of the structure of the die bonding head device provided in this embodiment of the utility model. Figure 2 ;

[0021] Figure 3 This is a schematic diagram of the suction nozzle structure and pressurization unit used in the embodiment of this utility model;

[0022] Figure 4 yes Figure 3 Enlarged structural diagram at point A;

[0023] Figure 5 This is a schematic diagram of the sliding seat used in the embodiment of this utility model.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1. Connector; 2. Nozzle structure; 21. Sliding seat; 211. Seat body; 212. Adapter; 213. Pressure sensor; 214. First mounting surface; 215. Second mounting surface; 216. Abutment plane; 217. Protrusion; 22. Nozzle body; 3. First drive unit; 4. Pressurizing unit; 41. Spherical structure; 5. Cross guide rail assembly; 6. Second drive unit; 7. Transmission structure; 8. Displacement measurement assembly. Detailed Implementation

[0026] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0027] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0028] In this embodiment, according to Figure 1 The XYZ Cartesian coordinate system established in the diagram is defined as follows: the first direction can be the Z-direction (arrow), the second direction can be the Y-direction (arrow), and the third direction can be the X-direction (arrow). The side located in the positive X-axis direction is defined as front, and the side located in the negative X-axis direction is defined as back; the side located in the positive Y-axis direction is defined as left, and the side located in the negative Y-axis direction is defined as right; the side located in the positive Z-axis direction is defined as down, and the side located in the negative Z-axis direction is defined as up.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0032] Please refer to Figures 1 to 5 As shown in the present invention, a die bonding device is provided. The die bonding device includes a bonding head 1, a suction nozzle structure 2, a first driving unit 3, and a pressurizing unit 4. The suction nozzle structure 2 is slidably connected to the bonding head 1. The first driving unit 3 is disposed on the bonding head 1 and is used to drive the suction nozzle structure 2 to reciprocate along a first direction. The pressurizing unit 4 is disposed on the bonding head 1 and is used to apply pressure along the first direction to the suction nozzle structure 2 during die bonding.

[0033] Specifically, the connector 1 refers to a supporting component with a certain volume. The connector 1 can be block-shaped, plate-shaped, or column-shaped, and can also be composed of a combination of various shapes. The first direction can refer to the direction of movement of the nozzle structure 2 during operation, which is usually vertical. The connector 1 can also have the freedom to move in the horizontal plane. The movement of the connector 1 drives the nozzle structure 2 to move horizontally to achieve chip transport. The nozzle structure 2 refers to a component or assembly that can adsorb chips. The nozzle structure 2 is usually connected to a negative pressure generating device pipeline. By generating negative pressure at the working end of the nozzle structure 2, the chip is adsorbed. The nozzle structure 2 can slide back and forth in the first direction to assist in chip transport and installation. The nozzle structure 2 can be slidably connected to the connector 1 via a sliding structure.

[0034] The first driving unit 3 refers to a component or assembly that can drive an object to move in a straight line. The first driving unit 3 can be a voice coil motor, a cylinder, or an electric actuator, etc. It can also be a crank-slider structure driven by a motor. The pressurizing unit 4 refers to a component or assembly that can apply pressure to an object. The pressurizing unit 4 can be a cylinder, a hydraulic cylinder, or an electric actuator, etc. It can also be a crank-slider structure driven by a motor, ultimately applying pressure to other objects through the slider. The pressure value output by the pressurizing unit 4 can be adjusted by changing the current or airflow pressure supplied to it. Die bonding refers to the process when the nozzle structure 2 mounts and solders the chip onto the product. The driving end of the pressurizing unit 4 can be connected to the nozzle structure 2 via a snap-fit, fastener, or thread, or it can simply abut against the nozzle structure 2. The direction of the pressure applied by the pressurizing unit 4 to the nozzle structure 2 is generally along a first direction and towards the chip or product, thereby increasing the die bonding pressure.

[0035] The die bonding device provided in this embodiment of the invention slides a nozzle structure 2 onto a bonding connector 1, and a first driving unit 3 mounted on the bonding connector 1 drives the nozzle structure 2 to move along a first direction to cooperate with the nozzle structure 2 in the chip pick-up and mounting process. A pressure unit 4 is also provided on the bonding connector 1 to apply pressure along the first direction to the nozzle structure 2 during die bonding. Compared with the prior art that uses a swing arm structure to drive the nozzle structure 2, the slidable connection of the nozzle structure 2 to the bonding connector 1 avoids vibration caused by the swing arm, thus making the movement of the nozzle structure 2 more stable and precise. Furthermore, during die bonding, the pressure unit 4 applies pressure along the first direction to the nozzle structure 2, which is then transmitted to the chip and the product. The pressure applied by the pressure unit 4 to the nozzle structure 2 can also be adjusted, increasing the adjustment range of the die bonding pressure while ensuring the necessary bonding pressure, thereby improving the applicability of the device.

[0036] In one embodiment, see Figure 3 and Figure 5The suction nozzle structure 2 includes a sliding seat 21 and a suction nozzle body 22. The sliding seat 21 is slidably connected to the connector 1 along a first direction, and the suction nozzle body 22 is disposed on the sliding seat 21 along the first direction. The driving end of the first driving unit 3 is connected to the sliding seat 21, and the driving end of the pressurizing unit 4 abuts against or is connected to the sliding seat 21. Specifically, the sliding seat 21 refers to a component with a certain volume. The sliding seat 21 can be block-shaped, plate-shaped, or column-shaped, etc., and can also be composed of a combination of various shapes. The sliding seat 21 can be slidably connected to the connector 1 via a slide rail structure. The suction nozzle body 22 refers to a component or assembly with a certain length. The suction nozzle body 22 can include a suction nozzle part and a suction nozzle rod. The suction nozzle part is disposed at one end of the suction nozzle rod, and the other end of the suction nozzle rod is connected to an external vacuum generating device or system pipeline. An adsorption hole is provided on the suction nozzle part, and a channel structure for communicating the adsorption hole with the external vacuum generating device or system is also provided on the suction nozzle rod. The nozzle body 22 can be fixed on the sliding seat 21, or the nozzle body 22 can be movably disposed on the sliding seat 21, for example, rotatably disposed on the sliding seat 21.

[0037] In this embodiment, by dividing the nozzle structure 2 into two parts, a sliding seat 21 and a nozzle body 22, and sliding the sliding seat 21 to the connector 1 along the first direction, and setting the nozzle body 22 on the sliding seat 21 along the first direction, the manufacturing of the nozzle structure 2 can be simplified. Simultaneously, the driving end of the first driving unit 3 is connected to the sliding seat 21, and the driving end of the pressurizing unit 4 abuts against or is connected to the sliding seat 21, making it easier for the first driving unit 3 to drive the nozzle structure 2 and for the pressurizing unit 4 to apply pressure to the nozzle structure 2.

[0038] In one embodiment, see Figure 3 and Figure 5 The sliding seat 21 includes a seat body 211, an adapter 212, and a pressure sensor 213. The seat body 211 is slidably connected to the connector 1. The adapter 212 is used to connect to the drive end of the first drive unit 3, and the drive end of the pressurizing unit 4 also abuts against or connects to the adapter 212. The pressure sensor 213 is connected between the seat body 211 and the adapter 212, and is used to detect the pressure on the seat body 211 along a first direction. Specifically, the seat body 211 refers to a component with a certain volume. The seat body 211 can be block-shaped, plate-shaped, or column-shaped. The seat body 211 is the main body of the sliding seat 21 and is slidably connected to the connector 1. The adapter 212 refers to a component with a certain volume. The adapter 212 can be block-shaped, plate-shaped, or column-shaped. Pressure sensor 213 refers to a component or assembly that can convert pressure into an electrical signal. Pressure sensor 213 can be of the piezoresistive, capacitive, piezoelectric or resonant type, and pressure sensor 213 itself has a certain volume.

[0039] In this embodiment, a sliding base 21 is formed by a base body 211, an adapter 212, and a pressure sensor 213. The adapter 212 is connected to the driving end of the first driving unit 3, and the driving end of the pressurizing unit 4 also abuts against or is connected to the adapter 212. Simultaneously, the pressure sensor 213 is connected between the base body 211 and the adapter 212. During the operation of the nozzle body 22, the force applied to the adapter 212 by the pressurizing unit 4 and the first driving unit 3 can be transmitted to the base body 211 through the pressure sensor 213, and finally transmitted to the nozzle body 22 through the base body 211. At the same time, the pressure sensor 213 can detect the pressure on the base body 211, i.e., the nozzle body 22, allowing real-time monitoring of the pressure on the nozzle body 22 during die bonding and removal, and adjustment when the pressure exceeds a preset range, thus improving the accuracy of die bonding and removal.

[0040] In one embodiment, see Figure 3 and Figure 5 The base body 211 has a first mounting surface 214, which is perpendicular to a first direction. The adapter 212 has a second mounting surface 215 parallel to the first mounting surface 214. The first mounting surface 214 and the second mounting surface 215 are spaced apart from each other. The pressure sensor 213 is located between the first mounting surface 214 and the second mounting surface 215. Specifically, the first mounting surface 214 refers to a surface structure with a certain area, and it is generally a planar structure. The second mounting surface 215 also refers to a surface structure with a certain area, and it is generally a planar structure.

[0041] In this embodiment, a first mounting surface 214 is provided on the base body 211, and a second mounting surface 215 parallel to the first mounting surface 214 is provided on the adapter 212. The first mounting surface 214 and the second mounting surface 215 are spaced apart from each other, allowing the pressure sensor 213 to be mounted between them. One side of the pressure sensor 213 abuts against the first mounting surface 214, and the other side abuts against the second mounting surface 215, making the installation of the pressure sensor 213 more convenient. Furthermore, both the first mounting surface 214 and the second mounting surface 215 are perpendicular to the first direction, ensuring that the pressure exerted on the pressure sensor 213 by the base body 211 and the adapter 212 is set along the first direction, preventing the force on the pressure sensor 213 from being deflected in other directions, thus making the detection results of the pressure sensor 213 more accurate.

[0042] In one embodiment, see Figure 4The driving end of the pressurizing unit 4 abuts against the adapter 212. The adapter 212 is provided with an abutment plane 216 perpendicular to the first direction. The driving end of the pressurizing unit 4 is also provided with a spherical structure 41 for contacting the abutment plane 216. Specifically, the abutment plane 216 refers to a planar structure with a certain area, and the abutment plane 216 can be provided on the side of the adapter 212 away from the pressure sensor 213. The spherical structure 41 refers to a part of a spherical surface, and the radius of the spherical structure 41 matches the size of the driving end of the pressurizing unit 4. In this embodiment, by providing an abutment plane 216 perpendicular to the first direction on the adapter 212, and also providing a spherical structure 41 at the drive end of the pressurizing unit 4, after the drive end of the pressurizing unit 4 abuts against the abutment plane 216, even if the installation direction of the pressurizing unit 4 itself is deviated, the pressure applied by the pressurizing unit 4 to the adapter 212 can still be set in a direction perpendicular to the abutment plane 216, thereby reducing the installation difficulty of the pressurizing unit 4.

[0043] In an optional embodiment, please refer to Figure 3 and Figure 5 A protrusion 217 with a certain volume can be provided on the side of the seat body 211. The protrusion 217 can be block-shaped or plate-shaped, and the protrusion 217 can be an integral structure with the seat body 211. The first mounting surface 214 can be provided in the top area of ​​the protrusion 217. At this time, at least part of the adapter 212 can be arranged opposite to the protrusion 217. Meanwhile, the second mounting surface 215 is located on the part of the adapter 212 that is arranged opposite to the protrusion 217. The first mounting surface 214 and the second mounting surface 215 are opposite to each other and spaced apart, so that the overall structure of the sliding seat 21 is simpler and occupies less volume.

[0044] Based on the aforementioned feature protrusion 217, please refer to Figure 5 The adapter 212 may include a mainboard body and a drive connection portion. The mainboard body is located above the protrusion 217 in the first direction. The second mounting surface 215 is located on the side of the mainboard body facing the protrusion 217. The abutment plane 216 is located on the side of the mainboard body away from the protrusion 217, and the abutment plane 216 is opposite to the second mounting surface 215. At this time, the pressure unit 4 can be located above the mainboard body and abut against the abutment plane 216. The drive connection portion is connected to the side of the mainboard body facing the protrusion 217 and extends downward in the first direction. The drive end of the first drive unit 3 is connected to the drive connection portion. Specifically, the mainboard body refers to a plate structure with a certain area. The drive connection portion refers to a component with a certain length, and the drive connection portion can be strip-shaped or column-shaped, etc. In this embodiment, by adopting the above structure for the adapter 212, the connection or contact between the adapter 212 and the first drive unit 3 and the pressure unit 4 can be made more convenient.

[0045] It should be noted that the drive connection part is located on the side of the seat body 211 along the second direction, the pressure sensor 213 is located between the drive connection part and the seat body 211 along the second direction, and the first drive unit 3 can be located on the side of the drive connection part along the second direction, wherein the second direction is set at an angle to the first direction. By adopting the above arrangement, the structure of the device can be made more compact and occupy less space.

[0046] In one embodiment, see Figure 2 A cross guide rail assembly 5 is also provided between the seat body 211 and the connector 1 to guide the sliding of the seat body 211. Specifically, the cross guide rail assembly 5, also known as a cross roller linear slide rail, is a component used to achieve a sliding connection between two objects. The cross slide rail can include at least two sliding parts that can slide relative to each other, and one of the two sliding parts is provided with cross-arranged rollers and a retainer for stabilizing the rollers, achieving high-precision linear motion through rolling friction. In use, the sliding parts can be installed on different objects by snap-fitting, fastening, or welding to achieve a sliding connection between the two objects. In this embodiment, by providing the cross guide rail assembly 5 between the seat body 211 and the connector 1, while ensuring the sliding connection between the seat body 211 and the connector 1, the cross guide rail assembly 5 can also guide the sliding of the seat body 211, making the sliding smoother and more stable, thus improving the overall stability and safety of the equipment.

[0047] In an optional embodiment, please refer to Figure 2 The cross rail assembly 5 includes a main sliding part and two auxiliary sliding parts. The two auxiliary sliding parts are located on both sides of the main sliding part along a second direction, which forms an angle with the first direction. Both auxiliary sliding parts are fixedly mounted on the connector 1, and the main sliding part is fixedly mounted on the body 211. The main sliding part and the two auxiliary sliding parts are slidably connected, and the main sliding part has a degree of freedom to slide along the first direction relative to the two auxiliary sliding parts. Two limiting blocks are also provided on the connector 1, located at both ends of the main sliding part along the first direction, which can limit the main sliding part and prevent it from coming out of the gap between the two auxiliary sliding parts.

[0048] In one embodiment, see Figure 1 and Figure 2The nozzle body 22 is movably mounted on the sliding seat 21, and the nozzle body 22 only has the degree of freedom to rotate about its own axis relative to the sliding seat 21. The connector 1 is provided with a second drive unit 6 for driving the nozzle body 22 to rotate. A transmission structure 7 is also provided between the drive end of the second drive unit 6 and the nozzle body 22. Specifically, the second drive unit 6 refers to a component or assembly that can output torque. The second drive unit 6 can be a motor, a hydraulic motor, or other components that can output torque. The sliding seat 21 is provided with a mounting hole for accommodating the nozzle body 22. The nozzle body 22 can be rotatably mounted in the mounting hole, and a rotating bearing can be provided between the nozzle body 22 and the inner wall of the mounting hole to make the rotation of the nozzle body 22 more convenient and smooth, while also limiting the movement of the nozzle body 22 along the first direction. In this embodiment, by rotating the nozzle body 22 onto the sliding seat 21, the second driving unit 6 can drive the nozzle body 22 to rotate when there is a deviation in the angle of the chip picked up by the nozzle body 22, thereby achieving the purpose of adjusting the angle of the chip and improving the accuracy of die bonding.

[0049] In an optional embodiment, please refer to Figure 1 The transmission structure 7 includes pulleys and a transmission belt (not shown in the figure). There are two pulleys, one of which is coaxially arranged with the suction nozzle rod, and the other pulley is coaxially arranged with the drive end of the second drive unit 6. The transmission belt is fitted on the two pulleys.

[0050] In one embodiment, see Figure 1 and Figure 2 The die bonding head device also includes a displacement measuring component 8, which is used to detect the displacement of the nozzle structure 2. Specifically, the displacement measuring component 8 refers to a part or component that can measure the magnitude of the object's displacement. The displacement measuring component 8 can be a pointer scale structure, a laser measuring structure, or a photoelectric measuring structure. By setting the displacement measuring component 8, the displacement of the nozzle structure 2 along the first direction can be detected, making the control of the nozzle structure 2 more precise and convenient.

[0051] In an optional embodiment, please refer to Figure 1The displacement measurement component 8 includes a grating read head and a grating ruler structure. The grating read head is mounted on the connector 1, and the grating ruler structure is connected to the sliding seat 21 of the nozzle structure 2, used to cooperate with the grating read head to measure the movement distance of the nozzle structure 2. Specifically, the grating ruler structure refers to a component of a certain length, on which grating lines that can interact with light are provided. The grating read head is a component composed of an indicator grating, a lens group, and photoelectric elements, responsible for signal acquisition and conversion. During operation, the grating read head emits light, which interferes with the grating lines on the grating ruler structure, forming alternating bright and dark moiré fringes. During the relative movement of the grating read head and the grating ruler structure, the periodic changes in the fringes are converted into electrical pulse signals by the photoelectric elements. By counting these pulses, the displacement is accurately calculated, making the displacement detection results more precise.

[0052] In one embodiment, see Figure 1 The first drive unit 3 includes a voice coil motor. Specifically, a voice coil motor is a linear drive device based on electromagnetic principles, named after the voice coil structure in a loudspeaker. A voice coil motor generates linear motion through the interaction of current and magnetic field, featuring high response speed, high precision, short axial dimension, and compact structure. The voice coil motor can include a stator assembly and a mover assembly, with the mover assembly movably disposed within the stator assembly. Magnetic components can be mounted on the stator assembly, and a coil portion can be mounted on the mover assembly. The stator assembly can be mounted on the connector 1, and the mover assembly can be at least partially connected to the adapter 212. When the voice coil motor is operating, the coil portion can be connected to an external circuit. When the coil portion is energized, it also generates a magnetic field, which interacts with the magnetic field generated by the magnetic component, causing the mover assembly to move along a straight line or arc. By changing the direction of the current flowing into the coil portion (e.g., by applying alternating current), the reciprocating motion of the mover assembly can be achieved.

[0053] In one embodiment, see Figure 1 The pressurizing unit 4 includes a driving cylinder or a driving hydraulic cylinder. In this embodiment, the pressurizing unit 4 uses a driving cylinder or a driving hydraulic cylinder, which makes it easier for the pressurizing unit 4 to apply pressure to the suction nozzle structure 2, and also makes the driving of the pressurizing unit 4 more convenient and simple.

[0054] Secondly, a die bonding apparatus is provided, including the die bonding head device of any of the above-mentioned embodiments. It is understood that the beneficial effects of the second aspect can be found in the relevant description in the first aspect above, and will not be repeated here.

[0055] The above are merely preferred embodiments of the present utility model, and only specifically describe the technical principles of the present utility model. These descriptions are only for explaining the principles of the present utility model and should not be construed as limiting the scope of protection of the present utility model in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model, as well as other specific embodiments of the present utility model that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present utility model.

Claims

1. A die bonding head device, characterized in that, The device includes a die bonding base, a nozzle structure, a first driving unit, and a pressurizing unit. The nozzle structure is slidably connected to the die bonding base. The first driving unit is disposed on the die bonding base and is used to drive the nozzle structure to reciprocate along a first direction. The pressurizing unit is disposed on the die bonding base and is used to apply pressure along the first direction to the nozzle structure during die bonding.

2. The die bonding head device as described in claim 1, characterized in that, The suction nozzle structure includes a sliding seat and a suction nozzle body. The sliding seat is slidably connected to the head connector along the first direction. The suction nozzle body is disposed on the sliding seat along the first direction. The driving end of the first driving unit is connected to the sliding seat. The driving end of the pressurizing unit abuts against or is connected to the sliding seat.

3. The die bonding head device as described in claim 2, characterized in that, The sliding seat includes a seat body, an adapter, and a pressure sensor. The seat body is slidably connected to the connector. The adapter is used to connect to the drive end of the first drive unit, and the drive end of the pressurizing unit also abuts against or is connected to the adapter. The pressure sensor is connected between the seat body and the adapter, and the pressure sensor is used to detect the pressure on the seat body along the first direction.

4. The die bonding head device as described in claim 3, characterized in that, The seat body has a first mounting surface, which is perpendicular to the first direction. The adapter has a second mounting surface that is parallel to the first mounting surface. The first mounting surface and the second mounting surface are spaced apart from each other. The pressure sensor is located between the first mounting surface and the second mounting surface.

5. The die bonding head device as described in claim 4, characterized in that, The driving end of the pressurizing unit abuts against the adapter, and the adapter is provided with an abutting plane perpendicular to the first direction. The driving end of the pressurizing unit is also provided with a spherical structure for contacting the abutting plane.

6. The die bonding head device as described in claim 3, characterized in that, A cross guide rail assembly for guiding the sliding of the seat body is also provided between the seat body and the connector seat.

7. The die bonding head device as described in claim 2, characterized in that, The nozzle body is movably mounted on the sliding seat, and the nozzle body has only one degree of freedom to rotate about its own axis relative to the sliding seat. The connector is provided with a second drive unit for driving the nozzle body to rotate, and a transmission structure is also provided between the drive end of the second drive unit and the nozzle body.

8. The die bonding head device as claimed in claim 1, characterized in that, The die bonding head device also includes a displacement measuring component for detecting the displacement of the nozzle structure.

9. The die bonding head device according to any one of claims 1 to 8, characterized in that, The first drive unit includes a voice coil motor; And / or, the pressurization unit includes a drive cylinder or a drive hydraulic cylinder.

10. A die bonding apparatus, characterized in that, Includes the die bonding head device as described in any one of claims 1 to 9.

Images