Raw material cutting device for single-chip microcomputer chip production

Abstract

The utility model relates to the technical field of single-chip microcomputer chip raw material cutting, and discloses a raw material cutting device for single-chip microcomputer chip production, which comprises a workbench used for supporting the single-chip microcomputer chip raw material cutting device; the cutting fixing mechanism comprises a cutting blade arranged on the workbench and is used for cutting the wafer rod; according to the utility model, the suction cup is used for sucking the end surface of a wafer rod, so that the potential risk during manual supporting and cutting is avoided, the falling of the cut wafer is effectively prevented, the safety of an operator is ensured, in addition, the consistency of a cutting environment is favorably kept, and the working efficiency is improved. And the cutting quality and the production efficiency are further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to singlechip chip raw material cutting technical field especially, it relates to a raw material cutting device for singlechip chip production. BACKGROUND

[0002] It is known that wafer is very important production raw material in the process of singlechip chip production, and the wafer is cut from finished product wafer rod, wherein the raw material cutting device for singlechip chip production is a device for cutting wafer rod in the process of wafer processing for singlechip chip production, which has been widely used in the field of singlechip chip research and development.

[0003] But when cutting the wafer rod, the cut wafer still needs to be manually supported to prevent falling and damage, which is not only dangerous, but also easy to cause the wafer to fall and damage due to hand slip. UTILITY MODEL CONTENTS

[0004] The utility model aims at solving the shortcomings in the prior art and provides a raw material cutting device for singlechip chip production.

[0005] In order to achieve the above object, the utility model adopts the following technical scheme: a raw material cutting device for singlechip chip production, comprising:

[0006] A workbench is used to support the singlechip chip raw material cutting device.

[0007] A cutting fixing mechanism includes a cutting blade arranged on the workbench and used to cut the wafer rod.

[0008] A receiving structure includes a suction cup arranged on the workbench and used to adsorb the cut wafer.

[0009] As a further description of the above technical scheme, the cutting fixing mechanism further includes:

[0010] A second motor is used to drive the cutting blade to rotate, and the cutting blade is fixedly connected to the output end of the second motor.

[0011] A support is used to support the second motor, and the second motor is fixedly connected to one side of the support.

[0012] A support frame is fixedly arranged on the workbench and used to support the cutting blade.

[0013] A first hydraulic cylinder is fixedly arranged at the upper end of the support frame and used to drive the support to lift, and the support is fixedly connected to the output end of the first hydraulic cylinder.

[0014] Limiting grooves are arranged on both sides inside the support frame and used to limit the support, and the support is slidingly connected to the limiting grooves.

[0015] A placing table is fixedly arranged on the workbench and used for placing the wafer rod;

[0016] A first clamping plate is used for fixing the wafer rod during cutting;

[0017] A second clamping plate is used for fixing the wafer rod in cooperation with the first clamping plate;

[0018] A first sliding groove is arranged on the workbench and used for limiting the first clamping plate and the second clamping plate, and the first clamping plate and the second clamping plate are slidably connected to the first sliding groove;

[0019] A threaded rod is rotatably connected to the workbench and used for driving the first clamping plate and the second clamping plate to move oppositely, and the first clamping plate and the second clamping plate are threadedly connected to the threaded rod;

[0020] A first motor is fixedly arranged on one side of the workbench and used for driving the threaded rod to rotate, and one end of the threaded rod is fixedly arranged on an output end of the first motor.

[0021] As a further description of the above technical solution: the output end of the hydraulic cylinder one penetrates the support frame, and the output end of the second motor penetrates the support.

[0022] As a further description of the above technical solution: one end of the threaded rod penetrates the workbench, and the threaded rod penetrates the first clamping plate and the second clamping plate.

[0023] As a further description of the above technical solution: the collecting structure further comprises:

[0024] A fixed block is used for supporting the suction cup, and the suction cup is arranged on one side of the fixed block;

[0025] A second sliding groove is arranged on the workbench and used for limiting the fixed block, and the fixed block is slidably connected to the second sliding groove;

[0026] A fixed rod is fixedly arranged on the fixed block away from the suction cup and used for driving the fixed block to move;

[0027] A second hydraulic cylinder is fixedly arranged at a tail end on the workbench and fixedly arranged at an output end on one end of the fixed rod, and is used for driving the fixed rod to move;

[0028] A flexible hose is fixedly arranged at one end on the fixed block and fixedly arranged at the other end on the workbench, and is used for keeping the flexible hose in communication with the vacuum pump, and one end of the flexible hose is connected to the vacuum pump through a flange.

[0029] As a further description of the above technical solution: the flexible hose penetrates the fixed block, and the flexible hose is in communication with the suction cup.

[0030] As a further description of the above technical solution: the fixed rod is in the shape of L.

[0031] The utility model has the following beneficial effects:

[0032] 1. In the utility model, the wafer rod end face is adsorbed through the suction cup, the potential risk of manual support during cutting is avoided, the falling of the wafer after cutting is effectively prevented, thereby the safety of the operator is guaranteed, in addition, the consistency of the cutting environment is also helped to maintain, and the cutting quality and production efficiency are further improved.

[0033] 2. In the utility model, the threaded rod is rotated through the motor drive, the wafer rod is clamped by the clamping plate one and the clamping plate two driven by the two groups of reverse threads, the shaking of the wafer rod during cutting is effectively prevented, the cutting precision is remarkably improved, and the uniformity and consistency of wafer cutting are ensured. DRAWINGS

[0034] Figure 1 The utility model discloses a kind of raw material cutting device for single-chip microcomputer chip production structure display diagram;

[0035] Figure 2 The utility model discloses a kind of raw material cutting device for single-chip microcomputer chip production structure diagram Figure One ;

[0036] Figure 3 The utility model discloses a kind of raw material cutting device for single-chip microcomputer chip production structure diagram Figure Two ;

[0037] Figure 4 The utility model discloses a kind of raw material cutting device for single-chip microcomputer chip production local structure diagram.

[0038] Legend:

[0039] 1, workbench;201, sliding groove one;202, placement table;203, motor one;204, threaded rod;205, clamping plate one;206, clamping plate two;207, support frame;208, limit slot;209, hydraulic cylinder one;210, support;211, motor two;212, cutting piece;301, sliding groove two;302, hydraulic cylinder two;303, fixed rod;304, fixed block;305, suction cup;306, flexible hose. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model. Apparently, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0041] Example 1:

[0042] For reference Figures 1 to 4 The present invention provides a raw material cutting device for microcontroller chip production, including a worktable 1 for supporting the microcontroller chip raw material cutting device. The worktable 1 includes a cutting fixing mechanism, including a cutting blade 212 arranged on the worktable 1 for cutting the wafer rod.

[0043] In a preferred embodiment, the cutting and fixing mechanism further includes: a second motor 211 for driving the cutting blade 212 to rotate, and the cutting blade 212 is fixedly arranged at the output end of the second motor 211; a bracket 210 for supporting the second motor 211, and the second motor 211 is fixedly arranged on one side of the bracket 210; a support frame 207 fixedly arranged on the worktable 1 for supporting the cutting blade 212; a first hydraulic cylinder 209 fixedly arranged at the upper end of the support frame 207 for driving the bracket 210 to rise and fall, and the bracket 210 is fixedly arranged at the output end of the first hydraulic cylinder 209; a limiting groove 208 formed on both sides inside the support frame 207 for limiting the bracket 210, and the bracket 210 is slidably connected to the limiting groove 208; and a placement table 202. The following components are arranged on the worktable 1 for placing the wafer rod; clamping plate 205 is used to fix the wafer rod during cutting; clamping plate 206 is used to fix the wafer rod in conjunction with clamping plate 205; sliding groove 201 is formed on the worktable 1 to limit clamping plate 205 and clamping plate 206, and clamping plate 205 and clamping plate 206 are slidably connected to sliding groove 201; threaded rod 204 is rotatably connected to the worktable 1 to drive clamping plate 205 and clamping plate 206 to move in opposite directions, and clamping plate 205 and clamping plate 206 are threadedly connected to threaded rod 204; motor 203 is fixedly arranged on one side of the worktable 1 to drive threaded rod 204 to rotate, and one end of threaded rod 204 is fixedly arranged to the output end of motor 203.

[0044] It should be noted that the threaded rod 204 has two sets of opposite threads. The clamping plate 1 205 and the clamping plate 206 are respectively located on both sides of the threaded rod 204. The clamping plate 1 205 has an arc groove on the side near the clamping plate 206, and the clamping plate 206 has an arc groove on the side near the clamping plate 1 205, which makes it easy to fix the wafer rod stably during cutting.

[0045] In a preferred embodiment, the output end of the hydraulic cylinder 209 passes through the support frame 207, and the output end of the motor 211 passes through the bracket 210.

[0046] In a preferred embodiment, one end of the threaded rod 204 passes through the workbench 1, and the threaded rod 204 passes through the clamping plate 1 205 and the clamping plate 206.

[0047] Embodiment 2:

[0048] In order to further improve the stability of wafer cutting, the workbench 1 is provided with a collection structure based on embodiment 1;

[0049] As a preferred implementation, the collection structure comprises a suction cup 305 arranged on the workbench 1 for adsorbing the cut wafer;

[0050] As a preferred implementation, the collection structure further comprises a fixed block 304 for supporting the suction cup 305, and the suction cup 305 is arranged on one side of the fixed block 304; a second sliding groove 301 is arranged on the workbench 1 for limiting the fixed block 304, and the fixed block 304 is slidingly connected to the second sliding groove 301; a fixed rod 303 is fixedly connected to the fixed block 304 away from the side of the suction cup 305, for driving the fixed block 304 to move; a second hydraulic cylinder 302 is fixedly connected to the workbench 1 at the tail end, and the output end is fixedly connected to one end of the fixed rod 303, for driving the fixed rod 303 to move; a flexible hose 306 is fixedly connected to one end of the fixed block 304 and the other end of the workbench 1, for keeping the flexible hose 306 in communication with the vacuum pump, and one end of the flexible hose 306 is connected to the vacuum pump through a flange;

[0051] It should be noted that the shape of the second sliding groove 301 is T-shaped;

[0052] As a preferred implementation, the flexible hose 306 penetrates the fixed block 304, and the flexible hose 306 is in communication with the suction cup 305;

[0053] As a preferred implementation, the shape of the fixed rod 303 is L-shaped.

[0054] Working principle: in use, first, through the flange of one end of the flexible hose 306, the flexible hose 306 is connected to the vacuum pump, then the wafer rod is placed on the placing table 202, then the wafer rod is pushed to slide on the placing table 202 until the wafer rod extends the required cutting thickness, then the motor 203 is started, the motor 203 drives the threaded rod 204 to rotate on the workbench 1, the threaded rod 204 drives the clamping plate 205 and the clamping plate 206 to slide on the sliding groove 201 in opposite directions, and the clamping plate 205 and the clamping plate 206 are fixed on both sides of the wafer rod, thereby preventing the wafer rod from shaking during cutting, improving the cutting accuracy of the wafer rod, then the hydraulic cylinder 302 is started, the hydraulic cylinder 302 drives the fixed rod 303 to move, the fixed rod 303 drives the fixed block 304 to slide on the sliding groove 301 and pulls the flexible hose 306, the fixed block 304 drives the suction cup 305 to move, the vacuum pump is started when the suction cup 305 is attached to the end face of the wafer rod, the vacuum pump drives the suction cup 305 to be adsorbed on the end face of the wafer rod, thereby avoiding manual support during cutting, preventing the wafer from falling after cutting, then the motor 211 is started, the motor 211 drives the cutting blade 212 to rotate, then the hydraulic cylinder 209 is started, the hydraulic cylinder 209 drives the support 210 to slide downward on the limiting groove 208, the cutting blade 212 is released on the wafer rod to cut, after cutting, the hydraulic cylinder 209 is reversed to reset, then the hydraulic cylinder 302 is started to drive the wafer on the suction cup 305 to move to one side, after moving to the required distance, the vacuum pump is turned off, and the wafer is removed.

[0055] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for limiting the present application, although the foregoing detailed description of the present application, for the person skilled in the art, it still can be modified, or part of the technical features of the equivalent replacement, within the spirit and principles of the present application, any modification, equivalent replacement, improvement, etc., should be included in the scope of protection of the present application.

Claims

1. A raw material cutting device for single-chip computer chip production, characterized by: The utility model relates to a single chip wafer cutting device, including: Workbench (1) for supporting single chip wafer cutting device; Cutting fixed mechanism, including cutting piece (212) arranged on workbench (1), for cutting wafer rod; Collecting structure, including suction cup (305) arranged on workbench (1), for adsorbing wafer after cutting.

2. The raw material cutting device for single-chip microcomputer chip production according to claim 1, characterized in that: The cutting fixed mechanism further includes: Motor two (211) for driving cutting piece (212) rotation, and cutting piece (212) is fixedly connected arrangement on the output end of motor two (211); Support (210) for supporting motor two (211), and motor two (211) is fixedly connected arrangement on one side of support (210); Support frame (207) is fixedly arranged on workbench (1), for supporting cutting piece (212); Hydraulic cylinder one (209) is fixedly connected arrangement on the upper end of support frame (207), for driving support (210) to go up and down, and support (210) is fixedly connected arrangement on the output end of hydraulic cylinder one (209); Limiting groove (208) is arranged on both sides in the inside of support frame (207), for supporting (210) limiting, and support (210) is slidably connected on limiting groove (208); Placing table (202) is fixedly connected arrangement on workbench (1), for placing wafer rod; Clamp plate one (205) for fixing wafer rod during cutting; Clamp plate two (206) for fixing wafer rod in cooperation with clamp plate one (205); Slide groove one (201) is arranged on workbench (1), for limiting clamp plate one (205) and clamp plate two (206), and clamp plate one (205) and clamp plate two (206) are slidably connected on slide groove one (201); Threaded rod (204) is rotatably connected on workbench (1), for driving clamp plate one (205) and clamp plate two (206) to move towards each other, and clamp plate one (205) and clamp plate two (206) are threadedly connected on threaded rod (204); Motor one (203) is fixedly connected arrangement on one side of workbench (1), for driving threaded rod (204) rotation, and one end of threaded rod (204) is fixedly connected arrangement on the output end of motor one (203).

3. The raw material cutting device for single-chip microcomputer chip production according to claim 2, characterized in that: The output end of hydraulic cylinder one (209) penetrates support frame (207), and the output end of motor two (211) penetrates support (210).

4. The raw material cutting device for single-chip microcomputer chip production according to claim 3, characterized in that: One end of threaded rod (204) penetrates workbench (1), and threaded rod (204) penetrates clamp plate one (205) and clamp plate two (206).

5. The raw material cutting device for single-chip microcomputer chip production according to claim 4, characterized in that: The collecting structure further includes: Fixed block (304) for supporting suction cup (305), and suction cup (305) is arranged on one side of fixed block (304); Slide groove two (301) is arranged on workbench (1), for limiting fixed block (304), and fixed block (304) is slidably connected on slide groove two (301); Fixed rod (303) is fixedly connected arrangement on fixed block (304) away from one side of suction cup (305), for driving fixed block (304) to move; The hydraulic cylinder two (302) is arranged at the tail end of the workbench (1) and at the output end of the fixed rod (303) to drive the fixed rod (303) to move; The telescopic hose (306) is arranged at one end of the fixed block (304) and at the other end of the workbench (1) to keep the telescopic hose (306) in communication with the vacuum pump, and one end of the telescopic hose (306) is connected with the vacuum pump through a flange.

6. The raw material cutting device for single-chip microcomputer chip production according to claim 5, characterized in that: The telescopic hose (306) penetrates the fixed block (304), and the telescopic hose (306) is in communication with the suction cup (305).

7. The raw material cutting device for single-chip microcomputer chip production according to claim 6, characterized in that: The fixed rod (303) is L-shaped.

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