Chip aging drawer and chip aging test equipment

Abstract

The utility model provides a chip aging drawer and chip aging test equipment, and relates to the technical field of chip test. A PCB assembly is installed on a drawer body and connected with a first connector on the drawer body, the PCB assembly comprises a PCB and at least one heating assembly, and each heating assembly comprises a heating wire arranged on the PCB. The heat sink is installed on the heating assembly, a test clamp is installed on the heat sink, and the heat sink is used for transmitting heat generated by the heating wire to the test clamp so as to carry out aging test on the tested chip in the test clamp. According to the technical scheme, an external heat source and a welding process are canceled, the heating wire is arranged on the PCB to replace the external heat source such as a heating sheet to control the temperature of the tested chip, and the bad problem generated in the production and assembly process can be effectively avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip testing technical field, especially a kind of chip aging drawer and chip aging test equipment. BACKGROUND

[0002] The chip testing equipment for the aging test of laser chip is usually composed of three parts, including an aging test box, an aging drawer and an aging fixture, wherein the aging test box is provided with an aging single layer inside.The aging drawer is usually composed of a drawer structure, a PCB, a heat source and a heat sink.The heat source can be a heating sheet, a refrigeration sheet or a heating rod.When the laser chip is subjected to the aging test, multiple laser chips are placed on the aging fixture, and then the aging fixture is installed on the aging drawer.The aging drawer and the aging single layer are connected by a PCB connector and a back plate connector for communication and power supply to the laser chip and the heat source.When the laser chip is subjected to the aging test, a certain current needs to be applied to the laser chip, and the laser chip needs to be controlled at a suitable aging temperature.A part of the electric energy is used for light emission when the laser chip is powered on, and the other part of the electric energy is converted into heat energy.In order to make the chip reach a suitable aging temperature, the aging drawer needs to provide additional heat energy.Currently, there are three heating methods for the aging drawer:1. using a semiconductor refrigeration sheet;2. using a heating sheet;3. using a heating rod.

[0003] When the semiconductor refrigeration sheet is used for heating, the leads of the refrigeration sheet need to be welded to the PCB of the aging drawer by hand, and then the refrigeration sheet, the heat sink and the heat dissipation sheet are installed together.As the two sides of the current refrigeration sheet are ceramic sheets, they are easy to be crushed during installation.In order to ensure the effective contact between the refrigeration sheet and the heat sink, it is necessary to apply heat-conducting silicone grease, which is inconvenient to operate and easy to volatilize and pollute the laser chip.When the heating sheet or the heating rod is used for heating, the leads of the heating sheet or the heating rod need to be welded to the PCB of the aging drawer by hand.During welding, false welding is easy to occur, and the heating sheet or the heating rod must be in full contact with the heat sink.If the local position does not contact well, the temperature cannot be effectively transmitted, and dry burning is also easy to occur. SUMMARY

[0004] An object of the utility model is to provide a chip aging drawer to solve the technical problem that the external heat source is easy to produce defects during assembly in the prior art.

[0005] A further object of the utility model is to reduce the diffusion of heat generated by the heat source.

[0006] Another object of the utility model is to provide a chip aging test equipment with the above-mentioned chip aging drawer.

[0007] In particular, the utility model provides a chip aging drawer, which comprises:

[0008] A drawer body is provided with a first connector connected with an aging test box;

[0009] A PCB assembly is mounted on the drawer body and connected with the first connector, and comprises a PCB and at least one heating assembly, each of which comprises a heating wire arranged on the PCB;

[0010] At least one heat sink is mounted on the heating assembly, and a test clamp is mounted on the heat sink, which is used to transfer the heat generated by the heating wire to the test clamp to perform aging test on the tested chip in the test clamp.

[0011] Optionally, the heating wire comprises a first part arranged in a wave shape under the heat sink.

[0012] Optionally, the heating wire further comprises two second parts, which are respectively located on opposite sides of the first part, one end of each of the second parts is connected with the first part, and the other end is connected with the first connector.

[0013] Optionally, the width of the heating wire of the first part is smaller than the width of the heating wire of the second part.

[0014] Optionally, a plurality of through holes are arranged on the PCB, and the through holes are distributed around the first part.

[0015] Optionally, each of the through holes is in the shape of a long strip, and at least one through hole is arranged around each of the first parts.

[0016] Optionally, each of the heating assemblies further comprises a fuse connected with the corresponding heating wire for short-circuit protection.

[0017] Optionally, each of the heating assemblies further comprises a thermistor connected with the corresponding heating wire for obtaining the temperature of the heat sink.

[0018] Optionally, each of the heating assemblies corresponds to one heat sink.

[0019] In particular, the utility model further provides a chip aging test equipment, which comprises:

[0020] An aging test box has at least one backboard in the inside, and each backboard has a second connector;

[0021] The chip aging drawer is arranged to be inserted into the aging test box and to connect the first connector with the second connector.

[0022] A test fixture is mounted on the heat sink of the chip aging drawer, and at least one chip under test is mounted inside the test fixture.

[0023] The PCB assembly is mounted on the drawer body and connected with the first connector on the drawer body, and the PCB assembly comprises a PCB and at least one heating assembly, and each heating assembly comprises a heating wire arranged on the PCB. The heat sink is mounted on the heating assembly, and the test fixture is mounted on the heat sink. The heat sink is used for transferring heat generated by the heating wire to the test fixture to perform aging test on the chip under test in the test fixture. The above technical solution cancels the external heat source and the welding process, arranges the heating wire on the PCB, and replaces the external heat source such as the heating sheet to control the temperature of the chip under test, thereby effectively avoiding the adverse problems generated in the production and assembly process.

[0024] Further, the heating wire comprises a first portion, and the first portion is arranged in a wave shape below the test fixture. The PCB is provided with a plurality of through holes, and the plurality of through holes are distributed around the first portion, so as to separate the first portion of the heating wire from other positions of the PCB and avoid heat diffusion through the PCB.

[0025] The above and other objects, advantages and features of the present application will become more apparent from the following detailed description of some embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0026] Some specific embodiments of the present application will be described in detail hereinafter with reference to the accompanying drawings, in an exemplary and non-limiting manner. The same reference signs in the drawings denote the same or similar components or parts. Those skilled in the art should understand that the drawings are not necessarily drawn to scale. In the drawings:

[0027] Figure 1 is a schematic structural view of a chip aging drawer according to an embodiment of the present application;

[0028] Figure 2 is Figure 1 is a schematic structural view of a PCB assembly in the chip aging drawer shown in FIG. 1;

[0029] Figure 3 is a schematic structural view of a PCB assembly and a first connector according to an embodiment of the present application;

[0030] Figure 4is a schematic structural view of a PCB assembly and a heat dissipation fin according to an embodiment of the present utility model;

[0031] Figure 5 is a schematic structural view of a test fixture according to an embodiment of the present utility model.

[0032] Reference signs:

[0033] 100-chip aging drawer, 200-chip under test, 10-drawer body, 20-PCB assembly, 30-test fixture, 40-handle, 50-heat dissipation fin, 60-heat sink, 11-first connector, 21-PCB, 22-heating wire, 221-first part, 222-second part, 23-thermistor, 24-fuse, 25-through hole, 31-cover plate, 32-connection plate, 33-probe base, 34-first test probe. DETAILED DESCRIPTION

[0034] Embodiments of the present utility model are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present utility model, and cannot be understood as a limitation of the present utility model.

[0035] In the description of the present utility model, it is understood that the orientation or position relationship indicated by the terms "upper", "lower", etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present utility model.

[0036] The terms "first", "second", etc. are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features, i.e. one or more of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited. When a certain feature "includes or contains" a certain or certain features, unless otherwise specifically described, it indicates that other features and can further include other features are not excluded.

[0037] Unless otherwise clearly indicated or limited by the context, the terms "connect," "mount," and the like are to be construed broadly. For example, "connect" and "mount" can mean fixedly connected, releasably connected, or integrally formed; can mean mechanical connection, electrical connection, or both; can mean direct connection, or indirect connection via an intermediary; and can mean an internal connection between two elements, or an interaction between two elements. Those of ordinary skill in the art should understand the meaning of these terms in the context of the present application.

[0038] Unless otherwise defined, all terms (including technical and scientific terms) used in the description of the embodiments presented herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0039] Figure 1 is a schematic structural diagram of a chip aging drawer 100 according to an embodiment of the present application, Figure 2 is Figure 1 is a schematic structural diagram of a PCB assembly 20 in the chip aging drawer 100 shown in Figure 3 is a schematic structural diagram of a PCB assembly 20 and a first connector 11 according to an embodiment of the present application. As Figures 1 to 3 shown in the figure, in one specific embodiment, the chip aging drawer 100 includes a drawer body 10, a PCB assembly 20, and at least one heat sink 60. The drawer body 10 is provided with the first connector 11, which is connected to an aging test box. The PCB assembly 20 is mounted on the drawer body 10 and connected to the first connector 11. The PCB assembly 20 includes a PCB board 21 and at least one heating assembly. Each heating assembly includes a heating wire 22 arranged on the PCB board 21. The heat sink 60 is mounted on the heating assembly, and the test fixture 30 is mounted on the heat sink 60. The heat sink 60 is used to transfer the heat generated by the heating wire 22 to the test fixture 30. This embodiment is equivalent to laying the heating wire 22 on the PCB board 21. The heating wire 22 generates heat after being powered, and the heat is transferred to the test fixture 30 through the heat sink 60.

[0040] This embodiment cancels the external heat source and the soldering process. The heating wire 22 is arranged on the PCB board 21, replacing the external heat source such as a heating sheet to control the temperature of the measured chip 200. This can effectively avoid the problems caused during the production and assembly process.

[0041] In some embodiments, the inside of the aging test box has at least one backboard, each backboard has a second connector. When the chip aging drawer 100 is inserted into the aging test box, the first connector 11 of the chip aging drawer 100 is connected with the second connector of the backboard, so as to realize power supply to the PCB board 21 of the chip aging drawer 100. The drawer body 10 of the chip aging drawer 100 has a handle 40, through which the chip aging drawer 100 can be conveniently inserted into and separated from the aging test box.

[0042] In some embodiments, each heating assembly corresponds to one heat sink 60. Above each heat sink 60 is provided with one test fixture 30. That is, one heating assembly is used to heat one test fixture 30. In other embodiments, multiple heating assemblies can also be provided to heat one test fixture 30, or one heating assembly can heat multiple test fixtures 30, which is determined according to design requirements.

[0043] In some embodiments, the heating wire 22 includes a first part 221, which is arranged in a wave shape below the heat sink 60. Here, the first part 221 of the heating wire 22 is arranged directly below the heat sink 60.

[0044] In a preferred embodiment, the first part 221 of the heating wire 22 is uniformly arranged below the heat sink 60, so as to realize uniform heating of the test fixture 30. The shape of the first part 221 of the heating wire 22 is consistent with the shape of the test fixture 30. If the test fixture 30 is rectangular, the first part 221 of the heating wire 22 is also rectangular as a whole, so as to realize uniform heating of the test fixture 30.

[0045] In some embodiments, the heating wire 22 further includes two second parts 222, which are respectively located on opposite sides of the first part 221, one end of each second part 222 is connected with the first part 221, and the other end is connected with the first connector 11. Here, the two ends of the first part 221 are respectively connected with one second part 222.

[0046] In some embodiments, the width of the heating wire 22 of the first part 221 is smaller than the width of the heating wire 22 of the second part 222. It can be understood that in this embodiment, when the circuit of the heating wire 22 is designed, the width of the heating wire 22 at the bottom of the test fixture 30, that is, the first part 221 of the heating wire 22, is narrower, that is, the resistance is larger, and more heat can be generated. The width of the heating wire 22 on both sides of the PCB board 21, that is, the second part 222 of the heating wire 22, is wider, so as to reduce the heat as much as possible. It can be understood that the main part of the heating wire 22 that provides heat to the test fixture 30 is the first part 221.

[0047] The embodiment is designed to make the heating wire 22 generate more heat for the aging test and reduce unnecessary heat loss.

[0048] In some embodiments, the PCB board 21 is provided with a plurality of through holes 25, which are distributed around the first part 221 to separate the first part 221 of the heating wire 22 from other positions of the PCB board 21 and avoid heat spreading through the PCB board 21.

[0049] In some embodiments, each through hole 25 is in the shape of a long strip, and each first part 221 is provided with at least one through hole 25 around it. In this embodiment, the first part 221 of the heating wire 22 is in the shape of a rectangle as a whole, so the through holes 25 are arranged around the first part 221 of the heating wire 22. In this embodiment, one long-strip-shaped through hole 25 is arranged at each side of the first part 221 of the heating wire 22, and the extension length of the through hole 25 is close to the overall length of the first part 221 of the heating wire 22. The width of the through hole 25 is set according to the arrangement space. If the arrangement space of the PCB board 21 is large, the width of the through hole 25 is larger, and if the arrangement space of the PCB board 21 is small, the width of the through hole 25 is smaller.

[0050] In some embodiments, each heating assembly further comprises a fuse 24 connected to the corresponding heating wire 22 for short-circuit protection. On the one hand, the fuse 24 has an over-temperature protection function, which can be selected according to the maximum temperature at which the chip aging drawer 100 can work for a long time; on the other hand, the fuse 24 has an over-current protection function, and if a short circuit occurs in the loop of the heating wire 22, causing the current of the heating wire 22 to be too large, the fuse 24 can be directly fused to protect against short circuits.

[0051] In some embodiments, each heating assembly further comprises a thermistor 23 connected to the corresponding heating wire 22 for obtaining the temperature of the heat sink 60. The thermistor 23 can feedback the real-time temperature of the heat sink 60. Since the heating wire 22 on the PCB board 21 is in a continuous heating state after being powered on, when the real-time temperature exceeds the aging temperature required by the chip under test 200, the thermistor 23 feeds back the temperature to the temperature controller, which stops supplying power to the heating wire 22 on the PCB board 21, at which time the heating stops. When the real-time temperature is lower than the aging temperature required by the chip under test 200, the temperature controller works to supply power to the heating wire 22 on the PCB board 21, at which time the temperature rises, thereby accurately controlling the heating temperature.

[0052] In a preferred embodiment, the thermistor 23 is arranged at the middle position of the heat sink 60, so that the actual temperature of the heat sink 60 can be more accurately obtained.

[0053] Figure 4 is a schematic structural view of the PCB assembly 20 and the heat dissipation fin 50 according to an embodiment of the present application. As shown in the figure, in some embodiments, the chip aging drawer 100 further comprises at least one heat dissipation fin 50, which is located below the PCB 21 and used for dissipating heat from the PCB 21. Here, the drawer body 10 is hollow inside, and the PCB 21 can be installed above the drawer body 10, and the heat dissipation fin 50 can be arranged inside the drawer body 10. Figure 4

[0054] In some embodiments, the number of heat dissipation fins 50 is consistent with the number of heating wires 22, and each heat dissipation fin 50 is arranged in correspondence with one heating wire 22. If the number of heating wires 22 is two, then the number of heat dissipation fins 50 is also two.

[0055] Figure 5 is a schematic structural view of the test fixture 30 according to an embodiment of the present application. As shown in the figure, Figure 5 In one embodiment, the test fixture 30 comprises a cover plate 31, a connecting plate 32, a test seat, and a probe seat 33, wherein the test seat is located above the heat sink 60, the connecting plate 32 is installed above the test seat, and the cover plate 31 is installed above the connecting plate 32. Here, the connecting plate 32 is equivalent to a circuit board. The inside of the test seat is provided with a plurality of test sites for placing the measured chips 200. A plurality of probe groups are arranged inside the test seat, each probe group corresponds to one measured chip 200, and comprises a plurality of first test probes 34. The bottom of the first test probe 34 is in contact with the measured chip 200, and the top of the first test probe 34 penetrates the test seat and is in contact with the connecting plate 32. The left and right sides of the connecting plate 32 are respectively provided with one probe seat 33, and the inside of each probe seat 33 is provided with a plurality of second test probes, the top of the second test probe is in contact with the connecting plate 32, and the bottom is in contact with the PCB 21, so as to transmit the test data of the measured chip 200 to the PCB 21, and then transmit the test data to the backboard through the first connector 11.

[0056] In some embodiments, the backboard comprises a temperature controller, the thermistor 23 serves as a temperature feedback sensor, and the temperature is fed back to the temperature controller of the backboard through the PCB 21. The host computer controls the operation of the temperature controller, and the temperature controller controls the heating wire 22 of the PCB 21 to heat up, and the temperature is transmitted to the test fixture 30 and the measured chip 200 through the heat sink 60, so as to realize the aging test of the measured chip 200.

[0057] ​The embodiment also provides a chip aging test device, which comprises an aging test box, the chip aging drawer 100 according to any one of the above embodiments, and a test fixture 30. The interior of the aging test box has at least one backplane, and each backplane has a second connector. The chip aging drawer 100 is arranged to be inserted into the aging test box, and the first connector 11 is connected with the second connector, so that the backplane supplies power to the PCB board assembly 20. The test fixture 30 is mounted on the heat sink 60 of the chip aging drawer 100, and the interior of the test fixture 30 is mounted with at least one chip under test 200. For the chip aging drawer 100, details are not repeated here.

[0058] The embodiment cancels the existing heating mode, such as external heating sheet, heating rod or refrigeration sheet, and has lower cost. By arranging the heating wire 22 on the PCB board 21, the layout design of the heating wire 22 is completed in the early stage of the design of the PCB board 21, no additional heat source is needed, the welding process is cancelled, the efficiency is higher, there is no risk of virtual welding, the problem of poor welding and assembly process is solved, and dry burning or pollution of the chip of other heating modes is avoided.

[0059] At this point, those skilled in the art should recognize that, although the present application has been shown and described in detail in this paper, many other variants or modifications conforming to the principles of the present application can be directly determined or deduced according to the content disclosed in the present application without departing from the spirit and scope of the present application. Therefore, the scope of the present application should be understood and recognized as covering all these other variants or modifications.

Claims

1. A chip burn-in drawer, comprising: The chip aging drawer comprises: a drawer body, a first connector being arranged on the drawer body and connected with an aging test box; a PCB assembly, the PCB assembly being mounted on the drawer body and connected with the first connector, the PCB assembly comprising a PCB and at least one heating assembly, each of the heating assemblies comprising a heating wire arranged on the PCB; at least one heat sink, the heat sink being mounted on the heating assembly, a test fixture being mounted on the heat sink, the heat sink being used to transfer heat generated by the heating wire to the test fixture to perform an aging test on a chip under test in the test fixture.

2. The chip aging drawer according to claim 1, wherein the heating wire comprises a first portion, the first portion being arranged in a wave shape under the heat sink.

3. The chip aging drawer according to claim 2, wherein the heating wire further comprises two second portions, the two second portions being respectively arranged on opposite sides of the first portion, one end of each of the second portions being connected with the first portion, and the other end of each of the second portions being connected with the first connector.

4. The chip aging drawer according to claim 3, wherein a width of the heating wire of the first portion is smaller than a width of the heating wire of the second portion.

5. The chip aging drawer according to claim 2, wherein a plurality of through holes are arranged on the PCB, the through holes being distributed around the first portion.

6. The chip aging drawer according to claim 5, wherein each of the through holes is in a strip shape, and at least one of the through holes is arranged around each of the first portions.

7. The chip aging drawer according to any one of claims 1-6, wherein each of the heating assemblies further comprises a fuse, the fuse being connected with the corresponding heating wire for short circuit protection.

8. The chip aging drawer according to any one of claims 1-6, wherein each of the heating assemblies further comprises a thermistor, the thermistor being connected with the corresponding heating wire for obtaining a temperature of the heat sink.

9. The chip aging drawer according to any one of claims 1-6, wherein each of the heating assemblies corresponds to one of the heat sinks.

10. A chip burn-in test apparatus, characterized by comprising: The chip aging drawer comprises: an aging test box, the aging test box having at least one back plate inside, each of the back plates having a second connector; the chip aging drawer according to any one of claims 1-9, the chip aging drawer being arranged to be inserted into the aging test box and to connect the first connector with the second connector; a test fixture, the test fixture being mounted on the heat sink of the chip aging drawer, at least one chip under test being mounted inside the test fixture.

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