Integrated audio power amplifier host

Abstract

The embodiment of the utility model provides an integrated audio power amplifier host. The integrated audio power amplifier host comprises a PoE switching module, an integrated power amplifier module, a wireless audio receiver, a power supply module and a box body, the PoE switching module, the integrated power amplifier module and the wireless audio receiver are arranged in the box body; the box body comprises a front panel and a rear panel, the front panel is provided with an Ethernet interface and a PoE interface, and the Ethernet interface and the PoE interface are connected to the PoE switching module; the rear panel is provided with an input interface area and an output interface area, and at least part of interfaces in the input interface area and the output interface area are connected to the integrated power amplifier module; and the PoE switching module is electrically connected with the integrated power amplifier module and the wireless audio receiver.

Description

TECHNICAL FIELD

[0001] The present specification relates to the field of audio technology, in particular to an integrated audio power amplifier host. BACKGROUND

[0002] With the rapid development of smart home and Internet of Things technology, the market demand for integration of audio systems with other smart devices is increasing. Traditional audio power amplifier host systems can usually only perform basic audio amplification and playback, lacking effective management of other smart devices, resulting in users having to purchase and maintain multiple independent devices to achieve a comprehensive smart experience. There are usually compatibility problems between different types of devices, and the wiring of traditional systems in device connection is complex, making the installation, configuration and daily maintenance of the system complex and increasing the risk of system failure.

[0003] Therefore, it is necessary to develop an integrated audio power amplifier host that can integrate audio amplification, network management and power supply functions in a single device, improving the integration of the system and reducing the related space occupation. CONTENT OF THE UTILITY MODEL

[0004] One or more embodiments of the present specification provide an integrated audio power amplifier host, comprising: a PoE switching module, an integrated amplifier module, a wireless audio receiver, a power supply module and a box body; the PoE switching module, the integrated amplifier module and the wireless audio receiver are placed inside the box body; the box body comprises a front panel and a rear panel, the front panel is provided with an Ethernet interface and a PoE interface, the Ethernet interface and the PoE interface are connected to the PoE switching module; the rear panel is provided with an input interface area and an output interface area, at least part of the interfaces in the input interface area and the output interface area are connected to the integrated amplifier module; the PoE switching module is electrically connected to the integrated amplifier module and the wireless audio receiver.

[0005] In some embodiments, the integrated amplifier module further comprises a PoE input module, the PoE input module comprising a DC voltage stabilizing device, a power supply isolation device and a filter.

[0006] In some embodiments, an electromagnetic shielding layer is provided outside the integrated amplifier module.

[0007] In some embodiments, a vibration-proof layer is provided outside the PoE switching module.

[0008] In some embodiments, the top of the box body is provided with a heat dissipation fin.

[0009] In some embodiments, the heat dissipation fin comprises a connecting portion and a main body portion, the connecting portion is fixedly connected with the top of the box body, and the main body portion comprises a plurality of protrusions extending away from the connecting portion.

[0010] In some embodiments, at least one third-party device interface is further arranged on the rear panel.

[0011] In some embodiments, the input interface region is provided with one or more input interfaces, and the input interfaces comprise at least one of a USB interface, an HDMI-IN interface, a coaxial interface, a fiber interface and a LINE-IN interface.

[0012] In some embodiments, the output interface region is provided with a mode switching push button and one or more output interfaces, and the output interfaces comprise at least one of a LINE-OUT interface, a SUB interface and a BRIDGE interface.

[0013] In some embodiments, at least one of an HDMI-ARC / eARC interface, a microphone interface, a power supply interface and an antenna interface is further arranged on the rear panel, and the power supply interface is electrically connected with the power supply module. BRIEF DESCRIPTION OF DRAWINGS

[0014] The present specification will be further illustrated in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not restrictive, and in these embodiments, the same numbers represent the same structures, wherein:

[0015] Figure 1 is a whole schematic diagram of an integrated audio power amplifier host shown according to some embodiments of the present specification;

[0016] Figure 2a is an exemplary structural schematic diagram of a vibration-proof layer shown according to some embodiments of the present specification;

[0017] Figure 2b is another exemplary structural schematic diagram of a vibration-proof layer shown according to some embodiments of the present specification;

[0018] Figure 3 is an exemplary schematic diagram of a front panel of a box body shown according to some embodiments of the present specification;

[0019] Figure 4 is an exemplary schematic diagram of a rear panel of a box body shown according to some embodiments of the present specification;

[0020] Figure 5 is an exemplary structural schematic diagram of a heat dissipation fin shown according to some embodiments of the present specification.

[0021] In the drawings:

[0022] 100, integrated audio power amplifier host; 110, PoE switching module; 120, integrated amplifier module; 130, wireless audio receiver; 140, power module; 150, cabinet; 151, front panel; 152, rear panel; 1511, Ethernet interface; 1512, POE interface; 210-1, honeycomb structure; 210-2, hollow structure; 410, third-party device interface; 420, HDMI-ARC / eARC interface; 430, microphone interface, 440, power interface; 450, antenna interface; 460, input interface area; 461, USB interface; 462, HDMI-IN interface; 463, coaxial interface; 464, fiber interface; 465, LINE-IN interface; 470, output interface area; 471, mode switching push button; 472, LINE-OUT interface; 473, SUB interface; 474, BRIDGE interface; 510, heat dissipation fin; 511, connecting part; 512, main body part; 520, top of cabinet. DETAILED DESCRIPTION

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present specification, the drawings needed to be used in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some examples or embodiments of the present specification, and for those skilled in the art, the present specification can also be applied to other similar scenarios without creative labor on the basis of these drawings. Unless it is obvious from the language environment or otherwise stated, the same reference numerals in the drawings represent the same structure or operation.

[0024] It should be understood that the "system", "device", "unit" and / or "module" used herein is a method for distinguishing different components, elements, parts, sections or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0025] Unless the context clearly indicates otherwise, the words "one", "an", "a", and / or "the" do not mean a single number, but can also include a plurality. Generally speaking, the terms "comprise" and "include" only indicate that the steps and elements explicitly identified are included, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements.

[0026] It should be understood that the "first", "second" and similar words used in the present specification do not represent any order, number or importance, but are only used to distinguish different components. Unless otherwise indicated, "front", "rear", "lower" and / or "upper" and similar words are only for convenience of description, and are not limited to a position or a spatial orientation.

[0027] Figure 1 is an exemplary structural schematic diagram of an integrated audio power amplifier host shown according to some embodiments of the present specification.

[0028] In some embodiments, as shown in Figure 1 , the integrated audio power amplifier host 100 can include a PoE switching module 110, an integrated amplifier module 120, a wireless audio receiver 130, a power supply module 140, and a cabinet 150.

[0029] PoE (Power over Ethernet) refers to a technology for transmitting power through a network cable. The PoE switching module 110 refers to a device that has both data transmission switching function and PoE power supply function.

[0030] In some embodiments, the PoE switching module 110 is electrically connected to the integrated amplifier module 120 and the wireless audio receiver 130.

[0031] In some embodiments, the PoE switching module 110 can be configured to supply power to external devices connected to the integrated audio power amplifier host 100, for example, the PoE switching module 110 can supply power to external devices through a PoE interface. The external devices can be speakers, displays, ceiling speakers, etc.

[0032] In some embodiments, the PoE switching module 110 can realize data transmission between the integrated amplifier module 120, the wireless audio receiver 130, the external devices connected through the PoE interface, and the Ethernet through the network cable. For example, the PoE switching module 110 can connect the integrated amplifier module 120 and the wireless audio receiver 130 to the Ethernet through the network cable connected to the Ethernet interface, so that the integrated amplifier module 120 and the wireless audio receiver 130 can transmit data through the Ethernet, and also realize data transmission with the external devices through the PoE interface. For more information about the Ethernet interface and the PoE interface, see the relevant description of the cabinet below.

[0033] In some embodiments, the PoE switching module 110 is externally provided with a vibration-proof layer. For example, the vibration-proof layer can be provided on each side around the PoE switching module 110, or only on the side facing the integrated amplifier module 120, which can be set according to actual needs.

[0034] Figure 2a is an exemplary structural schematic diagram of a vibration-proof layer shown according to some embodiments of the present specification. Figure 2b is another exemplary structural schematic diagram of a vibration-proof layer shown according to some embodiments of the present specification.

[0035] The anti-vibration layer is a component for isolating the vibration of the integrated power amplifier module 120. For example, the anti-vibration layer can be composed of one or more of rubber, polyurethane, etc. In some embodiments, as shown in FIGS. 10A and 10B, the anti-vibration layer can include a honeycomb structure 210-1 and / or a hollow structure 210-2, etc. Figure 2a 、 Figure 2b As shown in FIGS. 10A and 10B, the anti-vibration layer can include a honeycomb structure 210-1 and / or a hollow structure 210-2, etc.

[0036] In some embodiments of the present specification, the arrangement of the anti-vibration layer can effectively isolate the vibration generated by the integrated power amplifier module, avoid the deformation of the internal structure of the PoE switching module due to vibration, thereby enhancing the stability and durability of the PoE switching module, and improving the user experience.

[0037] In some embodiments of the present specification, by arranging the PoE switching module in the integrated audio power amplifier host, power supply and data transmission can be realized simultaneously through Ethernet, realizing the connection within the network, without occupying external network ports, reducing the complexity of wiring, reducing the complexity and cost of the system, providing a unified power supply and network foundation for connected devices, effectively solving the compatibility problem between devices, and enhancing the stability and reliability of the system.

[0038] AoIP (Audio over Internet Protocol) refers to a technology for real-time transmission of high-fidelity digital audio signals in the form of IP streams over a normal Ethernet network. Among them, high fidelity refers to non-compressed high-performance streaming audio with a sampling rate of 44.1 kHz as the basis, not less than 16 bits, and a delay of less than 10 ms.

[0039] The integrated power amplifier module 120 is a power amplifier audio module based on AoIP technology.

[0040] In some embodiments, the integrated power amplifier module can include an AoIP module, a signal processing module, a power amplifier module, a control management module, an audio input / output module, etc.

[0041] The AoIP module is a module for realizing network-based audio signal transmission. For example, the AoIP module can receive and send audio streams through an IP network (such as Ethernet). In some embodiments, the AoIP module can use Dante, Ravenna, AES67, etc. Audio network protocol to receive audio data streams from other devices or networks and convert them into appropriate analog or digital signals to pass to the signal processing module.

[0042] The signal processing module is a module responsible for processing or converting audio signals. For example, the signal processing module can be a digital signal processor (DSP). In some embodiments, the signal processing module can also include an audio decoder, such as a Dolby Digital decoder, an AAC decoder, etc. In some embodiments, the signal processing module can be configured to adjust the frequency response, loudness control, delay adjustment, decoding, etc. of the input audio signal to ensure the quality and clarity of the audio signal. In some embodiments, the signal processing module can pass the processed audio signal to the power amplification module.

[0043] The power amplification module is a module that amplifies the audio signal to sufficient power to drive a load such as a loudspeaker. For example, the power amplification module can include at least one of a digital power amplifier and an analog power amplifier, etc.

[0044] The control management module is a module for providing device control functions. In some embodiments, the control management module can include at least one of a local control module (such as a physical button, a knob, etc.), a remote control module (such as through a network, a Web interface, an application, etc.), etc. In some embodiments, a user can control the integrated power amplifier module 120 through the control management module, for example, the user can adjust audio parameters, enable / disable the integrated power amplifier module 120, etc. through buttons or a network, etc.

[0045] The audio input / output module is a module that implements the input / output of audio signals. In some embodiments, the audio input module is connected to the interface of the wireless audio receiver and the input interface area, and the audio output module is connected to the interface of the output interface area.

[0046] For more information about the input interface area and the output interface area, see the following.

[0047] In some embodiments, the integrated power amplifier module 120 further includes a PoE input module, which includes a DC voltage stabilizing device, a power isolation device, and a filter.

[0048] The PoE input module refers to a module in the integrated audio power amplifier host 100 that is responsible for receiving DC power transmitted from the PoE switching module 110. In some embodiments, the PoE input module can convert, stabilize, and electrically isolate the DC power to ensure that the subsequent circuit is provided with clean and stable DC power supply.

[0049] The DC voltage stabilizing device is a device for converting high voltage provided by the PoE switching module 110 into low voltage required by the audio power amplifier. For example, the DC voltage stabilizing device can be a DC-DC converter, etc.

[0050] The power isolation device is a device for isolating the PoE power supply circuit from the audio circuit. For example, the power isolation device can be an isolation transformer or the like. By providing the power isolation device, the power supply noise or ground noise generated by the PoE power supply can be prevented from interfering with the integrated audio power amplifier host 100.

[0051] The filter is a device for filtering specific frequencies in an electrical signal. For example, the filter can be a low-pass filter or the like. By providing the filter, high-frequency noise and interference included in the PoE power supply can be removed.

[0052] In some embodiments of the present specification, by providing the PoE input module in the integrated power amplifier module, the PoE exchange module can achieve more stable power supply, enhance electrical safety and anti-interference capability, and simplify wiring and installation, thereby significantly improving the reliability, sound quality performance, and maintenance convenience of the system.

[0053] In some embodiments, an electromagnetic shielding layer is provided outside the integrated power amplifier module 120.

[0054] The electromagnetic shielding layer is a metal shielding cover provided outside the integrated power amplifier module 120. In some embodiments, the electromagnetic shielding layer can be composed of one or more of aluminum alloy, copper, stainless steel, conductive plastic, or the like.

[0055] In some embodiments of the present specification, by providing the electromagnetic shielding layer outside the integrated power amplifier module, electromagnetic interference generated by other modules (such as the PoE exchange module, wireless microphone receiving board, etc.) integrated inside can be effectively avoided, and the transmission quality of the audio signal can be improved.

[0056] In some embodiments of the present specification, by providing the integrated power amplifier module in the integrated audio power amplifier host, the AoIP technology is introduced, which can achieve lossless transmission, low latency, and multi-channel transmission of the audio signal, support bidirectional transmission, make the audio source more extensive and easy to manage, and have more compatibility, thereby effectively improving the efficiency and quality of audio transmission.

[0057] The wireless audio receiver 130 is a receiver for receiving signals sent by the wireless microphone. In some embodiments, the wireless audio receiver 130 can be a Bluetooth audio receiver, a Wi-Fi audio receiver, or the like. In some embodiments, the wireless audio receiver 130 can transmit the received signals to the integrated power amplifier module 120, and transmit the signals to an external loudspeaker device (such as a ceiling speaker) after signal processing and power amplification.

[0058] In some embodiments of the present specification, by providing the wireless audio receiver, the wireless microphone signal can be received to reduce the wiring related to the microphone, and the system is easy to manage and has more compatibility.

[0059] The power module 140 is a module for converting power.

[0060] In some embodiments, the power module 140 can be electrically connected with the PoE switching module 110, the integrated power amplifier module 120, and the wireless audio receiver 130.

[0061] In some embodiments, the power module 140 can convert power into power of specific voltage and current for use by other components inside the integrated audio power amplifier host 100. For example, the power module 140 can convert high-voltage alternating current from an external power source into low-voltage direct current. The external power source can refer to power accessed through a power interface, more details of which are described in the corresponding description of Figure 4 .

[0062] In some embodiments of the present specification, the power module is configured such that the integrated audio power amplifier host can be powered by an external power source to meet the needs of various use scenarios.

[0063] The cabinet 150 is a container for accommodating and fixing the components inside the integrated audio power amplifier host 100. In some embodiments, the PoE switching module 110, the integrated power amplifier module 120, and the wireless audio receiver 130 are placed inside the cabinet 150.

[0064] Figure 3 is an exemplary schematic diagram of a front panel of a cabinet according to some embodiments of the present specification.

[0065] In some embodiments, the cabinet includes a front panel and a rear panel, as Figure 3 shown, the front panel 151 is provided with an Ethernet interface 1511 and a PoE interface 1512, the Ethernet interface 1511 and the PoE interface 1512 are connected to the PoE switching module 110. The Ethernet interface 1511 is an interface for connecting to an external Ethernet through a network cable, and the PoE interface 1512 is an interface for supplying power and transmitting data to a connected external device through a network cable.

[0066] In some embodiments, the front panel 151 can be provided with multiple Ethernet interfaces 1511 and PoE interfaces 1512. For example, as Figure 3 shown, the front panel 151 can be provided with 2 Ethernet interfaces 1511 and 8 PoE interfaces 1512.

[0067] Figure 4 is an exemplary schematic diagram of a rear panel of a cabinet according to some embodiments of the present specification.

[0068] In some embodiments, as Figure 4As shown, the rear panel 152 of the cabinet 150 is provided with an input interface area 460 and an output interface area 470, at least part of the input interface area 460 and the output interface area 470 being connected to the integrated amplifier module 120.

[0069] The input interface area 460 refers to an area containing an audio input interface.

[0070] In some embodiments, the input interface area 460 is provided with one or more input interfaces, which can include at least one of a USB interface 461, an HDMI-IN interface 462, a coaxial interface 463, an optical interface 464, and a LINE-IN interface 465. The input interface is an interface for inputting an audio signal from an external device to the integrated amplifier module 120.

[0071] The USB (Universal Serial Bus) interface 461 is a commonly used data transmission interface that supports high-quality audio signal transmission. In some embodiments, the integrated amplifier module 120 can obtain local audio files from an external device connected via the USB interface 461. In some embodiments, the integrated amplifier module 120 can also connect a microphone, an external sound card, or the like via the USB interface 461 to obtain audio input.

[0072] The HDMI-IN (High-Definition Multimedia Input) interface 462 is an interface for inputting uncompressed audio and video data. In some embodiments, an audio signal can be transmitted from an external device to the integrated amplifier module 120 via a cable connected to the HDMI-IN interface 462.

[0073] The coaxial (COAXIAL) interface 463 is an input interface for transmitting digital audio signals using a coaxial cable. The optical (OPTICAL) interface 464 is an input interface for transmitting digital audio signals via an optical cable. The LINE-IN interface 465 is an input interface for analog audio signals. In some embodiments, the LINE-IN interface 465 can include input interfaces for left and right channels.

[0074] In some embodiments of the present specification, by providing one or more input interfaces, and the input interfaces including at least one of a USB interface, an HDMI-IN interface, a coaxial interface, an optical interface, and a LINE-IN interface, the integrated audio amplifier host can better adapt to various audio devices to receive audio signals input from different audio devices, apply to various application scenarios, and ensure high-quality audio signal transmission.

[0075] The output interface area 470 refers to an area containing an audio output interface.

[0076] In some embodiments, the output interface area 470 is provided with a mode switching push button 471 and one or more output interfaces, including at least one of a LINE-OUT interface 472, a SUB interface 473, and a BRIDGE interface 474.

[0077] The mode switching push button 471 is a push button for switching between a stereo mode and a bridge mode. For example, the mode switching push button 471 can be used to turn off / bridge a high-power speaker device.

[0078] The output interface is an interface for outputting an audio signal from the integrated amplifier module 120 to an external device.

[0079] The LINE-OUT interface 472 is an output interface for an analog audio signal. In some embodiments, the LINE-OUT interface 472 can include output interfaces for left and right channels.

[0080] The SUB interface 473 refers to a subwoofer output interface. In some embodiments, the SUB interface 473 can be used to connect a subwoofer, and the integrated amplifier module 120 can transmit a low-frequency audio signal to the subwoofer through the SUB interface 473 for playing.

[0081] The BRIDGE interface 474 is an interface for implementing a bridge mode. The bridge mode refers to a mode for converting a two-channel amplifier into a single-channel output to increase output power. In some embodiments, the integrated amplifier module 120 can connect a passive speaker through the BRIDGE interface 474 to implement the bridge mode as needed.

[0082] In some embodiments of the present specification, by providing a mode switching push button and output interfaces, and the output interfaces including at least one of a LINE-OUT interface, a SUB interface, and a BRIDGE interface, the integrated audio amplifier host can better adapt to various audio devices to output audio signals to different audio devices, apply to various application scenarios, and ensure high-quality audio signal transmission.

[0083] In some embodiments, at least one third-party device interface 410 is further provided on the rear panel 152. For example, as shown in FIG. 4, the third-party device interface 410 can be an RS485 interface. Figure 4

[0084] ​In some embodiments, the integrated audio power amplifier host 100 can also be connected to the API (Application Programming Interface) of the third-party device through the third-party device interface 410, so that the user can control the integrated audio power amplifier host 100 and the connected external devices (such as display screens, PLC electric controls, etc. smart home devices) through the third-party device API.

[0085] In some embodiments, the integrated audio power amplifier host 100 can also be connected to the API of the third-party device through the Ethernet interface 1511.

[0086] In some embodiments of the present specification, at least one third-party device interface is further provided on the back panel, so that the user can connect the integrated audio power amplifier host to the API of the third-party device through the third-party device interface, and thus can more conveniently control the integrated audio power amplifier host and the connected external devices.

[0087] In some embodiments, the back panel 152 is further provided with at least one of an HDMI-ARC / eARC interface 420, a microphone interface 430, a power supply interface 440, and an antenna interface 450.

[0088] ARC (Audio Return Channel) and eARC (enhanced Audio Return Channel) are different versions of the audio return function of HDMI, wherein eARC has higher bandwidth and higher device compatibility than ARC. The HDMI-ARC / eARC interface 420 allows audio to be transmitted bidirectionally between devices through the same HDMI cable.

[0089] The microphone interface 430 is an audio input interface for connecting an active microphone. For example, the microphone interface 430 can include a 6.35mm audio jack and an XLR interface.

[0090] The power supply interface 440 is an interface for connecting an external power supply. In some embodiments, the integrated audio power amplifier host 100 can be powered by connecting an external power supply through the power supply interface 440. For example, the power supply interface 440 can be a 100-240V ~ 50 / 60Hz, 300W power supply interface, i.e., a power supply with an input AC voltage of 100-240V, a working frequency of 50Hz or 60Hz, and a rated power of 300W. In some embodiments, the power supply interface 440 can be electrically connected to the power supply module 140.

[0091] The antenna (ANT) interface 450 is an interface for connecting an antenna. For example, the wireless audio receiver 130 can receive the audio signal collected and transmitted by the passive microphone through the antenna connected by the antenna interface 450.

[0092] In some embodiments of the present specification, by arranging at least one of the HDMI-ARC / eARC interface, the microphone interface, and the antenna interface on the back panel, the integrated audio power amplifier host can have more practical audio transmission channels and more stable signal transmission performance. By arranging the power supply interface, the integrated audio power amplifier host can be powered by an external power supply, making it more compatible and practical, suitable for more application scenarios, and improving user experience.

[0093] In some embodiments of the present specification, by integrating the PoE switching module, the power amplifier, the wireless microphone receiving function, etc. in an integrated audio power amplifier host, a one-machine multi-purpose function fusion is realized. This integrated design breaks through the functional limitations of traditional audio power amplifier hosts, enabling them not only to perform audio amplification and playback tasks, but also to provide network connectivity and power supply as network switches, while receiving and processing wireless microphone signals. In addition, this design reduces the need for additional equipment, reduces the cost and maintenance difficulty of the system, and improves the compatibility and expandability of the system. At the same time, by using AoIP technology, audio signals are transmitted through a standard Ethernet interface, achieving high-quality audio transmission and low-latency audio playback, and enabling audio streams and related data for control and management to be transmitted on the same link, effectively improving audio transmission efficiency and quality and enhancing user experience.

[0094] It should be noted that the above description of the integrated audio power amplifier host 100 and its modules is for convenience of description only and cannot limit the present specification to the scope of the embodiments. It can be understood that, for those skilled in the art, after understanding the principles of the system, the modules can be combined arbitrarily or connected to form a subsystem with other modules without departing from the principles. In some embodiments, Figure 1 The PoE switching module 110, the integrated power amplifier module 120, the wireless audio receiver 130, and the power supply module 140 disclosed in the present specification can be different modules in a system, or one module can implement the functions of two or more modules described above. For example, each module can share a storage module, and each module can have its own storage module. Variations such as this are within the scope of protection of the present specification.

[0095] Figure 5 is an exemplary structural schematic diagram of the heat dissipation fin according to some embodiments of the present specification.

[0096] In some embodiments, as Figure 5As shown, the top 520 of the box body is provided with a heat dissipation fin 510. More description about the box body 150 can be found in the related description of Figure 1 , Figure 3 , Figure 4 .

[0097] The heat dissipation fin 510 refers to a thin sheet or fin structure for heat dissipation. In some embodiments, the heat dissipation fin 510 can be made of a material with high thermal conductivity, such as aluminum alloy, magnesium alloy, thermally conductive plastic, etc.

[0098] In some embodiments, as shown in Figure 5 , the heat dissipation fin 510 includes a connecting part 511 and a main body part 512, the connecting part 511 is fixedly connected with the top 520 of the box body, and the main body part 512 includes a plurality of protrusions extending away from the connecting part 511.

[0099] The connecting part 511 is a component for connecting the heat dissipation fin 510 and the box body 150.

[0100] In some embodiments, the connecting part 511 can be designed with a threaded hole, and connected with the top 520 of the box body by a bolt or screw; in some embodiments, the connecting part 511 can also be designed as a buckle structure, and fixed by matching the buckle with the clamping groove of the top 520 of the box body. In some embodiments, the thickness of the connecting part 511 can be thicker at the heat source, and gradually thinner at other positions away from the heat source, so that the heat dissipation fin 510 can absorb more heat at the heat source and quickly transfer to the surrounding thinner parts. Wherein, the heat source can refer to the position of the component corresponding to the top 520 of the box body which is easy to generate heat during work, such as the position of the PoE switching module 110, the integrated power supply module 120 corresponding to the top 520 of the box body, etc.

[0101] The main body part 512 is the main component of the heat dissipation fin 510 for strengthening heat dissipation.

[0102] In some embodiments, the main body part 512 includes a plurality of protrusions extending away from the connecting part 511, for increasing the heat dissipation surface area. In some embodiments, the cross section of the plurality of protrusions of the main body part 512 can be rectangular or square, or triangular, trapezoidal or circular, etc., and the cross-sectional area can gradually decrease from the connecting part direction to the extending direction, so as to better transfer the heat to the end of the protrusion, which can be designed according to actual needs. In some embodiments, the distribution of the plurality of protrusions can be uniform, or can be designed as non-uniform distribution according to actual needs. For example, slightly denser protrusions can be designed above the components which are easy to heat during work, and sparse protrusions can be designed in the remaining part.

[0103] In some embodiments of the present specification, the stability and reliability of the heat dissipation fins are ensured by fixing the connecting part of the heat dissipation fins to the top of the box body, and the heat dissipation surface area is significantly increased by the multiple protrusions of the main body part, thereby improving the heat dissipation efficiency.

[0104] In some embodiments of the present specification, the heat dissipation fins arranged on the top of the box body can absorb the heat generated by the integrated audio power amplifier host and dissipate the generated heat through convection, thereby improving the heat dissipation effect. At the same time, the heat dissipation fins can promote the effective dissipation of heat by increasing the surface area, improve the heat dissipation efficiency, ensure the stability of the integrated audio power amplifier host under long-time operation, and also help to prolong the service life of the equipment and reduce the maintenance cost.

[0105] The above has described the basic concept, and it is obvious that the above detailed disclosure is only used as an example and does not limit the present specification for those skilled in the art. Although it is not explicitly stated here, those skilled in the art can make various modifications, improvements and corrections to the present specification. Such modifications, improvements and corrections are suggested in the present specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of the present specification.

[0106] At the same time, the present specification uses specific words to describe the embodiments of the present specification. As "one embodiment", "an embodiment", and / or "some embodiments" means a certain feature, structure or characteristic related to at least one embodiment of the present specification. Therefore, it should be emphasized and noted that the "an embodiment" or "one embodiment" or "one alternative embodiment" mentioned in different places in the present specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present specification can be properly combined.

[0107] Similarly, it should be noted that, in order to simplify the expression of the present disclosure and to help understand one or more embodiments of the present invention, in the foregoing description of the embodiments of the present specification, various features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the present specification are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the disclosed single embodiment.

[0108] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of range in some embodiments of this specification are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0109] For each patent, patent application, patent application publication, and other material, such as articles, books, specifications, publications, and documents, referenced in this specification, the entire contents of which are incorporated herein by reference. This excludes historical application documents that are inconsistent with or conflict with the content of this specification, as well as documents that limit the broadest scope of the claims in this specification (currently or subsequently appended to this specification). It should be noted that in the event of any inconsistency or conflict between the descriptions, definitions, and / or terminology used in the supplementary materials to this specification and the content of this specification, the descriptions, definitions, and / or terminology used in this specification shall prevail.

[0110] Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments described herein. Other variations may also fall within the scope of this specification. Therefore, alternative configurations of the embodiments described herein are intended to be illustrative rather than limiting, and should be considered consistent with the teachings of this specification. Accordingly, the embodiments described herein are not limited to those explicitly introduced and described herein.

Claims

1. An integrated audio power amplifier main unit, characterized by comprising: The application relates to a PoE switching module, an integrated amplifier module, a wireless audio receiver, a power supply module and a box body. The PoE switching module, the integrated amplifier module and the wireless audio receiver are arranged in the box body. The box body comprises a front panel and a rear panel, the front panel is provided with an Ethernet interface and a PoE interface, and the Ethernet interface and the PoE interface are connected to the PoE switching module. The rear panel is provided with an input interface area and an output interface area, and at least part of the input interface area and the output interface area is connected to the integrated amplifier module. The PoE switching module is electrically connected to the integrated amplifier module and the wireless audio receiver. The integrated amplifier module further comprises a PoE input module, the PoE input module comprises a DC voltage stabilizing device, a power supply isolation device and a filter.

2. The host of claim 1, wherein, The integrated amplifier module is externally provided with an electromagnetic shielding layer.

3. The host of claim 1, wherein, The PoE switching module is externally provided with an anti-vibration layer.

4. The host of claim 3, wherein, The top of the box body is provided with a heat dissipation fin.

5. The host of claim 1, wherein, The heat dissipation fin comprises a connecting part and a main body part, the connecting part is fixedly connected to the top of the box body, and the main body part comprises a plurality of protrusions extending away from the connecting part.

6. The host of claim 5, wherein, The rear panel is further provided with at least one third-party device interface.

7. The host of claim 1, wherein, The input interface area is provided with one or more input interfaces, the input interfaces comprise at least one of a USB interface, an HDMI-IN interface, a coaxial interface, a fiber interface and a LINE-IN interface.

8. The host of claim 1, wherein, The output interface area is provided with a mode switching push button and one or more output interfaces, the output interfaces comprise at least one of a LINE-OUT interface, a SUB interface and a BRIDGE interface.

9. The host of claim 1, wherein, The rear panel is further provided with at least one of an HDMI-ARC / eARC interface, a microphone interface, a power supply interface and an antenna interface, and the power supply interface is electrically connected to the power supply module.

10. The host of claim 1, wherein, ​

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