Printed circuit board (PCB) packaging structure of double-row socket compatible with direct insertion and surface mounting

Abstract

The utility model discloses a printed circuit board (PCB) packaging structure of a double-row socket compatible with direct insertion and surface mounting, a surface mounting type welding area and a direct insertion type welding area are partially intersected, a plurality of groups of opposite surface mounting welding pads are uniformly distributed in the surface mounting type welding area, a plurality of groups of opposite through hole welding pads are uniformly distributed in the direct insertion type welding area, and a plurality of groups of through hole welding pads are uniformly distributed in the through hole welding pads. The edges of the surface-mounted bonding pad and the through hole bonding pad are overlapped, and the area where the surface-mounted bonding pad and the through hole bonding pad are located is a compatible welding area. According to the utility model, the switching between the direct insertion type socket and the patch type socket can be realized without changing the PCB or carrying out complex modification, so that the production period can be greatly shortened, the material cost is reduced, and the PCBA stacking flexibility is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field especially relates to a kind of PCB packaging structure of compatible direct insertion and patch of double-row socket. BACKGROUND

[0002] Double-row socket is a kind of connector, it functions as a bridge between two circuits, and is responsible for signal transmission and current, since it is widely used in the connection of PCB board, so it is also known as universal connector. According to the number of rows, it is divided into single-row, double-row, three-row, four-row, etc. According to the form of pin, it is divided into direct insertion type and patch type. Commonly used pitches include 0.8, 1.0, 1.27, 2.0, 2.54, 3.96 mm, etc. The traditional PCB packaging design is different for direct insertion type and patch type double-row socket PCB packaging, and it cannot be changed from patch type installation to direct insertion type installation, or from direct insertion type installation to patch type installation.

[0003] When designing PCB board, double-row socket is often used, sometimes it is direct insertion type double-row socket, and sometimes it is patch type double-row socket. One kind of double-row socket installation method is determined according to the stacking height. For example, the double-row socket of one project PCB is patch type, while the double-row socket of another project needs to be pin type due to different stacking heights. However, direct insertion type double-row socket cannot be directly installed and welded on this PCB, and the PCB packaging of double-row socket on this PCB must be redesigned and reprocessed, which is more troublesome and not easy to change.

[0004] Therefore, a kind of PCB packaging structure of compatible direct insertion and patch of double-row socket is designed, so that double-row socket can be freely selected between patch type and direct insertion type, thereby providing more double-row socket type selection, more stacking height selection, improving the flexibility and replaceability of PCBA, which becomes the further improvement direction. UTILITY MODEL CONTENTS

[0005] In order to solve the above technical problems, the utility model provides a kind of PCB packaging structure of compatible direct insertion and patch of double-row socket.

[0006] The utility model provides the following technical scheme: a kind of PCB packaging structure of compatible direct insertion and patch of double-row socket, including the patch type welding area and direct insertion type welding area being arranged on circuit board, the patch type welding area and direct insertion type welding area partially intersect, multiple groups of opposite surface mount pads are evenly arranged in the patch type welding area, multiple groups of opposite through hole pads are evenly arranged in the direct insertion type welding area, the edge of the surface mount pad and the through hole pad is overlapped, and the area where the surface mount pad and the through hole pad are located is a compatible welding area.

[0007] Preferably, the surface mount pad and the through hole pad are coaxially arranged.

[0008] Preferably, a through-hole type silkscreen frame is provided around the outer perimeter of the through-hole pad, and a surface mount type silkscreen frame is provided around the outer perimeter of the surface mount pad, with identifiers spaced at the lower end of the surface mount type silkscreen frame.

[0009] Preferably, the through-hole screen printing frame is provided between adjacent surface mount pads.

[0010] Preferably, the two sides of the straight-insertion screen printing frame coincide with the two sides of the patch screen printing frame.

[0011] Preferably, the diameter of the through-hole pad is 0.9 mm.

[0012] Preferably, the spacing between adjacent surface mount pads is 1 mm.

[0013] Preferably, the diameter of the through-hole pad is greater than the width of the surface mount pad.

[0014] Compared with existing technologies, the beneficial effects of this utility model are:

[0015] (1) This utility model uses a surface mount soldering area and a through-hole soldering area set on a circuit board. The surface mount soldering area and the through-hole soldering area partially intersect. Multiple sets of opposing surface mount pads are evenly distributed in the surface mount soldering area, and multiple sets of opposing through-hole pads are evenly distributed in the through-hole soldering area. The edges of the surface mount pads and through-hole pads overlap, and the area containing the surface mount pads and through-hole pads is a compatible soldering area. This utility model can simultaneously ensure that the center positions of components are consistent when soldering through-hole or surface mount double-row sockets, facilitating subsequent structural alignment design. Surface mount pads are used for soldering surface mount double-row sockets, through-hole pads are used for soldering through-hole double-row sockets, and the compatible pads are the areas of both surface mount pads and through-hole pads. The surface mount silkscreen frame is used to mark the size of the surface mount double-row socket, facilitating layout during PCB design and avoiding component interference. The through-hole silkscreen frame is used to mark the size of the through-hole double-row socket, facilitating layout during PCB design and avoiding component interference. Without changing the PCB or making complex modifications, it is possible to switch between through-hole and surface-mount dual-row sockets, which can greatly shorten the production cycle, reduce material costs, and improve PCBA stacking flexibility. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model. Detailed Implementation

[0017] like Figure 1 As shown, a PCB package structure for a dual-row socket compatible with both through-hole and surface mount components includes a surface mount soldering area 1, a through-hole soldering area 2, surface mount pads 3, through-hole pads 4, a through-hole silkscreen frame 5, a surface mount silkscreen frame 6, and an identifier 7.

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] like Figure 1 As shown, a surface mount soldering area 1 and a through-hole soldering area 2 are set on the circuit board. The surface mount soldering area 1 and the through-hole soldering area 2 partially intersect, which ensures that the center position of the components is consistent when soldering through-hole or surface mount double-row sockets, which facilitates the later structural alignment design.

[0022] The surface mount soldering area 1 has multiple sets of opposing surface mount pads 3 evenly distributed, while the through-hole soldering area 2 has multiple sets of opposing through-hole pads 4 evenly distributed. The edges of the surface mount pads 3 and through-hole pads 4 overlap, and the area containing the surface mount pads 3 and through-hole pads 4 is the compatible soldering area. The surface mount pads 3 are used for soldering surface mount double-row sockets, and the through-hole pads 4 are used for soldering through-hole double-row sockets. The compatible soldering area includes the areas of both surface mount pads 3 and through-hole pads 4.

[0023] The spacing between adjacent surface mount pads 3 is 1 mm. Surface mount pads 3 and through-hole pads 4 are coaxially arranged, and the diameter of through-hole pads 4 is 0.9 mm. The diameter of through-hole pads 4 is larger than the width of surface mount pads 3.

[0024] The straight insertion type silk screen frame 5 is arranged outside the periphery of the through hole pad 4, and is used for identifying the size of the straight insertion type double row socket, facilitating layout during PCB design, and avoiding interference of the device.

[0025] The straight insertion type silk screen frame 5 is arranged outside the periphery of the through hole pad 4, and is used for identifying the size of the straight insertion type double row socket, facilitating layout during PCB design, and avoiding interference of the device.

[0026] The identifier 7 is arranged at the lower end of the paster type silk screen frame 6, and is used for representing the 1-pin position of the connector, facilitating positioning during PCB design and later testing.

[0027] The utility model discloses a simple overall structure can make double row socket according to different installation mode, different stacking height demand, select straight insertion type double row socket or paster type double row socket, need not change PCB or carry out complicated change. In addition, since need not change PCB or carry out complicated change, can realize the switching of straight insertion type and paster type double row socket, can greatly shorten production cycle, with low material cost, improve PCBA stacking flexibility.

[0028] The above, only for the preferable specific implementation mode of the utility model, but the protection scope of the utility model does not limit to this, any skilled person in the art in the utility model discloses the technical range of the utility model, according to the utility model technical scheme and the utility model concept, carries out equivalent replacement or change, all should cover in the protection scope of the utility model.

Claims

1. A PCB package structure compatible with both a direct plug-in and a surface mount dual-in-line socket, characterized by: The application relates to a circuit board comprising a patch soldering area (1) and a straight insertion soldering area (2), the patch soldering area (1) and the straight insertion soldering area (2) partially intersecting, a plurality of sets of opposite surface pads (3) being uniformly arranged in the patch soldering area (1), a plurality of sets of opposite through-hole pads (4) being uniformly arranged in the straight insertion soldering area (2), the surface pads (3) and the through-hole pads (4) edge-intersecting, and the area where the surface pads (3) and the through-hole pads (4) are located being a compatible soldering area.

2. The PCB packaging structure of a dual-in-line and surface-mount compatible socket according to claim 1, wherein: The surface pads (3) and the through-hole pads (4) are coaxially arranged.

3. The PCB package structure of claim 2, wherein: A straight insertion silk screen frame (5) is arranged around the periphery of the through-hole pads (4), and a patch silk screen frame (6) is arranged around the periphery of the surface pads (3), and an identifier (7) is arranged at the lower end of the patch silk screen frame (6).

4. The PCB package structure of claim 3, wherein: The straight insertion silk screen frame (5) is arranged between adjacent surface pads (3).

5. The PCB package structure of claim 3 or 4, wherein: The two side edges of the straight insertion silk screen frame (5) coincide with the two side edges of the patch silk screen frame (6).

6. The PCB package structure of claim 3, wherein: The aperture of the through-hole pads (4) is 0.9 mm.

7. The PCB packaging structure of a dual-in-line compatible with direct insertion and surface mount according to claim 5, wherein: The distance between adjacent surface pads (3) is 1 mm.

8. The PCB package structure of claim 7, wherein: The diameter of the through-hole pads (4) is greater than the width of the surface pads (3).

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