Vapor chamber and electronic equipment

Abstract

The embodiment of the utility model provides a vapor chamber and electronic equipment, the vapor chamber comprises a shell, a flow guide assembly and a working medium, the shell comprises two cover plates which cover each other, and the two cover plates jointly define a sealing cavity; the flow guide assembly is located in the sealing cavity and comprises a supporting component and a capillary structure, the supporting component is connected to the at least one cover plate and divides the sealing cavity into a capillary cavity and a steam cavity, the capillary cavity comprises one or more capillary sub-cavities, the capillary sub-cavities are filled with the capillary structure, and the steam cavity is communicated with the capillary sub-cavities. Each capillary sub-cavity is provided with an arc-shaped supporting wall located on the side close to the steam cavity, the convex direction of the arc-shaped supporting wall faces the steam cavity, and a plurality of through holes are formed in each arc-shaped supporting wall; and the working medium is filled in the sealing cavity. According to the vapor chamber, due to the arrangement of the arc-shaped supporting wall, the flowing of a working medium can be changed into columnar flowing from previous planar flowing, the capillary recovery efficiency and the temperature uniformizing effect of the vapor chamber are improved, and the starting and using temperature range of electronic equipment is widened.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of heat conduction plates, and particularly relates to a heat conduction plate and electronic equipment. BACKGROUND

[0002] With the gradual improvement of the performance of electronic equipment such as mobile phones and notebook computers, components and devices with stronger computing and processing capabilities are prone to generate a large amount of heat instantaneously, which causes the temperature of the local area of the electronic equipment to rapidly rise and affects the normal operation of the components and devices. In order to solve the problem of local high temperature of the electronic equipment, a heat conduction plate with strong heat dissipation capacity is applied to the electronic equipment.

[0003] The current conventional heat conduction plate has the problems of low heat dissipation efficiency and poor temperature equalization effect. CONTENT OF THE UTILITY MODEL

[0004] The application aims to provide a heat conduction plate and electronic equipment, and aims to solve the technical problem of low heat dissipation efficiency and poor temperature equalization effect of the current conventional heat conduction plate.

[0005] To achieve the above-mentioned purpose, in a first aspect, the application provides a heat conduction plate, comprising a shell, a flow guide assembly and a working medium.

[0006] The shell comprises two cover plates that are overlapped, and the two cover plates jointly enclose a sealed cavity.

[0007] The flow guide assembly is located in the sealed cavity, and the flow guide assembly comprises a support member and a capillary structure. The support member is connected to at least one cover plate and divides the sealed cavity into a capillary cavity and a vapor cavity. The capillary cavity comprises one or more capillary sub-cavities, and the capillary structure is filled in each capillary sub-cavity. Each capillary sub-cavity has an arc-shaped support wall located on the side close to the vapor cavity. The convex side of the arc-shaped support wall faces the vapor cavity. A plurality of through holes are formed in each arc-shaped support wall.

[0008] The working medium is filled in the sealed cavity.

[0009] In some possible implementation manners in the first direction, the support member comprises one or more arc-shaped plates. The concave side of the arc-shaped plate forms the arc-shaped support wall, and a plurality of through holes are formed in the arc-shaped plate. When the arc-shaped plate is provided with a plurality of arc-shaped plates, the convex sides of all the arc-shaped plates are the same, and adjacent two arc-shaped plates are spaced apart.

[0010] In some possible implementation manners in the first direction, the support member further comprises a bottom plate. Both ends of the plurality of arc-shaped plates are connected to the bottom plate, and the arc-shaped plates are connected to the cover plates through the bottom plate.

[0011] In some possible implementation forms of the first aspect, the flow guide assembly comprises a plurality of arc-shaped plates, and each of the arc-shaped plates has a same or different arc angle.

[0012] In some possible implementation forms of the first aspect, the arc angle of each of the arc-shaped plates is 120°-180°.

[0013] In some possible implementation forms of the first aspect, the flow guide assembly comprises at least three arc-shaped plates, and a spacing between any two adjacent arc-shaped plates is equal.

[0014] In some possible implementation forms of the first aspect, the spacing between any two adjacent arc-shaped plates is 5 μm-20 μm.

[0015] In some possible implementation forms of the first aspect, each of the arc-shaped plates is provided with a plurality of through holes, the plurality of through holes are arranged in an array, and the through holes provided on two adjacent arc-shaped plates are oppositely arranged along the thickness direction of the shell.

[0016] In some possible implementation forms of the first aspect, the through holes are circular holes, and the diameter of each of the through holes is 2 μm-100 μm.

[0017] In a second aspect, an electronic device is provided, which comprises the vapor chamber provided in any of the above embodiments.

[0018] The technical effect of the present application relative to the prior art is that after the working medium at the cold end condenses into a liquid phase and enters the capillary structure, the flow of the working medium in the capillary structure is mainly driven by capillary force. Capillary force is a force generated by the interaction between a liquid and a solid surface, which is derived from the surface tension of the liquid and the adhesion between the liquid and the solid. In the capillary structure, there is adhesion between the working medium (liquid) and the capillary wall, and the liquid itself has surface tension. When the working medium is in the capillary structure, due to the arrangement of the arc-shaped support wall, the part of the liquid in the capillary sub-cavity will be subjected to the combined action of the adhesion of the arc-shaped support wall and the surface tension of the liquid. The surface tension of the liquid will make the liquid try to maintain the smallest surface area, while the adhesion will make the liquid adhere to the arc-shaped support wall. The curvature change of the arc-shaped support wall will change the contact angle between the working medium and the arc-shaped support wall, thereby affecting the direction and size of the capillary force, so that the working medium flows in the direction that can reduce the surface energy, that is, it may flow to the narrower channel. For the capillary cavity, in the thickness direction of the capillary cavity, the width of the capillary sub-cavity gradually decreases along the convexity of the arc-shaped support wall, that is, the width of the channel of the working medium in the thickness direction of the capillary sub-cavity gradually narrows, so the working medium can flow towards the convexity of the arc-shaped support wall. At the same time, based on Bernoulli's principle, the pressure in the direction from the wider flow channel to the narrower channel is gradually reduced, so under the driving of the pressure difference, the working medium will flow from the wider flow channel with higher pressure to the narrower channel with lower pressure. In this way, the working medium in the capillary sub-cavity on the concave side of the arc-shaped support wall can enter the capillary sub-cavity on the convex side of the arc-shaped support wall through the through hole, that is, the arrangement of the arc-shaped support wall can realize the flow of the working medium in the capillary structure along the thickness direction of the capillary sub-cavity, and improve the speed of the working medium penetrating from the concave side to the convex side of the arc-shaped support wall, until the working medium in the capillary structure fills the entire cross section of the cold end capillary cavity. In this way, the flow of the working medium changes from the previous planar flow to the columnar flow, increasing the flow of the working medium from the cold end to the hot end, thereby maximizing the cohesive force between the working medium molecules, improving the capillary recovery efficiency and the maximum heat dissipation capacity, and improving the temperature equalization effect of the vapor chamber. At the same time, with the improvement of the internal penetration efficiency of the working medium in the capillary structure, the liquid phase working medium can be more dispersed in the capillary structure, thereby reducing the working temperature of the vapor chamber startup, so that the vapor chamber is more suitable for low load mode of electronic equipment, and the startup and use temperature range of electronic equipment is widened. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the present application or the prior art. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creating any inventive work.

[0020] Figure 1 is a cross-sectional view of the vapor chamber provided by the embodiments of the present application;

[0021] Figure 2 FIG. 1 is a perspective view of a support member in a heat plate provided by an embodiment of the present application.

[0022] Legend of reference signs:

[0023] 100, heat plate; 10, shell; 11, cover plate; 11a, upper cover plate; 11b, lower cover plate; 10a, sealed cavity; 101, vapor cavity; 102, capillary cavity; 201, capillary sub-cavity; 2011, arc-shaped support wall; 20, flow guide assembly; 21, support member; 211, arc-shaped plate; 212, bottom plate; 22, capillary structure; 202, through hole. DETAILED DESCRIPTION

[0024] The embodiments of the present application are described in detail below with reference to the accompanying drawings. The embodiments described below are examples for explaining the present application and are not intended to limit the present application.

[0025] In the description of the present application, it should be understood that the terms "length", "width", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0026] In addition, the terms "first", "second", "third", etc. are only used for descriptive purpose and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0027] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0028] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments.

[0029] The electronic device can be a smart consumer electronic device such as a mobile phone, a tablet computer, a notebook computer, etc., can be a wearable device such as an augmented reality (AR) device, a virtual reality (VR) device, a smart glasses device, a smart goggle device, a smart watch device, a smart bracelet device, etc., or can be a vehicle-mounted device, a game device, an industrial device, etc.

[0030] The electronic device includes a device main body, a heat generating component, and a vapor chamber (VC). The device main body provides a mounting position for the heat generating component and the vapor chamber. The vapor chamber is in contact with the heat generating component. The vapor chamber can also be referred to as a temperature equalizing plate or a superconducting heat plate. In this embodiment, the vapor chamber can absorb heat generated by the heat generating component through the above principle and transfer the heat to other positions with lower temperature, thereby uniformly dispersing the heat of the heat generating component.

[0031] Referring to Figure 1 The vapor chamber 100 includes an outer shell 10, a flow guide assembly 20, and a working medium.

[0032] The outer shell 10 includes two cover plates 11 that are lapped together to form a sealed cavity 10a. The cover plates 11 can be made of high thermal conductivity materials such as stainless steel, high polymer composite materials, copper, and copper alloys. The cover plates 11 can be polygonal such as square, triangular, etc., or can be circular such as circular, elliptical, etc., or can be irregular, which is not limited herein. For ease of description, the outer shell 10 is taken as a cuboid for illustration, and an XYZ rectangular coordinate system is established according to the length direction, the width direction, and the thickness direction of the outer shell 10, wherein the X-axis direction is defined as the length direction of the outer shell 10, the Y-axis direction is defined as the width direction of the outer shell 10, and the Z-axis direction is defined as the thickness direction of the outer shell 10. In this embodiment, the thickness of the outer shell 10 can be 0.1mm-1mm.

[0033] The flow guide assembly 20 is located in the sealed cavity 10a, and the flow guide assembly 20 includes a support member 21 and a capillary structure 22.

[0034] Please refer to Figure 2The support member 21 is connected to one of the cover plates 11 and divides the sealed cavity 10a into a capillary cavity 102 and a vapor cavity 101. The capillary cavity 102 includes one or more capillary sub-cavities 201, each of which has an arc-shaped support wall 2011 on the side close to the vapor cavity 101. The arc-shaped support wall 2011 has a convex direction towards the vapor cavity 101, and a plurality of through holes 202 are formed in each arc-shaped support wall 2011. The arc-shaped support wall 2011 of the capillary sub-cavity 201 refers to the inner wall with an arc-shaped cross section in the capillary sub-cavity 201. The capillary sub-cavity 201 is located on the concave side of the arc-shaped support arm, and the vapor cavity 101 is located on the convex side of the arc-shaped support arm. The wall surface of each arc-shaped support wall 2011 extends along an arc-shaped path. The line connecting the two extension ends of the wall surface is the width direction of the capillary sub-cavity 201. The direction perpendicular to the cross section of the arc-shaped support wall 2011 is the length direction of the capillary sub-cavity 201. The thickness direction of the capillary sub-cavity 201 is perpendicular to the width direction and the length direction. The capillary cavity 102 and the vapor cavity 101 are connected at least through the through holes 202. The two ends of the arc-shaped support wall 2011 in the length direction of the capillary sub-cavity 201 can be connected to the shell 10, or at least one end can be spaced apart from the shell 10.

[0035] In other embodiments, the support member 21 can be connected to both cover plates 11 to improve the structural strength of the vapor chamber. The remaining structure is set with reference to the scheme of being connected to one cover plate 11, which is not limited here.

[0036] The capillary structure 22 is filled in the capillary cavity 102, i.e., filled in each capillary sub-cavity 201. The capillary structure 22 in adjacent two capillary sub-cavities 201 is connected through the through holes 202 formed in the arc-shaped plate 211 between the two capillary sub-cavities 201. The capillary structure 22 is a structure that can generate capillary phenomenon. Capillary phenomenon is the process of liquid flowing in a narrow space, which can be without any external force or even against the direction of external forces such as gravity. The capillary structure 22 includes but is not limited to copper powder, copper woven mesh, and wire bundle. In this embodiment, the capillary structure 22 is made of hydrophilic copper-carbon material, for example, the copper-carbon material has a copper content greater than 40% and less than 55%, a chromium content greater than 3% and less than 5%, and a magnesium content greater than 5% and less than 8%, to obtain better capillary action performance.

[0037] The working medium is filled in the sealed cavity 10a. The working medium can be any cooling medium with thermal expansion and contraction properties, and the embodiments of the present application do not make specific limitations on this. Exemplarily, the cooling medium can be but is not limited to ethylene glycol (EG), fluorinated liquid FC-3283, PFPE, deionized water, liquid metal, etc.

[0038] In the installation, the heat generating component can be installed on the cover plate 11 of the vapor chamber 100 where the support member 21 is installed, and at one end of the length direction of the capillary sub-cavity 201, which is the hot end of the vapor chamber 100. When the temperature of the heat generating component rises, the working medium (cooling medium) in the capillary structure 22 near the heat generating component in the sealed cavity 10a changes from liquid phase to gas phase by absorbing heat, and the gas phase working medium enters the vapor cavity 101 through the through hole 202 and moves towards the other end of the length direction of the capillary sub-cavity 201, which is the cold end of the vapor chamber 100. The gas phase working medium condenses into liquid phase at the cold end and releases heat, and the liquid phase working medium enters the capillary cavity 102 through the through hole 202. The liquid phase working medium in the capillary cavity 102 is transported back to the hot end by the capillary structure 22, realizing the phase change cycle. In the above phase change process, the liquid phase working medium uses capillary force, gravity and other forces as driving force to complete the phase change cycle between the cold and hot ends, thereby realizing efficient heat exchange by using phase change latent heat, heat conduction and convection.

[0039] In the capillary structure 22, there is an adhesive force between the working medium (liquid) and the capillary wall, and the liquid itself has surface tension. When the working medium is in the capillary structure 22, due to the arrangement of the arc-shaped support wall 2011, part of the liquid in the capillary sub-cavity 201 will be subjected to the combined action of the adhesive force of the arc-shaped support wall 2011 and the surface tension of the liquid. The liquid surface tension will make the liquid try to maintain the smallest surface area, and the adhesive force will make the liquid adhere to the arc-shaped support wall 2011. The curvature change of the arc-shaped support wall 2011 will change the contact angle between the working medium and the arc-shaped support wall 2011, thereby affecting the direction and size of the capillary force, so that the working medium flows in the direction that can reduce the surface energy, that is, it may flow to the narrower channel.

[0040] For the capillary cavity 102, in the thickness direction, the width of the capillary sub-cavity 201 gradually decreases along the convex direction of the arc-shaped support wall 2011, that is, the width of the channel of the working medium in the thickness direction of the capillary sub-cavity 201 gradually narrows, so the working medium can flow towards the convex direction of the arc-shaped support wall 2011. At the same time, based on Bernoulli's principle, the pressure gradually decreases in the direction from the wider flow channel to the narrower channel, so under the driving of the pressure difference, the working medium will flow from the wider flow channel with higher pressure to the narrower channel with lower pressure.

[0041] Thus, the working medium in the arc-shaped support wall 2011 recessed to the side of the capillary sub-cavity 201 can enter the arc-shaped support wall 2011 convex to the side of the capillary sub-cavity 201 through the through hole 202, that is, the arrangement of the arc-shaped support wall 2011 can realize the flow of the working medium in the capillary structure 22 along the thickness direction of the capillary sub-cavity 201, and improve the speed of the working medium penetrating from the recessed side to the convex side of the arc-shaped support wall 2011, until the working medium in the capillary structure 22 fills the entire cross section of the cold end capillary cavity 102. Thus, the flow of the working medium changes from the previous planar flow to the columnar flow, increasing the flow rate of the working medium from the cold end to the hot end, thereby maximizing the cohesive force between the working medium molecules, improving the capillary recovery efficiency and maximum heat dissipation capacity, and improving the temperature equalization effect of the vapor chamber 100. At the same time, with the improvement of the internal penetration efficiency of the working medium in the capillary structure 22, the liquid phase working medium can be more dispersed in the capillary structure 22, thereby reducing the working temperature of the vapor chamber 100 to start, so that the vapor chamber 100 is more suitable for low load mode of electronic equipment, and the temperature range of the electronic equipment is widened.

[0042] Referring to Figure 1 and Figure 2 In some embodiments, the support member 21 includes a plurality of arc-shaped plates 211, and a plurality of through holes 202 are formed in the arc-shaped plates 211. The arc-shaped plates 211 can be made of high-strength silicon steel material containing copper. For example, the silicon content in the high-strength silicon steel material is greater than 5% and less than 8%, and the copper content is greater than 13% and less than 21%. In some scenarios where the vapor chamber 100 needs to be bent, the arc-shaped plates 211 can also be made of elastic material containing copper, which is not limited here.

[0043] Referring to Figure 1 and Figure 2 In some embodiments, the arc-shaped plate 211 can be formed by bending a flat plate, at this time, the shape of each cross section of the arc-shaped plate 211 is arc-shaped, and the shape and size of each cross section are the same, and the recessed side of the arc-shaped plate 211 forms the arc-shaped support wall 2011. The extension direction of the bending path of the arc-shaped plate 211 is defined as the extension direction of the arc-shaped plate 211, the direction perpendicular to the cross section of the arc-shaped plate 211 is defined as the length direction of the arc-shaped plate 211, the arc-shaped plate 211 does not deform in the length direction, the arc-shaped plate 211 has two extension ends in the extension direction, the connecting direction of the two extension ends is the width direction of the arc-shaped plate 211, and the direction perpendicular to the length direction and the width direction of the arc-shaped plate 211 is the thickness direction of the arc-shaped plate 211. The thickness direction of the arc-shaped plate 211 is the same as the thickness direction of the shell 10.

[0044] The arc-shaped plate 211 can be one or multiple. When the arc-shaped plate 211 is one, both extending ends of the arc-shaped plate 211 are connected to the same cover plate 11, the arc-shaped plate 211 divides the sealed cavity 10a into the capillary cavity 102 and the vapor cavity 101, the cavity formed by the arc-shaped plate 211 and the cover plate 11 connected thereto is the capillary cavity 102, and the capillary cavity 102 includes one capillary sub-cavity 201. When the arc-shaped plate 211 is multiple, the multiple arc-shaped plates 211 can be arranged in sequence along the thickness direction of the arc-shaped plate 211, the convex directions of the arc-shaped plates 211 are the same, both extending ends of the arc-shaped plates 211 are connected to the same cover plate 11, and adjacent two arc-shaped plates 211 are spaced apart, so the widths of the multiple arc-shaped plates 211 gradually decrease along the thickness direction of the arc-shaped plate 211, the arc-shaped plate 211 with the largest width in the multiple arc-shaped plates 211 is the outermost arc-shaped plate 211 of the support member 21, the outermost arc-shaped plate 211 divides the sealed cavity 10a into the capillary cavity 102 and the vapor cavity 101, the cavity formed by the outermost arc-shaped plate 211 and the cover plate 11 connected thereto is the capillary cavity 102, and the cavity outside the capillary cavity 102 is the vapor cavity 101, and the arc-shaped plates 211 inside the outermost arc-shaped plate 211 can divide the capillary cavity 102 into multiple capillary sub-cavities 201. The length direction of the arc-shaped plate 211 is the length direction of the capillary sub-cavity 201, the width direction of the arc-shaped plate 211 is the width direction of the capillary sub-cavity 201, and the thickness direction of the arc-shaped plate 211 is the thickness direction of the capillary sub-cavity 201.

[0045] Optionally, the upper ends of the length direction of the arc-shaped plate 211 abut against the cavity wall of the sealed cavity 10a, so as to improve the structural strength and reliability of the vapor chamber 100.

[0046] It should be noted that, in other embodiments, the arc-shaped plate 211 can also be a cover, the tangent plane of each point on the cover-shaped arc-shaped plate 211 is located on the same side of the arc-shaped plate 211, for example, the arc-shaped plate 211 can be a semi-spherical plate. Alternatively, the arc-shaped plates 211 inside the outermost arc-shaped plate 211 are arranged in sequence along the width direction of the arc-shaped plate 211, as long as the multiple arc-shaped plates 211 have the same pattern, which is not limited here. In addition, the support member 21 can also not be provided with the arc-shaped plate 211, but can be realized by opening an arc-shaped groove on the flat plate.

[0047] Please refer to Figure 1 and Figure 2In some embodiments, the support member 21 further comprises a bottom plate 212, both extension ends of the plurality of arc-shaped plates 211 are connected to the bottom plate 212, and the arc-shaped plates 211 are connected to the cover plate 11 through the bottom plate 212. In this way, the support member 21 can be formed into an independent whole through the connection of the plurality of arc-shaped plates 211 by the bottom plate 212 before being installed into the sealed cavity 10a, and then the bottom plate 212 is connected to the cover plate 11, thereby realizing the connection of the arc-shaped plates 211 and the cover plate 11 and improving the assembly efficiency of the vapor chamber 100.

[0048] The bottom plate 212 can also be made of the same material as the arc-shaped plates 211, and the bottom plate 212 can be machined from the plate material used to manufacture the arc-shaped plates 211. In this case, the bottom plate 212 is provided with through holes 202.

[0049] Alternatively, the support member 21 can comprise one arc-shaped plate 211 and one bottom plate 212, both extension ends of the arc-shaped plate 211 are connected to both extension ends of the bottom plate 212, the flow guide member comprises a plurality of support members 21, the plurality of support members 21 are nested with each other, and the bottom plates 212 in the plurality of support members 21 are connected to each other and are commonly connected to the cover plate 11. In this way, the processing technology of each support member 21 is simple, the plurality of arc-shaped plates 211 can be stacked by the nesting of the plurality of support members 21, and the error is reduced.

[0050] In other embodiments, among all the arc-shaped plates 211 in the support member 21, the outermost arc-shaped plate 211 can be directly connected to the cover plate 11, the other arc-shaped plates 211 are connected to the bottom plate 212 and are connected to the cover plate 11 through the bottom plate 212, or the plurality of outermost arc-shaped plates 211 are directly connected to the cover plate 11, and the other arc-shaped plates 211 are connected to the bottom plate 212, which is not limited herein.

[0051] In the following embodiments, for the convenience of description, the two cover plates 11 can be respectively named as an upper cover plate 11a and a lower cover plate 11b, both extension ends of the arc-shaped plate 211 can be connected to the lower cover plate 11b, and the heat generating component is connected to the side of the lower cover plate 11b away from the upper cover plate 11a. The width direction of the arc-shaped plate 211 is the same as the width direction of the shell 10, and the length direction of the arc-shaped plate 211 is the same as the length direction of the shell 10.

[0052] Alternatively, the cross section of the arc-shaped plate 211 is in the shape of a circular arc. In the tangent direction of the circular arc-shaped arc-shaped plate 211, the curvature change of the capillary structure 22 is relatively continuous and uniform, so that the distribution of the capillary force is also relatively stable. The capillary force acting on the working medium in the capillary structure 22 has a small difference at each position, and the working medium can flow relatively stably along the capillary structure 22, and will not cause a large fluctuation of the permeability due to the sudden change of the capillary force.

[0053] Please refer to Figure 1 andFigure 2 In some embodiments, the support member 21 comprises a plurality of arc-shaped plates 211, and the corresponding arc angles of the plurality of arc-shaped plates 211 can be equal or unequal. In this way, the curvatures of the arc-shaped support walls 2011 of the plurality of arc-shaped plates 211 change by the same amount, the distribution of the surface tension experienced by the liquid working medium in the capillary structure 22 is relatively uniform, and the flow path of the liquid working medium in the capillary structure 22 is relatively stable and regular. In this case, the rising or flowing of the liquid working medium in the capillary structure 22 is mainly affected by the capillary action itself, as well as the adhesion and cohesion between the liquid and the material of the capillary structure 22, and the permeability is relatively stable. At the same time, the arc-shaped plates 211 in the shape of an arc of a circle can better guide the uniform filling of the working medium in the capillary structure 22. Due to the uniformity of the curvatures, the rising height and filling degree of the working medium in the capillary structure 22 are relatively consistent at each position, and there is no local overfilling or underfilling, which is conducive to the rapid and stable flowing of the working medium in the capillary structure 22. When the arc angles corresponding to the plurality of arc-shaped plates 211 are equal and the centers of the arcs coincide, the plurality of arc-shaped plates 211 are parallel to each other to ensure that the permeation rates of each region of the capillary sub-cavities 201 in the extension direction of the arc-shaped plates 211 are uniform.

[0054] Optionally, the flow guide assembly 20 comprises at least three arc-shaped plates 211, and the spacing between any two adjacent arc-shaped plates 211 is equal on the premise that the arc angles corresponding to all the arc-shaped plates 211 are equal. At this time, the uniformity of the capillary structure 22 is better, the distribution of the capillary force experienced by the liquid in the two adjacent capillary sub-cavities 201 is relatively uniform, and the flow path is also relatively consistent, so there is no local resistance mutation caused by sudden changes in the spacing, and therefore the permeability of the liquid on the capillary structure 22 in the two adjacent capillary sub-cavities 201 is relatively stable and uniform, and the liquid can flow and diffuse in the capillary cavity 102 at a relatively consistent permeation rate. Of course, when the cross section of the arc-shaped plate 211 is not in the shape of an arc of a circle, the spacing between any two adjacent arc-shaped plates 211 can also be equal, which is not limited here.

[0055] Generally, the arc-shaped plates 211 in the flow guide assembly 20 can be provided in 2-5 to improve the recovery efficiency of the working medium while ensuring that the vapor chamber 100 is relatively thin.

[0056] It should be noted that the innermost arc-shaped plate 211 of the plurality of arc-shaped plates 211 and the cavity formed by the lower cover plate 11b are also capillary sub-cavities 201, and the thickness of the capillary sub-cavity 201 is the distance between the middle part of the arc-shaped plate 211 and the lower cover plate 11b. The thickness of the capillary sub-cavity 201 can be equal to the spacing between the two adjacent arc-shaped plates 211 to improve the stability and uniformity of the flow of the working medium between the capillary sub-cavities 201.

[0057] Please refer to Figure 2In some embodiments, a plurality of through holes 202 are formed on each arc-shaped plate 211, and the through holes 202 are arranged in an array. Increasing the number of through holes 202 within a certain range can improve the permeability of the working medium in the capillary cavity 102. The array arrangement of the through holes 202 can make the gap between adjacent two through holes 202 uniform, and can make the permeability of the working medium in the capillary structure 22 uniform and stable.

[0058] Optionally, the through hole 202 is a circular hole. The hole wall of the circular through hole 202 is also arc-shaped, which is similar to the arc-shaped plate 211. The arrangement of the arc-shaped hole wall of the through hole 202 can further improve the permeation speed of the working medium in the capillary structure 22 from the center to the periphery of the through hole 202, so as to further improve the recovery efficiency of the working medium.

[0059] Optionally, please refer to Figure 1 The through holes 202 formed on adjacent two arc-shaped plates 211 are arranged opposite to each other in the thickness direction of the shell 10, so as to shorten the flow path of the working medium in adjacent two capillary sub-cavities 201, thereby improving the permeation rate of the working medium. Among them, the plurality of arc-shaped plates 211 can be cut from the same plate material, so that the gap between adjacent two through holes 202 on the plurality of arc-shaped plates 211 is the same, and it is also convenient for processing.

[0060] Optionally, the through holes 202 are also formed on the bottom plate 212, so that the through holes 202 on the bottom plate 212 can also be filled with the capillary structure 22, thereby increasing the filling volume of the capillary structure 22, and thereby increasing the permeation amount of the working medium. Among them, the through holes 202 on the bottom plate 212 are arranged opposite to the through holes 202 on the arc-shaped plate 211 in the thickness direction of the shell 10, so that the plurality of through holes 202 opposite in the thickness direction of the shell 10 form a columnar structure of the capillary structure 22 at the through holes 202. The columnar structure can make the working medium aggregate together and increase the permeation pressure in this area, so that the working medium can perform directional permeation along the circumference of the columnar structure, thereby improving the permeation efficiency.

[0061] It should be noted that the number and area of the through holes 202 are not the larger the better. The larger the area of the arc-shaped plate 211 occupied by the through holes 202, the smaller the area of the arc-shaped plate 211 used for adsorbing the working medium. However, too small number and area of the through holes 202 will affect the permeation efficiency of the working medium. Therefore, in actual application, the number and size of the through holes 202 need to be selected through simulation experiments combined with the maximum heat dissipation capacity requirement of the electronic equipment.

[0062] Please refer to Figure 1In some embodiments, the flow guide assembly 20 can be arranged in the sealed cavity 10a of the housing 10, with the two ends of the support member 21 abutting the two ends of the sealed cavity 10a in the length direction. In other embodiments, a plurality of flow guide assemblies 20 can be arranged in the sealed cavity 10a of the housing 10, and the plurality of flow guide assemblies 20 can be connected to the same cover plate 11. In this case, the support member 21 can be arranged to have a smaller size to reduce the cost.

[0063] The permeability of the working medium in the capillary structure 22 is related to the gap width between the two adjacent arc-shaped plates 211, the distance between the two adjacent through holes 202, and the total thickness of the plurality of arc-shaped plates 211. The corresponding relationship between the theoretical permeability K0 obtained by simulation and the center distance t of the two adjacent through holes 202 can be verified according to the following formula:

[0064]

[0065] where d is the thermal radiation constant.

[0066] The actual permeability K formula is:

[0067]

[0068] where K0 is the theoretical permeability obtained by simulation, e is the gap between the two adjacent arc-shaped plates 211, b0 is the theoretical total thickness of the plurality of arc-shaped plates 211, and b is the actual total thickness of the plurality of arc-shaped plates 211.

[0069] The value of b can be obtained according to the value of K0 in the range of 0.16-0.49, thereby obtaining the value of b.

[0070] The e in the above formula can be calculated according to the following formula:

[0071]

[0072] where As is the area of the region other than the arc-shaped plate 211 in the circular ring in which the arc-shaped plate 211 is arranged, R m is the equivalent heat transfer constant.

[0073] Optionally, the circular arc angle of the arc-shaped plate 211 is 120°-180°, and the gap between the two adjacent arc-shaped plates 211 is 5-20 μm. Under the above parameters, the permeability of the working medium in the capillary structure 22 can be at a relatively good level.

[0074] Optionally, the aperture of the through hole 202 is 2-100 μm, under which the permeability of the working medium in the capillary structure 22 is at a preferable level. If the aperture of the through hole 202 is too large, it will occupy too much area of the arc-shaped plate 211, affecting the capillary force of the arc-shaped plate 211 on the working medium in the capillary structure 22, and if the aperture of the through hole 202 is too small, it will affect the permeation efficiency of the inner capillary sub-cavity 201 to the outer capillary sub-cavity 201.

[0075] Under the above parameters, the maximum temperature difference between the hot end and the cold end of the vapor chamber 100 can be within 0.5°C (the average level in the industry is 3°C), and the heat dissipation performance of the vapor chamber 100 can be improved by more than 5 times.

[0076] The above merely describes several specific embodiments of the present application, and only specifically describes the technical principles of the present application, and these descriptions are only for explaining the principles of the present application, and cannot be interpreted in any way as a limitation on the protection scope of the present application. Based on the explanations here, any modifications, equivalent replacements and improvements within the scope of the present application, and other specific embodiments of the present application that can be conceived by those skilled in the art without creative labor, should be included in the protection scope of the present application.

Claims

1. A vapor chamber, characterized by, The application relates to a heat conduction plate, comprising: a housing, which comprises two cover plates that are combined together to form a sealed cavity; a flow guide assembly in the sealed cavity, the flow guide assembly comprising a support member and a capillary structure, the support member being connected to at least one of the cover plates and separating the sealed cavity into a capillary cavity and a vapor cavity, the capillary cavity comprising one or more capillary sub-cavities, the capillary structure being filled in each of the capillary sub-cavities, each of the capillary sub-cavities having an arc-shaped support wall on the side close to the vapor cavity, the arc-shaped support wall being convex to the vapor cavity, and a plurality of through holes being formed in each of the arc-shaped support walls; a working medium filled in the sealed cavity.

2. The vapor chamber of claim 1, wherein The support member comprises one or more arc-shaped plates, the concave side of the arc-shaped plate forming the arc-shaped support wall, and a plurality of through holes being formed in the arc-shaped plate; when a plurality of arc-shaped plates are provided, the convex sides of all the arc-shaped plates are the same, and adjacent two arc-shaped plates are spaced apart.

3. The vapor chamber of claim 2, wherein The support member further comprises a bottom plate, and two ends of each of the arc-shaped plates are connected to the bottom plate, and the arc-shaped plates are connected to the cover plates through the bottom plate.

4. The vapor chamber of claim 2, wherein The flow guide assembly comprises a plurality of arc-shaped plates, and the corresponding arc angles of each of the arc-shaped plates are the same or different.

5. The vapor chamber of claim 4, wherein The arc angle of the arc-shaped plate is 120 DEG to 180 DEG.

6. The vapor chamber of claim 5, wherein The flow guide assembly comprises at least three arc-shaped plates, and the spacing between any adjacent two arc-shaped plates is equal.

7. The vapor chamber of claim 6, wherein The spacing between adjacent two arc-shaped plates is 5 mu m to 20 mu m.

8. The vapor chamber of claim 7, wherein A plurality of through holes are formed in each of the arc-shaped plates, and the plurality of through holes are arrayed, and the through holes formed in adjacent two arc-shaped plates are oppositely arranged along the thickness direction of the housing.

9. The vapor chamber of any one of claims 1 to 8, wherein The through hole is a circular hole, and the diameter of the through hole is 2 mu m to 100 mu m.

10. An electronic device, comprising: The application further relates to a heat conduction plate comprising the heat conduction plate as claimed in any one of claims 1 to 9.

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