High-performance double-sided spiral liquid cooling radiator with multiple parallel channels
By designing a high-performance double-sided spiral multi-parallel channel liquid cooler, and adopting a microchannel parallel and manifold interconnection structure, the problem of heat dissipation channel blockage is solved, achieving more efficient heat dissipation and equipment stability.
Patent Information
- Application Number
- CN202520402307.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-07
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-03-07
AI Technical Summary
Existing spiral radiators are prone to heat dissipation efficiency being affected by blockage of one or more heat dissipation channels, which reduces the stability and reliability of equipment operation.
A high-performance double-sided spiral multi-parallel channel liquid cooler was designed, which adopts a microchannel side-by-side arrangement and a first and second manifold interconnection structure to ensure that the heat dissipation medium can flow into other channels when the channels are blocked, thereby enhancing the contact time and area between the heat dissipation medium and the channels. A square spiral structure is also adopted to improve heat transfer efficiency.
This effectively avoids the decrease in heat dissipation efficiency caused by blockage of a single microchannel, improves the reliability and stability of the radiator, and enhances heat dissipation efficiency.
Smart Images
Figure CN223885519U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of spiral heat sinks, in particular to a high-performance double-sided spiral multi-parallel-channel liquid cooling heat sink. BACKGROUND
[0002] In the working process of high-power electronic components, the heat problem is extremely significant. If the heat is not effectively dissipated in time, the stability and service life of the equipment will be seriously threatened. Therefore, the use of heat sinks to achieve efficient heat dissipation has become a key to ensuring the normal operation of the equipment.
[0003] The spiral heat sink is widely used in the field of electronic equipment heat dissipation due to its excellent heat dissipation performance. Its working principle is as follows: the heat dissipation medium flows into the medium inlet, flows along the spiral heat dissipation channel, and finally flows out through the medium outlet. In this circulation process, the heat dissipation medium continuously absorbs the heat emitted by the equipment during the flow in the heat dissipation channel, thereby taking away the heat of the equipment to achieve the effect of heat dissipation.
[0004] In order to further improve the heat dissipation efficiency of the spiral heat sink and control the pressure loss, the heat dissipation channel is usually designed as multiple parallel channels in the related technology. The medium inlet and the medium outlet are simultaneously connected to multiple heat dissipation channels. This design helps to enhance the heat dissipation effect.
[0005] However, in actual application, it is found that the above-mentioned spiral heat sink occasionally has the problem of single or multiple heat dissipation channel blockage. Once the heat dissipation channel is blocked, the normal flow of the heat dissipation medium will be hindered, thereby seriously affecting the overall heat dissipation effect of the spiral heat sink and reducing the stability and reliability of the equipment operation. CONTENT OF THE INVENTION
[0006] In order to reduce the situation that a single heat dissipation channel is blocked and thus affects the heat dissipation efficiency of the heat sink, the application provides a high-performance double-sided spiral multi-parallel-channel liquid cooling heat sink.
[0007] The application provides a high-performance double-sided spiral multi-parallel-channel liquid cooling heat sink, which adopts the following technical scheme:
[0008] The high-performance double-sided spiral multi-parallel-channel liquid cooling heat sink comprises a base plate and a cover plate. The base plate is provided with a heat dissipation channel. The heat dissipation channel is used for the flow of the heat dissipation medium. The base plate is provided with a medium inlet and a medium outlet. One end of the heat dissipation channel is connected to the medium inlet, and the other end of the heat dissipation channel is connected to the medium outlet. A plurality of tube walls are arranged in the heat dissipation channel to form a plurality of parallel microchannels. Part of the parallel tube walls in the heat dissipation channel are simultaneously removed to form a first confluence cavity. The first confluence cavity is used for connecting the plurality of microchannels. The cover plate covers the heat dissipation channel. The base plate and the cover plate are fixedly connected.
[0009] By adopting the technical scheme, when in use, the heat of the heat dissipation device is transferred to the cover plate, the heat dissipation medium flows into the plurality of microchannels through the medium inlet, and the heat dissipation medium continuously absorbs the heat on the cover plate when flowing in the heat dissipation channel, thereby taking away the heat of the heat dissipation device, achieving the effect of heat dissipation and cooling; when the single microchannel is blocked, the heat dissipation medium can flow into the next section of the other microchannels through the first flow collecting cavity, thereby avoiding the situation that the heat dissipation efficiency of the heat radiator is affected due to the blocking of the single microchannel.
[0010] Optionally, the first flow collecting cavity is provided in plurality, and the plurality of first flow collecting cavities are arranged at intervals along the flow direction of the heat dissipation medium.
[0011] By adopting the technical scheme, the plurality of first flow collecting cavities arranged at intervals enable the flow to be restored in multiple places when the microchannels are partially blocked, further reducing the influence of the blocking on the flow of the heat dissipation medium.
[0012] Optionally, the microchannel comprises an inflow channel and an outflow channel, the inflow channel and the outflow channel are connected, the inflow channel is connected with the medium inlet, the outflow channel is connected with the medium outlet, and the inflow channel and the outflow channel are both in the same direction of spiral structure and are nested with each other.
[0013] By adopting the technical scheme, the inflow channel and the outflow channel are both in the same direction of spiral structure and are nested with each other, which can guide the heat dissipation medium to flow along a specific track, effectively increasing the contact time and contact area of the heat dissipation medium and the heat dissipation channel; and the heat dissipation medium can perform complete counterflow heat exchange in the spiral structure microchannel, and this counterflow mode can achieve a greater logarithmic mean temperature difference, thereby improving the heat transfer per unit area and enhancing the heat dissipation efficiency.
[0014] Optionally, a second flow collecting cavity is arranged at the connection of the inflow channel and the outflow channel in the heat dissipation channel, and the second flow collecting cavity is used for connecting the plurality of microchannels.
[0015] By adopting the technical scheme, the connection of the inflow channel and the outflow channel is located at the center of the heat dissipation channel, the length of each section of the bending channel is shorter, and the problem of blocking is more likely to occur; the second flow collecting cavity is arranged at the connection of the inflow channel and the outflow channel, even if the inflow channel is partially blocked, the heat dissipation medium can flow into all the outflow channels through the second flow collecting cavity, thereby reducing the situation that the heat dissipation efficiency of the heat radiator is affected due to the blocking of the inflow channel.
[0016] Optionally, the heat dissipation channel is in a square spiral structure.
[0017] By adopting the technical scheme, the square spiral structure makes the arrangement of the heat dissipation channel more dense, which is helpful to improve the heat dissipation efficiency, and the square is easier to process.
[0018] Optionally, the substrate is provided with a heat dissipation channel on each side, and the two heat dissipation channels are arranged in parallel.
[0019] By adopting the above technical scheme, the heat dissipation channel is arranged on each side of the substrate, so that both ends of the heat dissipation device can act on the heat generating equipment for heat dissipation, thereby effectively improving the heat dissipation efficiency.
[0020] Optionally, the cover plate is provided with two, and the two cover plates are respectively fixed on both ends of the substrate; and the cover plate and the substrate are welded and fixed.
[0021] By adopting the above technical scheme, the welding fixed mode has good structural strength, good sealing performance, reduces the entry of external impurities, and improves the reliability and service life of the heat dissipation device.
[0022] Optionally, the substrate is provided with a mounting hole for assisting installation and fixation.
[0023] By adopting the above technical scheme, the mounting hole for assisting installation and fixation is arranged on the substrate, so that the heat dissipation device does not need other installation support during installation, and the use is simple and convenient.
[0024] In summary, the present application has at least one of the following beneficial technical effects:
[0025] 1. During use, the heat of the heat generating equipment is transferred to the cover plate, the heat dissipation medium flows into the plurality of microchannels through the medium inlet, and the heat dissipation medium continuously absorbs the heat on the cover plate when flowing in the heat dissipation channel, thereby taking away the heat of the heat generating equipment, achieving the effect of heat dissipation and cooling; when the single whole microchannel is blocked, the heat dissipation medium can flow into the next section of the other microchannel through the first flow collecting cavity, thereby avoiding the situation that the single whole microchannel is blocked and the heat dissipation efficiency of the heat dissipation device is affected;
[0026] 2. By arranging the second flow collecting cavity, even if part of the inflow channel is blocked, the heat dissipation medium can flow into all the outflow channels through the second flow collecting cavity, further reducing the situation that the heat dissipation channel is blocked and the heat dissipation efficiency of the heat dissipation device is affected;
[0027] 3. The heat dissipation channel is arranged on each side of the substrate, so that both ends of the heat dissipation device can act on the heat generating equipment for heat dissipation, thereby effectively improving the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0028] Figure 1 is a whole structure schematic diagram of the embodiment of the present application;
[0029] Figure 2 is a front view of the heat dissipation channel of the embodiment of the present application;
[0030] Figure 3 is Figure 2 is an enlarged view of the A area in
[0031] Figure 4 is a structural schematic view of the embodiment of the application highlighting the parallel arrangement of the two heat dissipation channels.
[0032] Reference signs: 1, substrate; 11, medium inlet; 12, medium outlet; 2, cover plate; 3, heat dissipation channel; 31, microchannel; 311, inflow channel; 312, outflow channel; 32, first flow collection cavity; 33, second flow collection cavity; 4, mounting hole. DETAILED DESCRIPTION
[0033] The following will be described in detail in combination with the accompanying Figures 1-4 The application will be further described in detail.
[0034] The embodiment of the application discloses a high-performance double-sided spiral multi-parallel-channel liquid cooling heat sink, referring to Figure 1 and Figure 2 , comprising a substrate 1 and a cover plate 2, the substrate 1 is provided with a heat dissipation channel 3 for the flow of heat dissipation medium, and the substrate 1 is respectively provided with a medium inlet 11 and a medium outlet 12, one end of the heat dissipation channel 3 is communicated with the medium inlet 11, and the other end of the heat dissipation channel 3 is communicated with the medium outlet 12; the cover plate 2 covers the heat dissipation channel 3, and the cover plate 2 is fixedly connected with the substrate 1.
[0035] In use, the heat sink is installed at a heat generating position of a heat dissipation device, and the heat of the heat dissipation device is transferred to the cover plate 2; the heat dissipation medium flows into the heat dissipation channel 3 through the medium inlet 11, continuously absorbs the heat emitted by the heat dissipation device when flowing in the heat dissipation channel 3, and then flows out from the medium outlet 12, so as to take away the heat of the heat dissipation device, thereby achieving the effect of heat dissipation and cooling.
[0036] Referring to Figure 2 and Figure 3 , the heat dissipation channel 3 is provided with a plurality of pipe walls to form a plurality of microchannels 31 arranged side by side, so as to control pressure loss and increase the contact area of the heat dissipation medium with the heat dissipation channel 3, thereby improving the heat dissipation efficiency of the spiral heat sink. In the embodiment, six microchannels 31 are milled in the heat dissipation channel 3 by CNC technology, and the width of each microchannel 31 is 1.5 mm.
[0037] The micro channel 31 comprises an inflow channel 311 and an outflow channel 312, the inflow channel 311 is communicated with the outflow channel 312, and the inflow channel 311 is communicated with the medium inlet 11, and the outflow channel 312 is communicated with the medium outlet 12. The inflow channel 311 and the outflow channel 312 are both in a clockwise spiral structure, and at the same time, the inflow channel 311 and the outflow channel 312 are spirally nested to form a square structure, so that the arrangement of the heat dissipation channel 3 is more dense, and the heat dissipation medium can perform complete counter-flow heat exchange in the spiral structure micro channel 31, and the counter-flow mode can realize a greater logarithmic mean temperature difference, thereby improving the heat transfer per unit area and helping to improve the heat dissipation efficiency. In other embodiments, the heat dissipation channel 3 can also be circular or polygonal.
[0038] Part of the tube walls of the heat dissipation channel 3 are simultaneously removed to form a first flow collection cavity 32, and the first flow collection cavity 32 communicates all the micro channels 31 with the same flow direction in the heat dissipation channel 3; when a single micro channel 31 is blocked, the heat dissipation medium can flow into the next section of the other micro channels 31 through the first flow collection cavity 32, thereby avoiding the situation that the single micro channel 31 is blocked and the heat dissipation efficiency of the radiator is affected. The first flow collection cavity 32 is provided in plurality, and the plurality of first flow collection cavities 32 are arranged at intervals along the flow direction of the heat dissipation medium.
[0039] In this embodiment, four first flow collection cavities 32 are provided, and the inflow channel 311 and the outflow channel 312 are each bent eight times to form nine bent channels, two of the first flow collection cavities 32 are respectively located in the third bent channel and the fifth bent channel of the inflow channel 311, and the other two first flow collection cavities 32 are respectively located in the sixth bent channel and the eighth bent channel of the outflow channel 312.
[0040] And, a second flow collection cavity 33 is arranged at the connection between the inflow channel 311 and the outflow channel 312, and the second flow collection cavity 33 communicates all the inflow channels 311 and the outflow channels 312; even if part of the inflow channels 311 are blocked, the heat dissipation medium can flow into all the outflow channels 312 through the second flow collection cavity 33, thereby avoiding the situation that the single inflow channel 311 is blocked and the heat dissipation efficiency of the radiator is affected.
[0041] Referring to Figure 1 and Figure 4 , two heat dissipation channels 3 are arranged at both ends of the substrate 1, and the two heat dissipation channels 3 are arranged in parallel; the medium inlet 11 and the medium outlet 12 are both located on the same side of the substrate 1, the medium inlet 11 is communicated with the inflow channels 311 of the two heat dissipation channels 3 at the same time, and the medium outlet 12 is communicated with the outflow channels 312 of the two heat dissipation channels 3 at the same time. And, two cover plates 2 are provided, and the two cover plates 2 cover the heat dissipation channels 3 at both ends of the substrate 1 and are welded to the cover plates 2.
[0042] A plurality of mounting holes 4 are arranged at intervals along the length direction of the side of the substrate 1, for assisting the installation and fixation of the heat sink on the required heat dissipation device.
[0043] In this embodiment, the heat sink is of rectangular structure; in other embodiments, the heat sink can be of circular, polygonal structure, or other shape convenient for assembly with the heat generating device.
[0044] The implementation principle of the high-performance double-sided spiral multi-parallel-channel liquid cooling heat sink disclosed in the embodiments of the present application is as follows: the substrate 1 is provided with spiral heat dissipation channels 3 at both ends, one end of the heat dissipation channel 3 is communicated with the medium inlet 11, and the other end is communicated with the medium outlet 12; the heat dissipation channel 3 includes a plurality of microchannels 31 arranged side by side, a second collecting cavity 33, and a plurality of first collecting cavities 32 arranged at intervals along the flow direction of the heat dissipation medium; when a single microchannel 31 is blocked, the heat dissipation medium can flow into the next section of other microchannels 31 through the first collecting cavities 32 and the second collecting cavities 33, thereby avoiding the situation that the single microchannel 31 is blocked and the heat dissipation efficiency of the heat sink is affected.
[0045] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application, therefore: any equivalent changes made according to the structure, shape, principle of the present application shall be covered within the protection scope of the present application.
Claims
1. A high performance double helix multi-parallel channel liquid cooling radiator, characterized in that, The application relates to a heat dissipation device, which comprises a substrate (1) and a cover plate (2), the substrate (1) is provided with a heat dissipation channel (3) for the flow of a heat dissipation medium, the substrate (1) is respectively provided with a medium inlet (11) and a medium outlet (12), one end of the heat dissipation channel (3) is communicated with the medium inlet (11), and the other end of the heat dissipation channel (3) is communicated with the medium outlet (12); a plurality of tube walls are arranged in the heat dissipation channel (3) to form a plurality of micro-channels (31) arranged in parallel, part of the tube walls arranged in parallel in the heat dissipation channel (3) are simultaneously removed to form a first flow collecting cavity (32), and the first flow collecting cavity (32) is used for connecting the plurality of micro-channels (31); the cover plate (2) covers the heat dissipation channel (3), and the substrate (1) and the cover plate (2) are fixedly connected.
2. The high-performance double-sided helical multi-parallel-channel liquid cooling radiator of claim 1, wherein, The first flow collecting cavities (32) are arranged in a plurality of groups, and the groups of the first flow collecting cavities (32) are arranged in a spaced mode along the flow direction of the heat dissipation medium.
3. The high-performance double-sided helical multi-parallel-channel liquid cooling radiator of claim 1, wherein, The micro-channel (31) comprises an inflow channel (311) and an outflow channel (312), the inflow channel (311) and the outflow channel (312) are communicated with each other, the inflow channel (311) is communicated with the medium inlet (11), and the outflow channel (312) is communicated with the medium outlet (12); the inflow channel (311) and the outflow channel (312) are both in the same direction and are nested with each other.
4. The high-performance double-sided helical multi-parallel-channel liquid cooling radiator of claim 3, wherein, The connection position of the inflow channel (311) and the outflow channel (312) in the heat dissipation channel (3) is provided with a second flow collecting cavity (33), and the second flow collecting cavity (33) is used for connecting the plurality of micro-channels (31).
5. The high-performance double-sided helical multi-parallel-path liquid cooling radiator of claim 3, wherein, The heat dissipation channel (3) is in a square spiral structure.
6. The high-performance double-sided helical multi-parallel-path liquid cooling radiator of claim 1, wherein, Both sides of the substrate (1) are provided with the heat dissipation channel (3), and the two heat dissipation channels (3) are arranged in parallel.
7. The high-performance double-sided helical multi-parallel-path liquid cooling radiator of claim 6, wherein, The cover plate (2) is provided with two cover plates (2), and the two cover plates (2) are respectively fixed to the two ends of the substrate (1); the cover plate (2) and the substrate (1) are welded and fixed.
8. The high-performance double-sided helical multi-parallel-path liquid cooling radiator of claim 1, wherein, The substrate (1) is provided with a mounting hole (4), and the mounting hole (4) is used for assisting installation and fixation.