Electromagnetic shielding structure and 800G OSFP optical module
By designing the EMI adhesive and baffle structure in the upper shell adhesive groove of the 800G OSFP optical module through the lower shell ribs, multiple shielding is formed, solving the problems of electromagnetic leakage and space occupation, and achieving efficient electromagnetic shielding and signal stability.
Patent Information
- Application Number
- CN202520421894.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-03-11
AI Technical Summary
At high speeds and high densities, 800G OSFP optical modules have small electromagnetic leakage gaps and numerous electronic components. Existing shielding structures are insufficient to effectively prevent electromagnetic wave leakage, while also occupying PCB layout space.
The design employs a lower and upper shell. Ribs on the lower shell allow EMI adhesive to enter the adhesive groove of the upper shell, forming a sealed structure. The adhesive then enters the inner cavity of the lower shell through the first baffle wall. Combined with the U-shaped ribs and baffle wall, multiple shielding is formed, avoiding the PCB board location and enhancing electromagnetic shielding effectiveness.
It achieves dual shielding against electromagnetic radiation, prevents electromagnetic wave leakage, improves shielding effectiveness, and does not occupy PCB board layout space, thus ensuring signal quality.
Smart Images
Figure CN223885536U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to optical module technical field, concretely relates to an electromagnetic shielding structure and 800G OSFP optical module. BACKGROUND
[0002] The signal transmission rate of 800G OSFP encapsulated optical module reaches 100Gbps, compared with traditional low-rate optical module, the rate wavelength of single wave 100Gbps is shorter, and the electromagnetic leakage gap is smaller, so the shielding requirement of upper shell and lower shell is higher, and the increase of corresponding electronic components will also lead to the higher module rate, thus requiring larger PCB board layout space. SUMMARY
[0003] The utility model provides an electromagnetic shielding structure and 800G OSFP optical module to overcome the deficiencies in the prior art.
[0004] The utility model solves the technical scheme as follows:
[0005] An electromagnetic shielding structure for 800G OSFP optical module, comprising: a lower shell and an upper shell, an inner cavity for accommodating a PCB board is arranged on the upper surface of the lower shell, and a rib is arranged on the upper surface of the lower shell at the two side edges of the inner cavity in the area corresponding to the PCB board, a glue groove is arranged on the lower surface of the upper shell, and EMI glue is arranged in the glue groove; the upper shell is assembled on the lower shell, the rib on the lower shell enters the glue groove and compacts the EMI glue in the glue groove, and a first barrier wall is arranged on the lower surface of the upper shell and enters the inner cavity of the lower shell and is adjacent to the cavity wall along the direction of the glue groove.
[0006] The utility model has the advantages of:
[0007] When the rib enters the glue groove and compacts the EMI glue in the glue groove, sealing is realized, and electromagnetic wave leakage is prevented, since the first barrier wall enters the inner cavity of the lower shell, a reverse stop is formed between the first barrier wall and the lower shell, and the electromagnetic shielding performance is improved, the electromagnetic shielding structure can realize double shielding of electromagnetic radiation, improve the shielding effect between the lower shell and the upper shell, and avoid the position of the PCB board without occupying the layout space of the PCB board.
[0008] On the basis of the above technical scheme, the utility model can also be improved as follows.
[0009] Further, the outer side surface of the first barrier wall is coplanar with the inner groove surface of the glue groove.
[0010] Further, the tail end of the rib on the upper surface of the lower shell at the two side edges of the inner cavity is outside the tail end of the PCB board, and the front end of the rib on the upper surface of the lower shell at the two side edges of the inner cavity is adjacent to the gold finger of the PCB board.
[0011] The further beneficial effect is that the PCB board can be covered in the section in the lower shell and the upper shell, and electromagnetic wave leakage is effectively prevented.
[0012] Further, the inner cavity of the lower shell is provided with a second barrier wall distributed along the width direction thereof, and the inner cavity of the lower shell is divided into a first cavity and a second cavity independent of each other by the second barrier wall, and the first cavity and the second cavity are respectively used to accommodate the PCB board and the ferrule, and two first slits for the optical fiber to pass through are vertically formed on the second barrier wall.
[0013] The further beneficial effect is that, since the first slit is only used for the optical fiber to pass through, the second barrier wall can form a barrier, and the electromagnetic shielding effect is improved.
[0014] Further, the upper surface of the lower shell is provided with a rib on both side edges of the inner cavity and the upper surface of the second barrier wall, the rib is in a U-shaped form, the glue groove is in a U-shaped form, and the first barrier wall is in a U-shaped form.
[0015] The further beneficial effect is that a barrier is formed in three directions of the PCB board except the gold finger end, and the electromagnetic shielding effect is improved.
[0016] Further, the U-shaped end of the first barrier wall is provided with a second slit vertically distributed at the position corresponding to each first slit.
[0017] Further, the lower surface of the upper shell is provided with a third barrier wall at the opening end of the first barrier wall, and the lower surface of the third barrier wall can be attached to the PCB board.
[0018] The further beneficial effect is that the third barrier wall can also form a barrier for the PCB board, and the electromagnetic shielding effect is improved.
[0019] Based on the above technical scheme, the utility model also provides a 800G OSFP optical module comprising the electromagnetic shielding structure.
[0020] The further beneficial effect is that the electromagnetic shielding effect of the 800G OSFP optical module is effectively improved. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 It is an exploded state first perspective view of the electromagnetic shielding structure in the utility model;
[0022] Figure 2 It is an exploded state second perspective view of the electromagnetic shielding structure in the utility model;
[0023] Figure 3 It is a width direction sectional view of the electromagnetic shielding structure in the utility model;
[0024] Figure 4 It is a length direction sectional view of the electromagnetic shielding structure in the utility model;
[0025] Figure 5 It is an exploded view of the 800G OSFP optical module in the utility model;
[0026] Figure 6 It is a first perspective view of the shell in the utility model;
[0027] Figure 7 It is a second perspective view of the shell in the utility model;
[0028] Figure 8 It is an exploded view of the shell in the utility model;
[0029] Figure 9 It is an assembly drawing of the shell and the pull ring in the utility model;
[0030] Figure 10 It is an exploded view of the shell and the pull ring in the utility model;
[0031] Figure 11 It is a cross-sectional view of the cage in the utility model;
[0032] Figure 12 It is an assembly drawing of the lower shell and the PCB in the utility model;
[0033] Figure 13 It is an exploded view of the lower shell and the PCB in the utility model;
[0034] Figure 14 It is a structural view of the lower shell in the utility model;
[0035] Figure 15 It is a partial enlarged view of Figure 13 ;
[0036] Figure 16 It is an assembly drawing of the shell and the PCB fixing structure in the utility model.
[0037] In the drawings, the components represented by each reference numeral are listed as follows:
[0038] 1, lower shell, 110, rib, 120, second baffle, 121, first gap, 130, first cavity, 140, second cavity, 150, assembly groove, 151, second matching surface, 160, first matching surface, 170, groove, 180, positioning column, 181, threaded hole, 2, upper shell, 210, glue groove, 220, first baffle, 221, second gap, 230, third baffle, 240, stroke groove, 3, PCB, 4, pull ring, 410, unlocking arm, 411, protruding block, 412, unlocking block, 5, cage, 510, stop position, 520, tongue, 6, rib position, 610, inclined guide surface, 7, screw. DETAILED DESCRIPTION
[0039] The principles and characteristics of the present application are described below in conjunction with the accompanying drawings, and the examples are used to explain the present application and are not intended to limit the scope of the present application.
[0040] Embodiment 1
[0041] As shown in the drawings, an electromagnetic shielding structure for an 800G OSFP optical module comprises: Figures 1-4
[0042] The lower shell 1 is provided with an inner cavity on the upper surface to accommodate the PCB board 3, that is, the subsequent PCB board 3 is placed in the inner cavity on the lower shell 1, and the lower shell 1 is provided with a rib 110 on the upper surface at the two side edges of the inner cavity in the area corresponding to the PCB board 3, the lower surface of the upper shell 2 is provided with a glue groove 210, the position and shape of the glue groove 210 match the position and shape of the rib 110, and the glue groove 210 is provided with EMI glue, the upper shell 2 is assembled on the lower shell 1, and the rib 110 on the lower shell 1 enters the glue groove 210 and compacts the EMI glue in the glue groove 210, and the lower surface of the upper shell 2 is provided with a first barrier wall 220 entering the inner cavity of the lower shell 1 and adjacent to the cavity wall along the direction of the glue groove 210;
[0043] When the rib 110 enters the glue groove 210 and compacts the EMI glue in the glue groove 210, sealing is achieved to prevent electromagnetic wave leakage, and since the first barrier wall 220 enters the inner cavity of the lower shell 1, a reverse stop is formed between the first barrier wall 220 and the lower shell 1, which can also improve the electromagnetic shielding performance, the electromagnetic shielding structure can achieve double shielding of electromagnetic radiation, improve the shielding effect between the lower shell 1 and the upper shell 2, and avoid the position of the PCB board 3 without occupying the layout space of the PCB board 3.
[0044] Embodiment 2
[0045] As shown in the drawings, the present embodiment is a further improvement based on embodiment 1, and the specific improvements are as follows: Figure 3
[0046] The outer side surface of the first barrier wall 220 is preferably coplanar with the inner groove surface of the glue groove 210.
[0047] Embodiment 3
[0048] As shown in the drawings, the present embodiment is a further improvement based on embodiment 1 or 2, and the specific improvements are as follows: Figures 1-4
[0049] The tail ends of the ribs 110 on the upper surface of the lower shell 1 on both sides of the inner cavity are outside the tail end of the PCB board 3, and the front ends of the ribs 110 on the upper surface of the lower shell 1 on both sides of the inner cavity are close to the gold fingers of the PCB board 3, which can cover the section of the PCB board 3 in the lower shell 1 and the upper shell 2, effectively preventing electromagnetic wave leakage.
[0050] Furthermore, the inner cavity of the lower shell 1 is provided with a second barrier wall 120 distributed along the width direction thereof, and the inner cavity of the lower shell 1 is divided into a first cavity 130 and a second cavity 140 independent of each other by the second barrier wall 120, and the first cavity 130 and the second cavity 140 are respectively used to accommodate the PCB board 3 and the ferrule, and two first slits 121 for the optical fiber to pass through are vertically formed on the second barrier wall 120, and since the first slits 121 are only for the optical fiber to pass through, the second barrier wall 120 can form a barrier to improve the electromagnetic shielding effectiveness.
[0051] The upper surface of the lower shell 1 is provided with ribs 110 on both side edges of the first cavity 130 and on the upper surface of the second barrier wall 120, so that the ribs 110 are in a U-shaped form, and since the ribs 110 cooperate with the glue groove 210, the glue groove 210 is also in a U-shaped form, and the first barrier wall 220 is on the inside edge of the glue groove 210, so that the first barrier wall 220 is also in a U-shaped form, which forms a barrier to the PCB board 3 except for the gold finger end, thereby improving the electromagnetic shielding effectiveness.
[0052] The U-shaped end of the first barrier wall 220 is provided with a second slit 221 vertically distributed at each first slit 121.
[0053] Embodiment 4
[0054] As shown in Figure 2 , Figure 4 , this embodiment is a further improvement based on embodiment 3, as follows:
[0055] The lower surface of the upper shell 2 is provided with a third barrier wall 230 at the opening end of the first barrier wall 220, and the lower surface of the third barrier wall 230 can be attached to the PCB board 3, which can form a barrier to the PCB board 3, thereby improving the electromagnetic shielding effectiveness.
[0056] Embodiment 5
[0057] As shown in Figure 5 , an 800G OSFP optical module includes an electromagnetic shielding structure as described in any one of embodiments 1-4.
[0058] As a further optimization of the above scheme, the shell structure is improved as follows:
[0059] As shown in Figures 6-11As shown, the shell is assembled by the lower shell 1 and the upper shell 2, and the first barrier wall 220 is designed to enter the inner cavity of the lower shell 1 on the lower surface of the upper shell 2, so that even if the thickness size of the edge of the upper shell 2 (that is, the thickness size of the overlapping area with the edge of the lower shell 1) is reduced, the upper shell 2 is not easy to deform, thereby the thickness size of the lower shell 1 can be increased, and the parting position of the upper shell 2 and the lower shell 1 will be higher, and the assembly groove 150 is respectively arranged on the two sides of the lower shell 1 in the length direction, and the height of the assembly groove 150 is increased due to the increase of the thickness size of the lower shell 1, and the assembly groove 150 penetrates the upper surface and the tail end surface of the lower shell 1, which is a common form, so it is not described in detail here, and the two unlocking arms 410 of the pull ring 4 are respectively slidably connected with the assembly grooves 150 on the two sides of the lower shell 1, and the structure of the pull ring 4 remains unchanged in the scheme, the assembly groove 150 has a second matching surface 151 for abutting against the two tongues 520 of the cage 5, the two unlocking arms 410 abut against the second matching surface 151 of the assembly groove 150 under the elastic force of the reset spring, the upper end of the second matching surface 151 is higher than the tongue 520 located at the high position of the two tongues 520, and the lower end of the second matching surface 151 is lower than the tongue 520 located at the low position of the two tongues 520, the lower shell 1 has a first matching surface 160 for abutting against the stop position 510 of the cage 5 on the two sides of the inner cavity, and the distance between the first matching surface 160 of the lower shell 1 for abutting against the stop position 510 of the cage 5 and the second matching surface 151 of the assembly groove 150 is 44.59±0.08mm, and further, due to the use of the above structure design in the scheme, the distance between the first matching surface 160 of the lower shell 1 for abutting against the stop position 510 of the cage 5 and the second matching surface 151 can be 44.59±0.05mm, that is, it is better than the protocol size.
[0060] When the 800G OSFP optical module is inserted into the cage for a predetermined length, the stop position 510 of the cage 5 abuts against the first matching surface 160 of the lower shell 1, and the tongue 520 located at the low position and the tongue 520 located at the high position abut against the second matching surface 151 of the two assembly grooves 150, respectively, since the tongue 520 located at the low position and the tongue 520 located at the high position abut against the two second matching surfaces 151 of the same lower shell 1 and are cancelled to abut against the upper shell 2, even if there is an assembly step difference between the lower shell 1 and the upper shell 2, it does not affect the consistency of the matching size, thereby the signal quality can be ensured.
[0061] The height size of the first barrier wall 220 is not less than 1.5mm, and the width size of the first barrier wall 220 is not less than 0.5mm, of course, the size cannot be too large, which cannot occupy the layout space of the PCB board, and also does not affect the loading of the PCB board.
[0062] The lower surface of the upper shell 2 is provided with two stroke grooves 240 at both sides along the length direction, and the protrusions 411 on the two unlocking arms 410 enter the two stroke grooves 240 on the lower surface of the upper shell 2 respectively. By allowing the protrusions 411 to enter the stroke grooves 240, the unlocking arms 410 are effectively prevented from falling off the shell. The second matching surface 151 is provided with a groove 170 in the middle region for the unlocking block 412 of the unlocking arm 410 to enter completely.
[0063] As shown in Figures 12-16 As a further optimization of the above scheme, the fixing structure of the shell and the PCB is improved:
[0064] The PCB 3 is placed in the inner cavity of the lower shell 1. The PCB 3 is provided with a positioning groove 310 at each of the lengthwise side edges. Each positioning groove 310 is adjacent to a gold finger. The inner cavity of the lower shell 1 is provided with a positioning column 180 corresponding to each positioning groove 310. The positioning column 180 is located in the positioning groove 310 and matches the positioning groove 310. At least one rib 6 is provided between each side of the PCB 3 along the length direction and the cavity wall of the inner cavity of the lower shell 1. The rib 6 between the side of the PCB 3 and the cavity wall of the inner cavity of the lower shell 1 forms a transition fit between the PCB 3 and the lower shell 1. At least one rib 6 is provided between the side of the positioning column 180 and the groove wall of the positioning groove 310 on the PCB 3. The rib 6 between the side of the positioning column 180 and the groove wall of the positioning groove 310 on the PCB 3 forms a transition fit between the PCB 3 and the positioning column 180.
[0065] In this scheme, the rib 6 is introduced at the corresponding position. When the PCB 3 is assembled into the lower shell 1, the rib 6 forms a transition fit between the PCB 3 and the lower shell 1 and a transition fit between the PCB 3 and the positioning column 180. Therefore, even if there is a certain interference between the lower shell 1 and the PCB 3 after production and molding, the assembly can still be completed. This prevents the PCB 3 from shaking in the lower shell 1 and improves the consistency of the relative position of the PCB 3 and the lower shell 1. This prevents the gold finger of the PCB 3 from being relatively dispersed in the spring contact position of the connector of the switch, thereby ensuring the stability of the signal.
[0066] The rib 6 is preferably wedge-shaped. As a further optimization of this scheme, the upper end of the rib 6 is obliquely cut downward to form an oblique guide surface 610 facing the PCB 3. The oblique guide surface 610 allows the PCB 3 to be assembled in place by being pressed lightly.
[0067] Furthermore, at the tail of each side of the PCB 3 along the length direction, a rib 6 is provided between the tail of each side of the PCB 3 and the cavity wall of the inner cavity of the lower shell 1 to form a transition fit between the PCB 3 and the lower shell 1. The rib 6 between the side of the PCB 3 and the cavity wall of the inner cavity of the lower shell 1 is preferably fixed to the cavity wall of the inner cavity of the lower shell 1.
[0068] The side of the positioning column 180 close to the gold finger of the PCB 3 and the groove wall of the positioning groove 310 on the PCB 3 and the side of the positioning column 180 away from the gold finger of the PCB 3 and the groove wall of the positioning groove 310 on the PCB 3 are respectively provided with a rib 6 to make the PCB 3 and the positioning column 180 form a transition fit, and the rib 6 of the side of the positioning column 180 close to the gold finger of the PCB 3 and the groove wall of the positioning groove 310 on the PCB 3 and the rib 6 of the side of the positioning column 180 away from the gold finger of the PCB 3 and the groove wall of the positioning groove 310 on the PCB 3 are respectively preferably fixed with the side of the positioning column 180.
[0069] The side of the positioning column 180 close to the gold finger of the PCB 3 is an arc surface, and the surface of the positioning groove 310 opposite to the arc surface of the positioning column 180 is also an arc surface.
[0070] The lower shell 1 is assembled with the upper shell 2, and as a common solution, a threaded hole 181 is downwardly formed on the upper surface of the positioning column 180, the lower shell 1 and the upper shell 2 are fastened and connected by screws 7, the screws 7 are threadedly connected with the threaded hole 181 on the positioning column 180, and the screw fixing column does not need to be additionally designed.
[0071] Although the embodiments of the utility model have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and cannot be understood as the limitation of the utility model, and the ordinary skilled in the art can change, modify, replace and transform the above-mentioned embodiments within the scope of the utility model.
Claims
1. An electromagnetic shielding structure for an 800G OSFP optical module, comprising: The lower shell (1) and the upper shell (2), the upper surface of the lower shell (1) is provided with an inner cavity for accommodating the PCB board (3), characterized in that the upper surface of the lower shell (1) is provided with a rib (110) on both side edges of the inner cavity corresponding to the area of the PCB board (3), the lower surface of the upper shell (2) is provided with a glue groove (210), and the glue groove (210) is provided with EMI glue; the upper shell (2) is assembled on the lower shell (1), and the rib (110) on the lower shell (1) enters the glue groove (210) and compacts the EMI glue, and the lower surface of the upper shell (2) is provided with a first baffle (220) entering the inner cavity of the lower shell (1) and adjacent to the cavity wall along the direction of the glue groove (210).
2. The electromagnetic shielding structure of claim 1, wherein, The outer side of the first baffle (220) is coplanar with the inner groove of the glue groove (210).
3. The electromagnetic shielding structure of claim 1, wherein, The tail end of the rib (110) on the upper surface of the lower shell (1) at both side edges of the inner cavity is outside the tail end of the PCB board (3), and the front end of the rib (110) on the upper surface of the lower shell (1) at both side edges of the inner cavity is adjacent to the gold finger of the PCB board (3).
4. The electromagnetic shielding structure of claim 3, wherein, The inner cavity of the lower shell (1) is provided with a second baffle (120) distributed along the width direction thereof, and the inner cavity of the lower shell (1) is divided into a first cavity (130) and a second cavity (140) independent of each other by the second baffle (120), the first cavity (130) and the second cavity (140) are respectively used for accommodating the PCB board (3) and the ferrule, and two first slits (121) for the optical fiber to pass through are vertically formed on the second baffle (120).
5. The electromagnetic shielding structure of claim 4, wherein, The upper surface of the lower shell (1) at both side edges of the inner cavity and the upper surface of the second baffle (120) are both provided with a rib (110), the rib (110) is in a U-shaped form, the glue groove (210) is in a U-shaped form, and the first baffle (220) is in a U-shaped form.
6. The electromagnetic shielding structure of claim 5, wherein, The U-shaped end of the first baffle (220) is respectively provided with a second slit (221) vertically distributed at each first slit (121).
7. The electromagnetic shielding structure of claim 5, wherein, The lower surface of the upper shell (2) is provided with a third baffle (230) at the opening end of the first baffle (220), and the lower surface of the third baffle (230) can be attached to the PCB board (3).
8. An 800G OSFP optical module, characterized in that, An electromagnetic shielding structure comprising any one of claims 1-7. An electromagnetic shielding structure comprising any one of claims 1-7.