Semiconductor device production mounting equipment

Abstract

The utility model discloses semiconductor device production mounting equipment, which belongs to the technical field of semiconductor device production and comprises a mounting box, a mounting head component is fixedly mounted on the inner side of the mounting box, and a circuit board positioning table component is fixedly mounted on the inner side of the mounting box and positioned below the mounting head component. A paster placing table is fixedly installed at the position, located on one side of the circuit board positioning table assembly, of the inner side of the pasting box, two surface cleaning devices are arranged on the outer side of the pasting head assembly, and an auxiliary supporting device is fixedly installed below the pasting box; according to the utility model, the surface cleaning device is arranged, so that a worker can perform certain cleaning work on the surface of the patch placing table and the surface of the circuit board positioning table assembly through the cooperation of a fan, filter cloth and other structures when needed, thereby reducing the difficulty of cleaning work, reducing the labor burden of the worker, and improving the working efficiency. And the working capability of the equipment is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor device production, and specifically relates to a semiconductor device production mounting equipment. BACKGROUND

[0002] Semiconductor devices are electronic devices that have electrical conductivity between that of a conductor and an insulator, and use the special electrical characteristics of semiconductor materials to complete specific functions, and can be used to generate, control, receive, convert, amplify signals and carry out energy conversion.

[0003] Chinese patent application No. 202420941506.1 discloses a semiconductor device production mounting equipment, which comprises a mounting box, a three-axis linear motor is installed on the upper side of the inside of the mounting box, a mounting head is installed at the Z-axis sliding block of the three-axis linear motor, and a circuit board positioning table assembly and a patch placement table are respectively installed on the lower side of the inside of the mounting box.

[0004] 1. The above-mentioned disclosed patent has the problem of inconvenient cleaning of the surface of the patch placement table and the circuit board positioning table assembly, thereby reducing the working capacity of the equipment; 2. The above-mentioned disclosed patent has the problem of being difficult to maintain stability when encountering uneven ground, thereby reducing the practicality of the equipment. UTILITY MODEL CONTENTS

[0005] To solve the problems in the above background art, the utility model provides a semiconductor device production mounting equipment, which has the characteristics of high working capacity and strong practicality.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a semiconductor device production mounting equipment, which comprises a mounting box, a mounting head assembly is fixedly installed on the inside of the mounting box, a circuit board positioning table assembly is fixedly installed on the inside of the mounting box and below the mounting head assembly, a patch placement table is fixedly installed on the inside of the mounting box and on one side of the circuit board positioning table assembly, two surface cleaning devices are arranged on the outside of the mounting head assembly, and an auxiliary supporting device is fixedly installed below the mounting box.

[0007] Preferably, the surface cleaning device comprises an electric telescopic rod, a moving plate, a blockage block, a fan, filter cloth, an auxiliary cleaning assembly and a moving frame, two electric telescopic rods are fixedly installed on the top of the mounting box, moving plates are fixedly installed on both sides of the two electric telescopic rods away from each other, a moving frame is fixedly installed below the moving plate, a plurality of fans are fixedly installed below the moving frame, filter cloth is fixedly installed on the inside of the moving frame, a blockage block is installed on one side of the moving frame through threads, and an auxiliary cleaning assembly is arranged on the upper side of the moving frame.

[0008] Preferably, the auxiliary cleaning assembly comprises a cleaning brush, a threaded block and an electric lifting rod, the cleaning brush is arranged above the circuit board positioning table assembly and the patch placing table, the threaded block is arranged above the cleaning brush, and the moving frame is connected with the threaded block through the electric lifting rod.

[0009] Preferably, the auxiliary cleaning assembly further comprises a threaded sleeve, and the threaded sleeve is fixedly installed above the cleaning brush and at a position outside the threaded block.

[0010] Preferably, the auxiliary supporting device comprises a supporting plate, a connecting block, threaded rods and a supporting frame, the connecting block is fixedly installed below the patch mounting box, the supporting plate is fixedly installed below the connecting block, a plurality of threaded rods are installed at edge positions of the supporting plate through threads, and the supporting frame is installed at a position outside the supporting plate through bearings.

[0011] Preferably, the auxiliary supporting device further comprises an antiskid rubber pad, and the antiskid rubber pad is fixedly installed below the supporting frame.

[0012] Compared with the prior art, the surface cleaning device of the utility model has the advantages that:

[0013] 1、The surface cleaning device is arranged, so that the staff can clean the surface of the patch placing table and the circuit board positioning table assembly through the cooperation of the fan, the filter cloth and other structures when needed, thereby reducing the difficulty of cleaning work, reducing the labor burden of the staff, and further improving the working capacity of the equipment.

[0014] 2、The auxiliary supporting device is arranged, so that the staff can keep the equipment stable on the uneven ground through the cooperation of the threaded rods and the supporting frame when needed, thereby better meeting the needs of work, ensuring the normal progress of work, and further improving the practicability of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a perspective view of the utility model;

[0016] Figure 2 It is a perspective cutaway view of the utility model;

[0017] Figure 3 It is a perspective cutaway view of the surface cleaning device of the utility model;

[0018] Figure 4 It is a perspective cutaway view of the auxiliary supporting device of the utility model.

[0019] In the figure: 1, mounting box; 2, surface cleaning device; 21, electric telescopic rod; 22, moving plate; 23, blockage block; 24, fan; 25, filter cloth; 26, auxiliary cleaning assembly; 261, cleaning brush; 262, threaded block; 263, threaded sleeve; 264, electric lifting rod; 27, moving frame; 3, auxiliary support device; 31, support plate; 32, connecting block; 33, threaded rod; 34, support frame; 35, anti-skid rubber pad; 4, circuit board positioning table assembly; 5, patch placement table; 6, mounting head assembly. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0021] Embodiment 1

[0022] Please refer to Figures 1-4 The present application provides the following technical solutions: a semiconductor device production mounting equipment, comprising a mounting box 1, a mounting head assembly 6 is fixedly installed on the inner side of the mounting box 1, a circuit board positioning table assembly 4 is fixedly installed on the inner side of the mounting box 1 and below the mounting head assembly 6, a patch placement table 5 is fixedly installed on the inner side of the mounting box 1 and at one side of the circuit board positioning table assembly 4, two surface cleaning devices 2 are arranged on the outer side of the mounting head assembly 6, and an auxiliary support device 3 is fixedly installed below the mounting box 1.

[0023] Specifically, the surface cleaning device 2 comprises an electric telescopic rod 21, a moving plate 22, a blockage block 23, a fan 24, a filter cloth 25, an auxiliary cleaning assembly 26 and a moving frame 27, two electric telescopic rods 21 are fixedly installed above the mounting box 1, moving plates 22 are fixedly installed on both sides of the two electric telescopic rods 21 away from each other, a moving frame 27 is fixedly installed below the moving plate 22, a plurality of fans 24 are fixedly installed below the moving frame 27, a filter cloth 25 is fixedly installed on the inner side of the moving frame 27, a blockage block 23 is fixedly installed on one side of the moving frame 27 through threads, and an auxiliary cleaning assembly 26 is arranged above the moving frame 27.

[0024] By adopting the above technical solutions, the staff can perform certain cleaning work on the surface of the patch placement table 5 and the circuit board positioning table assembly 4 through the cooperation of the fan 24 and the filter cloth 25 and other structures when needed, thereby reducing the difficulty of cleaning work and alleviating the labor burden of the staff.

[0025] Specifically, the auxiliary cleaning assembly 26 comprises a cleaning brush 261, a threaded block 262 and an electric lifting rod 264, the cleaning brush 261 is arranged above the circuit board positioning table assembly 4 and the patch placing table 5, the threaded block 262 is arranged above the cleaning brush 261, and the moving frame 27 and the threaded block 262 are connected through the electric lifting rod 264.

[0026] Through the above technical scheme, the staff can clean stubborn stains on the surface of the patch placing table 5 and the circuit board positioning table assembly 4 through the cooperation of the cleaning brush 261 and the electric lifting rod 264 when needed.

[0027] Specifically, the auxiliary cleaning assembly 26 further comprises a threaded sleeve 263, and the threaded sleeve 263 is fixedly installed above the cleaning brush 261 and at a position outside the threaded block 262.

[0028] Through the above technical scheme, the staff can connect or separate the cleaning brush 261 and the threaded block 262 through the threaded sleeve 263 when needed, thereby facilitating the staff to assemble and disassemble the threaded sleeve 263 and the cleaning brush 261, and reducing the labor burden of the staff.

[0029] When the production work of the semiconductor device needs to use the equipment for the mounting work, the staff starts the electric telescopic rod 21 in the two surface cleaning devices 2 on the mounting box 1, thereby driving the two moving frames 27 and other structures to move back and forth through the two moving plates 22, starting the fans 24, and under the action of the fans 24, the dust and other objects on the surface of the circuit board positioning table assembly 4 and the patch placing table 5 are sucked into the two moving frames 27 and then blocked by the two filter cloths 25, when encountering stubborn stains, the staff can start the electric lifting rod 264 in the auxiliary cleaning assembly 26, thereby driving the cleaning brush 261 to descend and contact the stains through the threaded block 262 and the threaded sleeve 263, and then moving the cleaning brush 261 through the electric telescopic rod 21, the stains brushed down are sucked into the moving frame 27 by the fan 24, after cleaning, the two electric telescopic rods 21 drive the two moving frames 27 and other structures to move to a position that does not affect the work, the staff fixes the semiconductor device on the circuit board positioning table assembly 4, places the patch on the patch placing table 5, and then operates the mounting head assembly 6 to mount the patch on the semiconductor device, thereby working, and the staff can unscrew the plug block 23 to take out the dust and other objects in the moving frame 27 when needed.

[0030] Embodiment 2

[0031] The difference between the embodiment and embodiment 1 is that the auxiliary supporting device 3 comprises a supporting plate 31, a connecting block 32, a threaded rod 33 and a supporting frame 34, the connecting block 32 is fixedly installed below the mounting box 1, the supporting plate 31 is fixedly installed below the connecting block 32, a plurality of threaded rods 33 are installed at the edge position of the supporting plate 31 through threads, and the supporting frame 34 is installed at the outer side of the supporting plate 31 through bearings.

[0032] By adopting the above technical scheme, the staff can make the equipment stable on the uneven ground through the cooperation of the threaded rods 33 and the supporting frame 34 and other structures when needed, so that the needs of work are better met, and the normal work is ensured.

[0033] Specifically, the auxiliary supporting device 3 further comprises an anti-skid rubber pad 35, and the anti-skid rubber pad 35 is fixedly installed below the supporting frame 34.

[0034] By adopting the above technical scheme, the equipment can enhance the friction between the equipment and the ground through the anti-skid rubber pad 35, so that the possibility of accidental sliding of the equipment is reduced, and the normal work is ensured.

[0035] When the equipment is on the uneven ground, the staff can rotate each threaded rod 33 in the auxiliary supporting device 3, the threaded rod 33 is threadedly connected with the supporting plate 31, the threaded rod 33 is bearing-connected with the supporting frame 34, and the inner side of each supporting frame 34 and the outer side of the supporting plate 31 are mutually attached, so that each threaded rod 33 drives each supporting frame 34 to ascend and descend, thereby adapting to the ground condition, ensuring the stability of the equipment, the anti-skid rubber pad 35 can enhance the friction between the equipment and the ground, thereby reducing the possibility of accidental sliding of the equipment, and the connecting block 32 plays a supporting role.

[0036] The structure and principle of the mounting box 1 and the structures thereon, the circuit board positioning table assembly 4, the patch placement table 5, and the patch head assembly 6 composed of a three-axis linear motor and a patch head in the utility model have been disclosed in a semiconductor device production mounting equipment with Chinese patent application No. 202420941506.1, and the working principle is that the mounting box, the three-axis linear motor, the patch head, the first linear motor and the second linear motor are all connected with the control device of the external production workshop, the patch is placed on the patch placement table, the three-axis linear motor drives the patch head to move, the patch head attaches and moves the patch to the upper part of the circuit board, the patch is installed on the circuit board, and the function of patch mounting is realized.

[0037] The utility model discloses a working principle and use flow: when the production work of semiconductor device needs to use equipment to carry out the mounting work, the staff starts the electric telescopic link 21 in two surface cleaning devices 2 on mounting box 1, and thereby through two movable plate 22 drive two movable frame 27 etc. structure to and fro movement, starts each fan 24, under the action of each fan 24, circuit board positioning table assembly 4 and the dust of the surface of paster placing table 5 are sucked into two movable frame 27, and then are blocked by two filter cloth 25, when stubborn stain is encountered, the staff can start the electric lifting rod 264 in auxiliary cleaning assembly 26, and thereby through threaded block 262 and threaded sleeve 263 drive cleaning brush 261 to descend and contact with the stain, and then through electric telescopic link 21 drive cleaning brush 261 to move, and the stain of brushing down is inhaled into movable frame 27 by fan 24, after cleaning, two electric telescopic links 21 drive two movable frame 27 etc. structure moves to the position of not affecting work, and the staff fixes semiconductor device on circuit board positioning table assembly 4, and places the paster on paster placing table 5, then operates mounting head assembly 6 and mounts the paster on semiconductor device, to work, and the staff can unscrew the plug block 23 and take out the dust etc. in movable frame 27 when needed;When the equipment is on the uneven ground, the staff can rotate each threaded rod 33 in auxiliary support device 3 respectively, and the threaded rod 33 is connected between the threaded connection of support plate 31, and the bearing connection between threaded rod 33 and support frame 34, and the inside of each support frame 34 and the outside of support plate 31 mutually adhere, so each threaded rod 33 drives each support frame 34 to lift respectively, to adapt to the ground condition, ensure the stability of equipment, and antiskid rubber pad 35 can enhance the friction between equipment and ground, to reduce the possibility of accidental sliding of equipment, and connecting block 32 plays the role of support.

[0038] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor device manufacturing mounting equipment, comprising a mounting box (1), wherein a mounting head assembly (6) is fixedly mounted on the inner side of the mounting box (1), a circuit board positioning stage assembly (4) is fixedly mounted on the inner side of the mounting box (1) and below the mounting head assembly (6), and a chip placement stage (5) is fixedly mounted on the inner side of the mounting box (1) and to one side of the circuit board positioning stage assembly (4), characterized in that: The outer side of the mounting head assembly (6) is provided with two surface cleaning devices (2), and the lower side of the mounting box (1) is fixedly provided with an auxiliary supporting device (3).

2. The semiconductor device production mounting apparatus according to claim 1, wherein: The surface cleaning device (2) comprises an electric telescopic rod (21), a moving plate (22), a blocking block (23), a fan (24), a filter cloth (25), an auxiliary cleaning assembly (26) and a moving frame (27), the upper side of the mounting box (1) is fixedly provided with two electric telescopic rods (21), the two electric telescopic rods (21) are fixedly provided with moving plates (22) on the two sides away from each other, the lower side of the moving plate (22) is fixedly provided with a moving frame (27), the lower side of the moving frame (27) is fixedly provided with a plurality of fans (24), the inner side of the moving frame (27) is fixedly provided with a filter cloth (25), one side of the moving frame (27) is provided with a blocking block (23) through screwing, and the upper side of the moving frame (27) is provided with an auxiliary cleaning assembly (26).

3. The semiconductor device production mounting apparatus according to claim 2, wherein: The auxiliary cleaning assembly (26) comprises a cleaning brush (261), a threaded block (262) and an electric lifting rod (264), the upper side of the circuit board positioning table assembly (4) and the patch placing table (5) is provided with a cleaning brush (261), the upper side of the cleaning brush (261) is provided with a threaded block (262), and the moving frame (27) and the threaded block (262) are connected through an electric lifting rod (264).

4. The semiconductor device production mounting apparatus according to claim 3, wherein: The auxiliary cleaning assembly (26) further comprises a threaded sleeve (263), and the threaded sleeve (263) is fixedly installed on the upper side of the cleaning brush (261) and outside the threaded block (262).

5. The apparatus according to claim 1, wherein: The auxiliary supporting device (3) comprises a supporting plate (31), a connecting block (32), a threaded rod (33) and a supporting frame (34), the lower side of the mounting box (1) is fixedly provided with a connecting block (32), the lower side of the connecting block (32) is fixedly provided with a supporting plate (31), the edge of the supporting plate (31) is provided with a plurality of threaded rods (33) through screwing, and the outer side of the threaded rod (33) and the outer side of the supporting plate (31) are provided with a supporting frame (34) through bearing.

6. The semiconductor device production mounting apparatus according to claim 5, wherein: The auxiliary supporting device (3) further comprises an anti-skid rubber pad (35), and the lower side of the supporting frame (34) is fixedly provided with an anti-skid rubber pad (35).

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