LED packaging structure and lamp bead

Abstract

The utility model provides an LED packaging structure and a lamp bead, the LED packaging structure comprises a substrate main body, a circuit board, a cofferdam and a filling part are arranged around the periphery of a die bonding area of the substrate main body, the circuit board is arranged between the substrate main body and the cofferdam, and the filling part covers the circuit board and the inner side surface of the cofferdam. According to the arrangement, the circuit board or the inner side face of the cofferdam is covered with the filling part, light emitted by the light-emitting chip can be reflected through the filling part, the light is prevented from being absorbed by the circuit board and the cofferdam, and light emitting loss is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED product, in particular to an LED packaging structure and a lamp bead. BACKGROUND

[0002] The existing COB lamp bead production process includes five processes of die bonding, wire bonding, cofferdam, pouring glue and light splitting. Among them, the cofferdam process is to lay a circle of dam glue around the die bonding area to prevent the pouring of the sealing glue. The cofferdam process of the existing cofferdam process has a single dam angle, which generally presents an arch shape (round on top and straight on bottom), and the light reflection angle is small, which affects the light efficiency. Moreover, the dam glue has high light absorption, and since the BT material has low reflectivity, it is connected to the substrate in gray, which also absorbs light, so the light source has a certain light loss, which affects the light efficiency of the lamp bead. CONTENT OF THE UTILITY MODEL

[0003] Therefore, the present application provides an LED packaging structure and a lamp bead, which can reduce the light loss of the light source and improve the light efficiency.

[0004] In order to achieve the above purpose, the present application provides the following technical scheme:

[0005] An LED packaging structure, comprising a substrate main body, a circuit board, a cofferdam and a filling part are arranged around the outer periphery of the die bonding area of the substrate main body, the circuit board is arranged between the substrate main body and the cofferdam, the filling part covers the inner side of the circuit board and the cofferdam, and the reflectivity of the filling part to light is greater than that of the cofferdam and the circuit board to light.

[0006] Optionally, the circuit board protrudes in the direction close to the die bonding area relative to the inner side of the cofferdam to form a stepped structure on the inner side of the cofferdam, and the filling part covers the stepped structure.

[0007] Optionally, the width of the stepped structure is 0.05-0.5mm.

[0008] Optionally, the distance between the inner side of the circuit board and the die bonding area of the substrate main body is 0.5-1mm.

[0009] Optionally, the height of the inner side of the filling part gradually increases in the direction away from the die bonding area of the substrate main body.

[0010] Optionally, the included angle formed by the inner side of the filling part and the die bonding area of the substrate main body is 120-160 degrees.

[0011] Optionally, the height of the filling part is less than the height of the cofferdam.

[0012] Optionally, the height difference between the filling part and the cofferdam is 0.1-0.2mm.

[0013] Optionally, the filling part is white glue, and the viscosity of the white glue is 2000-4000 Pa.s.

[0014] A lamp bead comprising the LED packaging structure.

[0015] The LED packaging structure and the lamp bead provided by the application have the following advantages: the circuit board is arranged between the cofferdam and the substrate main body, and the filling part is arranged on the inner side of the circuit board and the cofferdam, so that the filling part covers the inner side of the circuit board and the cofferdam. In this way, the light emitted by the light-emitting chip is reflected by the filling part, and the light absorption of the circuit board and the cofferdam is avoided, and the light loss is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the provided drawings.

[0017] Figure 1 A cross-sectional view of the LED packaging structure shown in some embodiments.

[0018] In the figure: 1, substrate main body; 2, circuit board; 3, cofferdam; 4, filling part; 5, light-emitting chip; 6, fluorescent glue. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0020] As Figure 1 shown, the embodiment of the present application provides an LED packaging structure, which comprises a substrate main body 1, and the substrate main body 1 has opposite first and second side surfaces, for example, Figure 1 The upper surface of the substrate main body 1 is the first side surface, and the lower surface of the substrate main body 1 is the second side surface. The middle part of the first side surface of the substrate main body 1 is arranged as a die bonding area for mounting a light-emitting chip 5.

[0021] The first side of the substrate body 1 is provided with a circuit board 2, a cofferdam 3 and a filling part 4, all of which are arranged around the outer periphery of the die bonding area and around the outer periphery of the light emitting chip 5 after packaging, for example, the circuit board 2, the cofferdam 3 and the filling part 4 are all arranged in a ring shape. Specifically, the substrate body 1 is made of an aluminum plate, the circuit board 2 is made of a BT plate, and the cofferdam 3 is formed by curing the dam glue. During packaging, the fluorescent glue 6 is poured on the inner side of the cofferdam 3, and the light emitting chip 5 and the filling part 4 inside are covered by the fluorescent glue 6 to form a lamp bead product.

[0022] The circuit board 2 is arranged between the cofferdam 3 and the substrate body 1, and the filling part 4 is arranged on the inner side of the circuit board 2 and the cofferdam 3, so that the filling part 4 covers the inner side of the circuit board 2 and the cofferdam 3, and the reflectivity of the filling part to light is greater than that of the cofferdam and the circuit board. Here, the filling part 4 can cover part of the inner side of the circuit board 2 or the cofferdam 3, or it can cover the entire inner side of the circuit board 2 or the cofferdam 3. In this way, by covering the inner side of the circuit board 2 or the cofferdam 3 with the filling part 4, the light emitted by the light emitting chip 5 can be reflected by the filling part 4, thereby avoiding the absorption of light by the circuit board 2 and the cofferdam 3 and reducing light loss.

[0023] During packaging, the circuit board 2 is first packaged on the first side of the substrate body 1, then the cofferdam 3 is packaged on the circuit board 2 so that the cofferdam 3 covers the circuit board 2, and finally the filling part 4 is arranged on the inner side of the cofferdam 3 and the circuit board 2 to cover the inner side of the cofferdam 3 and the circuit board 2. Among them, the filling part 4 can be arranged as a high-reflectivity glue, which is coated on the inner side of the circuit board 2 and the cofferdam 3 to form the filling part 4; the filling part 4 can also be arranged as a high-reflectivity solid part, which is installed on the inner side of the circuit board 2 and the cofferdam 3, and the inner side of the solid part is arranged as a high-reflectivity surface to form the filling part 4. Here, the filling part 4 is preferably white glue with a viscosity of 2000-4000 Pa.s, which is more conducive to the formation of the filling part 4. In this way, since part or all of the filling part 4 has high reflectivity, i.e. the reflectivity of the filling part 4 to light is greater than that of the cofferdam 3 and the circuit board 2, the light emitting efficiency of the light emitting chip 5 can be improved by the filling part 4, to a certain extent, to weaken the absorption of light by the cofferdam 3 and the circuit board 2, thereby improving the light efficiency of the product.

[0024] In some embodiments, the inner side of the cofferdam 3 is larger than the inner side of the circuit board 2, i.e. the inner side of the circuit board 2 protrudes in the direction close to the die bonding area relative to the inner side of the cofferdam 3, to form a stepped structure on the inner side of the cofferdam 3. During packaging, dam glue can be arranged on the side of the circuit board 2 away from the substrate body 1, and the dam glue is located on the outer side of the inner side of the circuit board 2, so that the cofferdam 3 formed by the dam glue is located on the outer periphery of the inner side of the circuit board 2, thereby forming a stepped structure on the inner side of the cofferdam 3.

[0025] The filling part 4 covers the step structure, that is, the filling part 4 covers not only the inner side of the circuit board 2 but also the part of the inner side of the circuit board 2 protruding relative to the cofferdam 3, so that the filling part 4 covers the connection between the circuit board 2 and the cofferdam and covers the connection between the circuit board 2 and the substrate main body 1, which is conducive to further weakening the light absorption of the circuit board 2 and the cofferdam 3 and improving the connection strength of the substrate main body 1, the circuit board 2 and the cofferdam 3.

[0026] Of course, in other embodiments, the inner side of the cofferdam 3 and the inner side of the colloid can be flush, or the inner side of the cofferdam 3 protrudes relative to the inner side of the circuit board 2 in the direction close to the die bonding area. Here, it is preferred that the inner side of the circuit board 2 protrudes relative to the inner side of the cofferdam 3 in the direction close to the die bonding area, which is easier to process and has a more stable structure than other ways.

[0027] Specifically, the width of the step structure is set to 0.05-0.5 mm, that is, the distance of the inner side of the circuit board 2 protruding relative to the cofferdam 3 is 0.05-0.5 mm. During packaging, the colloid can be coated on the step surface of the step structure, and the colloid flows downward to the first side of the substrate main body 1 by its own fluidity, so that the cured colloid covers the step structure. By designing the size of the step structure, the amount of colloid used can be saved, and the structural strength can be improved.

[0028] The distance between the inner side of the circuit board 2 and the die bonding area of the substrate main body 1 is 0.5-1 mm, that is, the distance between the inner side of the circuit board 2 and the closest light emitting chip 5 is 0.5-1 mm, so that by keeping a distance between the circuit board 2 and the die bonding area, the coated colloid can be prevented from flowing downward to the first side of the substrate main body 1 and covering the light emitting chip 5, so that the filling part 4 after curing and forming will not cover the light emitting chip 5, which is conducive to improving the light spot quality of the product.

[0029] In some embodiments, the inner side of the filling part 4 gradually increases in the direction away from the die bonding area of the substrate main body 1, so that the inner side of the filling part 4 and the substrate main body 1 form a gradually expanding bowl shape, which is conducive to improving the effective light output of the internal light emitting chip 5.

[0030] As shown in Figure 1 The inner side of the filling part 4 and the die bonding area of the substrate main body 1 form an angle A of 120-160 degrees, that is, the inner side of the filling part 4 is set as an inclined surface and forms an angle A with the die bonding area on the first side of the substrate main body 1, and by designing the angle A, the light emitted by the light emitting chip 5 can be reflected to a greater extent, thereby improving the light efficiency.

[0031] In some preferred embodiments, the height of the filling part 4 is less than the height of the cofferdam 3, for example, the height difference between the filling part 4 and the cofferdam 3 is set to 0.1-0.2 mm. In this way, the forming process of the filling part 4 is facilitated, and the appearance and stability of the structure are improved.

[0032] The embodiment of the present application provides a lamp bead comprising the LED packaging structure in the above embodiment. In this way, by covering the inner side of the circuit board 2 or the cofferdam 3 with the filling part 4, the light emitted by the light emitting chip 5 can be reflected by the filling part 4, thereby avoiding the light absorption of the circuit board 2 and the cofferdam 3 and reducing the light loss.

[0033] The basic principle of the present application is described above in combination with specific embodiments, but it should be pointed out that the advantages, advantages, effects and the like mentioned in the present application are only examples and not limitations, and these advantages, advantages, effects and the like cannot be considered as the necessary possession of each embodiment of the present application. In addition, the above disclosed specific details are only for the purpose of example and for the purpose of understanding, and are not limited to the present application, and the above details do not limit the present application to be realized by the above specific details.

[0034] The block diagram of the device, apparatus, equipment, system involved in the present application is only an illustrative example and is not intended to require or imply the connection, arrangement, configuration shown in the block diagram. As those skilled in the art will recognize, these devices, apparatus, equipment, system can be connected, arranged, configured in any way. Words such as "include", "contain", "have" and the like are open-ended words, which mean "include but not limited to", and can be used interchangeably. The words "or" and "and" used herein mean the word "and / or", and can be used interchangeably unless the context clearly indicates otherwise. The word "such as" used herein means the phrase "such as but not limited to", and can be used interchangeably.

[0035] It should also be noted that in the device, equipment and method of the present application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombination should be considered as equivalent solutions of the present application.

[0036] The above description of the disclosed aspects is provided so that any person skilled in the art can make or use the present application. Various modifications to these aspects will be apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but is intended to be in accordance with the widest scope consistent with the principles and novel features disclosed herein.

[0037] It should be understood that the limiting words "first", "second", "third", "fourth", "fifth" and "sixth" used in the embodiments of the present application are only used for more clearly explaining the technical solutions, and cannot be used to limit the protection scope of the present application.

[0038] The above description is given for the purpose of illustration and description. Furthermore, this description does not intend to limit the embodiments of the present application to the forms disclosed herein. Although several example aspects and embodiments have been discussed above, those of ordinary skill in the art will recognize certain variations, modifications, changes, additions, and sub-combinations thereof.

Claims

1. An LED package structure, characterized in that, The LED package structure comprises a substrate body (1), an outer periphery of a die bonding area of the substrate body (1) is provided with a circuit board (2), a cofferdam (3) and a filling part (4), the circuit board (2) is arranged between the substrate body (1) and the cofferdam (3), the filling part (4) covers inner side surfaces of the circuit board (2) and the cofferdam (3), and the filling part (4) has a light reflectivity greater than that of the cofferdam (3) and the circuit board (2).

2. The LED package structure of claim 1, wherein, The circuit board (2) is convex relative to an inner side surface of the cofferdam (3) in a direction close to the die bonding area, so as to form a stepped structure on the inner side of the cofferdam (3), and the filling part (4) covers the stepped structure.

3. The LED package structure of claim 2, wherein, The width of the stepped structure is 0.05-0.5 mm.

4. The LED package structure of claim 1, wherein, The distance between an inner side surface of the circuit board (2) and the die bonding area of the substrate body (1) is 0.5-1 mm.

5. The LED package structure of claim 1, wherein, The inner side surface height of the filling part (4) gradually increases in a direction away from the die bonding area of the substrate body (1).

6. The LED package structure of claim 5, wherein, The included angle formed between the inner side surface of the filling part (4) and the die bonding area of the substrate body (1) is 120-160 degrees.

7. The LED package structure of claim 1, wherein, The height of the filling part (4) is less than the height of the cofferdam (3).

8. The LED package structure of claim 7, wherein, The height difference between the filling part (4) and the cofferdam (3) is 0.1-0.2 mm.

9. The LED package structure of claim 1, wherein, The filling part (4) is white glue, and the viscosity of the white glue is 2000-4000 Pa.s.

10. A lamp bead, characterized by The LED package structure comprises a substrate body (1), an outer periphery of a die bonding area of the substrate body (1) is provided with a circuit board (2), a cofferdam (3) and a filling part (4), the circuit board (2) is arranged between the substrate body (1) and the cofferdam (3), the filling part (4) covers inner side surfaces of the circuit board (2) and the cofferdam (3), and the filling part (4) has a light reflectivity greater than that of the cofferdam (3) and the circuit board (2).

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