Cleaning equipment of semiconductor manufacturing equipment

Abstract

The utility model discloses cleaning equipment of semiconductor manufacturing equipment, which relates to the technical field of cleaning equipment, and comprises a shell, two side surfaces of the shell are fixedly communicated with pick-and-place channels, the two pick-and-place channels are hinged with bin doors and a control base, the two pick-and-place channels are fixedly connected in the shell, and an ultrasonic cleaner is mounted on the control base. Cleaning liquid is arranged in the ultrasonic cleaner, and the storage vessel is arranged above the control base. The ultrasonic cleaning device is reasonable in design structure, can penetrate into a fine structure on the surface of a semiconductor through the ultrasonic cleaning technology, greatly improves thoroughness and uniformity of cleaning, ensures effective transmission of ultrasonic energy through the cage-shaped design of the storage vessel and the through holes, meanwhile allows cleaning liquid to flow circularly, and improves cleaning efficiency. The cleaning effect is further enhanced, the cleaning efficiency of the semiconductor manufacturing equipment is improved, higher cleaning quality is guaranteed, and the yield of final products can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a cleaning equipment technical field, concretely is a kind of cleaning equipment of semiconductor manufacturing equipment. BACKGROUND

[0002] Semiconductor has extensive application on electronic product, for example, the core unit in computer, mobile phone or digital recorder is closely related with semiconductor, and semiconductor material is easy to remain oil stain on surface after being manufactured, thus semiconductor equipment needs to be cleaned.

[0003] Among them, the Chinese patent with publication number CN220821491U discloses a kind of cleaning equipment of semiconductor manufacturing equipment, it is placed to the flush box by the semiconductor needing to be cleaned, by starting electric telescopic rod, flush box can be pushed to the below of shower head, by starting water pump, the cleaning liquid in cleaning water tank is extracted, by water outlet pipe, flush head and shower head, the semiconductor in cleaning box can be started to be cleaned comprehensively, by electromagnetic regulating valve, water pressure can be adjusted, the water speed and water flow of controllable cleaning water flow are entered, cleaning speed is accelerated, cleaning quality is guaranteed, cleaning is more comprehensive, cleaning efficiency is improved, cleaning effect is guaranteed, quality quality is guaranteed.

[0004] The above scheme uses the way of shower to clean semiconductor, although the flow rate and flow of water can be controlled by adjusting valve, but there are still some blind areas that cannot be directly flushed, and the flushing liquid will be retained on the surface of semiconductor after flushing and cleaning, causing new pollution due to water residue. Therefore, we provide a kind of cleaning equipment of semiconductor manufacturing equipment to solve the above problems. UTILITY MODEL CONTENTS

[0005] I) technical problems solved

[0006] The utility model aims at making up for the deficiency of prior art, and provides a kind of cleaning equipment of semiconductor manufacturing equipment.

[0007] II) technical scheme

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a kind of cleaning equipment of semiconductor manufacturing equipment, comprising:

[0009] The shell is fixedly connected with a taking and placing channel on both sides, and a warehouse door is hinged on the taking and placing channel.

[0010] The control base is fixedly connected in the shell, and an ultrasonic cleaner is installed on the control base, and a cleaning liquid is arranged in the ultrasonic cleaner.

[0011] The storage dish is arranged above the control base, and the control base is provided with a moving assembly for moving the storage dish and a height adjusting assembly for lifting the storage dish.

[0012] The drying assembly is arranged on the storage dish, moves synchronously with the storage dish, and blows hot air to dry the semiconductor in the storage dish.

[0013] Further, the shell is inlaid with an observation window, and the upper surface of the shell is fixedly connected with an exhaust hood, and the exhaust hood is fixedly connected with an exhaust pipe.

[0014] Further, the drying assembly comprises a wind collecting box, an electric heating rod is installed in the wind collecting box, the upper surface of the wind collecting box is fixedly connected with an air supply pipe, and the bottom surface of the wind collecting box is provided with an exhaust hole.

[0015] Further, the moving assembly comprises a motor installed on the control base, the control base is provided with a first sliding groove, the output shaft of the motor is provided with a screw rod, the screw rod is threadedly connected with a first sliding block, the first sliding block is slidingly connected in the first sliding groove, and the first sliding block is located below the wind collecting box.

[0016] Further, the height adjusting assembly comprises an electric push rod installed on the first sliding block, the two side surfaces of the wind collecting box are fixedly connected with connecting plates, the telescopic end of the electric push rod is fixedly connected with the connecting plates, the bottom surface of the connecting plate is fixedly connected with a connecting plate, and the bottom end of the connecting plate is fixedly connected with the storage dish.

[0017] Further, the control base is provided with a second sliding groove, a guide rod is fixedly connected in the second sliding groove, a second sliding block is slidingly connected on the guide rod, a spring telescopic rod is installed on the second sliding block, and the telescopic end of the spring telescopic rod is fixedly connected with the connecting plate.

[0018] Further, the ultrasonic cleaner is provided with a first collecting box and a second collecting box on the two sides respectively.

[0019] III) Beneficial effects:

[0020] Compared with the prior art, the cleaning device for semiconductor manufacturing equipment has the following beneficial effects:

[0021] Firstly, the ultrasonic cleaning technology is arranged, which can deeply clean the internal structure of the semiconductor surface, greatly improve the completeness and uniformity of cleaning, and ensure the effective transmission of ultrasonic energy through the cage design and through hole of the storage dish, and allow the cleaning liquid to circulate, further enhance the cleaning effect, not only improve the cleaning efficiency of the semiconductor manufacturing equipment, but also ensure higher cleaning quality, which helps to improve the yield of the final product.

[0022] The utility model discloses a drying assembly is set up, combine electric heating rod and nitrogen delivery system, realized the quick and gentle drying treatment of the semiconductor after cleaning, the use of high temperature nitrogen not only accelerated the evaporation of moisture, reduced the secondary pollution risk caused by water residue, and nitrogen is inert gas, can also play the protection effect in the drying process, avoid the oxidation or other chemical reaction that semiconductor can encounter in the exposure to air, thereby ensure the physical and chemical stability of semiconductor material. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is the perspective view of the utility model;

[0024] Figure 2 It is the perspective view of the utility model after removing the shell;

[0025] Figure 3 It is the left view of the utility model;

[0026] Figure 4 It is the structure diagram of drying assembly in the utility model.

[0027] In the drawing: 1, shell, 2, take and place passageway, 3, bin door, 4, observation window, 5, exhaust hood, 6, exhaust pipe, 7, control base, 8, ultrasonic cleaner, 9, motor, 10, first sliding slot, 11, screw rod, 12, first sliding block, 13, electric push rod, 14, connecting plate, 15, wind collecting box, 16, air supply pipe, 17, first collection box, 18, second collection box, 19, second sliding slot, 20, guide rod, 21, spring telescopic rod, 22, storage dish, 23, connecting block, 24, second sliding block, 25, electric heating rod, 26, exhaust hole. DETAILED DESCRIPTION

[0028] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0029] As Figures 1-4 Indicated, the utility model provides a kind of technical scheme: a kind of semiconductor manufacturing equipment's cleaning equipment, including shell 1, control base 7, storage dish 22 and drying assembly.

[0030] The two side surfaces of shell 1 are fixedly connected with take and place passageway 2, and bin door 3 is hinged on the two take and place passageways 2, the feeding and discharging of semiconductor are completed through bin door 3 on take and place passageway 2, so that semiconductor is cleaned and dried in the closed space in shell 1.

[0031] The control base 7 is fixedly connected in the shell 1, and an ultrasonic cleaner 8 is installed on the control base 7, and cleaning liquid is arranged in the ultrasonic cleaner 8. The ultrasonic cleaner 8 is a structure known in the art, and the cleaning liquid is used to clean the semiconductor by ultrasonic waves, thereby improving the cleaning effect on the semiconductor.

[0032] The storage dish 22 is arranged above the control base 7, and a moving assembly for moving the storage dish 22 and a height adjusting assembly for lifting the storage dish 22 are arranged on the control base 7. The storage dish 22 is a cage-shaped structure with through holes on the outer surface, and the semiconductor can be taken and placed through the opening at the top of the storage dish 22.

[0033] The drying assembly is arranged on the storage dish 22 and moves synchronously with the storage dish 22, and blows hot air to dry the semiconductor in the storage dish 22.

[0034] In this embodiment, the drying assembly includes a wind collecting box 15, an electric heating rod 25 is installed in the wind collecting box 15, a blast pipe 16 is fixedly connected to the upper surface of the wind collecting box 15, and an exhaust hole 26 is arranged on the bottom surface of the wind collecting box 15. The blast pipe 16 is a corrugated pipe, so that the wind collecting box 15 can move horizontally and vertically without being hindered. External nitrogen gas can be delivered to the inside of the wind collecting box 15 through the blast pipe 16, and heated under the action of the electric heating rod 25 to form high-temperature nitrogen gas, which is then sprayed out from the exhaust hole 26.

[0035] In this embodiment, the moving assembly includes a motor 9 installed on the control base 7, a first sliding groove 10 is arranged on the control base 7, a screw rod 11 is installed on the output shaft of the motor 9, a first sliding block 12 is threadedly connected to the screw rod 11, and the first sliding block 12 is slidably connected in the first sliding groove 10. The first sliding block 12 is located below the wind collecting box 15.

[0036] The output shaft of the motor 9 drives the screw rod 11 to rotate in the first sliding groove 10, so that the first sliding block 12 moves in the first sliding groove 10.

[0037] In this embodiment, the height adjusting assembly includes an electric push rod 13 installed on the first sliding block 12, and connecting plates 14 are fixedly connected to the two side surfaces of the wind collecting box 15. The telescopic end of the electric push rod 13 is fixedly connected to the connecting plates 14. The bottom surface of each connecting plate 14 is fixedly connected to a connecting block 23, and the bottom end of the connecting block 23 is fixedly connected to the storage dish 22.

[0038] When the first sliding block 12 moves, the storage dish 22 and the drying assembly can be driven to move synchronously by the electric push rod 13 and the connecting plate 14, and the extension end of the electric push rod 13 can also drive the storage dish 22 to move up and down, so that the semiconductor stored on the storage dish 22 can be extended into the ultrasonic cleaner 8 for cleaning, and the storage dish 22 can be taken out of the ultrasonic cleaner 8 after cleaning, at this time, the two sides of the ultrasonic cleaner 8 are divided into a feeding position and a post-cleaning discharging position.

[0039] The control base 7 is provided with a second sliding groove 19, the second sliding groove 19 is fixedly connected with a guide rod 20, the guide rod 20 is slidably connected with a second sliding block 24, the second sliding block 24 is installed with a spring telescopic rod 21, and the extension end of the spring telescopic rod 21 is fixedly connected to the connecting plate 14, the connecting plate 14 is assisted and supported by the spring telescopic rod 21, and the spring telescopic rod 21 drives the second sliding block 24 to slide synchronously on the guide rod 20, so that the wind collecting box 15 can keep stability during movement.

[0040] The ultrasonic cleaner 8 is provided with a first collecting box 17 and a second collecting box 18 on the two sides, respectively, the first collecting box 17 is used for collecting impurities blown by the semiconductor in the ultrasonic cleaner 8 before cleaning, and the second collecting box 18 is used for collecting liquid dropped by the semiconductor in the ultrasonic cleaner 8 after drying.

[0041] The observation window 4 is inlaid on the shell 1, the working state of the structure in the shell 1 can be observed through the observation window 4, the suction hood 5 is fixedly connected to the upper surface of the shell 1, the suction pipe 6 is fixedly connected to the suction hood 5, nitrogen gas can affect human body when the concentration exceeds a certain value, the nitrogen gas in the shell 1 can be extracted through the suction hood 5 and the suction pipe 6.

[0042] It should be noted that in this paper, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model; the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance, in addition, unless otherwise explicitly specified and limited, the terms "fixed", "mounted", "connected", "connected" should be understood broadly, for example, "mounted" can be fixedly connected, or can be detachably connected, or integrally connected; "connected" can be mechanical connection, or electrical connection; "connected" can be directly connected, or indirectly connected through an intermediate medium, or the communication between two elements. For ordinary skilled persons in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0043] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A cleaning apparatus for semiconductor manufacturing equipment, characterized by, Include: The shell (1), both sides of the shell (1) are fixedly connected with the taking and placing channel (2), and the two taking and placing channels (2) are hingedly connected with the door (3); The control base (7) is fixedly connected in the shell (1), the ultrasonic cleaner (8) is installed on the control base (7), and the ultrasonic cleaner (8) is provided with a cleaning liquid; The storage dish (22) is arranged above the control base (7), the control base (7) is provided with a moving assembly for moving the storage dish (22) and a height adjusting assembly for lifting the storage dish (22); The drying assembly is arranged on the storage dish (22), moves synchronously with the storage dish (22), and blows hot air to dry the semiconductor in the storage dish (22).

2. The cleaning apparatus for semiconductor manufacturing equipment according to claim 1, wherein: The shell (1) is inlaid with an observation window (4), and the upper surface of the shell (1) is fixedly connected with an exhaust hood (5), and the exhaust hood (5) is fixedly connected with an exhaust pipe (6).

3. The cleaning apparatus of claim 1, wherein: The drying assembly includes a wind collecting box (15), the wind collecting box (15) is provided with an electric heating rod (25), the upper surface of the wind collecting box (15) is fixedly connected with a air supply pipe (16), and the bottom surface of the wind collecting box (15) is provided with an exhaust hole (26).

4. The cleaning apparatus of claim 3, wherein: The moving assembly includes a motor (9) installed on the control base (7), the control base (7) is provided with a first sliding groove (10), the output shaft of the motor (9) is provided with a screw rod (11), the screw rod (11) is threadedly connected with a first sliding block (12), the first sliding block (12) is slidably connected in the first sliding groove (10), and the first sliding block (12) is located below the wind collecting box (15).

5. The cleaning apparatus of claim 4, wherein: The height adjusting assembly includes an electric push rod (13) installed on the first sliding block (12), both sides of the wind collecting box (15) are fixedly connected with a connecting plate (14), the telescopic end of the electric push rod (13) is fixedly connected with the connecting plate (14), the bottom surface of the connecting plate (14) is fixedly connected with a connecting block (23), and the bottom end of the connecting block (23) is fixedly connected with the storage dish (22).

6. The cleaning apparatus of semiconductor manufacturing equipment according to claim 5, wherein: The control base (7) is provided with a second sliding groove (19), the second sliding groove (19) is fixedly connected with a guide rod (20), the guide rod (20) is slidably connected with a second sliding block (24), the second sliding block (24) is provided with a spring telescopic rod (21), and the telescopic end of the spring telescopic rod (21) is fixedly connected with the connecting plate (14).

7. The cleaning apparatus of claim 1, wherein: The ultrasonic cleaner (8) is provided with a first collecting box (17) and a second collecting box (18) on both sides.

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