Bearing device and test equipment

Abstract

The utility model relates to a bearing device and test equipment. The bearing device comprises a suction cup which is provided with an adsorption face and a heat conduction face deviating from the adsorption face, the adsorption face is used for adsorbing elements, and the heat conduction face comprises a plurality of temperature control areas and heat insulation grooves located between every two adjacent temperature control areas; the cooling disc is arranged on one side of the sucker with the heat-conducting surface; the plurality of heating elements are arranged between the suction disc and the cooling disc, all the heating elements are divided into a plurality of groups, each group of heating elements comprises at least one heating element, and each group of heating elements are positioned in each temperature control area in a one-to-one correspondence manner; the first electric connecting wires are arranged in the heat insulation groove, one end of each first electric connecting wire is connected with the corresponding heating piece, and the other end of each first electric connecting wire penetrates through the peripheral side face of the suction cup.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to a bearing device and test equipment. BACKGROUND

[0002] After the wafer is manufactured, it needs to be tested. In order to obtain the performance data of the wafer under different working environments, the wafer is adsorbed and fixed by using a chuck during testing, and the wafer is heated or cooled by using the chuck, so as to realize three-temperature (low temperature, normal temperature and high temperature) testing of the wafer.

[0003] However, the chuck has a cooling channel for circulation of a cooling medium inside. Since the temperature difference of each region of the cooling channel is relatively large, and the heat dissipation efficiency of each region of the chuck is different, the temperature of the surface of the chuck is not uniform, which adversely affects the temperature control of the wafer. CONTENT OF THE UTILITY MODEL

[0004] Therefore, it is necessary to provide a bearing device and test equipment capable of improving the temperature uniformity of the surface of the chuck in view of the above problems.

[0005] A bearing device comprises:

[0006] A chuck has an adsorption surface and a heat conduction surface opposite to the adsorption surface, the adsorption surface is used for adsorbing an element, and the heat conduction surface comprises a plurality of temperature control regions and a heat insulation groove between each adjacent two temperature control regions.

[0007] A cooling disc is arranged on one side of the chuck having the heat conduction surface.

[0008] A plurality of heating elements are arranged between the chuck and the cooling disc, and all the heating elements are divided into a plurality of groups, each group of the heating elements comprises at least one heating element, and each group of the heating elements is correspondingly arranged in each temperature control region.

[0009] A plurality of first electric connection lines are arranged in the heat insulation groove, one end of each first electric connection line is connected with a corresponding heating element, and the other end penetrates through the peripheral surface of the chuck.

[0010] In some embodiments, the bearing device further comprises a plurality of temperature measuring elements for detecting temperature, and at least one temperature measuring element is arranged in each temperature control region.

[0011] In some embodiments, each temperature control region is provided with a mounting hole, and each temperature measuring element is arranged in a corresponding mounting hole.

[0012] In some embodiments, each temperature measuring element is a temperature sensor.

[0013] In some embodiments, the bearing device further comprises a plurality of second electric connection lines, at least part of the second electric connection lines are arranged in the heat insulation groove, one end of each of the second electric connection lines is connected with the corresponding temperature measuring element, and the other end penetrates through the circumferential surface of the suction disc.

[0014] In some embodiments, a plurality of separation protrusions are arranged on the heat conduction surface, and each of the separation protrusions divides the heat conduction surface into a plurality of temperature control areas.

[0015] In some embodiments, the heat insulation groove is arranged on each of the separation protrusions, and each of the heat insulation grooves extends along the longitudinal direction of the corresponding separation protrusion.

[0016] In some embodiments, a ring-shaped protrusion is arranged on the circumferential edge of the heat conduction surface, each of the separation protrusions is arranged inside the ring-shaped protrusion, both ends of each of the separation protrusions are connected with the ring-shaped protrusion, and the heat insulation groove penetrates through the ring-shaped protrusion at the connection between the corresponding separation protrusion and the ring-shaped protrusion.

[0017] In some embodiments, the cooling disc has a cooling flow channel, and a liquid inlet and a liquid outlet which are in communication with the cooling flow channel, the liquid inlet is used for inputting cooling medium into the cooling flow channel, and the liquid outlet is used for discharging the cooling medium in the cooling flow channel.

[0018] The power of the heating element arranged at the liquid inlet is greater than the power of the heating element arranged at other positions.

[0019] A test device comprises a material supply device, a carrying device, a test device, and the bearing device as described in any one of the above embodiments, the carrying device is used for transferring elements between the material supply device and the adsorption surface of the suction disc, and the test device is used for testing the elements on the adsorption surface.

[0020] The above bearing device and test device divide the heat conduction surface of the suction disc into different temperature control areas, and arrange a group of heating elements in each of the temperature control areas, so that different groups of heating elements can be controlled to heat individually, the temperature of each of the temperature control areas of the heat conduction surface is kept uniform, and the temperature of the adsorption surface of the suction disc is kept uniform. Since each of the first electric connection lines penetrates through the circumferential surface of the suction disc, compared with the scheme that the first electric connection lines penetrate through the cooling disc in the axial direction, the through hole for the first electric connection lines to penetrate through the cooling disc is not needed, so that the design requirement of the cooling flow channel inside the cooling disc is greatly reduced, the cooling flow channel inside the cooling disc is designed more optimally, and the cooling effect of the cooling disc is greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 FIG. 1 is a structural schematic diagram of a bearing device according to an embodiment of the present application;

[0022] Figure 2 Fig. 2 is a perspective view of the bearing device shown in Fig. 1 ; Figure 1 Fig. 3 is an exploded structural schematic view of the bearing device shown in Fig. 1 ;

[0023] Figure 3 Fig. 4 is a bottom view of the bearing device shown in Fig. 1 (omitting the cooling disc) ; Figure 1 Fig. 5 is a bottom view of the suction disc of the bearing device shown in Fig. 1 ;

[0024] Figure 4 Fig. 6 is a structural schematic view of the suction disc of the bearing device shown in Fig. 1. Figure 1

[0025] Figure 5 Figure 1 DETAILED DESCRIPTION

[0026] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application can be practiced without using some or all of these specific details, and that the present application is not limited to the specific embodiments disclosed below.

[0027] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely used for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0028] In addition, the terms "first", "second", etc. are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0029] ​​​In the present application, unless specifically defined otherwise, the terms "mounting", "connected", "connecting", "fixed", and "fixedly" should be construed as broad terms, for example, can be fixed connection, can also be detachable connection, or integrated; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship of two elements, unless specifically defined otherwise. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0030] In the present application, unless specifically defined otherwise, the first feature is "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0031] It should be noted that when an element is referred to as "fixed to" or "provided to" another element, it can be directly on another element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and are not the only implementation.

[0032] Please refer to Figures 1 to 3 The present application provides a bearing device, comprising a suction disc 10, a cooling disc 20 and a plurality of heating elements 30. The suction disc 10 has an adsorption surface 11 and a heat conduction surface 12, and the adsorption surface 11 and the heat conduction surface 12 are away from each other. The adsorption surface 11 is used to adsorb elements to be tested. The heat conduction surface 12 comprises a plurality of temperature control areas 121 and a heat insulation groove 125 between each adjacent two temperature control areas 121. The cooling disc 20 is arranged on the side of the suction disc 10 with the heat conduction surface 12, so as to cool the suction disc 10 by the cooling disc 20. The plurality of heating elements 30 are arranged between the suction disc 10 and the cooling disc 20. All the heating elements 30 are divided into a plurality of groups, and each group of heating elements 30 comprises at least one heating element 30. Each group of heating elements 30 corresponds to each temperature control area 121, so that each group of heating elements 30 heats the temperature control area 121 where it is located. It should be noted that the element can be a wafer or other products to be tested, which is not limited herein. For the sake of understanding, the element is taken as a wafer for example in the present application.

[0033] In this way, by dividing the heat-conducting surface 12 of the chuck 10 into temperature control areas 121 and arranging a set of heating elements 30 in each temperature control area 121, the temperature of each temperature control area 121 of the heat-conducting surface 12 can be controlled individually, and the temperature of the adsorbing surface 11 of the chuck 10 can be ensured to be uniform. For example, when the temperature of a certain temperature control area 121 is too low, the heating elements 30 in the temperature control area 121 are controlled to increase the heat generation, so that the temperature of the temperature control area 121 is increased to the required temperature; when the temperature of a certain temperature control area 121 is too high, the heating elements 30 in the temperature control area 121 are controlled to reduce the heat generation, so that the temperature of the temperature control area 121 is reduced to the required temperature.

[0034] It should be noted that, in actual test operations, there are only some local areas of the wafer to be tested, and only the tested areas will generate heat, while the other areas will not generate heat. Therefore, when only some local areas of the wafer are tested, the heating elements 30 in the temperature control area 121 corresponding to the tested area can be controlled to reduce the heat generation, so that the tested area of the wafer is locally cooled, and the temperature of the tested area of the wafer is prevented from being too high.

[0035] Specifically, in the embodiment shown in Figure 2 and Figure 3 , a set of heating elements 30 includes one heating element 30, i.e., one temperature control area 121 is provided with one heating element 30. Of course, in other embodiments, a set of heating elements 30 can include multiple (i.e., two or more) heating elements 30, i.e., one temperature control area 121 is provided with multiple heating elements 30, which is not specially limited herein.

[0036] Please refer to Figures 2 to 5In some embodiments, the bearing device further comprises a plurality of temperature measuring elements 40 for detecting temperature, and each temperature control area 121 is provided with at least one temperature measuring element 40. Further, the bearing device further comprises a controller in communication connection with each heating element 30 and each temperature measuring element 40. In the same temperature control area 121, the controller is used to control the heating element 30 to heat according to the detection result of the temperature measuring element 40. In this way, the temperature of the temperature control area 121 where each temperature measuring element 40 is located is detected in real time by the temperature measuring element 40, so that the heating element 30 in the same temperature control area 121 is controlled to heat according to the detection result of the temperature measuring element 40, greatly improving the temperature control accuracy of each temperature control area 121. For example, when a certain temperature measuring element 40 detects that the temperature of the temperature control area 121 where it is located is too high, the controller controls the heating element 30 in the temperature control area 121 to reduce the heat generation, so that the temperature of the temperature control area 121 is reduced to the required temperature; when a certain temperature measuring element 40 detects that the temperature of the temperature control area 121 where it is located is too low, the controller controls the heating element 30 in the temperature control area 121 to increase the heat generation, so that the temperature of the temperature control area 121 is increased to the required temperature.

[0037] It should be noted that the controller can be an industrial computer, and of course can also be other control modules with control function, which is not limited here. The temperature measuring element 40 can be a temperature sensor, as long as it can detect the temperature in real time, which is not limited here.

[0038] Further, each temperature control area 121 is provided with a mounting hole 127, and each temperature measuring element 40 is arranged in the corresponding mounting hole 127, so that the temperature measuring element 40 is located inside the suction cup 10 and as close to the adsorption surface 11 of the suction cup 10 as possible, so that the temperature detected by the temperature measuring element 40 is more accurate, which is conducive to improving the control accuracy of the temperature of the adsorption surface 11 of the suction cup 10.

[0039] In some embodiments, the bearing device further comprises a plurality of first electric connection lines 31, and the first electric connection line 31 is arranged in the corresponding heat insulation groove 125. One end of each first electric connection line 31 is connected with the corresponding heating element 30, and the other end penetrates through the peripheral side surface of the suction cup 10 and is connected with the controller, that is, the controller is electrically connected with each heating element 30 through each first electric connection line 31, so that the controller can control each heating element 30 to heat. In this way, the heat insulation groove 125 plays a heat insulation role between the adjacent two temperature control areas 121, weakening the heat influence between the adjacent two temperature control areas 121; on the other hand, the first electric connection line 31 is routed, avoiding the adverse effects of the first electric connection line 31 on the assembly of the heating element 30 and the cooling disc 20, and avoiding the disorder of the circuit.

[0040] It can be understood that the first electric connection line 31 can be arranged in part of the heat insulation groove 125, and the first electric connection line 31 can not be arranged in another part of the heat insulation groove 125. Of course, in other embodiments, the first electric connection line 31 can be arranged in all heat insulation grooves 125, and the arrangement can be made according to specific conditions, which is not limited herein.

[0041] It should be noted that in the embodiment, each first electric connection line 31 is arranged to pass through the peripheral side surface of the suction plate 10, which is compared with the scheme that the first electric connection line 31 passes through the cooling disc 20 in the axial direction. The first electric connection line 31 needs to pass through the through hole on the cooling disc 20, thereby greatly reducing the design requirements of the cooling flow channel inside the cooling disc 20, which is beneficial to optimize the design of the cooling flow channel inside the cooling disc 20, and greatly improves the cooling effect of the cooling disc 20.

[0042] Further, the bearing device further comprises a plurality of second electric connection lines 41, and at least part of the second electric connection lines 41 are arranged in the heat insulation groove 125. One end of each second electric connection line 41 is connected with the corresponding temperature measuring element 40, and the other end penetrates the peripheral side surface of the suction plate 10 and is connected with the controller. That is, the controller is electrically connected with each temperature measuring element 40 through each second electric connection line 41, so as to control each temperature measuring element 40 to detect the temperature. In this way, the heat insulation groove 125 plays a heat insulation role between the adjacent two temperature control areas 121, and reduces the heat influence between the adjacent two temperature control areas 121. On the other hand, the heat insulation groove 125 provides a wiring path for the second electric connection line 41, so that the wiring is more regular and the line is not messy.

[0043] It should be noted that for the purpose of description, one circle of temperature control areas 121 located at the periphery of the suction plate 10 is named as the peripheral temperature control area 121a, and the remaining temperature control areas 121 are named as the internal temperature control area 121b. Since the peripheral temperature control area 121a is adjacent to the peripheral side surface of the suction plate 10, the second electric connection line 41 located in the peripheral temperature control area 121a can directly penetrate the peripheral side surface of the suction plate 10, without passing through the heat insulation groove 125. In the embodiment shown in the figure, the second electric connection line 41 connected with the temperature measuring element 40 in the peripheral temperature control area 121a does not pass through the heat insulation groove 125, but directly penetrates the peripheral side surface of the suction plate 10. The second electric connection line 41 connected with the temperature measuring element 40 in the internal temperature control area 121b passes through the corresponding heat insulation groove 125 to the periphery of the suction plate 10, and then penetrates the peripheral side surface of the suction plate 10. Figure 2

[0044] In some embodiments, a plurality of separation protrusions 123 are protruded on the heat conduction surface 12, and each separation protrusion 123 divides the heat conduction surface 12 to form a plurality of temperature control areas 121. In the embodiment shown in the figure, the separation protrusions 123 are arranged in the form of a grid, and each separation protrusion 123 divides the heat conduction surface 12 to form a temperature control area 121. Figure 3 ​In the shown embodiment, all of the partitioning protrusions 123 are divided into first partitioning protrusions 123a and second partitioning protrusions 123b, and the first partitioning protrusions 123a and the second partitioning protrusions 123b are arranged perpendicularly to each other. The first partitioning protrusions 123a extend along a first direction X1 and are arranged on the heat-conducting surface 12 at intervals along a second direction X2 perpendicular to the first direction X1; and the second partitioning protrusions 123b extend along the second direction X2 and are arranged on the heat-conducting surface 12 at intervals along the first direction X1.

[0045] Of course, in other embodiments, the first partitioning protrusions 123a and the second partitioning protrusions 123b can not be perpendicular to each other, for example, the included angle between the first partitioning protrusions 123a and the second partitioning protrusions 123b can be 60°, which is not limited herein.

[0046] Further, the heat-insulating grooves 125 are arranged on the partitioning protrusions 123, that is, each partitioning protrusion 123 is provided with a heat-insulating groove 125. Each heat-insulating groove 125 extends along the length direction of the partitioning protrusion 123 on which the heat-insulating groove 125 is arranged, that is, the length direction of each heat-insulating groove 125 is consistent with the length direction of the partitioning protrusion 123 on which the heat-insulating groove 125 is arranged.

[0047] Further, the heat-conducting surface 12 is provided with an annular protrusion 129 on the circumferential edge, and each partitioning protrusion 123 is located inside the annular protrusion 129 and connected to the annular protrusion 129 at both ends. For the heat-insulating groove 125 in which the first electric connecting wire 31 and / or the second electric connecting wire 41 is arranged: the heat-insulating groove 125 is penetrated through the annular protrusion 129 from the connection between the partitioning protrusion 123 on which the heat-insulating groove 125 is arranged and the annular protrusion 129, so that the first electric connecting wire 31 and / or the second electric connecting wire 41 in the heat-insulating groove 125 is penetrated to the outside of the annular protrusion 129, and then connected to the controller.

[0048] It can be understood that only the heat-insulating groove 125 in which the first electric connecting wire 31 and / or the second electric connecting wire 41 is arranged is penetrated through the annular protrusion 129, so that the first electric connecting wire 31 and / or the second electric connecting wire 41 in the heat-insulating groove 125 can be penetrated out to the outside of the annular protrusion 129, so as to be connected to the controller. For the heat-insulating groove 125 in which the first electric connecting wire 31 and the second electric connecting wire 41 are not arranged, the heat-insulating groove 125 is not penetrated through the annular protrusion 129.

[0049] It should be noted that the annular convex strip 129 is annular, the first and second partition convex strips 123a and 123b intersect each other perpendicularly, and thus each internal temperature control area 121b formed by partitioning is rectangular, and the shape of each peripheral temperature control area 121a formed by partitioning is irregular. In order to adapt to the shape of the temperature control area 121 and increase the contact area of the heating element 30 and the chuck 10 as much as possible to improve the heating efficiency, in some embodiments, the shape of the heating element 30 located in the internal temperature control area 121b is consistent with that of the internal temperature control area 121b, and the size is the same or slightly smaller. Similarly, the shape of the heating element 30 located in the peripheral temperature control area 121a is consistent with that of the peripheral temperature control area 121a, and the size is the same or slightly smaller.

[0050] In some embodiments, the cooling disc 20 has a cooling flow channel, and a liquid inlet 21 and a liquid outlet 22 in communication with the cooling flow channel. The liquid inlet 21 is used to input cooling medium into the cooling flow channel, and the liquid outlet 22 is used to discharge the cooling medium in the cooling flow channel. In this way, the cooling medium takes away heat during the flow in the cooling flow channel, achieving cooling of the chuck 10. Through the cooling of the chuck 10 by the cooling disc 20 and the heating of the chuck 10 by the heating elements 30, the temperature of the chuck 10 is precisely controlled.

[0051] It should be noted that the temperature of the cooling medium at the liquid inlet 21 is low, and thus the cooling effect of the part of the cooling disc 20 located at the liquid inlet 21 on the chuck 10 is the best, resulting in that the temperature of the part of the chuck 10 corresponding to the liquid inlet 21 of the cooling disc 20 is low, thereby adversely affecting the temperature uniformity of the chuck 10. In order to overcome the above-mentioned defects, in some embodiments, the power of the heating element 30 located at the liquid inlet 21 is greater than that of the heating element 30 at other positions. For example, the power of the heating element 30 located at the liquid inlet 21 is 200w to 400W, and the power of the heating element 30 at other positions is 150w to 250W.

[0052] Based on the above-described carrying device, the application further provides a test equipment. The test equipment comprises a material supply device, a carrying device, a test device, and the carrying device as described in any one of the above embodiments. The material supply device is used to provide a wafer to be tested, and also used to receive the wafer after testing. The carrying device is used to transfer the wafer provided by the material supply device to the chuck 10. The test device is used to test the wafer on the chuck 10. The carrying device is also used to transfer the wafer on the chuck 10 to the material supply device.

[0053] Any combination of the technical features in the above-described embodiments can be made, and for the sake of brevity, not all possible combinations are described, however, it is to be understood that the application embraces all such possible combinations.

[0054] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A load bearing device, characterized by, The bearing device comprises: a suction disc (10) having a suction surface (11) for suctioning elements and a heat-conducting surface (12) opposite to the suction surface (11), the heat-conducting surface (12) comprising a plurality of temperature control areas (121) and a plurality of heat insulation grooves (125) between every two adjacent temperature control areas (121); a cooling disc (20) arranged on the side of the suction disc (10) having the heat-conducting surface (12); a plurality of heating elements (30) arranged between the suction disc (10) and the cooling disc (20), and all the heating elements (30) are divided into a plurality of groups, each group of the heating elements (30) comprising at least one heating element (30), and each group of the heating elements (30) corresponds to one of the temperature control areas (121); and a plurality of first electric connection lines (31) arranged in the heat insulation grooves (125), one end of each first electric connection line (31) being connected to a corresponding heating element (30), and the other end penetrating the circumferential surface of the suction disc (10).

2. The load bearing device of claim 1, wherein, The bearing device further comprises a plurality of temperature measuring elements (40) for detecting temperature, and at least one temperature measuring element (40) is arranged in each temperature control area (121).

3. The load bearing device of claim 2, wherein, Each temperature control area (121) is provided with a mounting hole (127), and each temperature measuring element (40) is arranged in a corresponding mounting hole (127).

4. The load bearing device of claim 2, wherein, Each temperature measuring element (40) is a temperature sensor.

5. The load bearing device of claim 2, wherein, The bearing device further comprises a plurality of second electric connection lines (41), at least part of the second electric connection lines (41) being arranged in the heat insulation grooves (125), one end of each second electric connection line (41) being connected to a corresponding temperature measuring element (40), and the other end penetrating the circumferential surface of the suction disc (10).

6. The load bearing device of claim 1, wherein, The heat-conducting surface (12) is provided with a plurality of separation protrusions (123), and each separation protrusion (123) divides the heat-conducting surface (12) into a plurality of temperature control areas (121).

7. The load bearing device of claim 6, wherein, Each separation protrusion (123) is provided with a heat insulation groove (125), and each heat insulation groove (125) extends along the longitudinal direction of the separation protrusion (123).

8. The load bearing device of claim 7, wherein, The circumferential edge of the heat-conducting surface (12) is provided with an annular protrusion (129), each separation protrusion (123) is located inside the annular protrusion (129), both ends of each separation protrusion (123) are connected to the annular protrusion (129), and the heat insulation groove (125) penetrates the annular protrusion (129) at the connection between the separation protrusion (123) and the annular protrusion (129).

9. The load bearing device of claim 1, wherein, The cooling disc (20) has a cooling flow channel, an inlet (21) and an outlet (22) communicating with the cooling flow channel, the inlet (21) being used for inputting cooling medium into the cooling flow channel, and the outlet (22) being used for discharging the cooling medium in the cooling flow channel. The power of the heating element (30) located at the inlet (21) is greater than that of the heating element (30) located at other positions.

10. A test apparatus, characterized by, The system comprises a supply and collection device, a handling device for transferring elements between the supply and collection device and the suction surface (11) of the suction cup (10), a testing device for testing the elements on the suction surface (11), and a carrier device according to any one of claims 1 to 9.

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