Flat packaging shell and packaging device

Abstract

The utility model provides a flat packaging shell and a packaging device, which belong to the technical field of integrated circuit device packaging, and comprise a plastic shell and a metal lead, the front surface of the plastic shell is provided with a packaging cavity used for packaging a chip; the metal leads are respectively arranged on two symmetrical sides of the plastic shell; the metal lead is provided with an inner cavity lead section and an outer lead section, and the inner cavity lead section upwards penetrates through the plastic shell, extends into the packaging cavity and is attached to the bottom of the packaging cavity; and the external lead section horizontally extends outwards from the back surface of the plastic shell. The flat packaging shell and the packaging device provided by the utility model have the characteristics of simplicity in manufacturing, low operation requirement, low manufacturing cost and better heat resistance, moisture resistance, sealing performance and reliability, and meet the use requirements of the device.

Description

TECHNICAL FIELD

[0001] The utility model belongs to integrated circuit device packaging technical field, concretely relates to a kind of flat package shell and the packaging device of chip using the flat package shell of this. BACKGROUND

[0002] As one of the basic disciplines of electronic information industry, integrated circuit packaging technology plays a crucial supporting role in the development of integrated circuit devices. At present, various types of integrated circuits in the fields of 5G communication, consumer electronics, artificial intelligence, Internet of Things and automotive electronics have attracted the attention of the state and enterprises. The packaging technology of multi-source signal integration capability such as digital, analog, optoelectronic and MEMS has become the focus of the development of related industries.

[0003] Integrated circuit components are the entire process of assembling chips onto carriers, forming electrical connections using appropriate connection technology, and packaging them in a shell to form an effective assembly. Packaging mainly serves to place, fix, seal and protect chips, and ensure circuit performance and thermal performance.

[0004] There are various types of ceramic shells. For ceramic FP (flat package) and CSOP (ceramics small outline package) shells, the characteristic is that there are metal leads on both sides of the ceramic shell, and the metal leads are horizontally extended from the back of the ceramic shell (as shown in Figures 10 to 12

[0005] Traditional integrated circuit shells include ceramic shell packaging and plastic potting:

[0006] The ceramic shell is composed of an alumina ceramic shell, metal leads, a metal sealing ring and a metal cover plate. The alumina ceramic shell, metal leads and metal sealing ring are welded together, and the metal cover plate is sealed to form an airtight packaging shell. The process flow of ceramic shell packaging is as follows:

[0007] (1) Alumina ceramic powder is mixed and cast into a green ceramic sheet;

[0008] (2) A tungsten metallization paste is printed on the green ceramic sheet using screen printing;

[0009] (3) The green ceramic sheet is cut into individual green ceramic pieces

[0010] (4) Sintering is performed in a reducing atmosphere, and the green ceramic piece is sintered into a mature ceramic piece at a sintering temperature of about 1600℃;

[0011] (5) The mature ceramic piece is plated with nickel;

[0012] ​(6) The metallized area of the fired porcelain piece is welded with a metal lead wire and a sealing ring, the welding temperature is about 800 DEG C, and the solder is a silver-copper alloy;

[0013] (7) Nickel and gold plating as a whole;

[0014] (8) The cavity of the ceramic shell is airtight, a chip is welded or bonded on the bottom surface of the cavity, a gold wire is bonded on the gold-plated area of the chip and the metallized area in the cavity to realize circuit interconnection, and finally a metal cover plate is used to seal, so that a complete integrated circuit device is prepared.

[0015] The technological process of the plastic "potting" is as follows:

[0016] (1) The lead frame is first gold-plated;

[0017] (2) The chip is welded or bonded on the lead frame, and a gold wire is bonded on the gold-plated area of the chip and the surface of the lead frame to realize circuit interconnection;

[0018] (3) The liquid epoxy resin is used to pot the chip and the lead frame by using a potting machine, and then the epoxy resin is cured by heating. All the gaps are filled, and no cavity is allowed, and the inside of the device is solid. The epoxy resin is a thermosetting material, which is liquid at room temperature, and the cross-linking polymerization reaction between molecular chains occurs by heating, so that the epoxy resin becomes solid and has no cavity inside.

[0019] The ceramic packaging shell is currently prepared by sintering in a reducing atmosphere and high-temperature welding, and the production process is complex and requires high requirements, so that the manufacturing cost is high and the price is expensive. Although the plastic potting has low cost and simple process, the heat resistance, sealing property, moisture resistance and reliability are poor. Content of the utility model

[0020] The utility model discloses a kind of flat packaging shell and packaged device corresponding to ceramic FP, CSOP shell, simple to manufacture, low in operation requirement, low in manufacturing cost, and good in heat dissipation, solve the problem that ceramic packaging manufacturing process is complex, cost is high and plastic potting shell exists heat resistance, sealing property, moisture resistance, reliability is poor.

[0021] First, to achieve the above object, the technical scheme adopted by the utility model is as follows: a kind of flat packaging shell is provided, comprising:

[0022] A plastic shell is provided with a packaging cavity for packaging a chip on its front face; and

[0023] Metal lead wires are injection molded on the two symmetrical sides of the plastic shell; the metal lead wires have inner cavity lead wire segments and outer lead wire segments; the inner cavity lead wire segments pass through the plastic shell upwards and extend into the packaging cavity, and are attached to the bottom of the packaging cavity; the outer lead wire segments horizontally extend outwards from the back of the plastic shell.

[0024] With reference to the first aspect, in an implementable mode, the inner cavity lead wire segment is a bent segment; the inner cavity lead wire segment has an inner cavity horizontal lead wire segment and an inner cavity vertical lead wire segment connected in sequence; the inner cavity horizontal lead wire segment is perpendicular to the inner cavity vertical lead wire segment; the inner cavity horizontal lead wire segment horizontally extends into the packaging cavity; the inner cavity vertical lead wire segment is arranged in the bottom plate of the plastic shell and extends upward into the wall of the plastic shell; and the outer lead wire segment is perpendicular to the inner cavity vertical lead wire segment.

[0025] With reference to the first aspect, in an implementable mode, a locking glue hole is arranged on the inner cavity lead wire segment for locking glue.

[0026] With reference to the first aspect, in an implementable mode, a locking glue groove is arranged on the inner cavity lead wire segment for locking glue.

[0027] With reference to the first aspect, in an implementable mode, locking glue notches are further arranged on both sides of the inner cavity lead wire segment in the width direction for locking glue.

[0028] With reference to the first aspect, in an implementable mode, steps are arranged on both sides of the bottom of the packaging cavity symmetrically, and the inner cavity lead wire segment is attached to the steps.

[0029] With reference to the first aspect, in an implementable mode, a sink groove is arranged on both sides of the bottom of the packaging cavity symmetrically, the inner cavity lead wire segment extends into the sink groove, and the upper surface of the inner cavity lead wire segment is flush with the bottom surface of the packaging cavity.

[0030] With reference to the first aspect, in an implementable mode, guide grooves extending to both sides are respectively arranged on both sides of the back surface of the plastic shell, and the outer lead wire segment horizontally extends outward from the guide grooves.

[0031] With reference to the first aspect, in an implementable mode, the lower surface of the outer lead wire segment is flush with the back surface of the plastic shell.

[0032] Secondly, the utility model embodiment further provides a packaging device, which comprises:

[0033] the flat packaging shell;

[0034] a chip arranged in the packaging cavity of the plastic shell; the chip is directly connected with the metal lead wire extending into the packaging cavity through a bonding wire; and

[0035] a cap arranged on the plastic shell to seal the chip in the packaging cavity.

[0036] Compared with the prior art, the flat packaging shell and the packaging device have the beneficial effects that: compared with the traditional ceramic packaging shell, only the corresponding injection mold needs to be used, the metal lead and the plastic shell body can be integrally injection molded together, the flat packaging shell of the plastic product with the same size as the traditional ceramic shell and good performance can be manufactured, the manufacturing is simple, the operation requirement is low, the manufacturing cost is low, the price of the product is reduced, and the impact resistance and flexibility of the plastic material are also good; compared with the traditional plastic pouring sealing shell, the plastic shell body has a packaging cavity, the periphery of the chip is a cavity, after the cap is sealed, the packaging cavity cannot be filled, the periphery of the chip in the device is still a cavity, the shell structure of the plastic pouring sealing is different from the shell structure of the ceramic packaging, the shell of the application can be completely consistent with the internal and external structures of the ceramic packaging shell; meanwhile, compared with the plastic pouring sealing shell, the heat resistance, sealing property, moisture resistance and reliability are good.

[0037] The flat packaging shell provided by the utility model can keep the internal and external sizes and shapes of the flat packaging shell and the ceramic packaging shell highly consistent, in the actual application process, the flat packaging shell of the plastic material with lower cost can be selected to replace the ceramic packaging shell with high price according to the actual use environment and performance demand of the product, the production cost is reduced under the premise of ensuring the performance and reliability of the electronic product. ACCURACY OF DRAWINGS

[0038] Figure 1 The utility model provides a packaging device's main view structural schematic drawing for the embodiment of the utility model;

[0039] Figure 2 The utility model provides a packaging device's plan view structural schematic drawing for Figure 1 The utility model provides a packaging device's plan view structural schematic drawing for

[0040] Figure 3 The utility model provides a packaging device's main view structural schematic drawing for the embodiment of the utility model;

[0041] Figure 4 The utility model provides a packaging device's main view structural schematic drawing for Figure 3 The utility model provides a packaging device's main view structural schematic drawing for

[0042] Figure 5 The utility model provides a packaging device's main view structural schematic Figure 1 ;

[0043] Figure 6 The utility model provides a packaging device's main view structural schematic Figure 2 ;

[0044] Figure 7 The utility model provides a packaging device's main view structural schematic Figure 3 ;

[0045] Figure 8 A schematic diagram of the main structure of the plastic shell provided in this embodiment of the utility model. Figure 4 ;

[0046] Figure 9 A top view of the plastic shell provided in an embodiment of this utility model;

[0047] Figure 10 A top view of the ceramic flat packaging shell provided in an embodiment of this utility model;

[0048] Figure 11 for Figure 10 A bottom view of the provided ceramic flat package housing;

[0049] Figure 12 for Figure 10 A schematic diagram of the front view structure of the provided ceramic flat package shell;

[0050] Explanation of reference numerals in the attached figures:

[0051] 1. Metal lead; 11. Inner cavity lead segment; 111. Locking groove; 112. Locking hole; 113. Locking notch; 12. Outer lead segment; 2. Plastic shell; 21. Encapsulation cavity; 22. Step; 3. Adhesive layer; 4. Cap; 5. Bonding wire; 6. Chip; 7. Ceramic flat package shell. Detailed Implementation

[0052] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0053] Please refer to the following: Figures 3 to 9 The flat packaging shell provided by this utility model will now be described. The flat packaging shell includes: a plastic shell 2 and metal leads 1. The front side of the plastic shell 2 is provided with a packaging cavity 21 for packaging a chip 6; the metal leads 1 are injection molded on both sides of the plastic shell 2 symmetrically; the metal leads 1 have an inner cavity lead segment 11 and an outer lead segment 12. The inner cavity lead segment 11 passes upward through the plastic shell 2 and extends into the packaging cavity 21, and is in contact with the bottom of the packaging cavity 21; the outer lead segment 12 extends horizontally outward from the back side of the plastic shell 2.

[0054] Compared with the traditional ceramic packaging shell, the plastic shell has a packaging cavity, the periphery of the chip is a cavity, after the cap is sealed, the packaging cavity cannot be filled, the periphery of the chip in the device is still a cavity, the shell structure of the plastic pouring is different from the shell structure of the ceramic packaging, the shell of the application can be consistent with the internal and external structures of the ceramic packaging shell; meanwhile, compared with the plastic pouring shell, the heat resistance, sealing property, moisture resistance and reliability are better.

[0055] The flat packaging shell provided by the utility model can keep the internal and external sizes and shapes of the flat packaging shell and the ceramic packaging shell highly consistent, in the actual application process, the flat packaging shell made of the plastic material with low cost can be selected to replace the ceramic packaging shell with high price according to the actual use environment and performance requirement of the product, the production cost is reduced under the premise of ensuring the performance and reliability of the electronic product.

[0056] Meanwhile, since the plastic pouring shell is poured by the liquid epoxy resin, the liquid epoxy resin is in liquid state at normal temperature, has hygroscopicity after solidification and poor moisture resistance, the shell is easy to crack, crack and burst after being heated, has poor heat resistance, affects the sealing property and has poor performance reliability; the packaging shell provided by the application has the plastic material in solid state at normal temperature, has good heat resistance, sealing property, moisture resistance and reliability, and the packaging shell with good cost performance can be selected according to the environmental conditions of different occasions and the performance requirement of the device.

[0057] The manufacturing process of the flat packaging shell provided by the utility model is as follows:

[0058] (1) the metal lead 1 is processed by the mechanical processing mode, the surface is chemically treated to increase the bonding force with the plastic; (2) the metal lead 1 is loaded into the injection mold, and the plastic is injected, so that the plastic shell 2 wrapping the metal lead 1 can be manufactured, or the metal lead 1 and the plastic shell 2 can be integrally injection molded. This manufacturing method is not only simple and convenient, but also increases the contact area of the metal lead 1 and the plastic shell 2, and makes the connection of the metal lead 1 and the plastic shell 2 more tight and firm, avoids the risk that the metal lead 1 is only fixed at the bottom of the ceramic shell and is easy to contact badly or fall off, and also improves the stability of signal transmission.

[0059] The plastic shell 2 and the matched metal lead 1 of the utility model have the structure of ceramic flat package shell 7 (CFP) and ceramic small outline package shell (CSOP) corresponding to the plastic material. Figures 10 to 12 The two kinds of shells have the characteristics of metal leads 1 on both sides, and the metal leads 1 horizontally extend from the back of the ceramic shell.

[0060] The ceramic flat package shell 7 (CFP) has the advantages of small volume and light weight, and the commonly used lead pitch is 1.27mm, and the narrow pitch products of 1.0mm, 0.8mm and 0.635mm can be customized, and the heat sink can be designed according to the customer's requirements.

[0061] The ceramic small outline shell (CSOP) is a small-sized surface-mounted shell, and the wing-shaped lead structure is more conducive to absorbing the stress between the shell and the circuit board, has higher reliability, has single-core cavity and multi-core cavity structures, and the commonly used lead pitch is 1.27mm, and the narrow pitch products of 1.0mm, 0.8mm and 0.635mm can be customized, and is widely used in amplifiers, memories, drivers, comparators and the like.

[0062] The flat package shell provided by the utility model is applied to packaging integrated circuit chips, and the device manufactured is an integrated circuit component, including transistors, capacitors, resistors, microcontrollers MCU, microprocessors CPU, DSPs, interface circuits, programmable logic devices FPGA, application-specific integrated circuits ASIC, SOC, large-capacity memories and the like, analog integrated circuits A / D, D / A converters, DDS, RFIC and the like, and is a key component of various electronic circuits.

[0063] In some embodiments, as shown in Figures 3 to 9 The inner cavity lead segment 11 is a bending segment; the inner cavity lead segment 11 has an inner cavity horizontal lead segment and an inner cavity vertical lead segment connected in sequence; the inner cavity horizontal lead segment is perpendicular to the inner cavity vertical lead segment; the inner cavity horizontal lead segment horizontally extends into the packaging cavity, and the inner cavity vertical lead segment is arranged in the bottom plate of the plastic shell 2 and extends upward into the wall of the plastic shell 2; and the outer lead segment 12 is perpendicular to the inner cavity vertical lead segment.

[0064] In some embodiments, as shown in Figures 3 to 9 The inner cavity lead segment 11 is provided with a glue locking hole 112 for locking glue. When the metal lead 1 and the plastic shell 2 are integrally injection molded, the glue locking hole 112 can be filled with plastic liquid, so that the bonding force of the metal lead 1 and the plastic shell 2 is increased, and the firmness of the connection between the metal lead 1 and the plastic shell 2 is improved.

[0065] Optionally, the shape of the glue locking hole 112 is circular, oval, or polygonal such as triangular, quadrangular, pentagonal, etc. The number of glue locking holes 112 can be one, two, or more, and the setting position can be at the vertical part where the inner cavity lead segment 11 is located in the vertical hole, or at the horizontal part where the inner cavity lead segment 11 is located in the horizontal hole.

[0066] In some embodiments, as shown in FIG. 1, the inner cavity lead segment 11 is provided with a glue locking groove 111 for glue locking. Similarly, the glue locking groove 111 can be filled with plastic liquid to increase the bonding force between the metal lead 1 and the plastic shell 2, and to improve the firmness of the connection between the metal lead 1 and the plastic shell 2. Optionally, the shape of the glue locking groove 111 is circular, oval, or polygonal such as triangular, quadrangular, pentagonal, etc., and the quadrangular shape is preferably rectangular. Similarly, the number and setting position of the glue locking groove 111 are not limited. Figures 3 to 9 In some embodiments, as shown in FIG. 1, the inner cavity lead segment 11 is provided with a glue locking groove 111 for glue locking. Similarly, the glue locking groove 111 can be filled with plastic liquid to increase the bonding force between the metal lead 1 and the plastic shell 2, and to improve the firmness of the connection between the metal lead 1 and the plastic shell 2. Optionally, the shape of the glue locking groove 111 is circular, oval, or polygonal such as triangular, quadrangular, pentagonal, etc., and the quadrangular shape is preferably rectangular. Similarly, the number and setting position of the glue locking groove 111 are not limited.

[0067] Figures 3 to 9 In some embodiments, as shown in FIG. 1, the inner cavity lead segment 11 is provided with a glue locking groove 111 for glue locking. Similarly, the glue locking groove 111 can be filled with plastic liquid to increase the bonding force between the metal lead 1 and the plastic shell 2, and to improve the firmness of the connection between the metal lead 1 and the plastic shell 2. Optionally, the shape of the glue locking groove 111 is circular, oval, or polygonal such as triangular, quadrangular, pentagonal, etc., and the quadrangular shape is preferably rectangular. Similarly, the number and setting position of the glue locking groove 111 are not limited.

[0068] Optionally, the shape of the glue locking notch 113 is semicircular, or rectangular notch, or oval notch, or trapezoidal notch, etc. The setting position is also not limited.

[0069] It should be noted that the glue locking hole 112, the glue locking groove 111, and the glue locking notch 113 do not affect the bonding of the bonding wire 5, or in other words, they are designed to avoid the bonding position of the bonding wire 5.

[0070] At the same time, the metal lead 1 can be provided with any one of the glue locking hole 112, the glue locking groove 111, and the glue locking notch 113, or any two, or all three.

[0071] The plastic shell 2 of the present embodiment is rectangular, and the two sides of the plastic shell 2 are respectively provided with a plurality of metal leads 1. The metal lead 1 passes through the plastic shell 2 from inside to outside, and the glue locking structure such as the circular hole or the rectangular notch, the semirecessed glue locking groove 111, etc. processed on the metal lead 1 increases the bonding force between the metal and the plastic; the metal lead 1 is bent outwards by 90°, and horizontally extends out at the bottom surface of the plastic shell 2.

[0072] The shape of the metal lead 1 is flat.

[0073] ​In some embodiments, the bottom of the packaging cavity 21 is provided with a step 22 on both sides of the symmetry, and the inner cavity lead segment 11 is attached to the step 22. Optionally, the metal lead 1 on the step 22 can protrude from the surface of the step 22, or a groove is provided on the step 22, and the metal lead 1 is inserted into the groove, and the upper surface of the metal lead 1 is flush with the surface of the step 22.

[0074] Optionally, a step 22 is provided in the packaging cavity 21, the surface of the inner cavity lead segment 11 is higher than the surface of the step 22, and the bottom surface of the outer lead segment 12 protrudes from the back surface of the plastic shell 2 and horizontally extends outward (as shown in Figure 5

[0075] Optionally, a step 22 is provided in the packaging cavity 21, the surface of the inner cavity lead segment 11 is higher than the surface of the step 22, and the outer lead segment 12 is embedded in the back surface of the plastic shell 2, and the bottom surface of the outer lead segment 12 is flush with the back surface of the plastic shell 2 (as shown in Figure 6 ), at this time, the back surface of the plastic shell 2 is provided with a guide groove, and the outer lead segment 12 horizontally extends outward from the guide groove.

[0076] Similarly, when the metal lead 1 is flush with the surface of the step 22, the bottom surface of the outer lead segment 12 can be selected to protrude from the back surface of the plastic shell 2 (as shown in Figure 7 ), or be flush with the back surface of the plastic shell 2 (as shown in Figure 8 ).

[0077] In some embodiments, as shown in Figure 7 and Figure 8 , the bottom of the packaging cavity 21 is provided with a sink on both sides of the symmetry, the inner cavity lead segment 11 is inserted into the sink, and the upper surface of the inner cavity lead segment 11 is flush with the bottom surface of the packaging cavity 21. At this time, the bottom surface of the matched outer lead segment 12 can be selected to protrude from the back surface of the plastic shell 2, or be flush with the back surface of the plastic shell 2.

[0078] Optionally, the upper surface of the inner cavity lead segment 11 protrudes from the bottom surface of the packaging cavity 21. At this time, the bottom surface of the matched outer lead segment 12 can be selected to protrude from the back surface of the plastic shell 2, or be flush with the back surface of the plastic shell 2.

[0079] It is explained that the locking glue hole, locking glue groove and locking glue notch provided on the inner cavity lead segment are matched with the position relationship of the inner cavity lead segment flush with or protruding from the bottom surface of the packaging cavity and the surface of the step, and are also matched with the position relationship of the outer lead segment protruding from or flush with the back surface of the plastic shell.

[0080] Further, the flat packaging shell provided by the utility model comprises a plastic shell 2, a metal lead 1, a metal ring (which can be selected or not selected) and a cap 4.

[0081] ​The plastic shell 2 and the cap 4 are made of plastic, and the plastic is any one of high-temperature-resistant engineering plastics such as LCP (LIQUID CRYSTAL POLYMER), LCP modified material, PPS (polyphenylene sulfide), PS (Polystyrene, abbreviated as PS), PBT (Polybutylene terephthalate), etc., and more than 30% of glass fiber is filled in the plastic.

[0082] The metal lead 1 and the metal ring are made of any one of materials such as Kovar alloy, copper and copper alloy, aluminum and aluminum alloy, etc. The metal ring is located between the cap 4 and the plastic shell 2. When the metal ring is not selected, the cap 4 and the plastic shell 2 are bonded together; when the metal ring is selected, the metal ring can be bonded and fixed with the cap 4 and the plastic shell 2.

[0083] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described or recorded in a certain embodiment can be referred to the related description of other embodiments.

[0084] Based on the same inventive concept, as shown in Figure 1 and Figure 2 , the embodiment of the present application also provides a packaging device, which comprises a flat packaging shell, a chip 6 and a cap 4, the chip 6 is arranged in a packaging cavity 21 of the plastic shell 2; the chip 6 is directly connected with the metal lead 1 extending into the packaging cavity 21 through the bonding wire 5; and the cap 4 is arranged on the plastic shell 2.

[0085] The packaging device provided by the utility model has the advantages of simple manufacturing, low operation requirement, low manufacturing cost, good heat resistance, good moisture resistance and good sealing performance, and meets the use requirement of the device.

[0086] The manufacturing process of the packaging device comprises the following steps;

[0087] (1) Manufacturing of the metal lead 1:

[0088] The metal lead 1 is processed by a mechanical processing mode, and the surface is subjected to chemical treatment to increase the bonding force with the plastic;

[0089] (2) Manufacturing of the plastic shell 2:

[0090] Manufacturing of an injection mold;

[0091] The metal lead 1 is loaded into the injection mold, plastic is injected, and the plastic shell 2 wrapping the metal lead 1 is manufactured, so that the metal lead 1 and the plastic shell 2 are integrally injection molded.

[0092] The entire shell is subjected to nickel plating and gold plating after injection molding, and the shell product is manufactured.

[0093] (3) Making the plastic cap 4:

[0094] Making injection molds;

[0095] 4. Plastic caps are manufactured using injection molding.

[0096] (4) Manufacturing of integrated circuit packaging devices:

[0097] (a) Chip 6 is mounted on the bottom surface inside the encapsulation cavity 21 by means of soldering or adhesive bonding.

[0098] (b) Connect the circuit from the electrode bonding wire of chip 6 to the surface of the gold-plated metal lead 1;

[0099] (c) Apply adhesive to the surface of the cap 4 and bond it to the top of the plastic housing 2. Figure 1 The middle adhesive layer 3) forms a sealed cavity with a sealing effect.

[0100] (d) After inspection and testing, the complete packaged device is manufactured.

[0101] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A flat package housing, characterized by, include: The plastic housing (2) has a packaging cavity (21) on its front side for packaging the chip (6); as well as Metal leads (1) are injection molded on both sides of the plastic housing (2); the metal leads (1) have an inner cavity lead segment (11) and an outer lead segment (12). The inner cavity lead segment (11) passes upward through the plastic housing (2) and extends into the encapsulation cavity (21), and is attached to the bottom of the encapsulation cavity (21); the outer lead segment (12) extends horizontally outward from the back of the plastic housing (2).

2. The package of claim 1, wherein, The inner cavity lead segment (11) is a bent segment; the inner cavity lead segment (11) has an inner cavity horizontal lead segment and an inner cavity vertical lead segment connected in sequence; the inner cavity horizontal lead segment is perpendicular to the inner cavity vertical lead segment; the inner cavity horizontal lead segment extends horizontally into the encapsulation cavity, the inner cavity vertical lead segment is disposed in the bottom plate of the plastic shell (2) and extends upward into the wall of the plastic shell (2), and the outer lead segment (12) is perpendicular to the inner cavity vertical lead segment.

3. The package of claim 1 wherein, The inner cavity lead segment (11) is provided with a locking hole (112) for locking glue.

4. The package of claim 1 wherein, The inner cavity lead segment (11) is provided with a locking groove (111) for locking glue.

5. The package of claim 1 wherein, The inner cavity lead segment (11) is also provided with adhesive locking notches (113) on both sides in the width direction for adhesive locking.

6. The package of claim 1 wherein, The bottom of the encapsulation cavity (21) is provided with steps (22) on both sides symmetrically, and the inner cavity lead segment (11) is attached to the steps (22).

7. The package of claim 1 wherein, The bottom of the encapsulation cavity (21) is provided with symmetrical grooves on both sides, the inner cavity lead segment (11) extends into the groove, and the upper surface of the inner cavity lead segment (11) is flush with the bottom surface of the encapsulation cavity (21).

8. The package of claim 1 wherein, The plastic housing (2) has guide grooves extending to both sides on its symmetrical back side, and the external lead segment (12) extends horizontally outward from the guide grooves.

9. The package of claim 8, wherein, The lower surface of the external lead segment (12) is flush with the back of the plastic housing (2).

10. A packaged device, comprising: include: The flat package housing as described in any one of claims 1-9; The chip (6) is disposed in the encapsulation cavity (21) of the plastic housing (2); the chip (6) is directly connected to the metal lead (1) extending into the encapsulation cavity (21) by a bonding wire (5); as well as A cap (4) is placed on the plastic housing (2) to seal the chip (6) inside the encapsulation cavity (21).

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