Dual in-line packaging shell and packaging device

Abstract

The utility model provides a dual in-line packaging housing and a packaging device, which belong to the technical field of integrated circuit device packaging, and comprise a plastic housing and a metal lead, the front surface of the plastic housing is provided with a packaging cavity for packaging a chip; the metal leads are arranged on two symmetrical sides of the plastic shell through injection molding; the metal lead is provided with an inner cavity lead section and an outer lead section, and the inner cavity lead section upwards penetrates through the plastic shell, extends into the packaging cavity and is attached to the bottom of the packaging cavity; and the external lead section vertically extends downwards from the back surface of the plastic shell. The dual-in-line packaging shell and the packaging device provided by the utility model have the characteristics of simple manufacturing, low operation requirement, low manufacturing cost and better heat resistance, moisture resistance, sealing performance and reliability, and meet the use requirements of the device.

Description

TECHNICAL FIELD

[0001] The utility model belongs to integrated circuit device packaging technical field, concretely relates to a dual-in-line package (DIP) housing and a packaging device using the dual-in-line package (DIP) housing to package a chip. BACKGROUND

[0002] The DIP (dual in-line package) housing has the following features: the ceramic shell has leads on both sides, and the leads are vertically extended to the bottom of the ceramic shell (as shown in Figures 13 to 15 。

[0003] The conventional integrated circuit housing has a ceramic housing package and a plastic package:

[0004] The ceramic housing is composed of an alumina ceramic shell, metal leads, a metal sealing ring and a metal cover plate, and the alumina ceramic shell, metal leads and metal sealing ring are welded together, and the metal cover plate is sealed to form an airtight packaging housing. The process flow of the ceramic housing package is as follows:

[0005] (1) The alumina ceramic powder is mixed and cast into a green ceramic sheet through a casting process;

[0006] (2) The green ceramic sheet is printed with tungsten metallization paste by screen printing;

[0007] (3) The green ceramic sheet is cut into a single green ceramic piece

[0008] (4) Sintering in a reducing atmosphere, the green ceramic piece is sintered into a mature ceramic piece, and the sintering temperature is about 1600℃;

[0009] (5) The mature ceramic piece is plated with nickel;

[0010] (6) The metalized area of the mature ceramic piece is welded with metal leads and a sealing ring, and the welding temperature is about 800℃, and the solder is a silver-copper alloy;

[0011] (7) The whole is plated with nickel and gold;

[0012] (8) The cavity of the ceramic housing is an airtight cavity, the integrated circuit chip is welded or bonded on the bottom surface of the cavity, the gold-plated area of the chip and the metalized area in the cavity are bonded with gold wires for circuit interconnection, and finally the metal cover plate is sealed to form a complete integrated circuit device.

[0013] The process flow of the plastic "packaging" is as follows:

[0014] (1) The processed lead frame is first plated with gold;

[0015] (2) The chip is welded or bonded on the lead frame, and the gold-plated area of the chip and the surface of the lead frame are bonded with gold wires for circuit interconnection;​

[0016] (3) Liquid epoxy resin is filled into the chip and lead frame by a glue filling machine, and then the epoxy resin is cured by heating. All gaps are filled, and no cavity is allowed in the device. The epoxy resin is a thermosetting material, which is liquid at room temperature, and the molecular chains are cross-linked and polymerized by heating to become solid, and there is no cavity inside.

[0017] The current ceramic packaging shell is manufactured by sintering in a reducing atmosphere and high-temperature welding, and the production process is complex and requires high requirements, and the manufacturing cost is high, so the price is expensive. Although the plastic pouring has low cost and simple process, the heat resistance, sealing performance, moisture resistance and reliability are poor. Practical new type content

[0018] The embodiment of the utility model provides a kind of double row straight insertion packaging shell and packaged device, it is simple to make, and operation requirement is low, and manufacturing cost is low, and heat dissipation is better, solve the problem that ceramic packaging manufacturing process is complex, cost is high and plastic pouring shell exists heat resistance, sealing performance, moisture resistance, reliability is poor.

[0019] To achieve the above object, the technical scheme adopted by the utility model is as follows: a double row straight insertion packaging shell is provided, comprising: a plastic shell, which is provided with a packaging cavity for packaging chips on the front face; and

[0020] Metal lead is injection molded on the two symmetrical sides of the plastic shell;The metal lead has an inner cavity lead segment and an outer lead segment, the inner cavity lead segment passes through the plastic shell upwards and extends into the packaging cavity, and is attached to the bottom of the packaging cavity;The outer lead segment extends vertically downward from the back of the plastic shell.

[0021] In combination with the first aspect, in an implementable manner, the inner cavity lead segment is a bending segment;The inner cavity lead segment has an inner cavity horizontal lead segment and a vertical lead segment connected in sequence;The inner cavity horizontal lead segment is perpendicular to the vertical lead segment;The inner cavity horizontal lead segment extends horizontally into the packaging cavity, and the vertical lead segment extends vertically downward from the bottom plate of the plastic shell.

[0022] In combination with the first aspect, in an implementable manner, the inner cavity lead segment is a horizontal segment;The inner cavity lead segment horizontally passes through the wall of the plastic shell, and extends horizontally from the side of the plastic shell;The outer lead segment extends vertically downward from the side of the plastic shell and beyond the bottom surface of the plastic shell.

[0023] In combination with the first aspect, in an implementable manner, the inner cavity lead segment is provided with a glue locking hole for locking glue.

[0024] With reference to the first aspect, in an implementable mode, a locking groove for locking glue is arranged on the inner cavity lead segment.

[0025] With reference to the first aspect, in an implementable mode, locking notches for locking glue are further arranged on both sides of the inner cavity lead segment in the width direction.

[0026] With reference to the first aspect, in an implementable mode, a sink is arranged on both sides of the bottom of the packaging cavity symmetrically, the inner cavity lead segment extends into the sink, and the upper surface of the inner cavity lead segment is flush with the bottom surface of the packaging cavity.

[0027] With reference to the first aspect, in an implementable mode, a step is arranged on both sides of the bottom of the packaging cavity symmetrically, and the inner cavity lead segment is attached to the step.

[0028] With reference to the first aspect, in an implementable mode, the material of the plastic shell is any one of LCP, LCP modified material, PPS, PS, and PBT high-temperature-resistant engineering plastic.

[0029] Secondly, the utility model embodiment further provides a packaging device, which comprises:

[0030] The double-in-line packaging shell;

[0031] A chip is arranged in the packaging cavity of the plastic shell, and the chip is directly connected with the metal lead extending into the packaging cavity through a bonding wire; and

[0032] A cap is arranged on the plastic shell to seal the chip in the packaging cavity.

[0033] Compared with the prior art, the double-in-line packaging shell and the packaging device have the beneficial effects that: compared with the traditional double-in-line ceramic packaging shell, the metal lead and the plastic shell can be integrally injection molded together only by using a corresponding injection mold, a flat packaging shell made of plastic with consistent size and good performance as the traditional ceramic shell can be manufactured, the manufacturing is simple, the operation requirement is low, the manufacturing cost is low, the product price is reduced, and the impact resistance and flexibility of the plastic material are also good; compared with the traditional plastic potting shell, the plastic shell has a packaging cavity, the periphery of the chip is a cavity, the packaging cavity is not filled after the cap is sealed, the periphery of the chip in the device is still a cavity, the shell structure of the plastic potting is different from the shell structure of the ceramic packaging, the shell of the application can be completely consistent with the internal and external structures of the double-in-line ceramic packaging shell; meanwhile, compared with the plastic potting shell, the heat resistance, sealing property, moisture resistance and reliability are good.

[0034] The double-row direct insertion packaging shell provided by the utility model can keep the internal and external sizes and shapes highly consistent with the traditional double-row direct insertion ceramic packaging shell, in the actual application process, the double-row direct insertion packaging shell with lower cost of plastic material can be selected to replace the ceramic packaging shell with high price according to the actual use environment and performance requirement of products, meanwhile, the shell of the utility model can also be selected to replace the plastic packaging shell made by plastic pouring, under the premise of ensuring the performance and reliability of electronic products, the production cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 The utility model provides a double-row direct insertion packaging shell's main view structure schematic diagram Figure 1

[0036] Figure 2 The utility model provides a double-row direct insertion packaging shell's plan structure schematic view Figure 1

[0037] Figure 3 The utility model provides a metal lead's main view structure schematic diagram

[0038] Figure 4 The utility model provides a metal lead's plan structure schematic diagram Figure 3

[0039] Figure 5 The utility model provides a double-row direct insertion packaging shell's main view structure schematic diagram Figure 2

[0040] Figure 6 The utility model provides a double-row direct insertion packaging shell's main view structure schematic diagram Figure 3

[0041] Figure 7 The utility model provides a double-row direct insertion packaging shell's main view structure schematic diagram Figure 4

[0042] Figure 8 The utility model provides a double-row direct insertion packaging shell's main view structure schematic diagram Figure 5

[0043] Figure 9 The utility model provides a double-row direct insertion packaging shell's main view structure schematic diagram Figure 6

[0044] Figure 10 The utility model provides a double-row direct insertion packaging shell's main view structure schematic diagram Figure 7

[0045] Figure 11 ​​​​​​​​​This is a schematic diagram of the main structure of the packaging device provided in an embodiment of the present utility model;

[0046] Figure 12 for Figure 11 A top view of the provided packaged device;

[0047] Figure 13 A schematic diagram of the front structure of a conventional dual in-line ceramic package shell provided for an embodiment of this utility model;

[0048] Figure 14 for Figure 13 A side view of the provided dual in-line ceramic package (DIP) housing.

[0049] Figure 15 for Figure 13 A top view of the provided dual in-line ceramic package (DIP) housing.

[0050] Explanation of reference numerals in the attached figures:

[0051] 1. Metal lead; 11. Inner cavity lead segment; 111. Locking groove; 112. Locking hole; 113. Locking notch; 12. Outer lead segment; 2. Plastic housing; 21. Encapsulation cavity; 22. Step; 3. Adhesive layer; 4. Cap; 5. Bonding wire; 6. Chip; 7. Dual in-line ceramic package housing. Detailed Implementation

[0052] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0053] Please refer to the following: Figures 1 to 10 The dual in-line package (DIP) housing provided by this utility model will now be described. The DIP housing includes a plastic housing 2 and metal leads 1. The front side of the plastic housing 2 has a packaging cavity 21 for packaging a chip 6. The metal leads 1 are injection molded onto symmetrical sides of the plastic housing 2. The metal leads 1 have an inner cavity lead segment 11 and an outer lead segment 12. The inner cavity lead segment 11 passes upward through the plastic housing 2 and extends into the packaging cavity 21, abutting against the bottom of the packaging cavity 21. The outer lead segment 12 extends vertically downward from the back side of the plastic housing 2.

[0054] Compared with the traditional ceramic packaging shell, the plastic shell has a packaging cavity, the periphery of the chip is a cavity, after the cap is sealed, the packaging cavity cannot be filled, the periphery of the chip in the device is still a cavity, the shell structure of the plastic pouring is different from the shell structure of the ceramic packaging, the shell of the application can be consistent with the internal and external structures of the ceramic packaging shell; meanwhile, compared with the plastic pouring shell, the heat resistance, sealing property, moisture resistance and reliability are better.

[0055] The double-row straight insertion packaging shell provided by the utility model and the ceramic packaging shell can keep the internal and external sizes and shapes highly consistent, in the actual application process, the flat packaging shell with lower cost of plastic material can be selected to replace the high-price ceramic packaging shell according to the actual use environment and performance requirements of products, the production cost is reduced under the premise of ensuring the performance and reliability of electronic products.

[0056] Meanwhile, since the plastic pouring shell is poured by liquid epoxy resin, the liquid epoxy resin is in liquid state at normal temperature, has hygroscopicity after solidification and poor moisture resistance, the shell is prone to cracking, cracking and explosion after being heated, has poor heat resistance, affects the sealing property and has poor performance reliability; the packaging shell provided by the application has solid plastic material at normal temperature, has good heat resistance, sealing property, moisture resistance and reliability, and the packaging shell with good cost performance can be selected according to the environmental conditions of different occasions and the performance requirements of the device.

[0057] The manufacturing process of the double-row straight insertion packaging shell provided by the utility model is as follows:

[0058] (1) the metal lead 1 is processed by mechanical processing, and the surface is chemically treated to increase the bonding force with the plastic; (2) the metal lead 1 is loaded into an injection mold, and plastic is injected, so that the plastic shell 2 wrapping the metal lead 1 is manufactured, or the metal lead 1 and the plastic shell 2 are integrally injection molded. This manufacturing method is simple and convenient, the integrally injection molded and the integral metal lead 1 not only increase the contact area of the metal lead 1 and the plastic shell 2, but also make the connection of the metal lead 1 and the plastic shell 2 more tight and firm, avoid the risk that the metal lead 1 is only fixed at the bottom of the ceramic shell and is prone to poor contact or falling off, and also improve the stability of signal transmission.

[0059] The plastic shell 2 of the plastic material and the matched metal lead 1 correspond to a double-in-line ceramic packaging shell 7 (DIP) shell. Figures 13 to 15 The double-in-line packaging shell can replace the traditional ceramic packaging shell and the plastic potting shell in some occasions, and can meet the performance requirements.

[0060] The double-in-line packaging shell is used for packaging integrated circuit chips, and the manufactured device is an integrated circuit component, including a transistor, a capacitor, a resistor, a microcontroller MCU, a microprocessor CPU, a DSP, an interface circuit, a programmable logic device FPGA, an application-specific integrated circuit ASIC, a SOC, a large-capacity memory, and the like, and is a key component of various electronic circuits.

[0061] In some embodiments, as shown in Figures 1 to 7 The inner cavity lead segment 11 is a bending segment; the inner cavity lead segment 11 has an inner cavity horizontal lead segment and a vertical lead segment connected in sequence; the inner cavity horizontal lead segment is perpendicular to the vertical lead segment; the inner cavity horizontal lead segment horizontally extends into the packaging cavity, and the vertical lead segment vertically extends downward from the bottom plate of the plastic shell 2.

[0062] In some embodiments, as shown in Figures 8 to 10 The inner cavity lead segment 11 is a horizontal segment; the inner cavity lead segment 11 horizontally passes through the wall of the plastic shell 2 and horizontally extends from the side of the plastic shell 2; and the outer lead segment 12 vertically extends downward from the side of the plastic shell 2 and exceeds the bottom surface of the plastic shell 2.

[0063] In some embodiments, as shown in Figures 1 to 10 The inner cavity lead segment 11 is provided with a glue locking hole 112 for locking glue. When the metal lead 1 is integrally injection molded with the plastic shell 2, the glue locking hole 112 can be filled with plastic liquid, thereby increasing the bonding force between the metal lead 1 and the plastic shell 2 and improving the firmness of the connection between the metal lead 1 and the plastic shell 2. The metal lead provided in the embodiment can be applied to the shell with the vertical lead extending from the back and the shell with the horizontal lead extending from the side and then bending downward.

[0064] Optionally, the shape of the glue locking hole 112 is circular, elliptical, or polygonal such as triangular, quadrangular, pentagonal, etc. The number of the glue locking hole 112 can be one, two or more, and the position can be at the vertical position of the inner cavity lead segment 11 in the vertical hole or at the horizontal position of the inner cavity lead segment 11 in the horizontal hole.

[0065] In some embodiments, as shown in Figures 1 to 10As shown, the inner cavity lead segment 11 is provided with a glue locking groove 111 for locking glue. Similarly, the glue locking groove 111 can be filled with plastic liquid to increase the bonding force between the metal lead 1 and the plastic shell 2, and improve the connection firmness of the metal lead 1 and the plastic shell 2. Optionally, the shape of the glue locking groove 111 is circular, oval, or polygonal such as triangular, quadrangular, pentagonal, etc., and the quadrangular shape is preferred. Similarly, the number and arrangement position of the glue locking groove 111 are not limited. Meanwhile, the metal lead provided by the embodiment can be applied to the shell with the metal lead vertically leading out from the back, or the shell with the metal lead horizontally leading out from the side and then bending downward to vertically lead out.

[0066] In some embodiments, as shown in Figures 1 to 10 As shown, the two sides of the inner cavity lead segment 11 in the width direction are also provided with glue locking notches 113 for locking glue. Similarly, the glue locking notches 113 can be filled with plastic liquid to increase the bonding force between the metal lead 1 and the plastic shell 2, and improve the connection firmness of the metal lead 1 and the plastic shell 2.

[0067] Optionally, the shape of the glue locking notch 113 is semicircular, or rectangular notch, or oval notch, or trapezoidal notch, etc. without limitation. The arrangement position is also not limited.

[0068] It should be noted that the glue locking hole 112, the glue locking groove 111, and the glue locking notch 113 do not affect the bonding of the bonding wire 5, or in other words, the positions of the bonding wire 5 are avoided.

[0069] Meanwhile, the metal lead 1 can be individually provided with any one of the glue locking hole 112, the glue locking groove 111, and the glue locking notch 113, or any two, or all of them.

[0070] In the embodiment, the shape of the metal lead 1 is flat; the plastic shell 2 is rectangular, and the plastic shell 2 is provided with a plurality of metal leads 1 on the two sides. The metal lead 1 penetrates the plastic shell 2 from inside to outside, and the glue locking structure such as the circular hole or the rectangular notch, the semirecessed glue locking groove 111, etc. processed on the metal lead 1 increases the bonding force between the metal and the plastic; the metal lead 1 is bent and vertically extends downward.

[0071] In some embodiments, as shown in Figure 7 and Figure 10 As shown, the bottom of the packaging cavity 21 is provided with a sink on the two symmetrical sides, the inner cavity lead segment 11 extends into the sink, and the upper surface of the inner cavity lead segment 11 is flush with the bottom surface of the packaging cavity 21. At this time, the matched inner cavity lead segment 11 can directly horizontally extend out from the side of the plastic shell 2, bend outside the plastic shell 2, and then vertically extend downward, or can penetrate the bottom of the plastic shell 2 and vertically extend downward from the back.

[0072] Optionally, as shown in Figure 6 and Figure 9As shown in the drawings, the upper surface of the inner cavity lead segment 11 protrudes from the bottom surface of the packaging cavity 21. At this time, the matched inner cavity lead segment 11 can directly horizontally extend from the side surface of the plastic shell 2, be bent vertically downward outside the plastic shell 2, or vertically downward extend from the back surface through the bottom of the plastic shell 2.

[0073] In some embodiments, as shown in the drawings, Figure 1 , Figure 5 and Figure 8 , the bottom of the packaging cavity 21 is provided with a step 22 on both sides, and the inner cavity lead segment 11 is attached to the step 22. At this time, the matched inner cavity lead segment 11 can directly horizontally extend from the side surface of the plastic shell 2, be bent vertically downward outside the plastic shell 2, or vertically downward extend from the back surface through the bottom of the plastic shell 2.

[0074] Optionally, the packaging cavity 21 is provided with a step 22, and the surface of the inner cavity lead segment 11 is higher than the surface of the step 22. At this time, the matched inner cavity lead segment 11 can directly horizontally extend from the side surface of the plastic shell 2, be bent vertically downward outside the plastic shell 2, or vertically downward extend from the back surface through the bottom of the plastic shell 2.

[0075] It is illustrated that the locking glue hole, the locking glue groove and the locking glue notch arranged on the inner cavity lead segment are matched with the position relationship that the inner cavity lead segment is flush or protrudes from the bottom surface of the packaging cavity and the surface of the step.

[0076] In some embodiments, the material of the plastic shell 2 is any one of LCP, LCP modified material, PPS, PS, PBT high-temperature resistant engineering plastic.

[0077] Further, as shown in the drawings, Figure 11 and Figure 12 , the double-row direct insertion packaging shell provided by the utility model includes a plastic shell 2, a metal lead 1, a metal ring (which can be selected or not selected) and a cap 4.

[0078] The plastic shell 2 and the cap 4 are both plastic materials, and the plastic is any one of LCP (LIQUID CRYSTAL POLYMER-liquid crystal polymer), LCP modified material, PPS (polyphenylene sulfide), PS (Polystyrene, abbreviated as PS) and PBT (polybutylene terephthalate) high-temperature resistant engineering plastic, and the plastic has more than 30% glass fiber as filler.

[0079] The metal lead 1 and the metal ring are made of any one of the following materials: Kovar alloy, copper and copper alloy, aluminum and aluminum alloy, etc. The metal ring is located between the cap 4 and the plastic shell 2. When the metal ring is not used, the cap 4 and the plastic shell 2 are bonded together by glue; when the metal ring is used, the metal ring can be fixed with the cap 4 and the plastic shell 2 by glue.

[0080] In the above embodiments, the description of each embodiment has its own focus, and the parts not described or recorded in a certain embodiment can be referred to the related description of other embodiments.

[0081] Based on the same inventive concept, as shown in Figure 11 and Figure 12 , the embodiment of the present application also provides a packaging device, comprising: a dual-in-line package shell, a chip 6 and a cap 4, the chip 6 is arranged in the packaging cavity 21 of the plastic shell 2; the chip 6 is directly connected with the metal lead 1 extending into the packaging cavity 21 through the bonding wire 5; and the cap 4 is arranged on the plastic shell 2.

[0082] The packaging device provided by the utility model has the advantages of simple manufacturing, low operation requirement, low manufacturing cost, good heat resistance, good moisture resistance and good sealing performance, and meets the use requirement of the device.

[0083] The manufacturing process of the packaging device comprises the following steps;

[0084] (1) manufacturing of the metal lead 1:

[0085] The metal lead 1 is processed by a mechanical processing mode, and the surface is subjected to chemical treatment to increase the bonding force with the plastic;

[0086] (2) manufacturing of the plastic shell 2:

[0087] An injection mold is manufactured;

[0088] The metal lead 1 is loaded into the injection mold, plastic is injected, and the plastic shell 2 wrapping the metal lead 1 is manufactured, so that the metal lead 1 and the plastic shell 2 are integrally injection molded.

[0089] After injection molding, the entire shell is plated with a nickel layer and a gold layer to manufacture a shell product.

[0090] (3) manufacturing of the plastic cap 4:

[0091] An injection mold is manufactured;

[0092] The plastic cap 4 is manufactured by using an injection molding process.

[0093] (4) production and manufacturing of the packaging device of the integrated circuit:

[0094] (a) installing the chip 6 on the inner bottom surface of the packaging cavity 21, and the method can be selected from soldering or gluing;

[0095] (b) from the electrode bonding gold wire to the surface of the gold-plated metal lead 1, the circuit interconnection is carried out;

[0096] (c) glue on the surface of the cap 4, bond on the upper surface of the plastic shell 2 (the middle glue layer 3), form a sealed cavity with sealing performance. Figure 11

[0097] (d) after inspection, test, make complete packaging device.

[0098] The above only the preferred embodiment of the present application has been described, and is not intended to limit the present application, any modification, equivalent replacement and improvement within the spirit and principles of the present application, etc. should be included in the protection scope of the present application.​

Claims

1. A dual in-line package housing, characterized by, The application relates to a plastic package shell (2) provided with a package cavity (21) for encapsulating a chip (6) on the front surface; and a metal lead (1) injection-molded on two symmetrical sides of the plastic package shell (2); the metal lead (1) has an inner cavity lead segment (11) and an outer lead segment (12); the inner cavity lead segment (11) penetrates the plastic package shell (2) upward and extends into the package cavity (21) and is attached to the bottom of the package cavity (21); the outer lead segment (12) vertically extends downward from the back surface of the plastic package shell (2). The inner cavity lead segment (11) is a bending segment; the inner cavity lead segment (11) has an inner cavity horizontal lead segment and a vertical lead segment connected in sequence; the inner cavity horizontal lead segment is perpendicular to the vertical lead segment; the inner cavity horizontal lead segment horizontally extends into the package cavity (21); and the vertical lead segment vertically extends downward from the bottom plate of the plastic package shell (2). The inner cavity lead segment (11) is a horizontal segment; the inner cavity lead segment (11) horizontally penetrates the wall of the plastic package shell (2) and horizontally extends from the side surface of the plastic package shell (2); and the outer lead segment (12) vertically extends downward from the side surface of the plastic package shell (2) and exceeds the bottom surface of the plastic package shell (2). The inner cavity lead segment (11) is provided with a locking hole (112) for locking glue.

2. The dual in-line package housing of claim 1, wherein, The inner cavity lead segment (11) is provided with a locking groove (111) for locking glue.

3. The dual in-line package housing of claim 1, wherein, The inner cavity lead segment (11) is further provided with locking notches (113) on both sides in the width direction for locking glue.

4. The dual in-line package housing of claim 2 or 3, wherein, The bottom of the package cavity (21) is provided with a sink on both symmetrical sides; the inner cavity lead segment (11) extends into the sink; and the upper surface of the inner cavity lead segment (11) is flush with the bottom surface of the package cavity (21).

5. The dual in-line package housing of claim 2 or 3, wherein, The bottom of the package cavity (21) is provided with a step (22) on both symmetrical sides; and the inner cavity lead segment (11) is attached to the step (22).

6. The dual in-line package housing of claim 2 or 3, wherein, The material of the plastic package shell (2) is any one of LCP, LCP modified material, PPS, PS and PBT high-temperature-resistant engineering plastic.

7. The dual in-line package housing of claim 1, wherein, The application relates to a dual-in-line package shell according to any one of claims 1-9; a chip (6) arranged in the package cavity (21) of the plastic package shell (2); the chip (6) is directly connected with the metal lead (1) extending into the package cavity (21) through a bonding wire (5); and a cap (4) arranged on the plastic package shell (2) to seal the chip (6) in the package cavity (21).

8. The dual in-line package housing of claim 1, wherein, The application relates to a plastic package shell (2) provided with a package cavity (21) for encapsulating a chip (6) on the front surface; and a metal lead (1) injection-molded on two symmetrical sides of the plastic package shell (2); the metal lead (1) has an inner cavity lead segment (11) and an outer lead segment (12); the inner cavity lead segment (11) penetrates the plastic package shell (2) upward and extends into the package cavity (21) and is attached to the bottom of the package cavity (21); the outer lead segment (12) vertically extends downward from the back surface of the plastic package shell (2).

9. The dual in-line package housing of claim 1, wherein, The inner cavity lead segment (11) is a bending segment; the inner cavity lead segment (11) has an inner cavity horizontal lead segment and a vertical lead segment connected in sequence; the inner cavity horizontal lead segment is perpendicular to the vertical lead segment; the inner cavity horizontal lead segment horizontally extends into the package cavity (21); and the vertical lead segment vertically extends downward from the bottom plate of the plastic package shell (2).

10. A packaged device, comprising: The inner cavity lead segment (11) is a horizontal segment; the inner cavity lead segment (11) horizontally penetrates the wall of the plastic package shell (2) and horizontally extends from the side surface of the plastic package shell (2); and the outer lead segment (12) vertically extends downward from the side surface of the plastic package shell (2) and exceeds the bottom surface of the plastic package shell (2). The inner cavity lead segment (11) is provided with a locking hole (112) for locking glue. The inner cavity lead segment (11) is provided with a locking groove (111) for locking glue. The inner cavity lead segment (11) is further provided with locking notches (113) on both sides in the width direction for locking glue. The bottom of the package cavity (21) is provided with a sink on both symmetrical sides; the inner cavity lead segment (11) extends into the sink; and the upper surface of the inner cavity lead segment (11) is flush with the bottom surface of the package cavity (21). The bottom of the package cavity (21) is provided with a step (22) on both symmetrical sides; and the inner cavity lead segment (11) is attached to the step (22). The material of the plastic package shell (2) is any one of LCP, LCP modified material, PPS, PS and PBT high-temperature-resistant engineering plastic. The application relates to a dual-in-line package shell according to any one of claims 1-9; a chip (6) arranged in the package cavity (21) of the plastic package shell (2); the chip (6) is directly connected with the metal lead (1) extending into the package cavity (21) through a bonding wire (5); and a cap (4) arranged on the plastic package shell (2) to seal the chip (6) in the package cavity (21). The application relates to a plastic package shell (2) provided with a package cavity (21) for encapsulating a chip (6) on the front surface; and a metal lead (1) injection-molded on two symmetrical sides of the plastic package shell (2); the metal lead (1) has an inner cavity lead segment (11) and an outer lead segment (12); the inner cavity lead segment (11) penetrates the plastic package shell (2) upward and extends into the package cavity (21) and is attached to the bottom of the package cavity (21); the outer lead segment (12) vertically extends downward from the back surface of the plastic package shell (2).

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