Semiconductor silicon wafer laser cutting equipment

Abstract

The utility model discloses semiconductor silicon wafer laser cutting equipment, and relates to the technical field of laser cutting, the semiconductor silicon wafer laser cutting equipment comprises a processing platform, an X-axis moving platform and a Y-axis moving platform are arranged in the middle of one side of the processing platform, the X-axis moving platform and the Y-axis moving platform are distributed in an X-axis and Y-axis crossed mode, a fixed mounting plate is arranged on the side, away from the processing platform, of the X-axis moving platform, and a mold is arranged in the fixed mounting plate; a fixed mounting plate is arranged in the middle of one side of the die, a positioning point used for visual grabbing is arranged on one side of the fixed mounting plate, a Z-axis lifting table is arranged on one side of the machining platform, a laser is longitudinally arranged on one side of the Z-axis lifting table in a sliding mode, and a three-dimensional galvanometer used for guiding laser beams to change laser focuses for cutting is fixedly arranged on one side of the laser. The problems that large-range cutting cannot be achieved, consistent cutting cannot be achieved due to light spot changes during cutting, the cutting reverse face collapses, even precision cutting cannot be achieved, and consequently chip failure is caused are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of laser cutting technology, in particular to a semiconductor silicon wafer laser cutting equipment. BACKGROUND

[0002] With the continuous development of semiconductor technology, the size of the chip is getting smaller and smaller, and the integration is getting higher and higher, and the requirement for wafer cutting technology is also increasingly strict. The traditional semiconductor silicon wafer laser cutting cannot achieve consistent cutting depth due to manual segmentation, and the segmentation accuracy is poor, and the production efficiency is low. And the traditional semiconductor silicon wafer laser cutting cannot change the shape of the cutting groove, and cannot achieve the production of the existing process. The traditional semiconductor silicon wafer laser cutting cannot achieve smooth cutting groove edge due to excessive heat, which will cause edge collapse phenomenon. The traditional semiconductor silicon wafer laser cutting cannot achieve high-precision positioning cutting, and the cutting precision is poor. The traditional semiconductor silicon wafer laser cutting will cause low chip yield due to high-temperature processing.

[0003] The traditional semiconductor silicon wafer cutting cannot achieve large-scale cutting, and the spot at the middle position and the edge position of the cutting has changes and cannot be cut consistently, and cannot achieve consistent vertical groove and horn groove at the edge, and the traditional semiconductor silicon wafer cutting will cause edge collapse phenomenon on the front and back of the cutting due to excessive heat, and cannot achieve smooth edge, and the traditional semiconductor silicon wafer cutting cannot achieve high-precision cutting alignment, and the cutting precision cannot be achieved, and the silicon wafer is processed by laser high temperature, which causes chip failure. CONTENT OF THE INVENTION

[0004] In order to improve the problems of unable to cut in a large range and unable to cut consistently due to changes in the spot during cutting, and unable to achieve precision cutting on the back, which leads to chip failure, the present application provides a semiconductor silicon wafer laser cutting equipment.

[0005] The semiconductor silicon wafer laser cutting equipment provided by the present application adopts the following technical scheme:

[0006] A semiconductor silicon wafer laser cutting equipment, comprising a machining platform, an X-axis moving platform and a Y-axis moving platform are arranged in the middle of one side of the machining platform and cross-distributed with X-axis and Y-axis, a positioning plate is arranged on the side of the X-axis moving platform away from the machining platform, a mold is arranged in the positioning plate, a positioning plate is arranged in the middle of one side of the mold, and a positioning point for visual grabbing is arranged on one side of the positioning plate.

[0007] A Z-axis lifting table is arranged on one side of the machining platform, a laser is longitudinally slidably arranged on one side of the Z-axis lifting table, and a three-dimensional galvanometer for guiding laser beam and changing laser focal point for cutting is fixed on one side of the laser.

[0008] By adopting the technical scheme, the semiconductor silicon wafer laser cutting equipment realizes three-dimensional accurate movement of the X-axis, the Y-axis and the Z-axis, so that the laser can be accurately positioned to any position of the silicon wafer for cutting, and the cutting accuracy and efficiency are improved.

[0009] Preferably, one side of the machining platform is provided with a computer operating platform for programming control of cutting and real-time data observation.

[0010] By adopting the technical scheme, the computer operating platform provides an intuitive cutting program editing interface and real-time data monitoring function for the operator, so that the cutting process is more controllable, and problems occurring in the cutting process can be found and handled in time.

[0011] Preferably, a machining electrical cabinet is fixedly arranged on the side of the machining platform away from the X-axis moving platform, and the machining electrical cabinet supports the entire device.

[0012] By adopting the technical scheme, the machining electrical cabinet provides stable support and power supply for the entire laser cutting equipment, ensuring normal operation and long-term stability of the equipment.

[0013] Preferably, a second inner cylinder is fixedly arranged on one side of the computer operating platform, and an arc-shaped support cylinder is slidably arranged on the side of the second inner cylinder away from the computer operating platform.

[0014] By adopting the technical scheme, the sliding design of the second inner cylinder and the arc-shaped support cylinder enables the position of the computer operating platform to be adjusted according to the height and habit of the operator, improving the comfort and convenience of operation.

[0015] Preferably, a first inner cylinder is slidably arranged on one side of the arc-shaped support cylinder, an outer cylinder is slidably arranged on the side of the first inner cylinder away from the arc-shaped support cylinder, and a rotating shaft is rotatably arranged on the side of the outer cylinder away from the first inner cylinder, and the rotating shaft is fixedly arranged on one side of the machining electrical cabinet.

[0016] By adopting the technical scheme, the combined design of the first inner cylinder, the outer cylinder and the rotating shaft realizes flexible adjustment of part of the structure of the equipment, facilitating maintenance and maintenance of the equipment, and improving the adaptability and versatility of the equipment.

[0017] Preferably, a protective cover is fixedly arranged on the side of the machining platform away from the machining electrical cabinet, a safety door is arranged on one side of the protective cover, and an observation window is formed in the middle of the safety door.

[0018] By adopting the technical scheme, the design of the protective cover and the safety door effectively protects the personal safety of the operator, preventing the operator from being injured by splashes or radiation generated during the laser cutting process. The observation window is arranged to facilitate the operator to observe the cutting process in real time, ensuring the cutting quality.

[0019] Preferably, the mounting plate has a mounting groove for clamping the workpiece.

[0020] By adopting the above technical solution, the design of the mounting slot enables the workpiece to be firmly fixed on the mounting plate, ensuring the stability and accuracy of the workpiece during the cutting process and improving the cutting quality.

[0021] Preferably, both the X-axis moving platform and the Y-axis moving platform are provided with drag chains on one side, and a partition is provided between the X-axis moving platform and the Y-axis moving platform for separation.

[0022] By adopting the above technical solutions, the cable chain design effectively protects the cables and air pipes on the moving platform, preventing them from being damaged or tangled during movement. The partition design avoids mutual interference between the X-axis and Y-axis moving platforms, ensuring the normal operation of the equipment and cutting accuracy.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] 1. By utilizing the X-axis moving platform, Y-axis moving platform, and Z-axis lifting platform, the cutting accuracy and cutting size are increased. Since the three are interconnected, the platform size can be increased to increase the cutting size. Furthermore, by using a laser, the processing temperature is reduced, and the chipping phenomenon during cutting is reduced. The chipping on the front edge is within 10um, and the chipping on the back edge is within 50um. At the same time, the low temperature during laser cutting will greatly increase the yield of the cut chips.

[0025] 2. By leveraging the linkage of the X-axis moving platform, Y-axis moving platform, and Z-axis lifting platform controlled by computer operating console software, it is possible to ensure that every cutting point is vertical. The three-dimensional dynamic galvanometer controls the shape change of the cutting groove, enabling the cutting of vertical grooves and flared grooves that require specific processes.

[0026] 3. The camera is controlled by a computer console to position and guide the cutting of silicon wafers. After automatic identification, the laser cutting is positioned and the cutting range is 200mm*200mm. The device is equipped with its own computer system, and users can easily use the system's built-in software to draw cutting patterns or directly import pre-designed DXF / PLT / AI files from external sources to achieve personalized processing, saving time and greatly improving cutting efficiency. Attached Figure Description

[0027] Figure 1 This is an overall schematic diagram of this application;

[0028] Figure 2 This is a diagram of the internal structure of the cutting equipment described in this application;

[0029] Figure 3 This is a schematic diagram of the moldless application.

[0030] Figure 4 This is a schematic diagram of the mounting fixture for this application;

[0031] Figure 5 This is a schematic diagram of the semiconductor silicon mold of this application.

[0032] Reference numerals: 1. Machining platform; 2. X-axis moving platform; 3. Y-axis moving platform; 4. Z-axis lifting platform; 5. Laser; 6. 3D galvanometer; 7. Mold; 8. Mounting plate;

[0033] 9. Mounting slot; 10. Computer operating console; 11. Protective cover; 12. Positioning point; 13. Rotating shaft; 14. Outer cylinder; 15. First inner cylinder; 16. Arc-shaped support cylinder;

[0034] 17. Safety door; 18. Processing electrical cabinet; 19. Cable chain; 20. Partition; 21. Observation window; 22. Second inner cylinder. Detailed Implementation

[0035] The following is in conjunction with the appendix Figures 1-5 This application will be described in further detail.

[0036] This application discloses a semiconductor silicon wafer laser cutting device.

[0037] Reference Figure 1 , Figure 2 A semiconductor silicon wafer laser cutting equipment includes a processing platform 1 and a processing electrical cabinet 18 fixedly installed at the lower end of the processing platform 1. The processing electrical cabinet 18 is located on the ground to support the entire device. A protective cover 11 for dust protection is fixedly installed on the outer periphery of the processing platform 1 away from the processing electrical cabinet 18. A safety door 17 with good sealing performance is opened in the middle of one side surface of the protective cover 11. An observation window 21 for easy observation of the internal cutting situation is opened in the middle of the safety door 17.

[0038] Reference Figure 1 , Figure 2 On one side surface of the processing electrical cabinet 18, a damped rotating shaft 13 is fixedly connected to it via a connector. The rotating end of the rotating shaft 13 is fixedly connected to the outer cylinder 14, so that the rotating shaft 13 can drive the outer cylinder 14 to rotate. However, the rotation angle is limited by the processing electrical cabinet 18, and only one 180-degree rotation can be achieved. On the side of the outer cylinder 14 away from the rotating shaft 13, a first inner cylinder 15 is slidably arranged. The diameter of the first inner cylinder 15 is smaller than the diameter of the outer cylinder 14, so that the first inner cylinder 15 can retract into the inner cavity of the outer cylinder 14. When the first inner cylinder 15 slides in the outer cylinder 14, it has a certain damping and also mutually limits each other.

[0039] ReferenceFigure 1 , Figure 2 The first inner cylinder 15 is slidably disposed with the arc-shaped support cylinder 16 on the side away from the outer cylinder 14. Similarly, the diameter of the first inner cylinder 15 is smaller than the diameter of the arc-shaped support cylinder 16, and the first inner cylinder 15 and the arc-shaped support cylinder 16 limit each other and have damping when sliding. The second inner cylinder 22 is slidably disposed at the upper end of the arc-shaped support cylinder 16. The second inner cylinder 22 and the arc-shaped support cylinder 16 are disposed in the same way as the arc-shaped support cylinder 16 and the first inner cylinder 15. The side of the second inner cylinder 22 away from the arc-shaped support cylinder 16 is fixedly connected to the computer operating table 10 through a connector, so as to provide stable support when the operator operates the computer operating table 10.

[0040] The processing platform 1 is located in the center of the equipment and is responsible for carrying the cutting operation, while the processing electrical cabinet 18 is stably supported on the ground, providing power and control support for the entire equipment. The protective cover 11 is designed to effectively isolate the dust generated during the cutting process, ensuring a clean and safe working environment. The observation window 21 on the safety door 17 allows the staff to monitor the cutting process without damaging the protection.

[0041] A flexible support structure is constructed by nesting the outer cylinder 14, the first inner cylinder 15, the arc-shaped support cylinder 16, and the second inner cylinder 22. A stable and adjustable connection from the processing electrical cabinet 18 to the computer operating table 10 is achieved through the damped rotating shaft 13 and the mutual expansion and contraction connections between the structures. In particular, the outer cylinder 14 is connected to the processing electrical cabinet 18 through the rotating shaft 13 and can rotate 180 degrees in a restricted manner, which facilitates the adjustment of its position according to different operating requirements. The first inner cylinder 15 slides inside the outer cylinder 14, while the arc-shaped support cylinder 16 slides outside the first inner cylinder 15. Finally, the second inner cylinder 22 slides on the arc-shaped support cylinder 16. This series of sliding connections not only has damping to ensure stability, but also limits each other to prevent excessive movement.

[0042] This design greatly enhances the flexibility and adaptability of the equipment, allowing staff to easily adjust the position and angle of the computer console 10 according to its location, workspace requirements, or personal operating habits, ensuring convenient and comfortable operation. At the same time, the damping mechanism effectively reduces the risk of accidental movement, ensuring stability and safety during operation. This not only improves the practicality of the equipment but also reflects meticulous consideration for the operating experience of staff.

[0043] Reference Figures 2-5A Y-axis moving platform 3 is fixedly installed in the middle of one side of the upper end of the processing platform 1. A drag chain 19 for motor power supply is installed on one side of the Y-axis moving platform 3. A partition 20 is fixedly installed in the middle of the upper end of the Y-axis moving platform 3. The side of the partition 20 away from the Y-axis moving platform 3 is fixedly connected to the middle of the lower end of the X-axis moving platform 2. Thus, the Y-axis moving platform 3 and the X-axis moving platform 2 are arranged in an X-axis and Y-axis cross distribution and stacked on top of each other. The middle of the side of the X-axis moving platform 2 away from the Y-axis moving platform 3 is fixedly connected to the lower surface of the mold 7. A mounting plate 8 is fixedly installed in the middle of the surface of the mold 7 away from the X-axis moving platform 2. A mounting groove 9 is opened inside the mounting plate 8 to clamp the workpiece. The inner diameter of the mounting groove 9 is the same as the outer diameter of the workpiece. A positioning point 12, i.e., a MARK point, for visual gripping is set in the middle of the mold 7 at the same position as the mounting plate 8 to achieve automatic positioning.

[0044] Reference Figures 2-5 The upper surface of the processing platform 1 is fixedly connected to one side of the Z-axis lifting platform 4, and the moving end of the Z-axis lifting platform 4 is fixedly connected to the laser 5 through a connector, so that when the moving end of the Z-axis lifting platform 4 moves, it can drive the laser 5 to move longitudinally. The laser head of the laser 5 is fixedly connected to the three-dimensional galvanometer 6, so that the three-dimensional galvanometer 6 guides the laser beam emitted by the laser 5, thereby changing the focus of the camera and the laser to cut.

[0045] It should be noted that the X-axis moving platform 2, Y-axis moving platform 3, Z-axis lifting platform 4, laser 5, computer operating console 10, and 3D galvanometer 6 are all existing technologies, and their structural principles will not be elaborated here. The X-axis moving platform 2, Y-axis moving platform 3, and Z-axis lifting platform 4 all contain linear motors and require connection to a PLC controller. Furthermore, laser 5 can be an infrared femtosecond ultrafast laser, but since it is existing technology, its structural principles will not be detailed here.

[0046] The coordinated movement of the X-axis moving platform 2, Y-axis moving platform 3, and Z-axis lifting platform 4 is controlled by a PLC controller to achieve precise positioning and movement of the mold 7 and the workpiece fixed on the mold 7 in three-dimensional space. The Y-axis moving platform 3 drives the X-axis moving platform 2 and the mold 7 to move along the Y-axis in the horizontal plane, while the X-axis moving platform 2 drives the mold 7 to move along the X-axis, achieving precise positioning in a two-dimensional plane. At the same time, the Z-axis lifting platform 4 drives the laser 5 and its connected three-dimensional galvanometer 6 to move up and down in the vertical direction. The three-dimensional galvanometer 6 guides the laser beam emitted by the laser 5 to be precisely focused on the workpiece, and the cutting operation is carried out according to the preset cutting path. The mounting slot 9 on the mounting plate 8 ensures the stable clamping of the workpiece, while the positioning point 12 (MARK point) is used for visual grasping to achieve automatic positioning of the workpiece, improving processing accuracy and efficiency.

[0047] By precisely moving and positioning in three-dimensional space, combined with laser cutting technology, efficient and high-precision cutting of workpieces can be achieved. Meanwhile, the setting of the mounting slot 9 and positioning point 12 further improves the accuracy and stability of the processing. Furthermore, the application of a PLC controller makes the entire processing process more automated and intelligent, reducing the difficulty and error of manual operation, and improving production efficiency and product quality.

[0048] The implementation principle of a semiconductor silicon wafer laser cutting equipment in this application embodiment is as follows: The semiconductor silicon wafer laser cutting process involves placing the silicon wafer product onto the mounting plate 8 set at the center of the semiconductor silicon wafer mold 7, and then controlling the X-axis moving platform 2 and Y-axis moving platform 3 to move via PLC, thereby adjusting the position of the mold 7 so that the positioning point 12, also known as the MARK point, can be grasped by the vision function and thus achieve automatic positioning.

[0049] The cutting content is then linked to the cutting content through the software on the computer operating console 10. The laser beam emitted by the laser 5 is guided by the swing of the three-dimensional galvanometer 6 to change the laser focus for cutting. The cutting drawing file is adjusted in the software data APP in the computer operating console 10 to change the rotation direction. The focus of the laser and the camera is changed by the Z-axis lifting platform 4. After being processed by the computer operating console 10, it is then transmitted to the three-dimensional galvanometer 6 for cutting. The whole process is completed under linked cutting, which greatly increases the cutting accuracy and cutting difficulty.

[0050] The 200mm*200mm cutting was completed under the linkage of a linear motor, with a cutting accuracy of ±0.005mm. An infrared femtosecond ultrafast laser 5 with a wavelength of about 1064nm was used. Under specific conditions, the cutting depth and groove shape can be controlled by adjusting the output power of the laser 5 and the cutting speed. The higher the output power of the laser 5 and the faster the cutting speed, the deeper the cutting depth; conversely, the lower the output power and the faster the cutting speed, the shallower the cutting depth.

[0051] Placing a high-power fume purifier near the cutting position effectively removes smoke and dust, achieving a purification rate of 99.99% for 0.3-micron particles. This enables the semiconductor silicon wafer laser cutting equipment to not only achieve clean processing with low noise, no pollution, and high energy efficiency, but also to realize precise and automated production, making the cutting methods more diversified and meeting higher quality requirements.

[0052] The above are merely optional embodiments of this disclosure and are not intended to limit this disclosure. Various modifications and variations can be made to this disclosure by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A semiconductor silicon wafer laser cutting device, characterized in that: The system includes a processing platform (1), on one side of the processing platform (1) there is an X-axis moving platform (2) and a Y-axis moving platform (3) that are intersected by the X-axis and Y-axis. On the side of the X-axis moving platform (2) away from the processing platform (1) there is a mold (7). On one side of the mold (7) there is a mounting plate (8). On one side of the mounting plate (8) there is a positioning point (12) for visual grasping. The processing platform (1) is provided with a Z-axis lifting platform (4) on one side, and a laser (5) is longitudinally slidably arranged on one side of the Z-axis lifting platform (4). A three-dimensional galvanometer (6) is fixed on one side of the laser (5) to guide the laser beam and change the laser focus for cutting.

2. The semiconductor silicon wafer laser cutting equipment according to claim 1, characterized in that: The processing platform (1) is provided with a computer operating console (10) on one side for program control of cutting and real-time data observation.

3. The semiconductor silicon wafer laser cutting equipment according to claim 2, characterized in that: The machining platform (1) is fixedly equipped with a machining electrical cabinet (18) on the side away from the X-axis moving platform (2) for supporting the entire device.

4. The semiconductor silicon wafer laser cutting equipment according to claim 2, characterized in that: A second inner cylinder (22) is fixedly provided on one side of the computer operating table (10), and an arc-shaped support cylinder (16) is slidably provided on the side of the second inner cylinder (22) away from the computer operating table (10).

5. The semiconductor silicon wafer laser cutting equipment according to claim 4, characterized in that: The first inner cylinder (15) is slidably disposed on one side of the arc-shaped support cylinder (16), and the outer cylinder (14) is slidably disposed on the side of the first inner cylinder (15) away from the arc-shaped support cylinder (16). The outer cylinder (14) is rotatably disposed on the side of the outer cylinder (14) away from the first inner cylinder (15) and is fixed to the side of the processing electrical cabinet (18).

6. The semiconductor silicon wafer laser cutting equipment according to claim 1, characterized in that: The processing platform (1) is fixedly provided with a protective cover (11) on the side away from the processing electrical cabinet (18). A safety door (17) is provided on one side of the protective cover (11), and an observation window (21) is provided in the middle of the safety door (17).

7. The semiconductor silicon wafer laser cutting equipment according to claim 1, characterized in that: The mounting plate (8) has a mounting groove (9) for clamping the workpiece.

8. The semiconductor silicon wafer laser cutting equipment according to claim 1, characterized in that: Both the X-axis moving platform (2) and the Y-axis moving platform (3) are provided with drag chains (19) on one side, and a partition (20) is provided between the X-axis moving platform (2) and the Y-axis moving platform (3) for separation.

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