Fixing device based on single IC Bump characteristic test
By combining a multi-directional drive mechanism and a limiting slot, the problem of unstable fixing and inaccurate positioning of traditional chip fixing devices in the testing of highly integrated chips is solved, realizing stable chip fixing and accurate testing, and improving testing efficiency and reliability.
Patent Information
- Application Number
- CN202520534307.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-03-25
AI Technical Summary
Traditional chip mounting devices suffer from problems such as unstable fixation, inaccurate positioning, or complex operation in the testing of highly integrated, small-sized chips. This is especially true when testing the single IC bump characteristics, where stability and accuracy are required to be even higher, and the device may damage the chip or cause it to move.
A fixing device based on a multi-directional drive mechanism and a limiting groove is adopted. Through the combination of limiting components, guide grooves and negative pressure adsorption, the chip is stably fixed and accurately positioned. The cooperation of the limiting block and the limiting groove, as well as the negative pressure adsorption of the air guide groove, ensures that the chip does not move or get damaged during the test.
It achieves efficient and stable chip fixation, improves the accuracy and reliability of testing, simplifies the operation process, adapts to chips of different sizes and materials, and shortens test preparation time.
Smart Images
Figure CN223889835U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of integrated circuit manufacturing equipment, and more particularly to a fixed device for single IC bump characteristic testing. Background Technology
[0002] In the field of integrated circuit (IC) manufacturing, with the continuous increase in chip integration and the shrinking of chip size, the requirements for chip testing technology are becoming increasingly stringent. Single IC bump characteristic testing is an important part of chip testing, used to evaluate key indicators such as electrical performance, mechanical strength, and reliability of individual bumps on the chip. However, the prerequisite for performing such precise testing is that the chip must be stably and accurately fixed on the testing equipment.
[0003] Traditional chip mounting methods typically employ clamping, adsorption, or mechanical positioning to secure chips. However, these methods often suffer from instability, inaccurate positioning, or operational complexity when dealing with highly integrated, small-sized chips. This is especially true when performing single-IC bump characteristic testing, which requires testing individual bumps on the chip, thus demanding even higher stability and accuracy from the mounting device.
[0004] Traditional clamping methods may damage the chip or bumps due to excessive clamping force, or cause the chip to move during testing due to insufficient clamping force. While adsorption methods can avoid the influence of clamping force on the chip, the adsorption effect may be poor for chips with certain surface characteristics or special materials. Mechanical positioning methods, on the other hand, require precise mechanical structures and complex operating procedures, increasing the difficulty and cost of testing.
[0005] Therefore, the industry urgently needs a new type of single IC bump characteristic testing fixing device. This device needs to have the following characteristics: it can stably and accurately fix the chip to avoid movement or damage during the test; it is simple and convenient to operate, improving test efficiency; and it is highly adaptable to handle chips of different sizes, shapes and materials. Utility Model Content
[0006] To address the problems existing in the prior art, this utility model provides a fixing device based on single IC bump characteristic testing, comprising:
[0007] The upper cover is provided with a guide groove and a moving track;
[0008] A limiting component is installed on the upper cover through the guide groove, and a connecting device is provided on the limiting component at the position corresponding to the moving track;
[0009] A multi-directional drive mechanism is provided on the upper cover. Multiple multi-directional drive mechanisms are provided, and the multiple multi-directional drive mechanisms are respectively connected to the limiting member and the connecting device. The multi-directional drive mechanism drives the limiting member to move in the guide groove, and the multi-directional drive mechanism drives the connecting device to move on the moving track.
[0010] The upper cover has a limiting groove, and a chip element is disposed in the limiting groove. When the limiting member moves in the guide groove, the limiting member pushes the chip element to be limited and shielded in the limiting groove.
[0011] Optionally, in some embodiments of this application, two limiting members are provided, the two limiting members are arranged opposite to each other, and a limiting block is provided on one of the limiting members on one side facing the other limiting member, the limiting block being located in the limiting groove;
[0012] When the limiting member moves on the upper cover, the limiting block pushes the chip element to move in the limiting groove; when the limiting blocks on the two limiting members abut against each other, the chip element is abutted and fixed by the limiting block and the limiting groove.
[0013] Optionally, in some embodiments of this application, an air guide groove is provided on one side of the limiting groove. When the chip element is abutted by the limiting block and the limiting groove, the air guide groove is located at the bottom of the chip element, and the air guide groove is connected to the limiting groove through an air guide hole. The air guide groove is connected to an air pump, and the air pump performs negative pressure adsorption on the chip element through the air guide groove.
[0014] Optionally, in some embodiments of this application, a fixing member is provided on the limiting member at the position corresponding to the guide groove, the fixing member is located in the guide groove and the fixing member moves in the guide groove.
[0015] Optionally, in some embodiments of this application, four guide grooves are provided, and the four guide grooves are respectively located at both ends of the two limiting members. The guide grooves have an arc-shaped structure. When the limiting members move in the guide grooves, the two limiting members move closer to each other under the guidance of the guide grooves, and the limiting members limit the chip element.
[0016] Optionally, in some embodiments of this application, the connecting device includes:
[0017] A pusher is disposed on the moving track, and the pusher is movably connected to the limiting member through the fixing member;
[0018] A paddle is disposed on the pusher and is connected to the multi-directional drive mechanism, which pushes the paddle to move the pusher.
[0019] Optionally, in some embodiments of this application, a groove is provided on the pusher corresponding to the position of the fixing member, and the fixing member is located in the groove. When the pusher pushes the limiting member, the fixing member slides in the groove.
[0020] Optionally, in some embodiments of this application, a catch is provided between the paddle and the pusher, a positioning groove is provided on the pusher corresponding to the position of the catch, and a buffer mechanism is provided on the paddle corresponding to the position of the catch, and the catch moves in the positioning groove through the buffer mechanism.
[0021] Optionally, in some embodiments of this application, pushers are provided at both ends of the paddle, and both pushers are movably connected to the paddle via latches.
[0022] Optionally, in some embodiments of this application, three multi-directional drive mechanisms are provided, and the three multi-directional drive mechanisms are respectively connected to two of the limiting members and the paddle, and the multi-directional drive mechanisms push the limiting members and the paddle.
[0023] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0024] 1. Through a precise mechanical structure and multi-directional drive mechanism, the chip is efficiently and stably fixed. The design of the limiting components and connecting devices ensures that the chip will not move or shake during the test, thereby improving the accuracy and reliability of the test.
[0025] 2. The combination of limiting grooves and limiting blocks, along with the application of air guide grooves and negative pressure adsorption, further enhances the chip's fixation stability and ensures the accurate execution of single IC bump characteristic tests.
[0026] 3. The chip can be quickly fixed and released by the multi-directional drive mechanism, which greatly shortens the test preparation time. Attached Figure Description
[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0028] Figure 1This is a schematic diagram of the overall structure of the fixing device provided in the embodiments of this application in the first state;
[0029] Figure 2 This is a schematic diagram of the overall structure of the fixing device provided in the embodiments of this application in a second state;
[0030] Figure 3 This is a schematic diagram of the overall structure of the connecting device provided in the embodiments of this application;
[0031] Figure 4 This is a side cross-sectional view of the fixing device provided in an embodiment of this application.
[0032] Explanation of reference numerals in the attached figures:
[0033] 100. Top cover; 110. Guide groove; 120. Moving track; 130. Limiting groove; 140. Air guide groove; 200. Limiting component; 210. Limiting block; 220. Fixing component; 300. Multi-directional drive mechanism; 400. Connecting device; 410. Pushing component; 411. Slide groove; 412. Positioning groove; 420. Paddle; 430. Locking lug; 440. Buffer mechanism; 500. Chip element. Detailed Implementation
[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this application. It is understood that the accompanying drawings are provided for reference and illustration only, and are not intended to limit this application. The connection relationships shown in the accompanying drawings are only for clear description and do not limit the connection method.
[0035] Specifically, such as Figure 1-4 As shown in the embodiment of this application, a fixing device based on single IC bump characteristic testing is provided. This device is used to fix a chip component 500, facilitating bump characteristic testing of the chip component 500. The device includes an upper cover 100 and a limiting member 200. The limiting member 200 is disposed on the upper cover 100 and works with the upper cover 100 to fix the chip component 500. The specific structure includes:
[0036] A guide groove 110 is provided on the upper cover 100. The guide groove 110 is set in conjunction with the limiting member 200. In this embodiment of the application, four guide grooves 110 are provided. The four guide grooves 110 are respectively set at the four corners of the upper cover 100. The overall shape of the four guide grooves 110 is set as a quarter-circle arc structure.
[0037] A limiting member 200 is provided at the position corresponding to the guide groove 110. In this embodiment, two limiting members 200 are provided. The two limiting members 200 are arranged opposite to each other on the upper cover 100, and the two ends of the two limiting members 200 are set at the positions corresponding to their guide grooves 110. A fixing member 220 is provided on the limiting member 200 at the position corresponding to the guide groove 110. The fixing member 220 can move within the guide groove 110, so that the movement position of the two limiting members 200 in this embodiment is limited by the position of the guide groove 110. At the same time, due to the arc shape of the guide groove 110, the two limiting members 200 can move through the guide groove 110, which facilitates the limiting members 200 to limit the chip element 500.
[0038] Specifically, a limiting block 210 is provided on the limiting member 200 in the direction of facing another limiting member 200. In this embodiment, two limiting blocks 210 are provided on the limiting member 200, and the two limiting blocks 210 are arranged relatively parallel to each other. The setting of the limiting block 210 facilitates the fixing of the chip element 500. The specific fixing process is as follows:
[0039] A limiting groove 130 is formed on the upper cover 100 at the position corresponding to the limiting block 210. The chip element 500 can be placed in the limiting groove 130. The limiting groove 130 is a long strip structure. The limiting groove 130 and the limiting member 200 are set perpendicularly to each other. The width of the limiting groove 130 is greater than the width of the limiting block 210, which makes it easy to place the limiting block 210 in the limiting groove 130. Since the limiting member 200 moves through the guide groove 110 in this embodiment, the chip element 500 is in the limiting groove 130. During the movement of the limiting member 200, the limiting block 210 can push the chip element 500 to be limited and shielded in the limiting groove 130.
[0040] During the pushing process, when the two opposing limit blocks 210 abut against each other, the limit member 200 cannot continue to move. In this situation, the chip element 500 is simultaneously abutted by the limit block 210 and the limit groove 130. One limit block 210 abuts against one side of the chip element 500, and the other limit block 210 abuts against the other side of the chip element 500.
[0041] By having the limit blocks 210 abut against each other, damage to the chip element 500 can be avoided due to excessive displacement of the limit blocks 210.
[0042] In this embodiment of the application, an air guide groove 140 is also provided on the upper cover 100. The air guide groove 140 is located on one side of the limiting groove 130, and an air guide hole is connected between the air guide groove 140 and the limiting groove 130. The air guide groove 140 is connected to the limiting groove 130 through the air guide hole. When the chip element 500 is abutted by the limiting block 210 and the limiting groove 130, the air guide groove 140 is located at the bottom of the chip element 500. The end of the air guide groove 140 away from the limiting groove 130 is connected to the air pump, so that the air pump can perform negative pressure adsorption on the chip element 500 through the air guide groove 140.
[0043] In the above process, the movement of the limiting member 200 is mainly achieved through the multi-directional drive mechanism 300, specifically as follows:
[0044] Multi-directional drive mechanisms 300 are respectively provided on the outer side of the two limiting members 200. The output end of the multi-directional drive mechanism 300 abuts against the limiting member 200, so that when the multi-directional drive mechanism 300 is driven, it can push the limiting member 200 to move along the guide groove 110, which facilitates the fixing of the chip element 500.
[0045] In the above, the multi-directional drive mechanism 300 includes a linear driver, and the output end of the linear driver is connected to the limiting member 200.
[0046] Meanwhile, in this embodiment, to ensure the stable and synchronous operation of the limiting member 200, a connecting device 400 is provided on one side of the two limiting members 200. The connecting device 400 mainly includes a pusher 410 and a lever 420. The pusher 410 is disposed on the moving track 120 on the upper cover 100, so that the pusher 410 can move on the moving track 120. Two pushers 410 are provided on the upper cover 100, and the two pushers 410 are respectively connected to the limiting member 200 through the guide groove 110. Specifically:
[0047] Since the limiting member 200 moves within the guide groove 110 via the fixing member 220, and the fixing member 220 is also connected to the push member 410, the push member 410 has a sliding groove 411 corresponding to the moving position of the fixing member 220, and the fixing member 220 is located within the sliding groove 411. When the push member 410 pushes the limiting member 200, the fixing member 220 slides within the sliding groove 411, facilitating the movement of the limiting member 200.
[0048] A lever 420 is provided on the pusher 410 at a position away from the limiting member 200. In this embodiment of the application, one lever 420 is provided, such that both ends of the lever 420 are connected to the pusher 410. A latch 430 is provided between the lever 420 and the pusher 410, and both pushers 410 are movably connected to the lever 420 through the latch 430.
[0049] The connection process for this activity is as follows:
[0050] A positioning groove 412 is provided on the pusher 410 at the position corresponding to the latch 430. The positioning groove 412 is used to accommodate and move the latch 430. A buffer mechanism 440 is provided on the latch 430 at the end facing the lever 420. The latch 430 moves in the positioning groove 412 through the buffer mechanism 440.
[0051] Meanwhile, a multi-directional drive mechanism 300 is also provided on the paddle 420. The multi-directional drive mechanism 300 is connected to the paddle 420. The multi-directional drive mechanism 300 pushes the paddle 420 to move, so that the paddle 420 can drive the pusher 410 to move, and then drive the limiter 200 to move.
[0052] With the above structure, when the paddle 420 and the pusher 410 are moved, the slide groove 411 on the pusher 410 moves by the movement of the fixing member 220, thus completing the release and limiting process of the chip element 500.
[0053] Specifically:
[0054] During the limiting process, the corresponding chip component 500 to be measured is placed in the limiting groove 130, and three multi-directional drive mechanisms 300 are activated simultaneously. During the operation of the three multi-directional drive mechanisms 300, two multi-directional drive mechanisms 300 push the limiting member 200 to move linearly. The position of the movement is limited by the position of the guide groove 110. One multi-directional drive mechanism 300 pushes the lever 420, so that the latches 430 at both ends of the lever 420 enter the positioning groove 412, which facilitates the movement of the pusher 410. The chip element 500 moves on the track 120. When the limiting blocks 210 on the two limiting members 200 abut against each other, the movement stops. At this time, the chip element 500 is limited in the limiting groove 130 to achieve a fixed effect. Alternatively, when the limiting member 200 moves, the limiting block 210 directly abuts against the chip element 500. At the same time, during the limiting process, the air at the bottom of the chip element 500 is discharged through the air guide hole and air guide groove 140 by the start of the air pump, which facilitates the formation of negative pressure and fixes and adsorbs the chip element 500.
[0055] During the release process, the air pump stops running, and the chip element 500 is released within the limiting groove 130 by the reverse operation of the three multi-directional drive mechanisms 300.
[0056] The above embodiments are only used to illustrate the technical methods of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical methods of this utility model without departing from the spirit and scope of the technical methods of this utility model.
Claims
1. A fixing device based on single IC bump characteristic testing, characterized in that, include: The upper cover is provided with a guide groove and a moving track; A limiting component is installed on the upper cover through the guide groove, and a connecting device is provided on the limiting component at the position corresponding to the moving track; A multi-directional drive mechanism is provided on the upper cover. Multiple multi-directional drive mechanisms are provided, and the multiple multi-directional drive mechanisms are respectively connected to the limiting member and the connecting device. The multi-directional drive mechanism drives the limiting member to move in the guide groove, and the multi-directional drive mechanism drives the connecting device to move on the moving track. The upper cover has a limiting groove, and a chip element is disposed in the limiting groove. When the limiting member moves in the guide groove, the limiting member pushes the chip element to be limited and shielded in the limiting groove.
2. The fixing device based on single IC bump characteristic testing according to claim 1, characterized in that, Two limiting members are provided, and the two limiting members are arranged opposite to each other. A limiting block is provided on one of the limiting members on one side facing the other limiting member, and the limiting block is located in the limiting groove. When the limiting member moves on the upper cover, the limiting block pushes the chip element to move in the limiting groove; when the limiting blocks on the two limiting members abut against each other, the chip element is abutted and fixed by the limiting block and the limiting groove.
3. The fixing device based on single IC bump characteristic testing according to claim 2, characterized in that, An air guide groove is provided on one side of the limiting groove. When the chip element is abutted by the limiting block and the limiting groove, the air guide groove is located at the bottom of the chip element. The air guide groove is connected to the limiting groove through the air guide hole. The air guide groove is connected to the air pump. The air pump performs negative pressure adsorption on the chip element through the air guide groove.
4. The fixing device based on single IC bump characteristic testing according to claim 2, characterized in that, The limiting member is provided with a fixing member at the position corresponding to the guide groove. The fixing member is located in the guide groove and can move within the guide groove.
5. The fixing device based on single IC bump characteristic testing according to claim 4, characterized in that, The guide groove is provided in four parts, which are respectively located at both ends of the two limiting members. The guide groove has an arc-shaped structure. When the limiting member moves in the guide groove, the two limiting members move closer to each other under the guidance of the guide groove, and the limiting member limits the chip element.
6. The fixing device based on single IC bump characteristic testing according to claim 5, characterized in that, The connecting device includes: A pusher is disposed on the moving track, and the pusher is movably connected to the limiting member through the fixing member; A paddle is disposed on the pusher and is connected to the multi-directional drive mechanism, which pushes the paddle to move the pusher.
7. The fixing device based on single IC bump characteristic testing according to claim 6, characterized in that, The pusher has a groove corresponding to the position of the fixing member. The fixing member is located in the groove. When the pusher pushes the limiting member, the fixing member slides in the groove.
8. The fixing device based on single IC bump characteristic testing according to claim 6, characterized in that, A catch is provided between the paddle and the pusher. A positioning groove is provided on the pusher corresponding to the position of the catch. A buffer mechanism is provided on the paddle corresponding to the position of the catch. The catch moves within the positioning groove through the buffer mechanism.
9. A fixing device based on single IC bump characteristic testing according to claim 8, characterized in that, The pusher is provided at both ends of the paddle, and the two pushers are movably connected to the paddle through the latch.
10. A fixing device based on single IC bump characteristic testing according to claim 6, characterized in that, The multi-directional drive mechanism is provided in three parts, and the three multi-directional drive mechanisms are respectively connected to the two limiting members and the paddle. The multi-directional drive mechanism pushes the limiting members and the paddle.