Non-metal sheet flattening device

By designing a heating platform, temperature control device, and non-metallic sheet flattening device with a pressing cap, internal residual stress is eliminated, the problem of non-metallic sheet distortion is solved, and the production qualification rate and flatness are improved.

CN223890511UActive Publication Date: 2026-02-10GUANGDONG AOPUTE TECH CO LTD
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Patent Information

Application Number
CN202520303380.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-24
Publication Date
2026-02-10
Estimated Expiration
2035-02-24

AI Technical Summary

Technical Problem

Non-metallic thin sheets have a high scrap rate due to twisting deformation caused by internal residual stress after production.

Method used

Design a non-metallic sheet flattening device, including a heating table, a temperature control device and a pressure cap, to eliminate internal residual stress by heating and pressing the workpiece, and to ensure temperature uniformity by using a heat-conducting plate and a temperature control unit.

Benefits of technology

It effectively eliminates residual stress inside non-metallic thin sheets, improves flatness and production qualification rate, and extends the flatness retention time.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the field of plate flattening, and discloses a nonmetal thin plate flattening device, which comprises a heating table, a flattening device, a flattening device and a control device, the temperature control device is used for heating the heating table; and the gland is used for pressing the workpiece on the table top, so that the workpiece is attached to the table top. The non-metal thin plate leveling device is used for eliminating residual stress in the non-metal thin plate.
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Description

Technical Field

[0001] This utility model relates to the field of flattening sheet metal, and in particular to a non-metallic thin sheet flattening device. Background Technology

[0002] After production, non-metallic sheets are prone to distortion and deformation due to internal residual stress, leading to their scrapping. To reduce the scrap rate of non-metallic sheets, a non-metallic sheet leveling device needs to be designed to eliminate internal residual stress.

[0003] Therefore, it is necessary to design a non-metallic sheet flattening device to eliminate residual stress inside the non-metallic sheet.

[0004] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content

[0005] This invention provides a non-metallic thin plate leveling device for eliminating internal residual stress in non-metallic thin plates.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A non-metallic sheet leveling device, comprising:

[0008] A heating table with a surface for supporting workpieces;

[0009] Temperature control device for heating the heating platform;

[0010] A pressure cap is used to press the workpiece onto the table surface so that the workpiece fits against the table surface.

[0011] Optionally, the cover includes a pressure plate portion and a handle mounted on the pressure plate portion;

[0012] The outer periphery of the pressure plate is provided with an annular protective protrusion.

[0013] Optionally, the pressure cap includes a cover body and a heat-conducting plate mounted on one side of the bottom of the cover body;

[0014] The heat-conducting plate includes an upper plate, a lower plate, and a heat-conducting pipe array, wherein the heat-conducting pipe array is arranged between the upper plate and the lower plate.

[0015] The upper plate and the lower plate are fixedly connected, and the space between the upper plate and the lower plate is filled with thermally conductive silicone grease.

[0016] Optionally, the lower plate is a metal plate, and the upper plate is a heat-insulating plate.

[0017] Optionally, the non-metallic sheet flattening device further includes a temperature control unit for connecting the heat pipe assembly to supply coolant to the heat pipe assembly;

[0018] The temperature of the coolant flowing into the heat pipe from the temperature control unit is adjustable.

[0019] Optionally, the temperature control device further includes a connecting pipe and a constant temperature heating device;

[0020] The constant temperature heating device is connected to the heating platform through the connecting pipe. A heating chamber is formed in the heating platform. The constant temperature heating device is used to input a constant temperature liquid into the heating chamber through the connecting pipe.

[0021] Optionally, the temperature control device is a heating wire assembly installed in the heating platform.

[0022] Optionally, the temperature range of the tabletop is 50°-200°.

[0023] Optionally, the pressure cap includes a frame rotatably connected to the heating table and a pressure plate slidably mounted on the frame.

[0024] Optionally, the gland is a one-piece structure.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] The non-metallic sheet flattening device provided by this utility model involves placing a workpiece on a table, then pressing the workpiece flat on the table with a pressure cap. A temperature control device heats the heating table to anneal the non-metallic sheet, thereby eliminating internal residual stress in the non-metallic sheet. This non-metallic sheet flattening device effectively eliminates internal residual stress in non-metallic sheets, allowing the flatness of the non-metallic sheet to be maintained for a longer period.

[0027] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a front view schematic diagram of the non-metallic thin plate leveling device provided in this embodiment of the utility model;

[0030] Figure 2 yes Figure 1 A schematic diagram of the AA cross-sectional structure of the non-metallic thin plate leveling device;

[0031] Figure 3 This is a cross-sectional structural schematic diagram of another non-metallic thin plate leveling device provided in this embodiment of the utility model;

[0032] Figure 4 This is a schematic cross-sectional view of the third type of non-metallic thin plate leveling device provided in this embodiment of the utility model.

[0033] Reference numerals: 1. Heating platform; 101. Platform surface; 2. Temperature control device; 21. Connecting pipe; 22. Constant temperature heating device; 201. Heating chamber; 3. Pressure cover; 301. Cover body; 302. Heat-conducting plate; 321. Upper plate body; 322. Lower plate body; 323. Heat-conducting pipe assembly; 324. Thermal grease; 3001. Frame body; 3002. Pressure plate. Detailed Implementation

[0034] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0035] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0036] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0037] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0038] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0039] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0040] Similar to the understanding in the Examination Guidelines, in this application, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments in this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0041] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0042] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0043] In view of the deficiencies in the existing technology, the applicant, based on years of practical experience and professional knowledge in the design and manufacture of such products, and in conjunction with the application of theoretical principles, has actively conducted research and innovation in order to create a technology that can solve the deficiencies in the existing technology and make the non-metallic thin plate flattening device more practical. After continuous research, design, and repeated prototype production and improvement, this utility model with real practical value has finally been created.

[0044] Please refer to Figures 1 to 2 This utility model provides a non-metallic thin plate flattening device, including a heating table 1, a temperature control device 2, and a pressure cover 3.

[0045] The heating table 1 has a table surface 101 for supporting the workpiece; the temperature control device 2 is used to heat the heating table 1 and control the temperature of the heating table 1; the pressure cover 3 is used to press the workpiece onto the table surface 101 so that the workpiece fits the table surface 101.

[0046] Specifically, the workpiece is first placed on the table 101, then the pressure cap 3 flattens the workpiece on the table 101. The temperature control device 2 heats the heating table to anneal the non-metallic sheet, thereby eliminating the internal residual stress of the non-metallic sheet. The non-metallic sheet flattening device in this embodiment can effectively eliminate the internal residual stress of the non-metallic sheet, maintain the flatness of the non-metallic sheet for a longer period, and improve the production qualification rate of the non-metallic sheet. It should also be noted that annealing involves slowly heating the non-metallic sheet to a certain temperature and holding it for a period of time, then cooling it at an appropriate rate. The annealing temperature is adjusted accordingly for different non-metallic sheet materials.

[0047] Optionally, the pressure cap 3 includes a pressure plate portion 31 and a handle 32 mounted on the pressure plate portion 31; an annular protective protrusion 33 is provided on the outer periphery of the pressure plate portion 31.

[0048] Specifically, during the annealing process of the non-metallic sheet, the annular protective protrusion 33 surrounds the outer periphery of the non-metallic sheet, preventing it from colliding with other mechanical components. Furthermore, the annular protective protrusion 33 ensures that the non-metallic sheet is positioned more effectively on the table 101, resulting in more uniform heating of the sheet.

[0049] Optionally, such as Figure 3 The pressure cap 3 includes a cover body 301 and a heat-conducting plate 302 installed on one side of the bottom of the cover body 301. The heat-conducting plate 302 includes an upper plate body 321, a lower plate body 322, and a heat-conducting pipe assembly 323, which is arranged in an array between the upper plate body 321 and the lower plate body 322. The upper plate body 321 and the lower plate body 322 are fixedly connected, and the space between the upper plate body 321 and the lower plate body 322 is filled with thermal grease 324. A sealed cavity is formed between the upper plate body 321 and the lower plate body 322, and the heat-conducting pipe assembly 323 passes through the sealed cavity.

[0050] Specifically, the structure of the heat-conducting plate 302 allows for better heat transfer, resulting in a more uniform surface temperature of the non-metallic sheet and improving the annealing effect. It should also be noted that the heat pipe assembly 323 is used to change the temperature of the heat-conducting plate 302, thereby annealing the non-metallic sheet.

[0051] It should also be noted that the heat-conducting plate 302 can heat the non-metallic sheet synchronously with the heating stage 1, and maintain the temperature consistency between the upper and lower parts of the non-metallic sheet, which is beneficial to improving the annealing effect.

[0052] Optionally, the lower plate 322 is a metal plate, and the upper plate 321 is a heat-insulating plate. The lower plate 322 has a better thermal conductivity, which is beneficial to improving temperature uniformity. The upper plate 321 is a heat-insulating plate, which helps to prevent burns to workers.

[0053] Optionally, the non-metallic sheet leveling device further includes a temperature control unit for connecting the heat pipe assembly 323 to supply coolant to the heat pipe assembly 323; the temperature of the coolant flowing into the heat pipes is adjustable. The temperature control unit heats or cools the non-metallic sheet by controlling the temperature of the coolant.

[0054] Optionally, the temperature control device 2 further includes a connecting pipe 21 and a constant temperature heating device 22; the constant temperature heating device 22 is connected to the heating platform 1 through the connecting pipe 21, and a heating chamber 201 is formed in the heating platform 1. The constant temperature heating device 22 is used to input a constant temperature liquid into the heating chamber 201 through the connecting pipe 21. It should be specifically noted that the temperature of the constant temperature liquid output by the constant temperature heating device is different for different stages of annealing.

[0055] Optionally, the temperature control device 2 is a heating wire assembly installed in the heating platform 1.

[0056] Optionally, the temperature range of the countertop 101 is 50°-200°.

[0057] Optionally, such as Figure 4 The pressure cap 3 includes a frame 3001 rotatably connected to the heating table 1 and a pressure plate 3002 slidably mounted on the frame 3001. In this embodiment, the position of the pressure plate 3002 can be changed by rotating the frame 3001, thereby loosening or tightening the non-metallic sheet. Preferably, a sliding column is provided on the frame 3001, the pressure plate 3002 is slidably mounted on the sliding column, and a telescopic device is provided on the frame 3001 for driving the pressure plate 3002 to slide along the sliding column.

[0058] Optionally, the cap 3 is a one-piece structure.

[0059] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A non-metallic thin plate leveling device, characterized in that, include: Heating table (1) has a table surface (101) for supporting workpieces; Temperature control device (2) is used to heat the heating platform (1); A pressure cap (3) is used to press the workpiece onto the table surface (101) so that the workpiece fits against the table surface (101).

2. The non-metallic thin plate leveling device according to claim 1, characterized in that, The pressure cap (3) includes a pressure plate (31) and a handle (32) mounted on the pressure plate (31); The outer periphery of the pressure plate (31) is provided with an annular protective protrusion (33).

3. The non-metallic thin plate leveling device according to claim 1, characterized in that, The pressure cap (3) includes a cover body (301) and a heat-conducting plate (302) installed on one side of the bottom of the cover body (301); The heat-conducting plate (302) includes an upper plate (321), a lower plate (322), and a heat-conducting pipe assembly (323), wherein the heat-conducting pipe assembly (323) is arranged in an array between the upper plate (321) and the lower plate (322); The upper plate (321) and the lower plate (322) are fixedly connected, and the space between the upper plate (321) and the lower plate (322) is filled with thermal grease (324).

4. The non-metallic thin plate leveling device according to claim 3, characterized in that, The lower plate (322) is a metal plate, and the upper plate (321) is a heat insulation plate.

5. The non-metallic thin plate leveling device according to claim 3, characterized in that, It also includes a temperature control unit for connecting the heat pipe assembly (323) to supply coolant to the heat pipe assembly (323); The temperature of the coolant flowing into the heat pipe from the temperature control unit is adjustable.

6. The non-metallic thin plate leveling device according to claim 1, characterized in that, The temperature control device (2) also includes a connecting pipe (21) and a constant temperature heating device (22); The constant temperature heating device (22) is connected to the heating platform (1) through the connecting pipe (21). A heating chamber (201) is formed in the heating platform (1). The constant temperature heating device (22) is used to input constant temperature liquid into the heating chamber (201) through the connecting pipe (21).

7. The non-metallic thin plate leveling device according to claim 1, characterized in that, The temperature control device (2) is a heating wire assembly installed in the heating platform (1).

8. The non-metallic thin plate leveling device according to claim 1, characterized in that, The temperature range of the tabletop (101) is 50°-200°.

9. The non-metallic thin plate leveling device according to claim 1, characterized in that, The pressure cap (3) includes a frame (3001) rotatably connected to the heating table (1) and a pressure plate (3002) slidably mounted on the frame (3001).

10. The non-metallic thin plate leveling device according to claim 1, characterized in that, The cover (3) is an integral structure.