Etchable conductive or heat-conducting adhesive film
By using etchable conductive or thermally conductive adhesive films, and utilizing photosensitive and developable adhesive layers and UV etching technology, the problems of discontinuous production and high cost in existing technologies have been solved, enabling rapid and flexible pattern development.
Patent Information
- Application Number
- CN202422744958.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2034-11-12
AI Technical Summary
Existing technologies for preparing specific patterned conductive and thermally conductive materials suffer from problems such as discontinuous production, high costs, and long development cycles. In particular, flexible circuit boards and screen printing processes cannot achieve rapid switching and flexible development.
The method employs an etchable conductive or thermally conductive adhesive film, including a photosensitive adhesive layer, conductive or thermally conductive particles, a flat substrate layer, a 3D microstructure layer, and a protective adhesive film. Patterning is achieved through UV exposure and thermosetting UV etching solution, enabling rapid secondary molding.
It achieves simple operation, low cost, flexible product development, and is not limited by material area, making it suitable for a variety of graphic requirements.
Smart Images
Figure CN223892670U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the engineering technical field of conductive material, and particularly relates to an etchable conductive or heat-conductive adhesive film. BACKGROUND
[0002] With the vigorous development of 5G wireless communication, artificial intelligence and data center services, due to the expansion of communication frequency bands and the number of electronic devices, the power consumption is multiplied, and various large amounts of specific pattern conductive, heat-conductive flexible or hard materials are needed to make communication antenna circuit design, flexible transmission circuit design and high-heat-conductive flexible heat dissipation module design. At present, the specific pattern conductive, heat-conductive flexible material is mainly realized through the copper etching process flow of the flexible circuit board and the screen printing process of the conductive material on the flexible substrate. The process flow of the flexible circuit board needs to print the photoresist on the flexible copper-clad plate made by a special manufacturing process to form the required pattern, and then fix the related pattern through a special exposure process. Finally, a specific circuit pattern is formed through a complex etching process. This method has good product performance and mature process, but it cannot realize continuous production of one pattern, the process and material cost are high, the material area size is limited by the existing etching equipment, one mask can only correspond to one pattern, the requirement of secondary development of related patterns cannot be realized, the product development cycle is long, and the insulating heat-conductive material cannot be etched by chemical method. The screen printing process of the conductive and heat-conductive material refers to the regular distribution of the conductive polymer material or the heat-conductive paste such as conductive silver paste and heat-conductive paste on the flexible or hard material through screen printing. However, one screen can only correspond to one specific pattern, and different conductive patterns need different screens to form, so the screen printing process cannot realize the rapid switching of products in actual application, the product development cycle is long, and the flexibility of product development is poor. SUMMARY
[0003] The utility model discloses a kind of etchable conductive or heat-conductive adhesive films, with simple operation, low cost, and can be quickly secondary pattern development.
[0004] The etchable conductive or heat-conductive adhesive film provided by the utility model is composed of a photosensitive developing adhesive layer 1, conductive or heat-conductive particles 2, a flat plate bearing layer 3, a 3D microstructure layer 4, a high filling rate protective adhesive film 8 and a release protective film 9, wherein the flat plate bearing layer 3 is arranged at the bottom of the photosensitive developing adhesive layer 1, a plurality of holes are uniformly distributed on the surface of the photosensitive developing adhesive layer 1, the conductive or heat-conductive particles 2 are embedded in the plurality of holes, the 3D microstructure layer 4 is solidified or bonded on the surface of the photosensitive developing adhesive layer 1, the high filling rate protective adhesive film 8 is attached to the surface of the photosensitive developing adhesive layer 1 with the 3D microstructure layer 4, and the release protective film 9 is attached to the surface of the high filling rate protective adhesive film 8.
[0005] The photosensitive developing type glue layer 1 can be dissolved by dilute lye (ph>=7.5) before exposure, and the glue film of the photosensitive developing type glue layer 1 cannot be dissolved after exposure.
[0006] In the utility model, the photosensitive developing type glue layer 1 adopts acrylic modified epoxy resin or acrylic modified polyacrylic acid resin and other commercially available products, including but not limited to Japanese chemical medicine KAYARAD CCR-1169, ZFR-1401H.
[0007] In the utility model, the conductive or heat-conducting particle 2 adopts any one of conductive particle materials composed of copper, nickel, silver, gold or related alloys, and the heat-conducting particle is commercially available insulating heat-conducting particle, such as any one of aluminum oxide, boron nitride or silicon carbide.
[0008] In the utility model, the flat plate bearing layer 3 is flexible or hard material with or without 3D structure, the flexible material adopts any one of flexible PET, PI, CPI or CPO film, and the hard material is SiO2 glass.
[0009] In the utility model, the thermosetting UV etching solution 7 is a self-prepared solution, specifically 1-5wt% sodium carbonate aqueous solution, and the sodium carbonate is commercially available sodium carbonate powder.
[0010] In the utility model, the release protection film 9 is covered on the photosensitive developing type glue layer 1 and the conductive or heat-conducting particle layer 2, and provides reliable protection for the photosensitive developing type glue layer 1 and the conductive or heat-conducting particle layer 2, and is easy to peel off during use.
[0011] The working process of the utility model is as follows: the release protection film of the etchable conductive or heat-conducting glue film is opened, then horizontally placed, the secondary curing mask 5 printed with the secondary etching pattern is attached on the etchable conductive or heat-conducting glue film, and the UV curing light source 6 is irradiated until the exposed part of the epoxy glue layer 1 is cured, the UV curing light source 6 and the secondary curing mask 5 are removed, and the remaining material is immersed in the thermosetting UV etching solution 7, the thermosetting UV etching solution 7 is stirred to clean the exposed part of the photosensitive developing type glue layer 1, and the etching of the conductive is completed, the photosensitive developing type glue layer 1 high filling rate protection glue film 8 and release protection film 9 are attached and protected.
[0012] The utility model discious the following advantages: simple structure, no special tooling is needed, simple operation process, low cost, easy secondary development, product size is not limited. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 The utility model discious the following advantages: simple structure, no special tooling is needed, simple operation process, low cost, easy secondary development, product size is not limited.
[0014] Figure 2 The utility model discious the following advantages: simple structure, no special tooling is needed, simple operation process, low cost, easy secondary development, product size is not limited.
[0015] Figure 3 The utility model discious the following advantages: simple structure, no special tooling is needed, simple operation process, low cost, easy secondary development, product size is not limited.
[0016] Figure 4 The utility model discious the following advantages: simple structure, no special tooling is needed, simple operation process, low cost, easy secondary development, product size is not limited.
[0017] Figure 5 The utility model discious the following advantages: simple structure, no special tooling is needed, simple operation process, low cost, easy secondary development, product size is not limited.
[0018] Figure 6 The utility model discious the following advantages: simple structure, no special tooling is needed, simple operation process, low cost, easy secondary development, product size is not limited.
[0019] The utility model discious the following advantages: simple structure, no special tooling is needed, simple operation process, low cost, easy secondary development, product size is not limited. DETAILED DESCRIPTION
[0020] The utility model will be further explained in connection with the drawings.
[0021] Example 1: as shown, the utility model discious the following advantages: simple structure, no special tooling is needed, simple operation process, low cost, easy secondary development, product size is not limited. Figures 1-6 The utility model discious the following advantages: simple structure, no special tooling is needed, simple operation process, low cost, easy secondary development, product size is not limited.
[0022] In the conductive or heat-conductive particles 2, the conductive particles are any one of commercially available spherical, dendritic or fibrous materials made of copper, nickel, silver, gold or carbon nanomaterials or related alloys, and the heat-conductive particles are any one of commercially available insulating heat-conductive particles such as alumina, boron nitride or silicon carbide, the flat plate bearing layer 3 is made of flexible or hard material with or without 3D structure, the flexible material is a film of PET, PI, CPI, LCP, etc., and the hard material is SiO2 glass, the 3D microstructure 4 is a film with 3D microstructure, which is a commercially available product. The bottom of the photosensitive developing type adhesive layer 1 is pasted with the flat plate bearing layer 3, the photosensitive developing type adhesive layer 1 is uniformly distributed with a plurality of holes, the conductive or heat-conductive particles 2 are embedded in the plurality of holes, the surface of the photosensitive developing type adhesive layer 1 is solidified or bonded with the 3D microstructure layer 4, and the high-filling-rate protective film 8 is attached to the surface of the photosensitive developing type adhesive layer 1 provided with the 3D microstructure layer 4, and the surface of the high-filling-rate protective film 8 is pasted with the release protective film 9.
Claims
1. An etchable conductive or thermally conductive adhesive film, characterized in that... It is composed of a photosensitive adhesive layer (1), conductive or thermally conductive particles (2), a flat support layer (3), a 3D microstructure layer (4), a high-fill-rate protective film (8), and a release protective film (9). The photosensitive adhesive layer (1) has a flat support layer (3) at the bottom. The photosensitive adhesive layer (1) has several holes evenly distributed on it. The conductive or thermally conductive particles (2) are embedded in the holes. The 3D microstructure layer (4) is cured or bonded to the surface of the photosensitive adhesive layer (1). The high-fill-rate protective film (8) is attached to the surface of the photosensitive adhesive layer (1) with the 3D microstructure layer (4). The release protective film (9) is pasted on the surface of the high-fill-rate protective film (8).
2. The etchable conductive or thermally conductive adhesive film according to claim 1, characterized in that... The photosensitive and developable adhesive layer (1) can be dissolved by dilute alkaline solution before exposure, with pH>=7.
5. After exposure, the adhesive film will not be dissolved.
3. The etchable conductive or thermally conductive adhesive film according to claim 1, characterized in that... The photosensitive adhesive layer (1) is made of acrylic-modified epoxy resin or acrylic-modified polyacrylic resin.
4. The etchable conductive or thermally conductive adhesive film according to claim 1, characterized in that... The flat plate support layer (3) is a flexible or rigid material with or without a 3D structure. The flexible material is any one of flexible PET, PI, CPI or CPO, and the rigid material is SiO2 glass.