Copper dissolving system for iron ion copper plating

Abstract

The utility model relates to the field of electroplating, and discloses a copper dissolving system for iron ion copper plating, which comprises a copper dissolving main tank, an iron ion copper plating tank, an iron ion copper plating tank and an iron ion copper plating tank, the winding and unwinding mechanism is arranged opposite to the copper dissolving main tank, and the winding and unwinding mechanism is in transmission connection with each copper storage part so as to control the copper storage parts to stretch into or break away from the copper dissolving space; the ion detection device is used for detecting the ion concentration in the main copper dissolving tank, and the number of the copper storage pieces placed in the main copper dissolving tank is determined by the ion concentration; a copper storage space used for storing copper materials is formed in the copper storage part, the copper storage part is further provided with an overflowing structure, and under the condition that the copper storage part stretches into the copper dissolving space, the copper storage space communicates with the copper dissolving space through the overflowing structure. According to the utility model, the ion concentration is monitored through the ion concentration detection device, and the copper storage piece is controlled to extend into or be separated from the copper dissolving main tank through the retracting and releasing mechanism, so that the ion concentration in the liquid medicine is accurately controlled.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, specifically to a copper dissolving system for iron ion copper plating. Background Technology

[0002] In the field of copper plating for PCBs (printed circuit boards), traditional copper plating methods are mainly divided into two types: (1) Soluble anodic plating: electroplating is carried out by adding phosphor bronze balls. The advantage of this method is that the process is mature and the operation is simple, but the cost is relatively high. (2) Insoluble anodic plating: electroplating is carried out by adding copper oxide powder. Although this method reduces the consumption of anode materials, it may encounter the problem of insufficient stability in practical applications.

[0003] With technological advancements, iron ion copper plating systems have been proposed and gradually applied in laboratory and small-scale production environments. This system uses a copper rod as the anode material, reacting it with a solution containing iron ions under specific conditions to generate copper ions. However, controlling the ion concentration in existing iron ion copper plating systems is difficult, and maintaining the dynamic balance between ferric, ferrous, and copper ions is challenging, leading to unstable product quality. Existing systems lack effective means to monitor and adjust the concentration of these ions in real time. Utility Model Content

[0004] In view of this, the present invention provides a copper dissolving system for iron ion copper plating to solve the problem of inaccurate control of ion concentration in related technologies.

[0005] In a first aspect, this utility model provides a copper dissolving system for iron ion copper plating, comprising:

[0006] The copper dissolving tank has an internal space for storing the reaction solution.

[0007] At least two copper storage components and a receiving and releasing mechanism are provided. The receiving and releasing mechanism is arranged opposite to the copper melting main tank. The receiving and releasing mechanism is connected to each of the copper storage components to control the copper storage components to extend into or detach from the copper melting space.

[0008] An ion detection device is used to detect the ion concentration in the copper dissolving tank, and the number of copper storage components placed in the copper dissolving tank is determined by the ion concentration.

[0009] The copper storage component has a copper storage space inside for storing copper material. The copper storage component is also provided with a flow passage structure. When the copper storage component extends into the copper melting space, the copper storage space is connected to the copper melting space through the flow passage structure.

[0010] Beneficial effects: By monitoring the ion concentration through an ion concentration detection device and controlling the copper storage component to extend into or detach from the copper dissolving tank through a receiving and releasing mechanism, precise control of the ion concentration in the solution can be achieved.

[0011] In one optional embodiment, the top of the copper melting tank is open to form an inlet and outlet, and the receiving and releasing mechanism is located above the copper melting tank and is disposed opposite to the inlet and outlet.

[0012] The receiving and releasing mechanism includes at least two automatic lifting devices, each of which is connected to at least one of the copper storage components via a transmission connection.

[0013] Beneficial effects: Because the top of the copper melting tank is open, the copper storage components can be directly placed in or removed from above, simplifying the operation process and reducing the need for manual intervention. At the same time, the design of multiple automatic lifting devices allows the movement of each copper storage component to be controlled individually, avoiding the error accumulation problems that may arise from traditional single control points, and ensuring the stability and reliability of the system.

[0014] In one alternative embodiment, the top of the copper storage component is open to form a feed inlet, and the bottom or sidewall of the copper storage component has the flow-through structure formed thereon, the size of which is smaller than the size of the copper material.

[0015] Beneficial effects: The open top design makes adding copper materials very simple. Operators can directly put the copper materials into the feed inlet, reducing cumbersome operating steps and improving work efficiency.

[0016] On the one hand, the design of the flow-through structure ensures that the liquid reagent can smoothly enter the copper storage container and fully contact the copper material, promoting the chemical reaction. This not only accelerates the reaction rate but also improves the efficiency of copper ion generation. On the other hand, by precisely controlling the dimensions of the flow-through structure, it is ensured that the copper material will not leak out of the copper storage container during the reaction, avoiding potential safety hazards and material waste.

[0017] In one optional embodiment, the flow structure includes an inlet hole and an outlet hole, with a plurality of inlet holes formed at the bottom of the copper storage component and a plurality of outlet holes formed on the sidewall of the copper storage component.

[0018] Beneficial effects: Multiple inlet holes at the bottom ensure that the liquid can quickly and evenly enter the copper storage container, making full contact with the copper material; multiple outlet holes on the side wall ensure that the liquid can be discharged in a timely manner after the reaction, avoiding stagnation. This design significantly improves the circulation efficiency of the liquid and promotes the occurrence of chemical reactions.

[0019] In one optional embodiment, a reinforcing bracket is provided on the outer side of the copper storage component, the reinforcing bracket being arranged around the outer peripheral wall of the copper storage component and avoiding the feed inlet.

[0020] Beneficial effects: The presence of the reinforced support significantly enhances the compressive strength of the copper storage component, especially when the copper storage component is full of copper material. It effectively prevents bending or cracking of the copper storage component during lifting and lowering, thus extending the service life of the equipment.

[0021] In one alternative implementation, the copper melting system further includes:

[0022] The raw material conveying mechanism includes an automatic conveying device and a collection box. The automatic conveying device is used to convey copper material into the collection box. The collection box has a discharge port and is connected to the inlet of the copper storage component through the discharge port.

[0023] Beneficial effects: The raw material conveying mechanism enables fully automated conveying and feeding of copper materials, greatly improving production efficiency and reducing labor costs. The system can quickly adjust the speed and quantity of material conveying according to actual needs, adapting to different production rhythms.

[0024] At the same time, the automated conveying process reduces the opportunity for operators to directly handle heavy materials, lowers safety risks, and ensures that each material delivery is accurate, avoiding safety hazards caused by human error.

[0025] In one optional embodiment, the bottom of the collection box forms the discharge port, the number of collection boxes is equal to the number of copper storage components, and each collection box is provided with a copper storage component below it.

[0026] Beneficial effects: The aforementioned one-to-one matching design ensures that materials accurately enter the corresponding copper storage units, guaranteeing that each unit receives replenishment, reducing the possibility of manual intervention, and improving operational safety and reliability. Furthermore, the relative positioning of the discharge port and the copper storage unit's inlet ensures accurate entry of copper materials into the storage units, avoiding safety hazards caused by human error.

[0027] In one optional embodiment, the automatic conveying device includes a plurality of conveying drive components, a plurality of rollers, and an annular conveyor belt composed of a plurality of interconnected conveyor boxes. The conveying drive components are driven to the rollers, and the rollers are driven to the annular conveyor belt. The conveying drive components are used to drive the annular conveyor belt to move cyclically through the rollers, so that the conveyor boxes convey copper material into the collection box.

[0028] Beneficial effects: Through the above-mentioned specific structural design, the automatic conveying device not only realizes the efficient and safe transportation of copper materials, but also significantly improves the overall performance and reliability of the copper melting system.

[0029] In one alternative implementation, the copper melting system further includes:

[0030] The material conveying mechanism includes an automatic lifting device, a material placement platform, and a vibrating plate. The automatic lifting device is used to automatically lift the material onto the material placement platform, and the material placement platform is located above the vibrating plate and is detachable from the vibrating plate. The vibrating plate is connected to the conveying box.

[0031] When the material placement platform is disassembled, the copper material is adapted to fall into the vibratory feeder and be distributed by the vibratory feeder into a plurality of the conveyor boxes.

[0032] Beneficial effects: The material handling mechanism achieves fully automated operation from material lifting to distribution, reducing the need for manual handling, lowering labor intensity, and improving work efficiency. The system can also quickly adjust the speed and quantity of material conveying according to actual needs, adapting to different production rhythms and ensuring production continuity.

[0033] The automated lifting and distribution process reduces the opportunity for operators to directly handle heavy materials, thus lowering safety risks. Furthermore, the even distribution by the vibratory feeder ensures accurate material delivery each time, avoiding safety hazards caused by human error.

[0034] In one optional embodiment, the copper dissolving system further includes a chemical solution collection tank located outside the main copper dissolving tank, and an overflow plate is provided between the chemical solution collection tank and the main copper dissolving tank. The top of the overflow plate defines an overflow port, and the chemical solution after reaction in the main copper dissolving tank is adapted to flow into the chemical solution collection tank through the overflow port.

[0035] Beneficial effects: The chemical solution collection tank not only achieves safe and efficient collection of the chemical solution after the reaction, but also significantly improves the overall performance and reliability of the copper dissolving system. In particular, the overflow plate design ensures that the chemical solution only flows into the collection tank when it reaches a certain height, thereby avoiding unnecessary chemical solution loss and improving operational safety and environmental friendliness. Attached Figure Description

[0036] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0037] Figure 1 This is a front view of a copper dissolving system for iron ion copper plating according to an embodiment of the present invention;

[0038] Figure 2 for Figure 1 A top view of the copper dissolving system used for iron ion copper plating;

[0039] Figure 3 for Figure 1 The side view shown is of a copper dissolving system used for iron ion copper plating.

[0040] Figure 4 This is a partial structural diagram of the copper storage component of the copper melting system according to an embodiment of the present invention, when the copper melting tank is located in the main copper melting tank.

[0041] Figure 5 This is a schematic diagram of the copper storage component according to an embodiment of the present utility model;

[0042] Figure 6 This is a schematic diagram of the raw material conveying mechanism according to an embodiment of the present utility model;

[0043] Figure 7 This is a flowchart illustrating the ion concentration control method according to an embodiment of the present invention.

[0044] Explanation of reference numerals in the attached figures:

[0045] 1. Copper melting main tank; 11. Copper melting space; 12. Inlet and outlet; 2. Copper storage component; 21. Feed inlet; 22. Liquid inlet; 23. Liquid outlet; 24. Reinforcing support; 3. Automatic lifting device; 4. Collection box; 41. Discharge port;

[0046] 51. Conveying drive unit; 52. Roller; 53. Circular conveyor belt; 54. Conveying box; 6. Automatic lifting device; 7. Material placement platform; 8. Vibrating plate; 9. Medicine collection tank; 91. Overflow plate; 10. Material bag. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0048] In the description of the embodiments of this utility model, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0049] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0050] In this embodiment of the utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0051] The following description, with reference to the accompanying drawings, introduces a copper dissolving system and an ion concentration control method for iron ion copper plating, wherein the ion concentration control method is based on the copper dissolving system for iron ion copper plating provided in this invention.

[0052] like Figures 1 to 6 As shown, the copper dissolving system for iron ion copper plating according to the first aspect of the present invention includes a copper dissolving main tank 1, at least two copper storage components 2, a receiving and discharging mechanism, and an ion detection device.

[0053] The interior of the copper dissolving main tank 1 has a copper dissolving space 11 for storing the reaction solution.

[0054] The receiving and releasing mechanism is arranged opposite to the copper melting tank 1. The receiving and releasing mechanism is connected to each copper storage component 2 to control the copper storage component 2 to extend into or detach from the copper melting space 11.

[0055] The ion detection device is used to detect the ion concentration in the copper dissolving main tank 1, and the number of copper storage components 2 placed in the copper dissolving main tank 1 is determined by the ion concentration.

[0056] The copper storage component 2 has a copper storage space inside for storing copper materials. The copper storage component 2 is also provided with a flow passage structure. When the copper storage component 2 extends into the copper melting space 11, the copper storage space is connected to the copper melting space 11 through the flow passage structure.

[0057] The copper dissolving system for iron ion copper plating according to an embodiment of this utility model has the following specific structural composition: The copper dissolving main tank 1 is the main container of the entire system, and a copper dissolving space 11 for storing the reaction solution is formed inside. This tank provides a closed environment for the chemical reaction, ensuring that the necessary reaction occurs between the reaction solution and the copper material in the copper storage container 2, and also serves as the basic platform for other components (such as the receiving and discharging mechanism and the ion detection device).

[0058] Each copper storage component 2 has an internal storage space for storing copper material (e.g., copper rods or copper balls), and the copper storage component 2 is equipped with a flow-through structure, including an inlet hole 22 and an outlet hole 23. The copper storage component 2 is connected to a receiving and discharging mechanism via a transmission connection, allowing it to extend into or detach from the copper dissolving space 11 within the main copper dissolving tank 1 as needed. When the copper storage component 2 is immersed in the copper dissolving space 11, the chemical solution flows into the storage space and contacts the copper material through its flow-through structure; when the copper storage component 2 is lifted out of the copper dissolving space 11, further chemical reaction is stopped, thereby controlling the rate of copper ion generation.

[0059] The receiving and discharging mechanism is positioned opposite to the main copper melting tank 1 and is connected to each copper storage component 2 via a transmission mechanism. It should be noted that the receiving and discharging mechanism can employ lifting, moving, or rotating methods to receive and discharge the copper storage components 2. This invention does not impose any special limitations on these methods, as long as the receiving and discharging mechanism can control the insertion and removal of the copper storage components 2 into or out of the copper melting space 11. The receiving and discharging mechanism determines whether and how the copper storage components 2 penetrate into the main copper melting tank 1, thus directly determining the number of copper storage components 2 participating in the reaction, and consequently affecting the final ion concentration.

[0060] The ion detection device can monitor the concentration of specific ions (such as ferric ions, ferrous ions, and copper ions) in the copper dissolving main tank 1 in real time. The ion detection device can be installed near the copper dissolving main tank 1 to directly detect the ion concentration of the solution within the tank. Furthermore, when the system of this invention has a control system, the ion detection device can provide immediate feedback to the control system to adjust the number and position of the copper storage components 2 to maintain an ideal ion concentration level.

[0061] Furthermore, the specific working principle of the copper dissolving system of this utility model is as follows: The operation of the copper dissolving system is based on the precise control of the ion concentration in the main copper dissolving tank 1. By continuously monitoring the concentrations of ferric ions, ferrous ions, and copper ions in the tank through an ion detection device, the system can determine the current reaction state. If the concentration of certain ions is detected to be too high or too low, the control system will issue corresponding instructions to the receiving and discharging mechanism, thereby adjusting the number of copper storage components 2 extending into the main copper dissolving tank 1, and the extent to which the copper storage components 2 extend into the copper dissolving space 11. In this way, the system can dynamically adjust the quality of the copper material reacting with the solution, thereby controlling the amount of copper ions generated and maintaining a stable production process.

[0062] Based on the above description of the structure and principle, the working process of the copper melting system of this utility model is roughly as follows:

[0063] An appropriate amount of copper material is placed into the copper storage container 2, ensuring that all copper storage containers 2 are in the ready position, prepared for the next step of the operation. The pump is started to introduce the electroplating solution into the copper dissolving tank 1, while simultaneously lowering the copper storage containers 2 into the copper dissolving space 11. At this time, the solution enters the copper storage space through the flow structure on the copper storage container 2, reacting with the copper material to generate copper ions. The ion detection device continuously measures the ion concentration in the copper dissolving tank 1 and transmits the data to the control system. Based on the changes in ion concentration, the control system instructs the take-up and release mechanism to adjust the number of copper storage containers 2 extending into the copper dissolving tank 1. Specifically, when the copper ion concentration is too high (or the iron ion concentration is too low), the number of copper storage containers 2 participating in the reaction is reduced; conversely, when the copper ion concentration is insufficient (or the iron ion concentration is too high), the number of copper storage containers 2 extending into the copper dissolving tank 1 is increased.

[0064] As production progresses, the above steps will be repeated to ensure that the ion concentration remains within an optimized range during the copper dissolution process until the predetermined production task is completed.

[0065] It is understood that the above description is based on the automatic control of the control system. It should be noted that the copper melting system of this utility model can also be operated manually by the receiving and releasing mechanism to increase or decrease the number of copper storage pieces 2 in the copper melting main tank 1. This utility model does not impose any special restrictions here.

[0066] Specifically, in manual operation mode, the operator can directly control the feeding and unloading mechanism to increase or decrease the number of copper storage pieces 2 in the main copper melting tank 1. For example, if the feeding and unloading mechanism is designed with a manual operating handle or lever, the operator can directly raise or lower the copper storage pieces 2 using these components. Alternatively, some feeding and unloading mechanisms may be equipped with manual controllers, such as buttons or switches, allowing the operator to manually start or stop the raising or lowering of the copper storage pieces 2 based on real-time data provided by the ion detection device. Furthermore, although the system emphasizes automation, in some cases, a mode between fully automatic and fully manual can be used. For example, when the control system suggests adjusting the number of copper storage pieces 2, it will provide specific instructions (such as icons or sound prompts), which the operator then confirms and performs the corresponding manual operation.

[0067] In the field of copper plating for PCBs (printed circuit boards), traditional copper plating methods are mainly divided into two types: (1) Soluble anodic plating: electroplating is carried out by adding phosphor bronze balls. The advantage of this method is that the process is mature and the operation is simple, but the cost is relatively high. (2) Insoluble anodic plating: electroplating is carried out by adding copper oxide powder. Although this method reduces the consumption of anode materials, it may encounter the problem of insufficient stability in practical applications.

[0068] With technological advancements, iron ion copper plating systems have been proposed and gradually applied in laboratory and small-scale production environments. This system uses a copper rod as the anode material, reacting it with a solution containing iron ions under specific conditions to generate copper ions. However, controlling the ion concentration in existing iron ion copper plating systems is difficult, and maintaining the dynamic balance between ferric, ferrous, and copper ions is challenging, leading to unstable product quality. Existing systems lack effective means to monitor and adjust the concentration of these ions in real time.

[0069] Therefore, in order to overcome the technical defects existing in the above-mentioned related technologies, this utility model provides a copper dissolving system for iron ion copper plating. The system monitors the ion concentration through an ion concentration detection device and controls the insertion and removal of the copper storage component 2 into or out of the main copper dissolving tank 1 through a receiving and releasing mechanism, thereby achieving precise control of the ion concentration in the solution. Furthermore, the copper dissolving system of this utility model has the following advantages compared to related technologies:

[0070] (1) Precise ion concentration control: The concentrations of ferric ions, ferrous ions, and copper ions in the copper dissolving main tank 1 are monitored in real time by an ion detection device. The above-mentioned real-time feedback mechanism enables the system to respond quickly to concentration changes and maintain ideal ion balance, thereby ensuring the high quality of electroplated products.

[0071] Meanwhile, based on changes in ion concentration, the system can automatically determine the number of copper storage components 2 to be placed in or removed from the copper melting space 11. This not only improves the controllability of the reaction process but also ensures the stability of ion concentration during production.

[0072] (2) High degree of automation: The feeding and receiving mechanism can automatically control the insertion or removal of the copper storage component 2 into the copper melting space 11, reducing the need for manual intervention, improving operational efficiency and reducing labor costs. Combined with the data from the ion detection device, the entire system forms a closed-loop control system, realizing a fully automated process from monitoring to adjustment, and improving the continuity and stability of production.

[0073] (3) High flexibility and adaptability: The design of the receiving and releasing mechanism is not limited to a specific form (such as lifting), but can adopt various methods such as horizontal movement and rotation according to actual needs. This flexibility allows the system to better adapt to different production environments and process requirements. The copper storage component 2 is equipped with a flow-through structure. When it extends into the copper melting space 11, the liquid can fully contact the copper material through these structures, promoting the uniformity and efficiency of the reaction.

[0074] (4) Improved production efficiency: Due to the high degree of automation, the system can react to changes in ion concentration in a short time and adjust the quantity of copper storage components 2 in a timely manner, thereby accelerating the production pace. In addition, the automated and intelligent design reduces operational errors caused by human factors, thereby reducing the possibility of equipment downtime for maintenance and maintaining the continuous operation of the production line.

[0075] like Figure 1 , Figure 3 and Figure 4 As shown, according to some embodiments of the present invention, the top of the copper melting main tank 1 is open to form an inlet and outlet 12, and the receiving and releasing mechanism is located above the copper melting main tank 1 and is arranged opposite to the inlet and outlet 12.

[0076] The receiving and releasing mechanism includes at least two automatic lifting devices 3, each of which is connected to at least one copper storage component 2 via a transmission connection.

[0077] In this embodiment, the top of the copper melting tank 1 is open, forming an inlet / outlet 12. This inlet / outlet 12 allows the copper storage component 2 to easily enter and exit the copper melting space 11, ensuring sufficient contact between the liquid and the copper material. The open top also facilitates operators to monitor the internal conditions and perform necessary maintenance.

[0078] The automatic lifting device 3 can precisely control the vertical movement of the copper storage unit 2, thereby determining whether it enters or leaves the copper melting space 11. Simultaneously, since multiple automatic lifting devices 3 operate at the same time, multiple copper storage units 2 can be controlled simultaneously or independently, improving the system's flexibility and response speed. Each copper storage unit 2 can smoothly extend into or detach from the copper melting space 11 under the action of each automatic lifting device 3, ensuring that the ion concentration during the reaction process can be dynamically adjusted as needed.

[0079] In this way, since the top of the copper melting tank 1 is open, the copper storage components 2 can be directly placed in or removed from above, simplifying the operation process and reducing the need for manual intervention. At the same time, the design of multiple automatic lifting devices 3 allows the movement of each copper storage component 2 to be controlled individually, avoiding the error accumulation problem that may be caused by a traditional single control point, and ensuring the stability and reliability of the system.

[0080] In addition, placing the receiving and feeding mechanism directly above the copper melting main tank 1 not only makes full use of the vertical space, but also makes the overall equipment layout more compact and reasonable, adapting to various factory conditions.

[0081] like Figure 5 As shown, according to some embodiments of the present invention, the top of the copper storage component 2 is open to form a feed inlet 21, and the bottom or side wall of the copper storage component 2 is formed with a flow passage structure, and the size of the flow passage structure is smaller than the size of the copper material.

[0082] It is understood that the top of the copper storage component 2 is open, forming a feed inlet 21, which facilitates the addition and replenishment of copper materials (such as copper rods or copper balls) without the need for additional equipment disassembly, thus improving the convenience and efficiency of operation. At the same time, the bottom or side wall of the copper storage component 2 forms a flow passage structure, such as a liquid inlet 22 and a liquid outlet 23.

[0083] The dimensions of the flow-through structure are designed to be smaller than the dimensions of the copper material to ensure that the copper material does not leak through these openings. Specifically, the flow-through structure allows the reagent to freely enter and exit the copper storage container 2, ensuring sufficient contact between the copper material and the reagent, thereby improving reaction efficiency. Furthermore, because the dimensions of the flow-through structure are smaller than the copper material, accidental detachment of the copper material from the copper storage container 2 is effectively prevented, ensuring the safety and stability of the system.

[0084] This open-top design makes adding copper material very simple. Operators can directly put the copper material into the feed inlet 21, reducing cumbersome operating steps and improving work efficiency.

[0085] On the one hand, the design of the flow-through structure ensures that the liquid can smoothly enter the copper storage container 2 and fully contact the copper material, promoting the chemical reaction. This not only accelerates the reaction rate but also improves the efficiency of copper ion generation. On the other hand, by precisely controlling the dimensions of the flow-through structure, it is ensured that the copper material will not leak out of the copper storage container 2 during the reaction, avoiding potential safety hazards and waste of material package 10.

[0086] like Figure 5 As shown, in some specific embodiments of this utility model, the flow structure includes an inlet hole 22 and an outlet hole 23. Multiple inlet holes 22 are formed at the bottom of the copper storage component 2, and multiple outlet holes 23 are formed on the side wall of the copper storage component 2.

[0087] In this way, the multiple inlet holes 22 at the bottom ensure that the liquid can enter the copper storage container 2 quickly and evenly, making full contact with the copper material; while the multiple outlet holes 23 on the side wall ensure that the liquid can be discharged in a timely manner after the reaction, avoiding stagnation. This design significantly improves the circulation efficiency of the liquid and promotes the occurrence of chemical reactions.

[0088] Meanwhile, the design of multiple liquid inlets 22 and liquid outlets 23 makes the distribution of the liquid solution more uniform throughout the copper storage component 2, reducing the problem of excessively high or low local concentrations, thereby improving the consistency of the reaction and the quality of the product.

[0089] like Figure 4 and Figure 5 As shown, in some specific embodiments of this utility model, a reinforcing bracket 24 is provided on the outer side of the copper storage component 2. The reinforcing bracket 24 is arranged around the outer peripheral wall of the copper storage component 2 and avoids the feed inlet 21.

[0090] Thus, the presence of the reinforcing bracket 24 significantly enhances the compressive strength of the copper storage component 2, especially when the copper storage component 2 is filled with copper material, effectively preventing bending or cracking that may occur during the lifting process, and extending the service life of the equipment.

[0091] On the one hand, by surrounding the outer wall of the copper storage component 2, the reinforcing bracket 24 not only strengthens the copper storage component 2 itself, but also indirectly protects the inlet hole 22 and outlet hole 23 from external interference, ensuring the stability and reliability of the liquid flow. On the other hand, the reinforcing bracket 24 deliberately avoids the top feed inlet 21, ensuring that operators can easily add copper materials without touching the reinforcing bracket 24, reducing operational risks and improving work efficiency.

[0092] In addition, since the reinforcing bracket 24 does not cover critical parts of the copper storage component 2 (such as the feed port 21 and the flow structure), it will not be obstructed during routine cleaning and inspection, thus reducing the difficulty of maintenance.

[0093] For example, the copper storage component 2 can be a titanium basket, with all four sides and the bottom plate made of titanium. Titanium is a highly corrosion-resistant metal, effectively preventing the solution from corroding the copper storage component 2. Multiple small holes (i.e., liquid inlet holes 22) are provided on the bottom plate of the titanium basket to allow the solution to enter the basket, ensuring sufficient contact and dissolution of the copper balls inside. Small holes (i.e., liquid outlet holes 23) are also provided on the side plates of the titanium basket for solution outflow. The dissolved solution is discharged through the liquid outlet holes 23, carrying away copper ions.

[0094] Because the copper spheres initially placed are very heavy (potentially close to 1 ton), a layer of titanium square tubing was used to reinforce the titanium basket and prevent deformation. This layer of titanium square tubing surrounds the outer wall of the basket, enhancing the overall structural strength. Additionally, a lifting ring is located at the top of the titanium square tubing for easy lifting of the basket using an automatic lifting device.

[0095] like Figure 1 and Figure 6 As shown, according to some embodiments of the present invention, the copper melting system also includes a raw material conveying mechanism.

[0096] The raw material conveying mechanism includes an automatic conveying device and a collection box 4. The automatic conveying device is used to convey copper material into the collection box 4. The collection box 4 has a discharge port 41 and is connected to the inlet 21 of the copper storage component 2 through the discharge port 41.

[0097] In this embodiment, the main purpose of the raw material conveying mechanism is to automatically transport copper materials (such as copper rods or copper balls) into the copper storage container 2 (titanium basket), thereby reducing manual intervention and improving operational efficiency. The automatic conveying device is responsible for transporting the copper materials from the initial position to the collection box 4. The collection box 4 is located on or at the end of the conveying path of the automatic conveying device and is used to receive the transported copper materials. Each collection box 4 has a discharge port 41, which communicates with the inlet 21 of the copper storage container 2, ensuring that the material package 10 can directly enter the interior of the copper storage container 2.

[0098] In this way, the raw material conveying mechanism achieves fully automated conveying and dispensing of copper materials, greatly improving production efficiency and reducing labor costs. The system can quickly adjust the conveying speed and quantity of material package 10 according to actual needs, adapting to different production rhythms.

[0099] Meanwhile, the automated conveying process reduces the opportunity for operators to directly contact the heavy material package 10, lowers safety risks, and ensures that each material package 10 is delivered accurately, avoiding safety hazards caused by human error.

[0100] like Figure 1 and Figure 6As shown, the automatic conveying device further includes several conveying drive units 51, several rollers 52, and an annular conveyor belt 53 composed of multiple interconnected conveying boxes 54. The conveying drive units 51 are connected to the rollers 52 in a driving manner, and the rollers 52 are connected to the annular conveyor belt 53 in a driving manner. The conveying drive units 51 are used to drive the annular conveyor belt 53 to move cyclically through the rollers 52, so that the conveying boxes 54 convey copper materials into the collection box 4.

[0101] It can be understood that the conveyor drive unit 51 is the core component that provides power to the entire conveying system. It typically includes a power source such as a motor and a transmission mechanism (such as gear or belt drive) to drive the rollers 52 to rotate. Several rollers 52 are installed inside the annular conveyor belt 53, contacting and supporting it. The rollers 52 are connected to the conveyor drive unit 51 via shafts. When the drive unit is working, the rollers 52 rotate accordingly, driving the annular conveyor belt 53 to move.

[0102] The circular conveyor belt 53 is the main component that carries the copper material. Each conveyor box 54 is an independently designed container, and they are connected in series to form a closed circular path. As the rollers 52 rotate, the circular conveyor belt 53 moves in a cycle, transporting the copper material placed in the conveyor box 54 from one place to another, for example, from the initial position to the collection box 4.

[0103] Thus, through the specific structural design described above, the automatic conveying device not only achieves efficient and safe transportation of copper materials, but also significantly improves the overall performance and reliability of the copper melting system.

[0104] like Figure 1 and Figure 6 As shown, further, a discharge port 41 is formed at the bottom of the collection box 4, the number of collection boxes 4 is equal to the number of copper storage components 2, and a copper storage component 2 is provided below each collection box 4. Preferably, the discharge port 41 is connected to the inlet 21 of the copper storage component 2 through a discharge pipe.

[0105] In this embodiment, the one-to-one matching design ensures that the material package 10 can accurately enter the corresponding copper storage unit 2, so that each copper storage unit 2 can be replenished by the material package 10, reducing the possibility of manual intervention and improving the safety and reliability of the operation. Furthermore, the relative positioning of the discharge port 41 and the inlet 21 of the copper storage unit 2 ensures that the copper material can accurately enter the copper storage unit 2, avoiding safety hazards caused by human error.

[0106] In addition, the material package 10 in the collection box 4 can pass through the discharge port 41 and the discharge pipe under the action of gravity and automatically fall into the inlet 21 of the copper storage component 2, which can avoid the setting of an unnecessary drive device, simplify the structure and improve the space utilization.

[0107] like Figure 1 , Figure 2 and Figure 6 As shown, according to some embodiments of the present invention, the copper melting system also includes a material conveying mechanism.

[0108] The material conveying mechanism includes an automatic lifting device 6, a material placement platform 7, and a vibrating plate 8. The automatic lifting device 6 is used to automatically lift the material package 10 onto the material placement platform 7. The material placement platform 7 is located above the vibrating plate 8 and is detachable from the vibrating plate 8. The vibrating plate 8 is connected to the conveying box 54.

[0109] With the material placement table 7 disassembled, the copper material is suitable to fall into the vibratory feeder 8 and be distributed to multiple conveyor boxes 54 by the vibratory feeder 8.

[0110] In this embodiment, the automatic lifting device 6 is used to automatically lift the ton bag or container containing copper material onto the material placement platform 7. The automatic lifting device 6 can be composed of an electric hoist or other form of lifting equipment, and can operate smoothly within a set height range.

[0111] It is understandable that the material placement platform 7 can serve as a temporary storage point for placing copper materials lifted up by the automatic lifting device 6. It is designed to be detachable for easy cleaning and maintenance, and also allows for quick replacement of different material package types or specifications when needed.

[0112] The vibratory feeder 8 is connected to the conveyor boxes 54 and is used to distribute and guide copper materials into each conveyor box 54. Specifically, the vibratory feeder 8 uses vibration to evenly disperse the material packages 10 and guides them into each conveyor box 54 through a specific path. This design ensures the uniformity and efficiency of material package 10 distribution while reducing the risk of blockage.

[0113] Furthermore, the specific working process of the material handling mechanism is as follows:

[0114] Copper materials (such as copper rods or spheres) are typically stored in ton bags or other containers located on the ground or at a lower level. The operator activates the automatic lifting device 6, which smoothly lifts the container containing the copper material to a predetermined height using an electric hoist, hydraulic lift, or other form of lifting equipment. The automatic lifting device 6 then accurately places the container containing the copper material onto the material placement platform 7. At this point, the material placement platform 7 is positioned above the vibratory feeder 8 and is detachably mounted relative to the vibratory feeder 8.

[0115] When material package 10 needs to be added, the operator can disassemble the material placement platform 7, allowing the copper material to fall naturally into the vibratory feeder 8 below. Once the material package 10 falls into the vibratory feeder 8, the vibratory feeder 8 starts working. Through its unique vibration mechanism, the material package 10 is evenly dispersed and guided onto a specific path. The vibratory feeder 8 is directly connected to the conveyor boxes 54, and the material package 10 smoothly enters each conveyor box 54 through the guide path of the vibratory feeder 8. Each conveyor box 54 is independently designed to ensure that the material package 10 can accurately enter the corresponding conveyor box 54, avoiding problems of human intervention and incorrect placement.

[0116] The entire material handling mechanism is typically equipped with an integrated control system that monitors the working status of each component in real time. Operators can adjust parameters such as the speed of the automatic lifting device 6 and the frequency of the vibratory feeder 8 through the control system to adapt to different production needs. The control system can also monitor potential problems in the system in real time and issue alarms when abnormalities are detected, reminding operators to handle them promptly, reducing downtime and improving system reliability.

[0117] In this way, the material handling mechanism achieves fully automated operation from lifting material package 10 to distribution, reducing the need for manual handling, lowering labor intensity, and improving work efficiency. The system can also quickly adjust the speed and quantity of material package 10 conveying according to actual needs, adapting to different production rhythms and ensuring production continuity.

[0118] The automated lifting and distribution process reduces the opportunity for operators to directly handle the heavy material package 10, thus lowering safety risks. Furthermore, the even distribution by the vibratory feeder 8 ensures accurate delivery of each material package 10, avoiding safety hazards caused by human error.

[0119] like Figure 1 As shown, according to some embodiments of the present invention, it also includes a liquid collection tank 9, which is located outside the copper dissolving main tank 1, and an overflow plate 91 is provided between the liquid collection tank 9 and the copper dissolving main tank 1. The top of the overflow plate 91 defines an overflow port, and the liquid after reaction in the copper dissolving main tank 1 is suitable to flow into the liquid collection tank 9 through the overflow port.

[0120] In this embodiment, the chemical solution collection tank 9 can form a structure that surrounds or partially surrounds the copper melting main tank 1, or it can simply be set on one side of the copper melting main tank 1. The chemical solution collection tank 9 is used to collect the reaction chemical solution that overflows from the copper melting main tank 1, preventing the chemical solution from leaking into the environment and ensuring the safety and environmental protection of the production process.

[0121] An overflow plate 91 is positioned between the copper melting main tank 1 and the chemical solution collection tank 9, serving as a separator between the two. The overflow port at the top of the overflow plate 91 is the crucial channel for the chemical solution to flow from the copper melting main tank 1 to the chemical solution collection tank 9. It can be understood that the overflow plate 91 not only acts as a separator but also controls the flow direction and speed of the chemical solution through the overflow port, ensuring that the chemical solution only flows into the chemical solution collection tank 9 when it reaches a certain height.

[0122] Specifically, its working principle is as follows: During the copper dissolving process, as the reaction proceeds, the liquid level in the main copper dissolving tank 1 may increase or rise due to the generation of bubbles. When the liquid level exceeds the height of the overflow plate 91, the liquid will automatically flow into the liquid collection tank 9 through the overflow port. The liquid flowing into the liquid collection tank 9 can be collected and recycled, and after appropriate treatment (such as filtration, regeneration, or waste disposal), the resource can be recycled or safely discharged.

[0123] In this way, the chemical solution collection tank 9 not only achieves safe and efficient collection of the chemical solution after the reaction, but also significantly improves the overall performance and reliability of the copper dissolving system. In particular, the design of the overflow plate 91 ensures that the chemical solution only flows into the collection tank when it reaches a certain height, thereby avoiding unnecessary chemical solution loss and improving operational safety and environmental friendliness.

[0124] like Figure 7 As shown, according to an embodiment of the second aspect of this utility model, an ion concentration control method is provided.

[0125] Before introducing the ion concentration control method of this utility model embodiment, the application scenarios of the ion concentration control method will be explained first. The ion concentration control method of this utility model can be applied to the copper dissolution system for iron ion copper plating described in the first aspect of this utility model, and can also be applied to smart terminals such as smartphones, tablets and computers connected to the copper dissolution system, and can also be applied to servers connected to the copper dissolution system. This utility model does not make any special limitations here, as long as it can support and implement the ion concentration control method of this utility model.

[0126] The ion concentration control method of this utility model embodiment will be described below using a copper dissolving system as an example. The structure of the copper dissolving system has been described in detail above and will not be repeated here.

[0127] like Figure 7 As shown, the ion concentration control method according to an embodiment of the present invention includes:

[0128] Step S1: Obtain the ion concentration in the copper dissolving main tank 1 based on the ion detection device;

[0129] Step S2: Determine the number of target copper storage components 2 in the copper dissolving main tank 1 based on the ion concentration;

[0130] Step S3: Based on the target number of copper storage components 2, control the take-up and release mechanism to perform take-up and release operations on several copper storage components 2.

[0131] The specific working process of the ion concentration control method according to this utility model embodiment is as follows: In step S1, the ion concentration (e.g., copper ions or iron ions) in the copper dissolving main tank 1 is monitored in real time using an ion detection device. Based on the ion concentration data obtained in step S1, the required number of target copper storage components 2 in the copper dissolving main tank 1 is calculated and determined.

[0132] Specifically, the system compares the current copper ion concentration with a preset ideal concentration range to assess whether the number of copper storage units 2 needs adjustment. If the copper ion concentration is too high, the number of copper storage units 2 may need to be reduced to decrease the reaction rate; conversely, if the copper ion concentration is too low, the number of copper storage units 2 will be increased to improve reaction efficiency. The specific increase or decrease depends on the pre-set control algorithm and empirical parameters. Finally, a suitable target number of copper storage units 2 is determined so that the ion concentration in the copper dissolving main tank 1 is maintained within the optimal range.

[0133] Based on the target number of copper storage components 2 determined in step S2, the number of copper storage components 2 in the copper melting main tank 1 is automatically adjusted by the take-up and release mechanism. Specifically, the control system issues instructions based on the target number of copper storage components 2, and the take-up and release mechanism performs corresponding actions to ensure that the number of copper storage components 2 in the copper melting main tank 1 reaches the predetermined value. After the take-up and release operation is completed, the system confirms the new ion concentration again through the ion detection device, forming a closed-loop control to ensure the stability and accuracy of the entire process.

[0134] In this way, the coordinated operation of the ion detection device and the receiving / discharging mechanism enables automatic monitoring and adjustment of ion concentration, reducing the need for manual intervention and improving the system's automation level. Simultaneously, based on real-time monitoring data, the system can quickly respond to changes in ion concentration, ensuring the copper dissolving process remains in optimal condition and avoiding safety hazards caused by excessively high or low ion concentrations.

[0135] The following is a specific embodiment of the copper dissolving system and its ion concentration control method of this utility model.

[0136] Taking a copper dissolving system comprising 20 titanium baskets (i.e., copper storage units 2) as an example, the electroplating solution is evenly distributed into the copper dissolving main tank 1 through a pump system. The copper dissolving main tank 1 is divided into twenty areas, and a titanium basket is placed in each area.

[0137] During normal production, the titanium basket is in a downward state, allowing the chemical solution to enter the basket through the mesh opening at its bottom. Iron ions in the chemical solution react with copper rods inside the basket to generate copper ions. These copper ions then flow through the mesh opening at the top of the basket into the main copper plating tank 1, and are subsequently pumped back into the copper tank for the electroplating reaction.

[0138] The system is equipped with an ion detection device to monitor changes in ion concentration within the main copper plating tank 1 in real time. These changes are related to various factors such as temperature, copper plating thickness, and fluid velocity. Based on the data provided by the ion detection device, the control system can dynamically adjust the number of titanium baskets participating in the reaction to maintain an ideal ion concentration range and ensure stable product quality.

[0139] Under normal production conditions, all 20 titanium baskets participate in the reaction. When an excessively high iron ion concentration is detected, the control system instructs the retraction mechanism to lift some of the titanium baskets, for example, reducing the number from 20 to 18 or fewer (e.g., 15), to slow the reaction rate and prevent excessive copper ion formation. Conversely, if a low copper ion concentration is detected, the control system will lower additional titanium baskets, for example, increasing the number from 15 to 17 or more (e.g., 18), to accelerate the reaction rate and raise the copper ion concentration to the ideal level.

[0140] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A copper dissolving system for iron ion copper plating, characterized in that, include: The copper dissolving tank (1) has a copper dissolving space (11) inside for storing the reaction solution; At least two copper storage components (2) and a receiving and releasing mechanism are provided. The receiving and releasing mechanism is arranged opposite to the copper melting main tank (1). The receiving and releasing mechanism is connected to each of the copper storage components (2) in a transmission manner to control the copper storage components (2) to extend into or leave the copper melting space (11). An ion detection device is used to detect the ion concentration in the copper dissolving main tank (1), and the number of copper storage pieces (2) placed in the copper dissolving main tank (1) is determined by the ion concentration. The copper storage component (2) has a copper storage space inside for storing copper materials. The copper storage component (2) is also provided with a flow passage structure. When the copper storage component (2) extends into the copper melting space (11), the copper storage space is connected to the copper melting space (11) through the flow passage structure.

2. The copper dissolving system for iron ion copper plating according to claim 1, characterized in that, The top of the copper melting main tank (1) is open to form an inlet and outlet (12), and the receiving and releasing mechanism is located above the copper melting main tank (1) and is arranged opposite to the inlet and outlet (12); The receiving and releasing mechanism includes at least two automatic lifting devices (3), each of which is connected to at least one of the copper storage components (2) via a transmission connection.

3. The copper dissolving system for iron ion copper plating according to claim 2, characterized in that, The top of the copper storage component (2) is open to form a feed inlet (21), and the bottom or side wall of the copper storage component (2) has the flow passage structure, and the size of the flow passage structure is smaller than the size of the copper material.

4. The copper dissolving system for iron ion copper plating according to claim 3, characterized in that, The flow structure includes an inlet hole (22) and an outlet hole (23). A plurality of inlet holes (22) are formed at the bottom of the copper storage component (2), and a plurality of outlet holes (23) are formed on the side wall of the copper storage component (2).

5. The copper dissolving system for iron ion copper plating according to claim 3, characterized in that, A reinforcing bracket (24) is provided on the outside of the copper storage component (2). The reinforcing bracket (24) is arranged around the outer peripheral wall of the copper storage component (2) and avoids the feed inlet (21).

6. The copper dissolving system for iron ion copper plating according to any one of claims 3 to 5, characterized in that, Also includes: The raw material conveying mechanism includes an automatic conveying device and a collection box (4). The automatic conveying device is used to convey copper material into the collection box (4). The collection box (4) has a discharge port and is connected to the inlet (21) of the copper storage component (2) through the discharge port.

7. The copper dissolving system for iron ion copper plating according to claim 6, characterized in that, The bottom of the collection box (4) forms the discharge port (41). The number of collection boxes (4) is equal to the number of copper storage components (2), and each collection box (4) is provided with a copper storage component (2) below it.

8. The copper dissolving system for iron ion copper plating according to claim 6, characterized in that, The automatic conveying device includes several conveying drive units (51), several rollers (52), and an annular conveyor belt (53) composed of multiple interconnected conveyor boxes (54). The conveying drive units (51) are driven to the rollers (52), and the rollers (52) are driven to the annular conveyor belt (53). The conveying drive units (51) are used to drive the annular conveyor belt (53) to move cyclically through the rollers (52) so that the conveyor boxes (54) convey copper material into the collection box (4).

9. The copper dissolving system for iron ion copper plating according to claim 8, characterized in that, Also includes: The material conveying mechanism includes an automatic lifting device (6), a material placement platform (7), and a vibratory feeder (8). The automatic lifting device (6) is used to automatically lift the material onto the material placement platform (7). The material placement platform (7) is located above the vibratory feeder (8) and is detachable from the vibratory feeder (8). The vibratory feeder (8) is connected to the conveying box (54). When the material placement table (7) is disassembled, the copper material is adapted to fall into the vibratory feeder (8) and be distributed to the plurality of conveyor boxes (54) by the vibratory feeder (8).

10. The copper dissolving system for iron ion copper plating according to any one of claims 1 to 5, characterized in that, It also includes a liquid collection tank (9), which is located outside the copper dissolving main tank (1), and an overflow plate (91) is provided between the liquid collection tank (9) and the copper dissolving main tank (1). The top of the overflow plate (91) defines an overflow port, and the liquid reacted in the copper dissolving main tank (1) is suitable to flow into the liquid collection tank (9) through the overflow port.

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