Bonding equipment and splicing tool with same

Abstract

The utility model provides bonding equipment and a splicing tool with the same. The bonding equipment is used for bonding a crystal support, a resin plate and a silicon rod together. The bonding equipment comprises a base; the counterweight pressing device is movably arranged on the base and comprises a mounting seat, a pressing structure, a first driving device and an elastic structure, the first driving device is in driving connection with the pressing structure so as to drive the pressing structure to do lifting motion relative to the mounting seat, and a bonding space is formed between the pressing structure and the base; one end of the elastic structure is connected with the downward pressing structure so as to apply elastic force moving towards one side of the base to the downward pressing structure; the centering device comprises two centering structures which are oppositely arranged, the two centering structures are located on the two sides of the bonding space respectively, each centering structure comprises a centering convex part, and the centering convex parts are movably arranged and used for limiting and stopping the resin plate. According to the utility model, the problem that the bonding equipment in the prior art has a poor pressurizing effect on a crystal support, a resin plate and a silicon rod is solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and more specifically, to an adhesive bonding device and a splicing fixture having the same. Background Technology

[0002] In the photovoltaic industry, the processing of silicon rods is particularly critical, and one important process is the bonding of silicon rods. Existing silicon rod bonding technologies typically use positioning fixtures to align the crystal holder, resin plate, and silicon rod, ensuring their precise positioning during the bonding process.

[0003] Specifically, during the bonding process, stable pressure needs to be applied to the silicone rod to ensure that the resin adhesive is fully filled and cured. However, existing pressure devices typically rely on gravity, which cannot provide a consistent pressure effect when bonding silicone rods of different weights, resulting in uneven bonding strength or even bonding failure, thus affecting product quality. Utility Model Content

[0004] The main objective of this invention is to provide a bonding device and a splicing fixture having the same, so as to solve the problem that the bonding device in the prior art has poor pressure effect on the crystal tray, resin plate and silicon rod, which affects the bonding strength.

[0005] To achieve the above objectives, according to one aspect of the present invention, a bonding device is provided for bonding a crystal substrate, a resin plate, and a silicon rod together. The bonding device includes: a base; a counterweight pressing device movably disposed on the base, the counterweight pressing device including a mounting base, a pressing structure, a first driving device, and an elastic structure, the first driving device being drivenly connected to the pressing structure to drive the pressing structure to move up and down relative to the mounting base, forming a bonding space between the pressing structure and the base; one end of the elastic structure being connected to the pressing structure to apply an elastic force to the pressing structure moving towards one side of the base; and a centering device including two opposing centering structures located on both sides of the bonding space, each centering structure including a centering protrusion movably disposed for contacting the resin plate, thereby limiting and stopping the resin plate.

[0006] Furthermore, the elastic structure is a tension spring; and / or, there is one elastic structure; or, there are multiple elastic structures, which are spaced apart along the length and / or width direction of the pressing structure.

[0007] Furthermore, the pressing structure includes: a pressing frame, comprising two first plates arranged opposite each other, a plurality of first connecting posts and a second connecting post, with a mounting cavity formed between the two first plates, the plurality of first connecting posts disposed on the side of the mounting cavity near the base, and both ends of each first connecting post connected to each first plate respectively; the other end of the elastic structure is connected to the second connecting post; at least a portion of the side of each first plate is disposed facing the base to form a mounting edge; an anti-slip strip is disposed on the mounting edge; and a pressure strip is disposed on the plurality of first connecting posts to press the silicon rod tightly onto the base; wherein the pressure strip is made of polyurethane material.

[0008] Furthermore, the centering device also includes: a second driving device; a transmission assembly, wherein the second driving device is driven to be connected to the two centering structures via the transmission assembly to drive the two centering structures to move toward or away from each other, thereby adjusting the position of the centering protrusion.

[0009] Furthermore, each centering structure also includes: a mounting plate, on which the centering protrusion is disposed; and a connecting plate, through which the transmission assembly is connected to the mounting plate; wherein, each centering structure is provided with one or more centering protrusions, and when multiple centering protrusions are provided on each centering structure, the multiple centering protrusions are spaced apart along the length direction of the mounting plate.

[0010] Furthermore, each centering structure includes two connecting plates, which are spaced apart along the length of the mounting plate. The transmission assembly includes two spaced-apart traction segment groups, which are spaced apart along the length of the silicon rod. Each traction segment group includes a first traction segment and a second traction segment arranged opposite to each other. The traction directions of the first traction segment and the second traction segment are opposite. The traction directions of the first traction segment and the second traction segment of the two traction segment groups are the same. In one centering structure, the two connecting plates are fixedly connected to the two first traction segments, and in the other centering structure, the two connecting plates are fixedly connected to the two second traction segments.

[0011] Furthermore, the transmission assembly also includes: a third traction section, wherein the first end of the first traction section in different traction section groups is connected to the first end of the second traction section through the third traction section; and a fourth traction section, wherein the second end of the first traction section in the same traction section group is connected to the second end of the second traction section through the fourth traction section.

[0012] Furthermore, the transmission assembly also includes a first connecting block and a second connecting block. Two connecting plates in one centering structure are fixedly connected to the first traction section via the first connecting block, and two connecting plates in the other centering structure are fixedly connected to the second traction section via the second connecting block. The centering device also includes: a first shaft and a second shaft arranged opposite to each other, with two connecting plates in each centering structure slidably connected to the first shaft and the second shaft, respectively; a first bearing structure slidably sleeved on the first shaft, with one connecting plate in each centering structure connected to the first bearing structure; and a second bearing structure slidably sleeved on the second shaft, with the other connecting plate in each centering structure connected to the second bearing structure.

[0013] Furthermore, the second drive device is a motor, and the centering device further includes: a lead screw and nut mechanism, wherein the output shaft of the motor is connected to the lead screw of the lead screw and nut mechanism, and the nut of the lead screw and nut mechanism is connected to the first connecting block or the second connecting block; wherein the bonding device further includes: a positioning block, which is disposed on the mounting base and located within the silicon rod positioning space; and / or, an adjustment device for locking or unlocking the output shaft of the second drive device.

[0014] According to another aspect of the present invention, a splicing fixture is provided, comprising: a frame; a bonding device disposed on the frame; a third driving device connected to the bonding device to drive the bonding device to move along a preset direction; and a robotic arm for sequentially transferring a crystal tray into the bonding device, transferring a resin plate onto the crystal tray, transferring a silicon rod onto the resin plate, and transferring the finished product formed by bonding the crystal tray, the resin plate, and the silicon rod to a preset position; wherein the bonding device is the aforementioned bonding device.

[0015] Using the technical solution of this utility model, the bonding equipment is used to bond a crystal tray, a resin plate, and a silicon rod together. The bonding equipment includes a base, a counterweight pressing device, and a centering device. The counterweight pressing device is movably mounted on the base and includes a mounting base, a pressing structure, a first driving device, and an elastic structure. The first driving device is driven to the pressing structure to drive the pressing structure to move up and down relative to the mounting base, forming a bonding space between the pressing structure and the base. One end of the elastic structure is connected to the pressing structure to apply an elastic force to the pressing structure towards the base. The centering device includes two opposing centering structures located on both sides of the bonding space. Each centering structure includes a centering protrusion, which is movably disposed to contact the resin plate, thereby limiting and stopping the resin plate. In this way, during the bonding process of the crystal tray, resin plate, and silicon rod, the pressing structure of the counterweight pressing device is driven by the first driving device, realizing the automatic lifting and lowering of the pressing structure. The above-mentioned setting of the elastic structure can ensure that a stable downward pressure is applied to the three components during the pressing process, thereby improving the pressure effect on the three components. This solves the problem of poor pressure effect on the crystal tray, resin plate, and silicon rod in the existing bonding equipment, which affects the bonding strength, and improves the bonding strength of the three components. At the same time, the two centering structures of the centering device have movable centering protrusions, which can contact the resin plate during the bonding process, ensuring the precise position of the resin plate relative to the crystal tray and silicon rod, thereby improving the bonding accuracy and reliability. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0017] Figure 1 A perspective structural schematic diagram of an embodiment of the bonding device according to the present invention is shown;

[0018] Figure 2 It shows Figure 1 A schematic diagram of the three-dimensional structure of the bonding equipment, crystal tray, resin plate, and silicon rod after assembly.

[0019] Figure 3 It shows Figure 1 A schematic diagram of the transmission components of the bonding equipment in the diagram;

[0020] Figure 4 It shows Figure 1 A three-dimensional structural diagram of the pressing structure of the bonding equipment in the process;

[0021] Figure 5 It shows Figure 4 A bottom view of the downward-pressing structure in the middle;

[0022] Figure 6 It shows Figure 1 A three-dimensional structural diagram of the bonding equipment after the adjustment device and the second drive device are assembled.

[0023] Figure 7 It shows Figure 1 A three-dimensional structural diagram of the centering structure of the bonding equipment in the process;

[0024] Figure 8 A three-dimensional structural schematic diagram of an embodiment of the seam fitting according to the present invention is shown.

[0025] The above figures include the following reference numerals:

[0026] 10. Crystal holder; 20. Resin plate; 30. Silicon rod; 40. Base; 50. Mounting seat; 60. Pressing structure; 61. Pressing frame; 611. First plate; 612. First connecting post; 613. Second connecting post; 62. Anti-slip strip; 63. Pressure strip; 70. Elastic structure; 80. Centering structure; 81. Centering protrusion; 82. Mounting plate; 83. Connecting plate; 90. Second driving device; 100. Transmission assembly; 101. Traction section group; 1011, First traction section; 1012, Second traction section; 102, Third traction section; 103, Fourth traction section; 104, First connecting block; 105, Second connecting block; 110, First shaft; 120, Second shaft; 130, First bearing structure; 140, Second bearing structure; 150, Lead screw and nut mechanism; 160, Positioning block; 170, Adjustment device; 180, Frame; 190, Bonding equipment. Detailed Implementation

[0027] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0028] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0029] In this utility model, unless otherwise stated, directional terms such as "upper" and "lower" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" are generally used in relation to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0030] To address the problem that existing bonding equipment has poor pressure application to crystal trays, resin plates, and silicon rods, thus affecting bonding strength, this application provides a bonding device and a splicing fixture having the same.

[0031] like Figures 1 to 7 As shown, the bonding equipment is used to bond the crystal tray 10, the resin plate 20, and the silicon rod 30 together. The bonding equipment includes a base 40, a counterweight pressing device, and a centering device. The counterweight pressing device is movably mounted on the base 40 and includes a mounting base 50, a pressing structure 60, a first driving device, and an elastic structure 70. The first driving device is driven to the pressing structure 60 to drive the pressing structure 60 to move up and down relative to the mounting base 50, forming a bonding space between the pressing structure 60 and the base 40. One end of the elastic structure 70 is connected to the pressing structure 60 to apply an elastic force to the pressing structure 60 towards the base 40. The centering device includes two opposing centering structures 80, which are located on both sides of the bonding space. Each centering structure 80 includes a centering protrusion 81, which is movably disposed to contact the resin plate 20, thereby limiting and stopping the resin plate 20.

[0032] Applying the technical solution of this embodiment, during the bonding process of the crystal tray 10, resin plate 20, and silicon rod 30, the pressing structure 60 of the counterweight pressing device is driven by the first driving device to realize the automatic lifting and lowering of the pressing structure 60. The above-mentioned setting of the elastic structure 70 can ensure that a stable downward pressure is applied to the three components during the pressing process, thereby improving the pressure effect of the three components. This solves the problem in the prior art where the pressing effect of the bonding equipment on the crystal tray 10, resin plate 20, and silicon rod 30 is poor, thus affecting the bonding strength and improving the bonding strength of the three components. At the same time, the two centering structures 80 of the centering device have movable centering protrusions 81, which can contact the resin plate 20 during the bonding process, ensuring the precise position of the resin plate 20 relative to the crystal tray 10 and silicon rod 30, thereby improving the accuracy and reliability of the bonding.

[0033] Optionally, the elastic structure 70 is a tension spring; and / or, there is one elastic structure 70; or, there are multiple elastic structures 70, spaced apart along the length and / or width of the pressing structure 60. This arrangement of the tension spring ensures that the elastic structure 70 can continuously apply downward pressure to the crystal holder 10, the resin plate 20, and the silicon rod 30, further enhancing the bonding strength among the three. Simultaneously, this arrangement allows for greater flexibility in selecting the number of elastic structures 70 to meet different usage requirements and working conditions, and also improves the processing flexibility for operators.

[0034] In this embodiment, the elastic structure 70 is a tension spring. There are four elastic structures 70, spaced apart along the length and width of the pressing structure 60. This arrangement of the elastic structures 70 ensures that the pressure on the silicon rod 30 is uniform at all points during the bonding process, thus avoiding product defects caused by uneven pressure distribution, such as uneven bonding interfaces or localized incomplete bonding, thereby improving bonding quality and product reliability. Simultaneously, when using a tension spring as the elastic structure 70, its elastic properties absorb impacts and vibrations during the bonding process, acting as a buffer to protect the silicon rod 30 and the equipment from damage. The elastic deformation characteristics of the tension spring under overload also prevent damage to the equipment or product due to excessive pressure.

[0035] like Figure 4 and Figure 5 As shown, the pressing structure 60 includes a pressing frame 61, an anti-slip strip 62, and a pressure strip 63. The pressing frame 61 includes two opposing first plates 611, multiple first connecting posts 612, and a second connecting post 613. A mounting cavity is formed between the two first plates 611. The multiple first connecting posts 612 are located on the side of the mounting cavity near the base 40, and both ends of each first connecting post 612 are connected to the respective first plate 611. The other end of the elastic structure 70 is connected to the second connecting post 613. At least a portion of the side edges of each first plate 611 face the base 40 to form a mounting edge. The anti-slip strip 62 is located on the mounting edge. The pressure strip 63 is located on the multiple first connecting posts 612 to press the silicon rod 30 firmly onto the base 40. In this way, the above-mentioned configuration improves the structural strength of the pressing structure 60, thereby ensuring the pressing stability of the pressing structure 60 on the crystal holder 10, resin plate 20 and silicon rod 30; on the other hand, the above-mentioned configuration makes the structure of the pressing structure 60 simpler, easier to process and implement, and reduces the processing cost and processing difficulty of the pressing structure 60.

[0036] Specifically, the aforementioned arrangement of the pressure frame 61 ensures that the silicon rod 30 receives uniform and stable vertical pressure during the pressing process. The multiple first connecting posts 612 enhance the structural strength and rigidity of the pressure frame 61, preventing deformation during pressure application and thus ensuring the flatness of the bonding interface and the reliability of the bonding. The anti-slip strip 62, located on the mounting edge of the first plate 611, increases the friction between the silicon rod 30 and the pressure frame 61, preventing the silicon rod 30 from sliding during pressing. The pressure strip 63, located on the multiple first connecting posts 612, enables multi-point contact and uniform pressing of the silicon rod 30, preventing deformation or breakage caused by single-point pressing. Furthermore, the connection method between the pressure strip 63 and the first connecting posts 612 ensures the stability and positional accuracy of the pressure strip, which is beneficial for improving the consistency and quality of the bonding. The elastic structure 70 is connected to the pressure frame 61 via the second connecting post 613, ensuring the uniform transmission of elastic force. At the same time, this connection method also enhances the structural stability of the pressure frame 61, preventing it from twisting or shifting when subjected to elastic force, thus ensuring the accuracy of pressure application.

[0037] Optionally, the pressure strip 63 is made of polyurethane. This allows the polyurethane pressure strip to maintain its shape and performance, extending the equipment's lifespan and reducing the frequency of maintenance and replacement.

[0038] Alternatively, the anti-slip strip is made of rubber or polyurethane, which can protect the surface of the silicon rod 30 from damage and maintain its integrity.

[0039] like Figure 3 and Figure 6 As shown, the centering device also includes a second drive device 90 and a transmission assembly 100. The second drive device 90 is connected to the two centering structures 80 via the transmission assembly 100, driving the two centering structures 80 to move toward or away from each other, thereby adjusting the position of the centering protrusion 81. In this way, the above configuration achieves automated centering of the centering device, thus improving the intelligence level of the bonding equipment; furthermore, the second drive device 90 drives the centering structures 80 to move via the transmission assembly 100, thereby improving the smoothness of the movement of the centering structures 80.

[0040] like Figure 7 As shown, each centering structure 80 also includes a mounting plate 82 and a connecting plate 83. A centering protrusion 81 is disposed on the mounting plate 82, and the transmission assembly 100 is connected to the mounting plate 82 via the connecting plate 83. Each centering structure 80 may have one or more centering protrusions 81. When multiple centering protrusions 81 are provided on each centering structure 80, the multiple centering protrusions 81 are spaced apart along the length direction of the mounting plate 82.

[0041] Specifically, the use of the transmission assembly 100 ensures that the power of the second drive device 90 can be stably and accurately transmitted to the centering structure 80, making the movement of the centering protrusion 81 both smooth and precise. This design improves the reliability of the centering device and reduces centering failures or poor adhesion caused by transmission instability.

[0042] like Figure 3 and Figure 7 As shown, each centering structure 80 includes two connecting plates 83, which are spaced apart along the length of the mounting plate 82. The transmission assembly 100 includes two spaced-apart traction segment groups 101, which are spaced apart along the length of the silicon rod 30. Each traction segment group 101 includes a first traction segment 1011 and a second traction segment 1012 arranged opposite to each other. The traction directions of the first traction segment 1011 and the second traction segment 1012 are opposite. The traction directions of the first traction segment 1011 and the second traction segment 1012 of the two traction segment groups 101 are the same. Specifically, the two connecting plates 83 in one centering structure 80 are fixedly connected to the two first traction segments 1011, and the two connecting plates 83 in the other centering structure 80 are fixedly connected to the two second traction segments 1012. In this way, the aforementioned arrangement of the traction section group 101 ensures that the centering structure 80 can move accurately and synchronously along the length of the silicon rod 30. Since the traction directions of the first traction section 1011 and the second traction section 1012 are opposite and they are respectively fixedly connected to the connecting plate 83 of the centering structure 80, symmetrical power can be provided, ensuring that the contact force of the centering protrusion 81 on both sides of the silicon rod is uniform, achieving high-precision centering positioning. At the same time, the use of the connecting plate 83 enhances the structural strength of the centering structure 80, improves the durability and long-term operational stability of the equipment, and also helps to maintain the accuracy of the centering protrusion 81 during movement.

[0043] In this embodiment, each centering structure 80 is connected to a traction segment in the same traction direction, thereby ensuring that the two centering structures 80 can move toward or away from each other to accurately position the resin plate 20 and improve the bonding strength and bonding stability between the crystal holder 10, the resin plate 20 and the silicon rod 30.

[0044] like Figure 3As shown, the transmission assembly 100 also includes a third traction section 102 and a fourth traction section 103. The first end of the first traction section 1011 in different traction section groups 101 is connected to the first end of the second traction section 1012 through the third traction section 102. The second end of the first traction section 1011 in the same traction section group 101 is connected to the second end of the second traction section 1012 through the fourth traction section 103. In this way, the above-mentioned arrangement of the third traction section 102 and the fourth traction section 103 ensures that the first traction section 1011 and the second traction section 1012 in different traction section groups 101 can move synchronously. Since the traction directions of the first traction section 1011 and the second traction section 1012 are opposite, the connection of the third traction section 102 and the fourth traction section 103 ensures that under the drive of the second drive device 90, the two centering structures 80 move towards or away from each other simultaneously, thereby improving the synchronicity and consistency of the centering process and ensuring that the silicon rod is subjected to uniform force on both sides.

[0045] Specifically, the connection between the traction section groups enhances the overall structural stability of the transmission assembly 100. The function of the third traction section 102 and the fourth traction section 103 is to form a stable closed loop between different traction section groups, preventing structural distortion or vibration caused by uneven force or uncoordinated movement during the driving process, and ensuring the stability and reliability of the centering device during operation.

[0046] like Figure 3As shown, the transmission assembly 100 also includes a first connecting block 104 and a second connecting block 105. Two connecting plates 83 in one centering structure 80 are fixedly connected to the first traction section 1011 via the first connecting block 104, and two connecting plates 83 in the other centering structure 80 are fixedly connected to the second traction section 1012 via the second connecting block 105. The centering device also includes a first shaft 110 and a second shaft 120, a first bearing structure 130, and a second bearing structure 140 arranged opposite to each other. Two connecting plates 83 in each centering structure 80 are slidably connected to the first shaft 110 and the second shaft 120, respectively. The first bearing structure 130 is slidably sleeved outside the first shaft 110, and one connecting plate 83 in each centering structure 80 is connected to the first bearing structure 130. The second bearing structure 140 is slidably sleeved outside the second shaft 120, and the other connecting plate 83 in each centering structure 80 is connected to the second bearing structure 140. In this way, the connecting plate 83 is connected to the first shaft 110 and the second shaft 120 through bearing structures (first bearing structure 130 and second bearing structure 140). This low-friction connection method makes the centering structure 80 move more smoothly during movement, reducing motion resistance and improving positioning accuracy, ensuring the stability and accuracy of centering. Simultaneously, the centering structure 80 is firmly connected to the first traction section 1011 and the second traction section 1012 through the first connecting block 104 and the second connecting block 105, enhancing the overall structural stability of the equipment. The use of bearing structures can also absorb vibration and impact during movement, reduce mechanical wear, extend the service life of the equipment, and improve operational reliability.

[0047] like Figure 3 and Figure 6 As shown, the second drive device 90 is a motor, and the centering device also includes a lead screw and nut mechanism 150. The output shaft of the motor is connected to the lead screw of the lead screw and nut mechanism 150, and the nut of the lead screw and nut mechanism 150 is connected to the first connecting block 104 or the second connecting block 105. In this way, the combined use of the motor and the lead screw and nut mechanism 150 enables high-precision control of the translation of the centering structure 80. The linear motion characteristics of the lead screw and nut mechanism, combined with the speed and torque control of the motor, ensure that the position adjustment of the centering convex part 81 achieves micron-level precision. Simultaneously, the motor's output shaft is directly connected to the lead screw, converting rotational motion into linear motion through the lead screw and nut mechanism. This power transmission method is not only stable but also highly efficient. Furthermore, the conversion of the motor's speed into the rotation of the lead screw, and then into the translation of the centering structure 80, reduces energy loss during power transmission, ensuring the high efficiency and reliability of the equipment operation.

[0048] Optionally, the bonding device further includes a positioning block 160, which is disposed on the mounting base 50 and located within the silicon rod positioning space; and / or, the bonding device further includes an adjustment device 170, which is used to lock or unlock the output shaft of the second drive device 90. In this way, the aforementioned arrangement of the positioning block 160 can limit and stop the silicon rod 30, ensuring the accuracy of the bonding position between the silicon rod 30 and the resin plate 20, thereby improving product quality. Simultaneously, the locking and unlocking function of the adjustment device 170 can precisely control the output shaft of the motor, ensuring that the motor stops immediately when the centering structure 80 moves to the designated position, avoiding over-alignment or position drift, and improving the control accuracy of the equipment.

[0049] In this embodiment, the bonding device further includes a positioning block 160 and an adjustment device 170. The positioning block 160 is disposed on the mounting base 50 and located within the silicon rod positioning space. The adjustment device 170 is used to lock or unlock the output shaft of the second drive device 90. Thus, during the bonding process, the locking function of the adjustment device 170 can prevent the motor from starting unexpectedly, avoid unintended movement of the centering structure 80, protect the safety of operators and equipment, and also prevent the silicon rod from being damaged during the bonding process.

[0050] In this embodiment, the mounting base 50 includes two second plates and a third plate disposed opposite to each other. The third plate is located between and connected to both second plates, forming an installation space around them. At least a portion of the pressing structure 60 is vertically and elliptically disposed within the installation space, and the elastic structure 70 is located within the installation space. Thus, by designing to form an installation space around each other, the pressing structure 60 and the elastic structure 70 can be centrally installed and arranged. This compact structure not only saves space but also simplifies the equipment layout, making the overall design more rational and compact.

[0051] In this embodiment, the counterweight pressing device also includes a guide rail, and at least a portion of the pressing structure 60 cooperates with the guide rail to move up and down along the extension direction of the guide rail. Thus, the guide rail provides linear guidance for the pressing structure 60, ensuring its verticality and straightness during the lifting process, thereby improving the positioning accuracy and pressing stability of the counterweight pressing device during silicon rod bonding, and avoiding poor bonding caused by deviations in the movement trajectory.

[0052] like Figure 8As shown, this application also provides a splicing fixture, including a frame 180, a bonding device 190, a third drive device, and a robotic arm. The bonding device 190 is mounted on the frame 180, and the third drive device is driven to connect to the bonding device 190 to drive the bonding device 190 to move in a preset direction. The robotic arm is used to sequentially transfer the crystal tray 10 into the bonding device, transfer the resin plate 20 onto the crystal tray 10, transfer the silicon rod 30 onto the resin plate 20, and transfer the finished product formed by bonding the crystal tray 10, the resin plate 20, and the silicon rod 30 to a preset position. The bonding device 190 is the aforementioned bonding device.

[0053] Specifically, the use of robotic arms enables automated transfer and positioning of the crystal tray 10, resin plate 20, and silicon rod 30, thereby greatly simplifying the splicing and bonding process, reducing manual operation steps, and improving the level of production automation.

[0054] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0055] The bonding equipment is used to bond a crystal substrate, a resin plate, and a silicon rod together. The equipment includes a base, a counterweight pressing device, and a centering device. The counterweight pressing device is movably mounted on the base and includes a mounting base, a pressing structure, a first driving device, and an elastic structure. The first driving device is driven by the pressing structure to drive it to move up and down relative to the mounting base, forming a bonding space between the pressing structure and the base. One end of the elastic structure is connected to the pressing structure to apply an elastic force to the pressing structure towards the base. The centering device includes two opposing centering structures located on opposite sides of the bonding space. Each centering structure includes a centering protrusion, which is movably positioned to contact the resin plate, thereby limiting and stopping the resin plate. In this way, during the bonding process of the crystal tray, resin plate, and silicon rod, the pressing structure of the counterweight pressing device is driven by the first driving device, realizing the automatic lifting and lowering of the pressing structure. The above-mentioned setting of the elastic structure can ensure that a stable downward pressure is applied to the three components during the pressing process, thereby improving the pressure effect on the three components. This solves the problem of poor pressure effect on the crystal tray, resin plate, and silicon rod in the existing bonding equipment, which affects the bonding strength, and improves the bonding strength of the three components. At the same time, the two centering structures of the centering device have movable centering protrusions, which can contact the resin plate during the bonding process, ensuring the precise position of the resin plate relative to the crystal tray and silicon rod, thereby improving the bonding accuracy and reliability.

[0056] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0057] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0058] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0059] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A bonding apparatus for bonding a crystal substrate (10), a resin plate (20), and a silicon rod (30) together, characterized in that, The bonding device includes: Base (40); A counterweight pressing device is movably mounted on the base (40). The counterweight pressing device includes a mounting base (50), a pressing structure (60), a first driving device, and an elastic structure (70). The first driving device is driven to connect with the pressing structure (60) to drive the pressing structure (60) to move up and down relative to the mounting base (50). An adhesive space is formed between the pressing structure (60) and the base (40). One end of the elastic structure (70) is connected to the pressing structure (60) to apply an elastic force to the pressing structure (60) to move towards one side of the base (40). The centering device includes two opposing centering structures (80), which are located on both sides of the bonding space. Each centering structure (80) includes a centering protrusion (81), which is movably disposed to contact the resin plate (20) and thereby limit and stop the resin plate (20).

2. The bonding equipment according to claim 1, characterized in that, The elastic structure (70) is a tension spring; and / or, the elastic structure (70) is one; or, the elastic structure (70) is multiple, and the multiple elastic structures (70) are spaced apart along the length direction and / or width direction of the pressing structure (60).

3. The bonding equipment according to claim 1, characterized in that, The pressing structure (60) includes: The pressure frame (61) includes two first plates (611) arranged opposite to each other, a plurality of first connecting posts (612) and a second connecting post (613). A mounting cavity is formed between the two first plates (611). The plurality of first connecting posts (612) are disposed on the side of the mounting cavity near the base (40). Both ends of each first connecting post (612) are respectively connected to each of the first plates (611). The other end of the elastic structure (70) is connected to the second connecting post (613). At least a portion of the side of each first plate (611) is disposed facing the base (40) to form a mounting edge. Anti-slip strip (62) is provided on the mounting edge; A pressure bar (63) is disposed on a plurality of first connecting posts (612) to press the silicon rod (30) onto the base (40); The pressure strip (63) is made of polyurethane.

4. The bonding equipment according to claim 1, characterized in that, The centering device further includes: Second drive unit (90); The transmission assembly (100) and the second drive device (90) are driven to be connected to the two centering structures (80) through the transmission assembly (100) to drive the two centering structures (80) to move toward or away from each other, thereby adjusting the position of the centering protrusion (81).

5. The bonding device according to claim 4, characterized in that, Each of the aforementioned centering structures (80) further includes: Mounting plate (82), wherein the centering protrusion (81) is provided on the mounting plate (82); A connecting plate (83) is provided, through which the transmission assembly (100) is connected to the mounting plate (82); Each of the centering structures (80) is provided with one or more centering protrusions (81). When each of the centering structures (80) is provided with multiple centering protrusions (81), the multiple centering protrusions (81) are spaced apart along the length direction of the mounting plate (82).

6. The bonding device according to claim 5, characterized in that, Each of the centering structures (80) includes two connecting plates (83), which are spaced apart along the length of the mounting plate (82). The transmission assembly (100) includes: Two traction segment groups (101) are spaced apart along the length direction of the silicon rod (30). Each traction segment group (101) includes a first traction segment (1011) and a second traction segment (1012) arranged opposite to each other. The traction directions of the first traction segment (1011) and the second traction segment (1012) are opposite. The traction directions of the first traction segment (1011) and the second traction segment (1012) of the two traction segment groups (101) are the same. In one centering structure (80), two connecting plates (83) are fixedly connected to two first traction sections (1011), and in another centering structure (80), two connecting plates (83) are fixedly connected to two second traction sections (1012).

7. The bonding device according to claim 6, characterized in that, The transmission assembly (100) further includes: The third traction section (102) connects the first end of the first traction section (1011) in the different traction section groups (101) to the first end of the second traction section (1012) through the third traction section (102); The fourth traction section (103) connects the second end of the first traction section (1011) in the same traction section group (101) to the second end of the second traction section (1012) through the fourth traction section (103).

8. The bonding device according to claim 6, characterized in that, The transmission assembly (100) further includes a first connecting block (104) and a second connecting block (105). Two connecting plates (83) in one centering structure (80) are fixedly connected to the first traction section (1011) via the first connecting block (104), and two connecting plates (83) in the other centering structure (80) are fixedly connected to the second traction section (1012) via the second connecting block (105). The centering device further includes: The first shaft (110) and the second shaft (120) are arranged opposite to each other, and the two connecting plates (83) in each of the centering structures (80) are slidably connected to the first shaft (110) and the second shaft (120); The first bearing structure (130) is slidably sleeved on the outside of the first shaft (110), and one of the connecting plates (83) in each of the centering structures (80) is connected to the first bearing structure (130); The second bearing structure (140) is slidably sleeved on the outside of the second shaft (120), and another connecting plate (83) in each of the centering structures (80) is connected to the second bearing structure (140).

9. The bonding device according to claim 8, characterized in that, The second drive device (90) is a motor, and the centering device further includes: A lead screw and nut mechanism (150) is provided, wherein the output shaft of the motor is connected to the lead screw of the lead screw and nut mechanism (150), and the nut of the lead screw and nut mechanism (150) is connected to the first connecting block (104) or the second connecting block (105). The bonding device further includes: A positioning block (160) is disposed on the mounting base (50) and located within the positioning space of the silicon rod (30); and / or, Adjustment device (170) is used to lock or unlock the output shaft of the second drive device (90).

10. A stitching garment, characterized in that, include: Rack (180); An adhesive bonding device (190) is mounted on the frame (180); A third driving device is connected to the bonding device (190) to drive the bonding device (190) to move in a preset direction; The robotic arm is used to sequentially transfer the crystal tray (10) into the bonding device (190), transfer the resin plate (20) onto the crystal tray (10), transfer the silicon rod (30) onto the resin plate (20), and transfer the finished product formed by bonding the crystal tray (10), the resin plate (20), and the silicon rod (30) to a preset position. The bonding device (190) is the bonding device according to any one of claims 1 to 9.

Images