Multifunctional incoming material inspection device

Abstract

The utility model relates to a multifunctional incoming material inspection device which comprises a tool plate and a power supply module arranged on the tool plate, and a plurality of test modules are detachably installed on the tool plate. The test module comprises an optocoupler test module, a nixie tube test module, an LED lamp test module, a buzzer test module, a cable test module, a panel test module, a power supply chip test module, a digital-to-analog converter test module, an analog-to-digital converter test module, an operational amplifier test module and a chip function integration test module. Compared with the prior art, the system has the advantages of being good in expansibility, high in integration level, simple to operate, capable of improving efficiency and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to sensor production and manufacturing field especially to a multifunctional incoming material inspection device. BACKGROUND

[0002] In the sensor production and manufacturing process, the quality of the incoming material and the final product has an important influence, in order to avoid the quality problem caused by unqualified incoming material in the production process, it is necessary to detect various different raw materials into the factory, and the chip in the incoming material is the most important, which is directly related to whether the product can realize the basic function.

[0003] At present, in order to strengthen product quality control, it is necessary to increase detection means when incoming material inspection to find bad incoming material in advance and avoid flowing into the production process, but the incoming material includes many kinds of materials, including power chip, cable, LED, panel, buzzer, ADC, DAC and other components, since each component needs to be independently designed corresponding tooling and circuit, in addition, each material needs to disassemble and assemble cable, which will greatly affect the efficiency and reliability of incoming material inspection.

[0004] Therefore, a device for unified incoming material inspection needs to be designed to reduce disassembly steps, improve detection efficiency, and also can be applied to test and analyze some components or raw materials in the production process. UTILITY MODEL CONTENTS

[0005] In order to solve the technical problems in the background art, the utility model provides a multifunctional incoming material inspection device, which comprises a tooling plate and a power module arranged on the tooling plate, a plurality of test modules are detachably mounted on the tooling plate, and the test module comprises:

[0006] Optocoupler test module: including the optocoupler test loop composed of the first power switch, the optocoupler socket for inserting the measured optocoupler, the first light emitting diode and the battery connected in sequence, for testing the on-off performance of the optocoupler;

[0007] Nixie tube test module: including the nixie tube test loop composed of the second power switch and the nixie tube socket for inserting the measured nixie tube, for testing the display performance of the nixie tube;

[0008] LED lamp test module: including the LED lamp test loop composed of the third power switch and the LED lamp socket for inserting the measured LED lamp, for testing the light emitting performance of the LED lamp;

[0009] Buzzer test module: including the buzzer test loop composed of the fourth power switch and the buzzer pin connector for inserting the measured buzzer, for testing the sound emitting performance of the buzzer;

[0010] Cable test module: including a cable test loop composed of a fifth power switch, a second light emitting diode and a cable pin connector for connecting the cable to be tested, for testing the continuity and line sequence of the cable;

[0011] Panel test module: including a panel test loop composed of a sixth power switch, a third light emitting diode and a panel socket for connecting the panel to be tested, for testing the switching performance of the panel;

[0012] Power chip test module: including a power chip test loop composed of a seventh power switch, a chip test seat for installing the power chip to be tested and a first voltage detection port, for testing the voltage output performance of the power chip;

[0013] Digital-to-analog converter test module: including a digital-to-analog converter test loop composed of an eighth power switch, a first single-chip microcomputer, a chip test seat for installing the digital-to-analog converter to be tested and a second voltage detection port;

[0014] Analog-to-digital converter test module: including an analog-to-digital converter test loop composed of a ninth power switch, a second single-chip microcomputer, a chip test seat for installing the analog-to-digital converter to be tested, a first sensor chip and a communication detection port;

[0015] Operational amplifier test module: including an operational amplifier test loop composed of a tenth power switch, a second sensor chip, a chip test seat for installing the operational amplifier to be tested and a third voltage detection port.

[0016] Further, the power module includes a power input terminal, a power management chip, a first voltage conversion chip and a second voltage conversion chip, the power management chip input end is connected with the power input terminal, for converting 8-24V voltage into +7.4V and outputting to the first voltage conversion chip and the second voltage conversion chip respectively, the first voltage conversion chip is used for converting +7.4V voltage into +5V output, and the second voltage conversion chip is used for converting +7.4V voltage into +3.3V output.

[0017] Further, in the optocoupler test module, one end of the optocoupler socket is connected with the output end of the first voltage conversion chip through the first power switch, the positive electrode of the battery is connected with the other end of the optocoupler socket through the first light emitting diode, the negative electrode is grounded, and a redundant power interface is arranged between the positive electrode of the battery and the first light emitting diode;

[0018] During testing, the optocoupler to be tested is installed in the optocoupler socket, and when the first power switch is closed, if the light emitting diode emits light, it is judged that the continuity performance of the optocoupler to be tested is normal.

[0019] Further, the digital tube testing module comprises a four-bit eight-segment digital tube testing submodule and a one-bit eight-segment digital tube testing submodule; when the second power switch is turned on, if the digital tube to be tested displays 8 with a decimal point, it is determined that the digital tube to be tested has a normal display function.

[0020] In the panel testing module, the switch of the panel to be tested and the corresponding third light-emitting diode form a panel switch subcircuit; when the sixth power switch and the switch of the panel to be tested are turned on, if the third light-emitting diode in the corresponding switch subcircuit is on, it is determined that the switch of the panel to be tested has a normal performance.

[0021] The LED lamp testing module comprises a two-pin LED lamp testing submodule, a common-anode double-color lamp testing submodule and a common-cathode double-color lamp testing submodule; when the third power switch is turned on, if the corresponding lamp of the LED lamp to be tested is on, the LED lamp to be tested has a normal light-emitting performance.

[0022] The buzzer testing module comprises a +5V buzzer testing submodule and a +3.3V buzzer testing submodule; when the fourth power switch is turned on, if the buzzer to be tested makes a sound, the buzzer to be tested has a normal sound-emitting performance.

[0023] Further, the cable testing module comprises a cable continuity testing submodule and a cable wire sequence testing submodule.

[0024] In the cable continuity testing submodule, one end of the cable to be tested is connected to the cable pin connector, and the other end is grounded, forming a plurality of continuity testing subcircuits; when the fifth power switch is turned on, if the second light-emitting diodes in the corresponding continuity testing subcircuits are all on, it is determined that the cable to be tested has a normal continuity function.

[0025] In the cable wire sequence testing submodule, both ends of the cable to be tested are respectively connected to the cable pin connector, and a plurality of wire sequence testing subcircuits are formed with a plurality of subcircuit switches; when the fifth power switch and the corresponding subcircuit switch are turned on, if only the second light-emitting diode in the subcircuit with the turned-on switch is on, it is determined that the cable to be tested has a normal wire sequence.

[0026] Further, in the digital-to-analog converter testing module, the power pin of the first single-chip microcomputer is connected to the power module through the eighth power switch, the digital output pin of the first single-chip microcomputer is connected to the input end of the digital-to-analog converter chip to be tested, the output end of the digital-to-analog converter chip to be tested is connected to the second voltage detection port, and the second voltage detection port is connected to a voltmeter.

[0027] Further, in the analog-to-digital converter test module, the power module is connected with the power pin of the second single-chip microcomputer through the voltage conversion circuit and the ninth power switch in sequence, and the power module is connected with the power pin of the first sensor chip through the first voltage conversion circuit, the data output end of the first sensor chip is connected with the second single-chip microcomputer through the to-be-tested analog-to-digital converter, and the data output end of the second single-chip microcomputer is connected with the communication detection port.

[0028] Further, in the operational amplifier test module, the power pin of the second sensor chip is connected with the power module through the tenth power switch and the second voltage conversion circuit, the data output end of the second sensor chip is connected with the third voltage detection port through the to-be-tested operational amplifier test group, and the third voltage detection port is connected with a voltmeter.

[0029] Further, the power chip test module further comprises a third single-chip microcomputer, a third sensor chip, a triode and a relay, the power module is connected with the power pin of the third single-chip microcomputer through the seventh power switch, the to-be-tested power chip and the third voltage conversion circuit in sequence, the base of the triode is connected with the signal control pin of the third single-chip microcomputer, the emitter stage is grounded, the collector is connected with the output end of the third voltage conversion circuit through the coil part of the relay, one end of the switch part of the relay is connected with the power module, and the other end is connected with the first voltage detection port, the first voltage detection port is connected with the voltmeter, and the data output end of the third sensor chip is connected with the third single-chip microcomputer.

[0030] Further, the device further comprises a chip function integrated test module for testing the to-be-tested triode, the to-be-tested sensor chip, the to-be-tested voltage-current converter chip, the to-be-tested voltage reference chip and the to-be-tested digital-to-analog converter chip, the module comprises a current detection port, a chip mounting seat, a fourth single-chip microcomputer, a fourth sensor chip, the power module is connected with the to-be-tested voltage reference chip through the current detection port, the to-be-tested voltage reference chip is connected with the to-be-tested sensor chip, the to-be-tested digital-to-analog converter chip and the fourth single-chip microcomputer for power supply, the base and the emitter stage of the to-be-tested triode are connected with the corresponding pins of the to-be-tested voltage-current converter chip respectively, the collector is connected with the current detection port, the data output pin of the fourth sensor chip is connected with the fourth single-chip microcomputer, the fourth single-chip microcomputer is connected with the digital input end of the to-be-tested digital-to-analog converter chip, the voltage output end of the to-be-tested digital-to-analog converter chip is connected with the voltage input end of the to-be-tested voltage-current converter chip, and the current output end of the to-be-tested voltage-current converter chip is connected with the current detection port.

[0031] Compared with the prior art, the utility model has following advantages:

[0032] The utility model provides a multifunctional incoming material device suitable for the production of inclination sensor, the device adopts the modularization detachable assembly design, can realize the functional test of various components incoming material (including optical coupler, nixie tube, LED lamp, buzzer, cable, panel, power supply chip, digital analog converter, operational amplifier, analog-digital converter and / or chip function integration), and also can meet some component or raw material bad test analysis in the production process, the device adopts the modularization setting, and each module is controlled by the corresponding power supply switch, can independently run also can several modules cooperate and run simultaneously, when needing to carry out the component detection of the same kind different model, only needs to replace the corresponding chip test seat and matched circuit, or adds the new detection module to the tooling board, can extend can improve can replace, and the chip test seat can also test its function under the condition of not damaging the chip. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 It is circuit schematic diagram of multifunctional incoming material inspection device;

[0034] Figure 2 It is circuit schematic diagram of power module;

[0035] Figure 3 It is circuit schematic diagram of optical coupler test module;

[0036] Figure 4 It is circuit schematic diagram of four eight segment nixie tube test submodule;

[0037] Figure 5 It is circuit diagram of four eight segment nixie tube;

[0038] Figure 6 It is circuit schematic diagram of one eight segment nixie tube test submodule;

[0039] Figure 7 It is circuit diagram of one eight segment nixie tube;

[0040] Figure 8 It is circuit schematic diagram of two foot LED lamp test submodule;

[0041] Figure 9 It is circuit schematic diagram of common anode bicolor lamp test submodule;

[0042] Figure 10 It is circuit schematic diagram of common cathode bicolor lamp test submodule;

[0043] Figure 11a It is circuit schematic diagram of +5V buzzer test submodule;

[0044] Figure 11bCircuit schematic diagram for +3.3V buzzer test sub-module

[0045] Figure 12 Circuit schematic diagram for cable continuity test sub-module

[0046] Figure 13 Circuit schematic diagram for cable wire sequence test sub-module

[0047] Figure 14a Circuit schematic diagram for first panel test sub-module

[0048] Figure 14b Circuit schematic diagram for first panel

[0049] Figure 15a Circuit schematic diagram for second panel test sub-module

[0050] Figure 15b Circuit schematic diagram for second panel

[0051] Figure 16a Circuit schematic diagram for third panel test sub-module

[0052] Figure 16b Circuit schematic diagram for third panel

[0053] Figure 17a Circuit schematic diagram for fourth panel test sub-module

[0054] Figure 17b Circuit schematic diagram for fourth panel

[0055] Figure 18a Circuit schematic diagram for fifth panel test sub-module

[0056] Figure 18b Circuit schematic diagram for fifth panel

[0057] Figure 19 Circuit schematic diagram for first power chip test sub-module

[0058] Figure 20 Circuit schematic diagram for second power chip test sub-module

[0059] Figure 21 Circuit schematic diagram for third power chip test sub-module

[0060] Figure 22 Circuit schematic diagram for fourth power chip test sub-module

[0061] Figure 23 Circuit schematic diagram for fifth power chip test sub-module power supply part

[0062] Figure 24The circuit principle diagram for the control part of the fifth power chip test sub-module;

[0063] Figure 25 The circuit principle diagram for the digital-analog converter test module;

[0064] Figure 26 The circuit principle diagram for the operational amplifier test module;

[0065] Figure 27 The circuit principle diagram for the analog-digital converter test module;

[0066] Figure 28 The circuit principle diagram for the chip function integration test module. DETAILED DESCRIPTION

[0067] The utility model will be described in detail below in combination with the drawings and specific embodiments. The embodiments are implemented on the premise of the technical scheme of the utility model, and detailed implementation modes and specific operation processes are given, but the protection scope of the utility model is not limited to the following embodiments.

[0068] It should be noted that in the present specification, similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0069] In the description of the present embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0070] The terms "first", "second" and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0071] In the description of the present embodiment, it should also be noted that unless otherwise explicitly specified and limited, the terms "arrangement", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present embodiment can be understood according to the specific circumstances.

[0072] In order to make the utility model's purpose, technical scheme and advantages more clear, the following will combine with the drawings to make the further detailed description to the utility model's embodiment.

[0073] Embodiment

[0074] As Figure 1 shown, the utility model provides a kind of multifunctional incoming material inspection device to realize the functional inspection of multiple incoming material, the device includes tooling plate, power module respectively detachably arranged on tooling plate, and respectively with power module connection photocoupler test module, nixie tube test module, LED lamp test module, buzzer test module, cable test module, panel test module, power supply chip test module, digital-analog converter test module, operational amplifier test module, analog-digital converter test module and chip function integrated test module, the function and circuit of each module are described in detail below.

[0075] (1) as Figure 2 shown, power module is to provide 8-24V, +7.4V, +3.3V, +5V voltage for other modules in device respectively, this module includes power input terminal P20, power management chip U3, first voltage conversion chip U2 and second voltage conversion chip U4, power management chip U3 input end is connected with power input end P20, and the +7.4V voltage of U3 output end output is respectively converted into +5V voltage by first voltage conversion chip U2 and +3.3V voltage by second voltage conversion chip U4.

[0076] Power module also includes switch S29, recoverable fuse F1 (preferably 500mA / 30V, current overprotection), overvoltage protection device D34 (transient suppression diode, preferentially 40V overvoltage protection), unidirectional conducting diode D32 (anti-reverse connection effect), input end filter capacitor C4 of power management chip U3's No.1 pin vin, output end rectifier diode D35 of power management chip U3, output end inductance L1 and output end capacitor C8 and C10, feedforward capacitor C3, input end filter capacitor C5 of first voltage conversion chip U2, output end capacitor C1 and C2 of second voltage conversion chip U4 and output end filter capacitor C6, C7 and C9 of second voltage conversion chip U4.

[0077] In the example, power management chip U3 adopts TD1509PR to convert 8~30V voltage input into +7.4V voltage output, and Vout=1.23*(1+R165 / R166), first voltage conversion chip U2 adopts LM1117-5.0 to convert +7.4V voltage input into +5V voltage output, and second voltage conversion chip U4 adopts LM1117-3.3 to convert +7.4V voltage input into +3.3V voltage output.

[0078] (2) Figure 3 As shown, the optocoupler test module is used to test the optocoupler components. The input terminal of the module is connected to the +5V voltage output terminal of the power supply module. The input terminal is connected to pin 1 of the 2*2 pin connector P9 through switch S11, tactile switch S10, and resistor R65 in sequence. The negative terminal of battery BT2 is grounded, and the positive terminal is connected to pin 2 of the 2*2 pin connector P9 through LED D7 and resistor R62 in sequence. Pins 3 and 4 of the pin connector P9 are grounded.

[0079] When testing the optocoupler, insert the optocoupler under test into the 2*2 pin connector P9 (note the installation direction). If closing switch S11 and pressing switch S10 will illuminate LED D7, and opening switch S10 will extinguish LED D7, then the optocoupler under test is considered to be performing normally. J2 is a redundant interface design. When not using a battery, pin 1 of J2 can be connected to +3.3V for testing.

[0080] (3) The digital tube testing module includes a four-digit eight-segment digital tube testing submodule and a one-digit eight-segment digital tube testing submodule, which are used to perform functional tests on the four-digit eight-segment digital tube and the one-digit eight-segment digital tube, respectively.

[0081] like Figure 4 As shown, the four-digit eight-segment display test submodule includes a display socket U28. This display socket U28 is connected to the +5V voltage output terminal of the power module via switch S20 to achieve +5V power supply. The four-digit eight-segment display to be tested (such as...) Figure 5 The four-digit eight-segment display tube (shown in the figure) is plugged into the digital tube socket U28. When the switch S20 (not shown in the figure) is closed to supply power, if the four digits of the eight-segment display tube are lit up with all four 8s, then the display function of the four-digit eight-segment display tube is normal.

[0082] like Figure 6 As shown, the 8-segment display test submodule includes a display socket U29. This socket U29 is connected to the +5V output terminal of the power module via switch S18 to achieve +5V power supply. The 8-segment display to be tested (e.g.,...) Figure 7 (As shown) is plugged into the digital tube socket U29. When switch S18 (not shown in the figure) is closed to supply power, if one digit of the eight-segment digital tube displays 8 and the decimal point is fully lit, it is determined that the display function of that digit of the eight-segment digital tube is normal.

[0083] It is foreseeable that this utility model can not only test one-digit eight-segment digital tubes and four-digit eight-segment digital tubes, but also test other types of digital tubes by simply replacing the corresponding socket.

[0084] (4) The LED lamp test module includes a two-pin LED lamp test submodule, a common anode double-color lamp test submodule, and a common cathode double-color lamp test submodule, which are used to detect two-pin LED lamps, common anode double-color lamps, and common cathode double-color lamps, respectively.

[0085] As shown in Figure 8 , the two-pin LED lamp test submodule includes a switch S7, an LED lamp socket P7, and a current-limiting resistor. The LED lamp socket P7 is provided with multiple parallel terminal contacts. Each terminal contact is installed with a two-pin LED lamp to be tested. One end of each terminal contact is connected to a 1K-ohm current-limiting resistor in parallel and then grounded. The other end is connected to the +5V voltage output terminal of the power module through the switch S7 in parallel.

[0086] During detection, the two-pin LED lamp to be tested is inserted into the LED lamp socket P7 (30*2 socket in this example). The switch S7 is closed. If the two-pin LED lamp is bright, it is determined that the two-pin LED lamp to be tested is functional.

[0087] As shown in Figure 9 , the common anode double-color lamp test submodule includes sockets P4, P5, and P6 for inserting the three pins of the common anode double-color lamp, respectively. The anode pin of the common anode double-color lamp is inserted into the socket P5 and connected to the +5V voltage output terminal of the power module. The green lamp cathode pin of the common anode double-color lamp is inserted into the socket P4 and grounded through the switch S16. The red lamp cathode pin of the common anode double-color lamp is inserted into the socket P6 and grounded through the switch S15. The sockets P4, P5, and P6 are each provided with multiple terminal contacts, which can satisfy the simultaneous detection of multiple common anode double-color lamps.

[0088] During detection, the three pins of the common anode double-color lamp to be tested are inserted into the sockets P4, P5, and P6. The switch S16 is closed to brighten the green lamp, the switch S15 is closed to brighten the red lamp, and both switches S16 and S15 are closed to change the lamp to orange. It is determined that the common anode double-color lamp to be tested is functional.

[0089] As shown in Figure 10 , the common cathode double-color lamp test submodule includes sockets P1, P2, and P3 for inserting the three pins of the common cathode double-color lamp, respectively. The cathode pin of the common cathode double-color lamp is inserted into the socket P2 and grounded. The red lamp anode pin of the common cathode double-color lamp is inserted into the socket P1 and connected to the +5V voltage output terminal of the power module through the switch S13. The green lamp anode pin of the common cathode double-color lamp is inserted into the socket P3 and connected to the +5V voltage output terminal of the power module through the switch S14. The sockets P1, P2, and P3 are each provided with multiple terminal contacts, which can satisfy the simultaneous detection of multiple common cathode double-color lamps.

[0090] When detecting, the three pins of the common cathode double-color lamp to be detected are plugged into the sockets P1, P2 and P3, the switch S14 is closed to light the green lamp, the switch S13 is closed to light the red lamp, the switches S13 and S12 are closed, and the lamp turns orange, indicating that the common cathode double-color lamp to be detected is normal.

[0091] (5) As shown in Figure 11a and 11b , the buzzer test module can detect two different voltage types of buzzers (5V buzzer and 3.3V buzzer) respectively, and the buzzer test module is provided with a 4*2 pin connector P36 and a 4*2 pin connector P35, the 7th pin and the 8th pin of the 4*2 pin connector P36 and the 4*2 pin connector P35 are grounded, and the 2nd pin is connected to the +5V voltage output end and the +3.3V voltage output end of the power module respectively,

[0092] When detecting, the 5V buzzer and the 3.3V buzzer to be tested are connected to the 1st and 7th pins of the corresponding 4*2 pin connector P36 and 4*2 pin connector P35 respectively, and if the 5V buzzer and the 3.3V buzzer to be tested sound, it is determined that the buzzer to be detected is normal.

[0093] (6) The cable test module includes a cable continuity test submodule and a cable wire sequence test submodule to detect the continuity and wire sequence of the cable to be tested (one end with a connector and / or both ends with a connector).

[0094] As shown in Figure 12 , the cable continuity test submodule is used to detect the continuity of the cable to be tested, the +5V voltage output end of the power module is connected to the input end of the module, and then connected to the connector P15 through the switch S28, the resistor R161 and the multiple light-emitting diodes (D23, D24, D27, D30, D33) connected in parallel with each other. In this example, there are 5 light-emitting diodes in total (the number can be adjusted according to actual needs), which are connected to the 5 pins of the connector P15. One end of the cable to be tested (containing 5 core wires in this example) with a connector is connected to the connector P15, and the other end is connected in parallel and grounded. The terminal P13 is used to detect the voltage by a multimeter.

[0095] When detecting, the cable to be tested is connected to the connector P15, and the switch S28 is closed. If the 5 light-emitting diodes D23, D24, D27, D30 and D33 all light up, it is determined that the continuity of the cable to be tested is qualified. If there is a light-emitting diode that does not light up, the corresponding cable continuity is unqualified.

[0096] As shown in Figure 13As shown, the cable line sequence test submodule is used to detect whether the line sequence of the cable under test is welded correctly or whether the continuous welding phenomenon occurs. The 8-30V power supply of the power module is connected to the input end of the module, and after the switch S34, it is connected to a plurality of parallel anodes of light emitting diodes (in this example, there are 6, respectively D40, D43, D46, D31, D54, D56), the cathode of each light emitting diode is connected to the 6 pins on one side of the 6*2 pin connector P29 through a switch, respectively, and the 6 pins on the other side of the 6*2 pin connector P29 are connected to the ground through the corresponding 6 light emitting diodes (D42, D44, D48, D53, D53, D57) and 1K ohm current limiting resistor.

[0097] During detection, one end of the cable under test is respectively connected to the 6 pins (1, 3, 5, 7, 9, 11 pins) on one side of the 6*2 pin connector P29, and the other end is respectively connected to the 6 pins (2, 4, 6, 8, 10, 12 pins) on the other side of the 6*2 pin connector P29. Taking the first loop as an example, after closing the switches S34 and S35, if only the light emitting diodes D40 and D42 emit light, and the rest do not emit light, it indicates that the core wire sequence welding has no misplacement and no continuous welding error occurs. If the light emitting diodes D40 and D42 do not emit light, it indicates that the core wire is broken. If in addition to the light emitting diodes D40 and D42 emitting light, one or more of the remaining light emitting diodes D44, D48, D53, D53, D57 emit light, it proves that the core wire and the core wire where the light emitting diode is located are continuously welded. In turn, the detection of all core wires is completed.

[0098] (7) Panel test module, used to detect the switch function of each type of panel. In this example, the panel test module can detect a total of 5 different types of panels. The specific detection circuit and detection method are as follows.

[0099] As shown in Figure 14a , the +5V voltage output end of the power module is connected to the input end of the first panel test submodule, and is connected to pin 1 of connector P32 directly through switch S39 and diode D47, respectively through light emitting diodes D50 and D52 to pins 2 and 3 of connector P32, and pin 4 of connector P32 is grounded.

[0100] As shown in Figure 14b , the 1 pin of the connection terminal P30 of the first panel under test is grounded through the light emitting diode D45, the 2 pin is grounded through the tactile switch S40, the 3 pin is grounded through the tactile switch S42, and the 4 pin is directly grounded.

[0101] During detection, the connector P32 is connected with the connection terminal P30 of the first panel under test, the switch S39 is closed, the light emitting diode D45 is bright, indicating that the power supply is turned on, the light touch switches S40 and S42 on the first panel under test are pressed respectively, if the corresponding light emitting diodes D50 and D52 emit light, it is judged that the first panel under test is qualified.

[0102] As shown in Figure 15a , the +5V voltage output end of the power module is connected with the input end of the second panel test sub-module, and sequentially passes through the switch S30 and the diode D36, and is connected with the No. 1 and No. 2 pins of the connector P25 through the light emitting diodes D37 and D38 respectively, and the No. 3 pin of the connector P25 is grounded.

[0103] As shown in Figure 15b , the No. 1 pin of the connection terminal P26 of the second panel under test is grounded through the light touch switch S31, the No. 2 pin is grounded through the light touch switch S32, and the No. 3 pin is directly grounded.

[0104] During detection, the connector P25 is connected with the connection terminal P26 of the second panel under test, the switch S30 is closed, and the light touch switches S31 and S32 on the second panel under test are pressed respectively, if the corresponding light emitting diodes D37 and D38 emit light, it is judged that the second panel under test is qualified.

[0105] As shown in Figure 16a , the +5V voltage output end of the power module is connected with the input end of the third panel test sub-module, and sequentially passes through the switch S36 and the diode D25, and is connected with the No. 1 and No. 2 pins of the connector P25 through the light emitting diodes D26 and D28 respectively, the No. 3 pin of the connector P17 is grounded through the resistor R163, the No. 4 and No. 6 pins are connected to the cathode of the diode D25, and the No. 5 and No. 7 pins are grounded.

[0106] As shown in Figure 16b , the No. 1 pin of the connection terminal P16 of the third panel under test is grounded through the light touch switch S25, the No. 2 pin is grounded through the light touch switch S27, the No. 3 pin is directly grounded, the No. 4 pin is connected with the No. 5 pin through the light emitting diode D29 and the resistor R162 in sequence, and the No. 6 pin is connected with the No. 7 pin through the light emitting diode D31 and the resistor R164 in sequence.

[0107] During detection, the connector P17 is connected with the connection terminal P16 of the third panel under test, the switch S26 is closed, and the light touch switches S25 and S27 on the third panel under test are pressed respectively, if the corresponding light emitting diodes D26 and D28 emit light, it is judged that the third panel under test is qualified.

[0108] As shown in Figure 17aAs shown in the figure, the +5V voltage output end of the power module is connected with the input end of the fourth panel test sub-module, and after passing through the switch S19 and the resistor R157 in turn, it is connected with the No. 1, No. 3, No. 5, No. 6 and No. 7 pins of the connector P25 through the light emitting diodes D17, D19, D20, D21 and D22 respectively, and the No. 2 and No. 4 pins of the connector P12 are grounded through the resistors R158 and R160 respectively, and the No. 8 pin is directly grounded.

[0109] As shown in the figure, Figure 17b As shown in the figure, the No. 1 pin of the connection terminal P11 of the fourth measured panel is grounded through the tactile switch S17, the No. 3 pin is grounded through the tactile switch S21, the No. 2 pin is grounded through the diode D16 and the resistor R156 in turn, the No. 4 pin is grounded through the diode D18 and the resistor R159 in turn, the No. 5 pin is grounded through the tactile switch S22, the No. 6 pin is grounded through the tactile switch S23, the No. 7 pin is grounded through the tactile switch S24, and the No. 8 pin is directly grounded.

[0110] During detection, the connector P12 is connected with the connection terminal P11 of the fourth measured panel, the switch S19 is closed, and the light emitting diodes D16 and D18 of the fourth measured panel emit light, indicating that the power supply has been turned on. Press the tactile switches S17, S21, S22, S23 and S24 on the fourth measured panel respectively, if the corresponding light emitting diodes D17, D19, D20, D21 and D22 emit light, it is judged that the fourth measured panel is qualified.

[0111] As shown in the figure, Figure 18a As shown in the figure, the +5V voltage output end of the power module is connected with the input end of the fifth panel test sub-module, and after passing through the switch S5 and the resistor R157 in turn, it is connected with the No. 1-6 pins of the connector P10 through the light emitting diodes D3, D4, D5, D6, D8 and D10 respectively, the No. 7-10 pins of the connector P10 are connected in parallel to the switch S5 and the resistor R157 through the resistors R106, R118, R129 and R132 respectively, and the No. 11 pin is directly grounded.

[0112] As shown in the figure, Figure 18b As shown in the figure, the No. 1-6 pins of the connection terminal P8 of the fifth measured panel are grounded through the tactile switches S1, S4, S6, S8, S9 and S12 respectively, the No. 7 pin is grounded through the diode D9 and the resistor R94 in turn, the No. 8 pin is grounded through the diode D11 and the resistor R123 in turn, the No. 9 pin is grounded through the diode D12 and the resistor R137 in turn, the No. 10 pin is grounded through the diode D13 and the resistor R144 in turn, and the No. 11 pin is directly grounded.

[0113] When testing, the connector P10 is connected with the connection terminal P8 of the fifth panel under test, the switch S5 is closed, the light emitting diodes D9, D11, D12 and D13 of the fifth panel under test emit light, indicating that the power supply has been turned on, the light touch switches S1, S4, S6, S8, S9 and S10 on the fifth panel under test are pressed respectively, if the corresponding light emitting diodes D3, D4, D5, D6, D8 and D10 emit light, it is judged that the fifth panel under test is qualified.

[0114] (8) The power chip test module is used to test the functions of various power chips. In this example, the power chip test module can test five different types of power chips. The specific detection circuit and detection method are as follows.

[0115] As shown in Figure 19 , the first power chip test submodule is used to test the LT1776IS8 power chip. When testing, the LT1776IS8 power chip under test is installed on the power chip test seat U5. The No. 5 pin of the power chip test seat U5 is connected with the 8-30V voltage of the power module through the switch S36. The LT1776IS8 power chip converts the input 8-30V voltage into +7V output, then Vout=1.23*(1+R173 / R172). The No. 3 pin is a +7V voltage output terminal. D41 is an output end rectifier diode. L2 is an output end inductor. C13, C14 and C12 are output end filter capacitors respectively. The No. 1 pin of the LT1776IS8 power chip U5 is grounded through the capacitor C15. The No. 8 pin is grounded through C18 and R176. P27 is a connection terminal, which is used to connect different loads to test the load carrying capacity of the LT1776IS8 power chip.

[0116] As shown in Figure 20 , the second power chip test submodule is used to test the TD1509PR power chip. When testing, the TD1509PR power chip under test is installed on the power chip test seat U6. The 8-30V voltage of the power module is connected with the No. 1 pin of the TD1509PR power chip through the switch S33. The TD1509PR power chip converts the input 8-30V voltage into +6.8V output, then Vout=1.23*(1+R169 / R174). The No. 3 pin is a +6.8V voltage output terminal. D49 is an output end rectifier diode. L3 is an output end inductor. C16 and C17 are output end filter capacitors respectively. C11 is a feedforward capacitor (can not be welded). P28 is a connection terminal, which is used to connect different loads to test the load carrying capacity of the TD1509PR power chip.

[0117] As shown in Figure 21As shown, the third power chip test sub-module is used to test the REF195 power chip, the +7.4V voltage output terminal of the power module is connected with the No.2 and No.3 pins of the REF195 power chip through the switch S46 and the inductor L4, C21, C22 and C23 are input end filter capacitors, C24 and C20 are output end filter capacitors, the wiring terminal P34 is connected with the positive electrode of the voltmeter, and the wiring terminal P37 is connected with the negative electrode of the voltmeter,

[0118] During detection, the REF195 power chip is installed on the power chip test seat U7, the switch S46 is closed, the positive electrode of the voltmeter is connected with P34, the negative electrode of the voltmeter is connected with P37, whether the output voltage range of the No.6 pin of the REF195 power chip is within the range of 5±0.01V is measured, in addition, a 5K load is additionally added for testing, whether the output voltage of the No.6 pin is within the range of 5±0.01V is detected, if yes, it is judged that the function of the chip is normal.

[0119] As shown in Figure 22 the fourth power chip test sub-module is used to test the TPS780270200DDCT power management chip, during detection, the TPS780270200DDCT power management chip to be tested is installed on the power chip test seat U7, the +3.3V voltage output terminal of the power module is connected with the No.1, No.3 and No.4 pins of the TPS780270200DDCT chip through the switch S45, C25 and C29 are input end filter capacitors, C26, C27 and C28 are output end filter capacitors, the No.2 pin of the TPS780270200DDCT power management chip is grounded, the No.5 pin is a converted voltage output terminal and is connected with the terminal post P33, the diode D58 is connected between the switch S45 and the terminal post P33 to prevent the influence of reverse potential on the power management chip, during detection, the output voltage range of the terminal post P33 is detected, if within the range of 2±0.04V, it is indicated that the function of the TPS780270200DDCT power management chip is normal.

[0120] As shown in Figure 23 and 24As shown, the fifth power chip test sub-module is used to determine whether the chip function is normal by actual circuit test when the chip is changed. The 8-30V voltage Vin of the power module is connected to the chip test seat U12 (in this case, the chip test seat U12 is installed with a voltage stabilizer chip LM2594) through the switch S47 and the anti-reverse connection diode D59. C39 is the input end capacitor of the chip test seat U12. The voltage stabilizer chip LM2594 is used to convert the 8-30V voltage into +7V output, so Vout = 1.23*(1+R188 / R189). D60 is the output end rectifier diode. L8 is the output end inductor. C41 and C46 are the output end capacitors. C40 is the feedforward capacitor (which can not be welded). The capacitor C52 is the input end filter capacitor of the chip U14 (in this case, it is LM1117-5.0). C49, C50 and C51 are the output end filter capacitors of the chip U14. The chip U14 converts the +7V voltage output by the voltage stabilizer chip LM2594 into +5V output to the coil of the relay K1. C46 and C52 are the input end capacitors of the chip U14. C49, C50 and C51 are the output end capacitors of the chip U14.

[0121] The 5th, 17th and 38th pins of the single-chip microcomputer U9 are connected to +5V. The 6th, 18th, 28th and 39th pins are grounded. J3 is a program burning port. +5V is connected to the 4th pin of the single-chip microcomputer U9 through the resistor R181. The capacitors C34, C36 and the crystal oscillator Y1 adjust the working frequency of the single-chip microcomputer. J5 is a communication interface.

[0122] The 40th pin PB0 of the single-chip microcomputer U9 is connected to the base of the triode Q1. The on-off of the relay K1 is controlled by controlling the switch of the triode Q1. The 4th and 8th pins of the double-axis inclination sensor chip U10 are connected to +5V. C31 is a filter capacitor. The 3rd and 7th pins are grounded. The 1st pin of U10 is connected to the 30th pin of the single-chip microcomputer U9 through the resistor R182. The 2nd and 5th pins are respectively connected to the 42nd and 44th pins of the single-chip microcomputer U9, which are used to send the inclination data to the single-chip microcomputer U9.

[0123] During the test, the to-be-tested voltage stabilizer chip LM2594 is installed on the chip test seat U12. The switch S47 is closed for power supply. When the angle detected by the double-axis inclination sensor chip U10 exceeds the threshold value, the single-chip microcomputer U9 controls the triode Q1 to be conductive through the 40th pin PB0. If the coil of the relay K1 is powered on and the switch is closed, the voltage detection port J7 detects that the 1st pin is de-energized and the 3rd pin is energized, and no rapid closing and opening abnormal sound occurs, then the voltage stabilizer chip LM2594 is normal.

[0124] (9) as Figure 25As shown, the digital-to-analog converter test module is used to perform functional tests on the AD5310 / 5320 chip. The +5V voltage output point of the power supply module supplies power to the microcontroller U13 through switch S48. LED2 and resistor R193 serve as power indicators. C48 and C47 are input filter capacitors. U11 is a chip test socket used to place the AD5310 / 5320 chip under test.

[0125] Pins 3 and 7 of the dual-axis tilt sensor chip U15 are grounded, and pins 8 and 4 are connected to +5V. C45 is a filter capacitor. Pin 1 of U15 is connected to pin 19 of microcontroller U13 through resistor R192, pin 2 of U15 is connected to pin 32 of microcontroller U13, and pin 5 of U15 is connected to pin 12 of microcontroller U13.

[0126] The microcontroller U13 is programmed with test programs through the programming port J8. Capacitors C43 and C53 and crystal oscillator Y2 jointly adjust the operating frequency of microcontroller U13. Pins 3, 5, and 21 of microcontroller U13 are grounded, pins 4, 6, and 18 are connected to +5V, and pin 20 is grounded through capacitor C42.

[0127] Pin 2 of the chip test socket U11 is grounded, pin 3 is connected to +5V, C38 is a filter capacitor, pins 4, 5 and 6 are connected to pins 25, 24 and 23 of the microcontroller U13 respectively, and pin 1 of the chip test socket U11 is connected to the Vyout of the voltage detection port J4 through resistor R185.

[0128] During measurement, a voltmeter is used to test the voltage Vyout at pin 4 of the voltage detection port J4. When the dual-axis tilt sensor chip U15 is rotated within a set range (e.g., from 0° to 90°), if the voltage change range collected by the voltmeter increases between 0.05 and 4.95V, it is determined that the AD5310 / 5320 chip under test is functioning normally.

[0129] (10) such as Figure 26 As shown, the operational amplifier test module is used to perform functional tests on different types of operational amplifiers (OP747 chips in this example). This module includes chip test sockets U22 (four are shown in the figure: U22A, U22B, U22C, and U22D) for placing the OP747 chips, a dual-axis tilt sensor chip U23 (model SCA100T-D02), and a voltage reference chip U26 (MAX6043C in this example).

[0130] The 24V voltage Vin of the power module is connected with the pin 4 of U26 through the switch S50 and the anti-reverse diode D64, C88 is the input end filter capacitor of U26, the voltage reference chip U26 converts the 8-30V voltage into 5V output, C86 and C89 are the output end filter capacitors of U26, the pins 1, 2, 3, 4, 7 and 8 of U23 are left in the air, the pins 6, 9 and 10 are grounded, the pin 5 is connected with the pin 3 of U22, and the pin 11 is connected with the pin 12 of U22.

[0131] The pin 11 of U22 is grounded, the pin 4 is connected with VCC, the pins 5 and 10 are connected with +5V, C85 and C101 are the 5V input end filter capacitors of U22, C100 is the ground filter capacitor of the output end Vy of the chip test seat U22, C104 is the ground filter capacitor of the output end Vx of the chip test seat U22, C93 and C94 are filter capacitors, C78, C85 and C76 are filter capacitors, the output ends Vx and Vy of the chip test seat U22 are connected with the pins 3 and 4 of the voltage detection port J11 respectively, and the output voltage is calculated as follows:

[0132] Vy=(R217+R216) / R218*(5-R209*Vout_2 / R213)

[0133] Vx=(R199+R198) / R203*(5-R202*Vout_1 / R208)

[0134] During the test, the switch S50 is closed and powered by the power module 24V, and the voltmeter is used to test the voltage Vx or Vy of the pins 3 and 4 of the terminal J11 respectively, when the double-axis tilt sensor chip U23 is rotated, if the reading of the voltmeter changes in the range of 0-10V, it is judged that the operational amplifier to be tested is normal.

[0135] (11)As shown in Figure 27 , the analog-to-digital converter test module is used to test the function of different types of analog-to-digital converters (in this example, AD7799BRUZ / TSSOP16 or AD7798BRUZ / TSSOP16 chip). The module includes a chip test seat U18 for placing the analog-to-digital converter chip, a single-chip microcomputer U17, a reference voltage source chip U27 (in this example, REF195), and a double-axis tilt sensor chip U19 (model SCA100T-D02).

[0136] The +7.4V voltage output end of the power module is connected to the 2nd and 3rd pins of U27 in sequence through the switch S52 and the inductor L9, C96, C97 and C98 are input capacitors of U27, C99 and C95 are output capacitors of U27, the 4th pin of U27 is connected to the signal ground through the inductor L11 and to the power ground through the inductor L10, the 6th pin (outputting 5V voltage) of U27 is connected to the 12th pin of U19 for power supply, C56 and C60 are voltage input filter capacitors of U19 and are connected to the signal ground, the 5th pin of U19 is connected to the 5th pin of U18 through the resistor R200, the 11th pin of U19 is connected to the 7th pin of U18 through the resistor R197, the 6th pin of U19 is connected to the signal ground, C59 and C57 are filter capacitors, the 1st pin of U19 is connected to the 14th pin of U17, the 3rd and 4th pins of U19 are connected to the 15th and 16th pins of U17, and the 7th pin of U19 is connected to the 11th pin of U17.

[0137] The 6th, 8th, 10th and 12th pins of U18 are connected to the signal ground, and the 11th pin is connected to the signal ground through the resistor R196. The 13th pin of U18 is connected to VREF, C61 and C72 are filter capacitors, the 14th pin is connected to +5V, C73 is a filter capacitor, and the 1st, 2nd, 16th and 15th pins of U18 are connected to the 22nd, 21st, 20th and 19th pins of U17 respectively.

[0138] The 6th, 18th, 28th and 39th pins of U17 are connected to the ground, and the 5th, 17th, 27th and 38th pins are connected to +5V. C80 and C77 are filter capacitors, +5V is connected to the 4th pin of U17 through the resistor R221, C79 is a filter capacitor, capacitors C75, C82 and the crystal oscillator Y5 adjust the working frequency of the single-chip microcomputer, and J9 is a single-chip microcomputer burning port.

[0139] J10 is a serial communication detection port, connected to the 9th and 10th pins of U17 (test angle output end) respectively, R222 and R223 are corresponding serial port protection resistors, used to avoid burning the single-chip microcomputer by connecting to high ground.

[0140] During testing, the to-be-tested analog-to-digital converter is placed in the chip test seat U18, the switch S52 is closed to supply +7.4V, the switch S51 is closed to supply +5V, and if the test angle output by the serial communication detection port J10 is normal, it is judged that the to-be-tested analog-to-digital converter is normal.

[0141] (12) Chip function integrated test module, such as Figure 28As shown, the module can respectively test the functions of MJD41C / D-PAK (triode Q2), SCA61T (single-axis tilt sensor chip), XTR115U / SO-8 (voltage-current converter chip), MAX6175AASA / SO-8 (voltage reference chip) and DAC7512N / 250 (digital-to-analog converter chip). The module includes terminal P45, voltage-current converter chip test seat U20, voltage reference chip test seat U24, digital-to-analog converter chip test seat U21, single-chip microcomputer U16 and single-axis tilt sensor chip test seat U25.

[0142] The 8-24V voltage Vin of the power module is linked to the collector of triode Q2 through current detection port P45 and anti-reverse connection diode D63. One end of capacitor C62 is connected to pin 1 of current detection port P45, and the other end is connected to ground. One end of C55 is connected to GND, and the other end is connected to ground. D62 is an overvoltage protection diode, F3 is an overcurrent protection fuse, the base of triode Q2 is connected to pin 5 of U20, and the emitter stage is connected to pin 6 of U20.

[0143] Pin 7 of U20 is connected to pin 2 of U24 through resistor R205, and pin 4 of U24 is connected to ground. Pin 6 of U24 is respectively connected to pin 8 of U25 and pin 3 of U21 REF_1. C71, C90 and C92 are REF_1 filter capacitors, C58 and C87 are filter capacitors, C74 and C68 are filter capacitors, pin 2 of U20 is connected to pin 1 of U21 through resistor R195, C69 and C70 are ground filter capacitors, pin 2 of U21 is connected to ground, pin 4 is connected to pin 25 of U16, pin 5 is connected to pin 24 of U16, and pin 6 is connected to pin 23 of U16.

[0144] During detection, the corresponding chip to be tested is respectively installed on the mounting seat and powered on. A current meter is connected to the current detection port P45. If the current collected by the current meter meets the condition (typical value: 3.845mA, maximum value: 3.870mA), it is determined that the chip to be tested is normal.

[0145] In conclusion, the multifunctional incoming material device suitable for the production of the tilt sensor has the modularized and detachable component design, can realize the function test on various components (including the photocoupler, the digital tube, the LED lamp, the buzzer, the cable, the panel, the power supply chip, the digital-analog converter, the operational amplifier, the analog-digital converter and / or the chip function integration), can also realize the test analysis on some components or raw materials in the production process, the device is modularized, each module is controlled by the corresponding power supply switch, can be independently operated or several modules can be simultaneously operated, when the same type of different components needs to be detected, only the corresponding chip test seat and the matched circuit need to be replaced, or the new detection module is added to the tooling plate, and the chip test seat can test the function without damaging the chip.

[0146] The preferred embodiments of the utility model are described in detail above. It should be understood that those skilled in the art can make many modifications and changes according to the concept of the utility model without creative labor. Therefore, any technical solution obtained by logical analysis, reasoning or limited experiment on the basis of the prior art according to the concept of the utility model shall be within the protection scope defined by the claims.

Claims

1. A multifunctional incoming material inspection device, comprising a tooling plate and a power module mounted on the tooling plate, characterized in that, Multiple test modules can also be detachably mounted on the tooling plate, the test modules including: Optocoupler test module: includes an optocoupler test circuit consisting of a first power switch, an optocoupler socket for inserting the optocoupler under test, a first light-emitting diode, and a battery connected in sequence, used to test the continuity performance of the optocoupler; Digital tube test module: includes a digital tube test circuit consisting of a second power switch and a digital tube socket for inserting the digital tube under test, used to test the display performance of the digital tube; LED lamp test module: includes an LED lamp test circuit consisting of a third power switch and an LED lamp socket for inserting the LED lamp under test, used to test the luminous performance of the LED lamp; Buzzer test module: includes a buzzer test circuit consisting of a fourth power switch and a buzzer pin connector for inserting the buzzer under test, used to test the sound performance of the buzzer; Cable testing module: includes a cable testing circuit consisting of a fifth power switch, a second light-emitting diode, and a cable pin connector for connecting the cable under test, used to test the continuity and wiring sequence of the cable; Panel test module: includes a panel test circuit consisting of a sixth power switch, a third light-emitting diode and a panel socket for connecting the panel under test, used to test the switching performance of the panel; Power chip test module: includes a power chip test circuit consisting of a seventh power switch, a chip test socket for mounting the power chip under test, and a first voltage detection port, used to test the voltage output performance of the power chip; Digital-to-analog converter test module: includes a digital-to-analog converter test circuit consisting of an eighth power switch, a first microcontroller, a chip test socket for mounting the digital-to-analog converter under test, and a second voltage detection port; Analog-to-digital converter test module: includes an analog-to-digital converter test circuit consisting of a ninth power switch, a second microcontroller, a chip test socket for mounting the analog-to-digital converter under test, a first sensor chip, and a communication detection port; Operational amplifier test module: includes a digital-to-analog converter test circuit consisting of a tenth power switch, a second sensor chip, a chip test socket for mounting the operational amplifier under test, and a third voltage detection port.

2. The multifunctional incoming material inspection device according to claim 1, characterized in that, The power module includes a power input terminal, a power management chip, a first voltage conversion chip, and a second voltage conversion chip. The input terminal of the power management chip is connected to the power input terminal to convert 8-24V voltage to +7.4V and output it to the first voltage conversion chip and the second voltage conversion chip respectively. The first voltage conversion chip is used to convert +7.4V voltage to +5V output, and the second voltage conversion chip is used to convert +7.4V voltage to +3.3V output.

3. The multifunctional incoming material inspection device according to claim 2, characterized in that, In the optocoupler test module, one end of the optocoupler socket is connected to the output terminal of the first voltage conversion chip through the first power switch, the positive terminal of the battery is connected to the other end of the optocoupler socket through the first light-emitting diode, the negative terminal is grounded, and a redundant power interface is provided between the positive terminal of the battery and the first light-emitting diode. During testing, the optocoupler under test is installed in the optocoupler socket. When the first power switch is closed, if the light-emitting diode emits light, it is determined that the optocoupler under test has normal switching performance.

4. The multifunctional incoming material inspection device according to claim 1, characterized in that, The digital tube testing module includes a four-digit eight-segment digital tube testing submodule and a one-digit eight-segment digital tube testing submodule. When the second power switch is closed, if the digital tube under test displays 8 and the decimal point is lit, it is determined that the display function of the digital tube under test is normal. In the panel testing module, the switch of the panel under test and the corresponding third light-emitting diode form a panel switch sub-circuit. When the sixth power switch and the switch of the panel under test are closed, if the third light-emitting diode on the corresponding switch sub-circuit lights up, it is determined that the switch performance of the panel under test is normal. The LED lamp testing module includes a two-pin LED lamp testing sub-module, a common anode dual-color lamp testing sub-module, and a common cathode dual-color lamp testing sub-module. When the third power switch is closed, if the corresponding lamp of the LED lamp under test lights up, the LED lamp under test has normal luminous performance. The buzzer testing module includes a +5V buzzer testing submodule and a +3.3V buzzer testing submodule. When the fourth power switch is closed, if the buzzer under test sounds, the buzzer under test has normal sound performance.

5. The multifunctional incoming material inspection device according to claim 1, characterized in that, The cable testing module includes a cable continuity testing submodule and a cable wiring sequence testing submodule; In the cable continuity test submodule, the connector at one end of the cable under test is connected to the cable pin connector, and the other end is grounded, forming multiple continuity test sub-circuits. When the fifth power switch is closed, if all the second LED lights corresponding to each continuity test sub-circuit are lit, it is determined that the continuity function of the cable under test is normal. In the cable sequence test submodule, both ends of the cable under test are respectively plugged into the cable pin connector, forming multiple sequence test subcircuits with multiple subcircuit switches. When the fifth power switch and the corresponding subcircuit switch are closed, if only the second LED corresponding to the closed subcircuit is lit, it is determined that the cable under test has a normal sequence.

6. The multifunctional incoming material inspection device according to claim 1, characterized in that, In the digital-to-analog converter test module, the power supply pin of the first microcontroller is connected to the power module through the eighth power switch, and the digital output pin of the first microcontroller is connected to the input terminal of the digital-to-analog converter chip under test. The output terminal of the digital-to-analog converter chip under test is connected to the second voltage detection port, and the second voltage detection port is connected to a voltmeter.

7. The multifunctional incoming material inspection device according to claim 1, characterized in that, In the analog-to-digital converter test module, the power supply module is connected to the power pin of the second microcontroller in sequence through a voltage conversion circuit and the ninth power switch. The power supply module is also connected to the power pin of the first sensor chip through a first voltage conversion circuit. The data output terminal of the first sensor chip is connected to the second microcontroller through the analog-to-digital converter under test. The data output terminal of the second microcontroller is connected to the communication detection port.

8. The multifunctional incoming material inspection device according to claim 1, characterized in that, In the operational amplifier test module, the power supply pin of the second sensor chip is connected to the power module through the tenth power switch and the second voltage conversion circuit. The data output terminal of the second sensor chip is connected to the third voltage detection port through the operational amplifier under test test group. The third voltage detection port is connected to a voltmeter.

9. A multifunctional incoming material inspection device according to claim 1, characterized in that, The power chip testing module also includes a third microcontroller, a third sensor chip, a transistor, and a relay. The power module is connected to the power pin of the third microcontroller in sequence through the seventh power switch, the power chip under test, and the third voltage conversion circuit. The base of the transistor is connected to the signal control pin of the third microcontroller, the emitter is grounded, and the collector is connected to the output terminal of the third voltage conversion circuit through the coil of the relay. One end of the switch part of the relay is connected to the power module, and the other end is connected to the first voltage detection port. The first voltage detection port is connected to a voltmeter, and the data output terminal of the third sensor chip is connected to the third microcontroller.

10. A multifunctional incoming material inspection device according to claim 1, characterized in that, The device also includes a chip functional integration test module for unified testing of the transistor under test, the sensor chip under test, the voltage-to-current converter chip under test, the voltage reference chip under test, and the digital-to-analog converter chip under test. This module includes a current detection port, a chip mounting base, a fourth microcontroller, a fourth sensor chip, and the power supply module connected to the voltage reference chip under test via the current detection port. The voltage reference chip under test is connected to and supplies power to the sensor chip under test, the digital-to-analog converter chip under test, and the fourth microcontroller. The base and emitter of the transistor under test are connected to the corresponding pins of the voltage-to-current converter chip under test, and the collector is connected to the current detection port. The data output pin of the fourth sensor chip is connected to the fourth microcontroller. The fourth microcontroller is connected to the digital input terminal of the digital-to-analog converter chip under test. The voltage output terminal of the digital-to-analog converter chip under test is connected to the voltage input terminal of the voltage-to-current converter chip under test, and the current output terminal of the voltage-to-current converter chip under test is connected to the current detection port.

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