Testing device for optical communication chip

Abstract

The utility model discloses a testing device of an optical communication chip, the top of the testing device is provided with a to-be-tested chip placing groove, the center of the interior of the to-be-tested chip placing groove is provided with a silica gel conduction gasket, the front end of the interior of the testing device is provided with a temperature adjusting rotating cavity, a rotating fluted disc is arranged below the temperature adjusting rotating cavity, and the rotating fluted disc is provided with a rotating shaft. A rotating column is installed in the temperature adjusting rotating cavity, the rotating column is connected with a rotating fluted disc below the rotating column and can be driven by the rotating fluted disc to rotate, four resistance heaters which are increased step by step are installed in the periphery of the rotating column, and a rubber heat insulation sheet is installed at the top of the rotating column. Four metal heat-conducting fins corresponding to the lower resistance heaters are installed in each rubber heat-insulating sheet, and the rubber heat-insulating sheets are in contact with the upper silica gel conduction gaskets through the metal heat-conducting fins to transfer heat. The optical communication chip testing device is reasonable in design, and the working temperature of the chip to be tested can be adjusted while the optical communication chip is tested, so that the working effect of the chip at different temperatures can be obtained.

Description

Technical Field

[0001] This utility model relates to the field of optical communication chips, and in particular to a testing device for optical communication chips. Background Technology

[0002] Optical communication chip testing is a crucial step in ensuring the performance and quality of optical communication chips. It aims to verify the chip's performance, reliability, and compliance with design specifications. Through testing, defective chips can be identified, ensuring the quality and stability of the final product. High and low temperature testing is a vital component of optical communication chip testing, used to evaluate the chip's performance at different temperatures. By simulating the high and low temperature environments that chips might encounter in real-world use, the chip's temperature resistance and stability can be tested. However, existing high and low temperature testing procedures require controlling the ambient temperature of the testing equipment, resulting in high energy consumption and slow temperature changes. Utility Model Content

[0003] The purpose of this invention is to provide a testing device for optical communication chips to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A testing device for an optical communication chip includes a testing unit, a chip-under-test (DUT) placement slot, a silicone conductive pad, a temperature-regulating rotating cavity, a rotating gear disk, a rotating column, resistance heaters, a rubber heat insulation sheet, and a metal heat-conducting sheet. The DUT placement slot is located at the top of the testing unit, and a silicone conductive pad is installed at the center of the slot. A temperature-regulating rotating cavity is located at the front end of the testing unit, and a rotating gear disk is installed below the cavity. A rotating column is installed inside the cavity and connected to the gear disk below, allowing it to rotate. Four progressively larger resistance heaters are installed around the rotating column. A rubber heat insulation sheet is installed at the top of the column, and four metal heat-conducting sheets corresponding to the resistance heaters below are installed within each sheet. These metal heat-conducting sheets contact the silicone conductive pad above to transfer heat.

[0006] Preferably, the testing device for the optical communication chip also includes heating level markings, with heating level markings corresponding to the resistive heaters equidistantly engraved around the outer perimeter of the rotating toothed disc.

[0007] The beneficial effects of this utility model are: This utility model is reasonably designed and can quickly adjust the operating temperature of the chip under test while testing the optical communication chip, so as to obtain the working effect of the chip at different temperatures. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the test device for the optical communication chip of this utility model;

[0009] Figure 2 This is a schematic diagram of the test device for the optical communication chip of this utility model.

[0010] In the diagram: 1. Testing device, 2. Chip under test placement slot, 3. Silicone conductive pad, 4. Temperature adjustment rotating cavity, 5. Rotating toothed disc, 6. Rotating column, 7. Resistance heater, 8. Rubber heat insulation sheet, 9. Metal heat-conducting sheet, 10. Heating level indicator. Detailed Implementation

[0011] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:

[0012] like Figures 1-2 As shown, a testing device for an optical communication chip includes a testing device 1, a chip under test (DUT) placement slot 2, a silicone conductive pad 3, a temperature-regulating rotating cavity 4, a rotating gear disk 5, a rotating column 6, a resistance heater 7, a rubber heat insulation sheet 8, and a metal heat-conducting sheet 9. The testing device 1 has a DUT placement slot 2 at its top. A silicone conductive pad 3 is installed at the center of the DUT placement slot 2. A temperature-regulating rotating cavity 4 is installed at the front end of the testing device 1. A rotating gear disk 5 is installed below the temperature-regulating rotating cavity 4. A rotating column 6 is installed inside the temperature-regulating rotating cavity 5 and is connected to the rotating gear disk 5 below, allowing it to rotate. Four progressively larger resistance heaters 7 are installed around the rotating column 6. A rubber heat insulation sheet 8 is installed at the top of the rotating column 6. Each rubber heat insulation sheet 8 contains four metal heat-conducting sheets 9 corresponding to the resistance heaters 7 below, which contact the silicone conductive pad 3 above to transfer heat. The testing device for the optical communication chip also includes heating level markings 10, with heating level markings 10 corresponding to the resistance heater 7 equidistantly engraved around the outer perimeter of the rotating toothed disc 6.

[0013] The working principle of this utility model is as follows: After the optical communication chip under test is installed in the chip under test placement slot 2 at the top of the test device 1, the test device 1 is started. During the test, the rotating column 6 in the temperature adjustment rotating cavity 4 is rotated by rotating the toothed disk 5, changing the position of different resistive heaters 7 on the rotating column 6, so that they take turns contacting the silicone conductive pad 3 through the top metal heat-conducting plate 9, thereby changing the temperature of the silicone conductive pad 3, thus simulating the operation of the optical communication chip at different temperatures.

[0014] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary in all respects, and thus equivalent variations within the scope of this invention are included within its scope.

Claims

1. A testing device for an optical communication chip, comprising a testing device (1), a chip placement slot (2), a silicone conductive pad (3), a temperature regulating rotating cavity (4), a rotating gear disk (5), a rotating column (6), a resistance heater (7), a rubber heat insulation sheet (8), and a metal heat-conducting sheet (9), characterized in that: The test device (1) has a chip placement slot (2) on the top. A silicone conductive pad (3) is installed in the center of the chip placement slot (2). A temperature regulating rotating cavity (4) is installed at the front end of the test device (1). A rotating toothed disk (5) is installed below the temperature regulating rotating cavity (4). A rotating column (6) is installed inside the temperature regulating rotating cavity (4). The rotating column (6) is connected to the rotating toothed disk (5) below and can be driven to rotate by the rotating toothed disk (5). Four progressively larger resistance heaters (7) are installed around the rotating column (6). A rubber heat insulation sheet (8) is installed on the top of the rotating column (6). Four metal heat-conducting sheets (9) corresponding to the resistance heaters (7) below are installed inside the rubber heat insulation sheet (8). The metal heat-conducting sheets (9) are in contact with the silicone conductive pad (3) above to transfer heat.

2. The testing apparatus for optical communication chips according to claim 1, characterized in that: The testing device for the optical communication chip also includes heating level markings (10), and the rotating toothed disk (5) is marked with heating level markings (10) corresponding to the resistive heater (7) at equal intervals around its outer perimeter.

Images