Heat sink assembly for optical module

By applying a phase-change metal layer as a heat-conducting medium between the optical module and the heat sink, the problem of poor heat dissipation of the optical module is solved, achieving efficient heat conduction and equipment temperature control, and adapting to the repeated insertion and removal requirements of the optical module.

CN223897680UActive Publication Date: 2026-02-10BLUECORE COMPUTING POWER (SHENZHEN) TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422765094.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-13
Publication Date
2026-02-10
Estimated Expiration
2034-11-13

AI Technical Summary

Technical Problem

Existing optical modules have poor heat dissipation performance, especially under high power consumption conditions. The polyurethane film of traditional thermal pads is not durable and is easily damaged, and its thermal conductivity is insufficient, which cannot effectively improve the heat conduction between the optical module and the heat sink.

Method used

A phase change metal layer is used as a heat conduction medium. By coating the phase change metal layer between the metal boss of the heat sink and the metal shell of the optical module, the heat dissipation effect of the optical module is improved by utilizing the excellent thermal conductivity and low phase change temperature of the phase change metal, and the heat dissipation area is increased by fin structure.

Benefits of technology

It improves the heat dissipation efficiency of the optical module, reduces contact thermal resistance, adapts to repeated insertion and removal of the optical module, extends the service life of the heat sink, and keeps the equipment operating within a suitable temperature range.

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Abstract

The utility model provides a radiator assembly used for an optical module. The radiator assembly used for the optical module comprises a cage and a radiator which abuts against and is fixed on one side of the cage. The cage comprises a cage body and a through groove, wherein the cage body is provided with a containing space, one side face of the cage body is provided with an opening, and the through groove penetrates through the top face of the cage body. The through groove is communicated with the accommodating space, and the accommodating space is used for accommodating and fixing an optical module; the radiator comprises a radiator body, a metal boss and a phase change metal layer, wherein the radiator body protrudes and extends in the direction close to the cage to form the metal boss, and the metal boss protrudes and extends in the direction close to the cage to form the phase change metal layer. The radiator body is attached to the top surface of the cage and covers the through groove, and the phase change metal layer extends into the through groove and is used for abutting against the optical module. The radiator assembly used for the optical module can improve the heat radiation performance of the optical module.
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Description

TECHNICAL FIELD

[0001] The utility model relates to optical module heat dissipation technical field especially relates to a radiator subassembly for optical module. BACKGROUND

[0002] With the high -speed development of AI, the data flow handled by data center increases greatly. Whether it is a server or a switch, more and faster optical modules are needed to carry out data conversion and transmission. The transmission rate of optical module also increases from early 10G to 400G, 800G. This leads to the power consumption of optical module to increase greatly, from early 1W or so to nearly 30W. The heat dissipation of optical module faces more and more big challenge, and gradually becomes the difficulty of server and switch heat dissipation scheme.

[0003] The early heat dissipation of optical module only relies on its own metal shell, and cooperates with the system fan inside the server or switch to dissipate heat. With the increase of the power consumption of optical module, its manufacturer begins to design radiator for its heat dissipation. At present, the metal spring piece fixing the radiator is integrated with the optical module cage through the buckle point. When the optical module is plugged, the optical module rubs the bottom of the radiator, therefore, it is impossible to paste thermal pad on the radiator in advance to improve the contact thermal resistance between the optical module and the radiator. In order to solve this difficulty, a layer of polyurethane film is usually pasted on the thermal pad on the bottom of the radiator to protect the thermal medium from being damaged in the process of plugging the optical module.

[0004] However, the polyurethane film of the thermal pad has low durability, and will be damaged after repeated plugging and unplugging, and the internal thermal medium will leak out. The damaged film will be blocked in the optical module cage. In addition, the polyurethane film itself has low thermal conductivity, which will hinder the conduction of heat, and cannot really improve the heat dissipation of the optical module. UTILITY MODEL CONTENTS

[0005] In view of the above technical problems of the prior art, the utility model provides a radiator subassembly for optical module to solve the problem of poor heat dissipation effect of the existing optical module.

[0006] In order to solve the above technical problems, the utility model adopts the following technical scheme:

[0007] The utility model discloses an embodiment provides a radiator assembly for optical module, include: cage and abut fixed in the one side of the cage's radiator, the cage includes having the accommodation space and one lateral surface of cage body and the through groove of the top surface of cage body is equipped with the opening, the through groove with the accommodation space is communicated, and the accommodation space is used for accommodating fixed optical module, the radiator includes radiator body, the metal boss of the protruding extension of radiator body is formed to the direction close to the cage, and the phase change metal layer of the protruding extension of metal boss is formed to the direction close to the cage, the radiator body is attached to the top surface of the cage and is covered on the through groove, and the phase change metal layer extends to the through groove, is used for abutting with optical module.

[0008] Preferably, the thickness of the phase change metal layer is 0.2-0.5mm.

[0009] Preferably, the phase change metal layer is coated on the side of the metal boss close to the cage.

[0010] Preferably, the radiator body includes a bottom plate and a plurality of fins arranged on the side of the bottom plate away from the cage, the bottom plate is attached to the top surface of the cage, and the metal boss extends into the through groove.

[0011] Preferably, the plurality of fins are arranged uniformly.

[0012] Preferably, the phase change metal layer is made of indium metal material.

[0013] Preferably, the through groove is of rectangular structure.

[0014] Preferably, the phase change metal layer is of rectangular structure.

[0015] Preferably, the optical module is fixedly connected to the cage by buckling.

[0016] Compared with the related art, in the embodiment of the utility model, the optical module is placed in the accommodation space of the cage; the cage includes a cage body having an accommodation space and an opening on one lateral surface, and a through groove penetrating the top surface of the cage body; the through groove is in communication with the accommodation space; the radiator includes a radiator body, a metal boss protruding and extending from the radiator body towards the cage, and a phase change metal layer protruding and extending from the metal boss towards the cage; the radiator body is attached to the top surface of the cage and covers the through groove, and the phase change metal layer extends into the through groove for abutting with the optical module; by utilizing the characteristics of high heat conduction performance, low phase change temperature and soft texture of the phase change metal, the phase change metal is used as a heat conduction medium between the metal boss of the bottom of the radiator and the metal shell of the optical module, thereby improving the heat dissipation of the optical module. BRIEF DESCRIPTION OF DRAWINGS

[0017] The present invention will now be described in detail with reference to the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description in conjunction with the following drawings. In the drawings:

[0018] Figure 1 This is a schematic diagram illustrating the process of inserting an optical module into a heat sink assembly for an optical module, as provided in this embodiment of the utility model. Figure 1 ;

[0019] Figure 2 A schematic diagram illustrating the process of removing and disassembling the optical module in the heat sink assembly for the optical module provided in this embodiment of the utility model. Figure 2 ;

[0020] Figure 3 A three-dimensional structural schematic diagram of a heat sink for a heat sink assembly for an optical module provided in an embodiment of this utility model;

[0021] Figure 4 A front view of the heat sink of a heat sink assembly for an optical module provided in an embodiment of the present utility model;

[0022] Figure 5 A schematic diagram showing the state in which the metal frame is covered on the outside of the phase change metal in the heat sink assembly for the optical module provided in this embodiment of the utility model.

[0023] Figure 6 This is a schematic diagram illustrating the process of forming a phase change metal layer from a phase change metal in a heat sink assembly for an optical module, provided in an embodiment of the present invention.

[0024] Among them, 100 is a heat sink assembly for optical modules, 1 is a cage, 11 is a cage body, 12 is a through slot, 2 is a heat sink, 21 is a heat sink body, 211 is a base plate, 212 is a fin, 22 is a metal boss, 23 is a phase change metal layer, 3 is an optical module, 4 is a metal frame, and 5 is a reflow oven heater. Detailed Implementation

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0026] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figures 1-4 As shown, this utility model embodiment provides a heat sink assembly 100 for an optical module, including: a cage 1 and a heat sink 2 abutting against one side of the cage 1; the cage 1 includes a cage body 11 having a receiving space and an opening on one side, and a through groove 12 penetrating the top surface of the cage body 11; the through groove 12 communicates with the receiving space, and the receiving space is used to receive and fix the optical module 3; the heat sink 2 includes a heat sink body 21, a metal boss 22 protruding from the heat sink body 21 toward the cage 1, and a phase change metal layer 23 protruding from the metal boss 22 toward the cage 1; the heat sink body 21 is attached to the top surface of the cage 1 and covers the through groove 12, and the phase change metal layer 23 extends into the through groove 12 for abutting against the optical module 3.

[0029] Specifically, the optical module 3 is inserted into the receiving space through the opening, so that the optical module 3 is snapped and fixed to the inside of the cage 1; the heat sink 2 is placed in the through slot 12 and made to contact the optical module 3, and the heat sink body 21 is placed on the cage body 11, so that the metal boss 22 is inserted into the through slot 12, which facilitates the contact of the phase change metal layer 23 with the optical module 3; taking advantage of the excellent thermal conductivity, low phase change temperature and soft texture of the phase change metal, the phase change metal is used as a heat conduction medium between the metal boss 22 at the bottom of the heat sink 2 and the metal shell of the optical module 3, thereby improving the heat dissipation of the optical module 3. When the optical module 3 needs to be replaced, the heat sink 2 is first pulled out of the through slot 12, and then the optical module 3 is pulled out of the cage 1 to remove the optical module 3.

[0030] This unique application method, which allows for repeated insertion and removal of the optical module 3, utilizes phase change metal as a heat-conducting medium to improve heat dissipation. Simultaneously, the excellent thermal conductivity of the phase change metal itself can be used as a heat-conducting medium between the heat sink 2 and the optical module 3, further improving heat dissipation.

[0031] Optionally, the cage 1 is made of metal, and the optical module 3 is inserted into the cage 1. The upper and lower sides of the optical module 3 are isolated from the inside of the cage 1. By inserting the heat sink 2 into the through slot 12 and contacting the optical module 3, the optical module 3 can quickly dissipate heat through the phase change metal layer 23 of the heat sink 2, and the optical module 3 has a good heat dissipation effect.

[0032] In this embodiment, the thickness of the phase change metal layer 23 is 0.2–0.5 mm. A phase change metal layer 23 with a thickness of 0.2–0.5 mm has good heat dissipation and saves costs. Preferably, the thickness of the phase change metal layer 23 is 0.3 mm, 0.5 mm, etc.

[0033] In this embodiment, as Figures 5-6 As shown, the phase change metal layer 23 is formed by coating the metal boss 22 on the side near the cage 1. The phase change metal layer 23 is formed by heating in a reflow oven to coat the metal boss 22 on the side near the cage 1 with phase change metal, and then cooling it to form the phase change metal layer 23.

[0034] Specifically, a metal frame 4 is designed to fit over a metal protrusion 22. A phase change metal (PCM) plate with an area similar to that of the protrusion 22 at the bottom of the heat sink 2 is placed on the protrusion 22 at the bottom of the heat sink 2, with a PCM thickness of 0.2-0.5 mm. External heating via a reflow oven heater 5 causes the PCM plate on the protrusion 22 to change from a solid to a liquid state. The liquid metal effectively wets the surface of the protrusion 22 at the bottom of the heat sink 2, and the metal frame 4 prevents the liquid PCM plate from overflowing. Finally, the temperature of the PCM plate is lowered, cooling from a liquid to a solid state. After removing the metal frame 4, a PCM plate 23 with a thickness of 0.2-0.5 mm is formed on the surface of the protrusion 22 at the bottom of the heat sink 2. The heat sink 2 is then mounted to a cage 1 using metal spring clips. The optical module 3 is inserted into the cage 1, causing the heat sink 2 to be pushed upwards, and the deformation of the metal spring clips generates pressure. The phase change metal (PCM) acts as a heat-conducting medium, situated between the heat sink 2 and the metal casing of the optical module 3, thus playing a heat-conducting role. Utilizing the PCM's relatively low phase change temperature, through its own solid-liquid-solid phase change process, the PCM fuses with the metal protrusion 22, forming a PCM layer 23. This eliminates the contact thermal resistance between the PCM as a heat-conducting medium and the metal protrusion 22 at the bottom of the heat sink 2. By utilizing the PCM's relatively low phase change temperature and the solid-liquid-solid phase change process, the PCM fuses with the metal protrusion 22 at the bottom of the heat sink 2, eliminating both the contact thermal resistance and securing the PCM.

[0035] Furthermore, external heating of the phase change metal via reflow soldering can achieve the phase change process, which is beneficial for large-scale production. When the phase change metal is in a solid state, it possesses a certain degree of durability and will not suffer damage to the polyurethane film, thus making it more suitable for applications involving repeated insertion and removal of the optical module 3. The phase change metal is soft and highly malleable, serving as a thermally conductive medium between the metal protrusion 22 at the bottom of the heat sink 2 and the metal casing of the optical module 3. When a certain pressure is applied, the phase change metal adheres well to the metal casing of the optical module 3, thereby improving the contact thermal resistance between the two. The pressure generated by the metal spring of the heat sink 2 further enhances the adhesion of the phase change metal to the metal casing of the optical module 3.

[0036] In this embodiment, the radiator body 21 includes a base plate 211 and a plurality of fins 212 disposed on the side of the base plate 211 away from the cage 1. The base plate 211 is attached to the top surface of the cage 1, and the metal boss 22 extends into the through groove 12. The design of the fins 212 greatly increases the surface area of ​​the radiator 2, thereby improving the heat exchange efficiency between the radiator 2 and the surrounding environment. By increasing the heat dissipation area, the fins 212 enable the radiator 2 to better dissipate the generated heat, thereby maintaining the operating temperature of the equipment within a suitable range and further improving the heat dissipation effect.

[0037] In this embodiment, the plurality of fins 212 are arranged in a uniform manner, resulting in uniform heat dissipation.

[0038] In this embodiment, the phase change metal layer 23 is made of indium metal. The phase change metal can be indium sheet, which is widely used in the industry. Indium sheet is a new type of composite heat-conducting material with excellent thermal conductivity, low phase change temperature, and soft texture. Its thermal conductivity is as high as 86 W / mK, far exceeding the thermal conductivity of thermal pads. The solid-liquid phase change temperature is 156 degrees Celsius. By adjusting the proportions of the components in the indium sheet, its phase change temperature can be further reduced. Indium sheet is a silvery-white soft metal with a soft texture and high plasticity. When a certain pressure is applied, it can adhere well to the solid surface, reducing the contact thermal resistance between solid surfaces.

[0039] In this embodiment, the through slot 12 has a rectangular structure, which facilitates the insertion and installation of the heat sink 2.

[0040] In this embodiment, the phase change metal layer 23 has a rectangular structure, which facilitates installation.

[0041] In this embodiment, the optical module 3 and the cage 1 are fixedly connected by a snap-fit. The optical module 3 is easy to assemble. The snap-fit ​​is a U-shaped slot, and the optical module 3 is inserted into and snapped into the U-shaped slot to achieve a fixed connection. Optionally, the U-shaped slot is an elastic slot, which facilitates direct, flexible snap-fit ​​fixing. This also allows the optical module 3 to be easily inserted and removed from the cage 1.

[0042] It should be noted that the various embodiments described above with reference to the accompanying drawings are only illustrative of the present invention and not intended to limit its scope. Those skilled in the art should understand that any modifications or equivalent substitutions made to the present invention without departing from its spirit and scope should be covered within the scope of the present invention. Furthermore, unless the context otherwise requires, singular terms include plural forms, and vice versa. Additionally, unless specifically stated otherwise, all or part of any embodiment may be used in conjunction with all or part of any other embodiment.

Claims

1. A heat sink assembly for an optical module, characterized in that, include: A cage and a heat sink fixed to one side of the cage; the cage includes a cage body having a receiving space and an opening on one side, and a through slot penetrating the top surface of the cage body; the through slot communicates with the receiving space, which is used to receive and fix an optical module; the heat sink includes a heat sink body, a metal boss extending from the heat sink body toward the cage, and a phase change metal layer extending from the metal boss toward the cage; the heat sink body fits against the top surface of the cage and covers the through slot, and the phase change metal layer extends into the through slot for contact with the optical module; The thickness of the phase change metal layer is 0.2~0.5mm; The phase change metal layer is formed by coating the metal boss on the side near the cage; The optical module and the cage are fixedly connected by a snap fastener; wherein the snap fastener is a U-shaped slot, and the optical module is inserted into the U-shaped slot to achieve a fixed connection; The radiator body includes a base plate and a plurality of fins disposed on the side of the base plate away from the cage. The base plate is attached to the top surface of the cage, and the metal boss extends into the through groove. The multiple fins are arranged in a uniform manner; The phase change metal layer is made of indium metal material; The heat sink is mounted to the cage via a metal spring, and the optical module is inserted into the cage. The heat sink is pushed upward, and the metal spring deforms to generate pressure.

2. The heat sink assembly for an optical module according to claim 1, characterized in that, The through slot has a rectangular structure.

3. The heat sink assembly for an optical module according to claim 1, characterized in that, The phase change metal layer has a rectangular structure.