Endoscope

Abstract

The utility model relates to the technical field of industrial endoscopes, and provides an endoscope which comprises a control box, a probe and a pipeline. A heat dissipation cavity is formed in the control box, and a semiconductor refrigerator is arranged in the heat dissipation cavity and used for refrigerating gas in the heat dissipation cavity. The probe is connected with the control box through a pipeline, a heat transfer cavity is formed in the pipeline, and the heat dissipation cavity is communicated with an inner cavity of the probe through the heat transfer cavity. According to the endoscope, the heat dissipation cavity is formed in the control box, the semiconductor refrigerator is arranged in the heat dissipation cavity, the heat dissipation cavity is communicated with the inner cavity of the probe through the heat transfer cavity in the pipeline, and the semiconductor refrigerator can refrigerate gas in the heat dissipation cavity based on the Peltier effect when the semiconductor refrigerator is powered on; therefore, the temperature in the probe is reduced through circulation and heat transfer of gas in the heat dissipation cavity, the heat transfer cavity and the inner cavity of the probe, heat dissipation and cooling of the probe are achieved, meanwhile, a heat dissipation device and a heat dissipation structure are located in a pipeline and a control box, and an additional heat dissipation structure does not need to be additionally arranged in the probe.

Description

TECHNICAL FIELD

[0001] The utility model relates to industrial endoscope technical field especially, relates to an endoscope. BACKGROUND

[0002] Industrial endoscope is the new nondestructive testing instrument of optical, precision machinery, electronic machinery, electronic technology and microscopic camera technology, is often used in precision machinery, pipeline, boiler, container inside, airplane turbine, vane, engine, combustion cavity etc., can be under the condition of not needing to disassemble or destroy assembly to the equipment inside carry out nondestructive testing. Industrial endoscope often wants to extend into high temperature environment and carry out detection, and when the temperature of endoscope probe is too high, the normal operation of endoscope will be affected. In the related art, the probe is mainly cooled through water cooling etc., and the whole heat dissipation device occupies larger space, which easily leads to larger volume of the probe, affecting the passability of the probe. UTILITARY MODEL CONTENT

[0003] The utility model provides an endoscope to solve the defects that the heat dissipation device occupies larger space in prior art, easily leads to larger volume of the probe, affects the passability of the probe.

[0004] The utility model provides an endoscope, which comprises:

[0005] A control box is internally structured with a heat dissipation cavity, a semiconductor refrigerator is arranged in the heat dissipation cavity, and the semiconductor refrigerator is used for refrigerating gas in the heat dissipation cavity.

[0006] A probe and a pipeline are connected with the control box through the pipeline, a heat transfer cavity is structured in the pipeline, and the heat dissipation cavity is communicated with the inner cavity of the probe through the heat transfer cavity.

[0007] According to the endoscope of the utility model, the temperature detector is arranged in the inner cavity of the probe, and the controller is in communication connection with the semiconductor refrigerator and the temperature detector.

[0008] The temperature detector is used for detecting the temperature of the inner cavity of the probe, and the controller is used for controlling the on-off of the semiconductor refrigerator according to the temperature information fed back by the temperature detector.

[0009] According to the endoscope of the utility model, the temperature detector comprises a thermistor or a thermocouple.

[0010] According to the endoscope of the utility model, the control box is provided with a heat conduction hole communicating the heat dissipation cavity and the outside, a heat conduction piece is arranged in the heat conduction hole, and one end of the heat conduction piece is in contact with the heat dissipation end of the semiconductor refrigerator.

[0011] The endoscope according to this utility model also includes a cooling fan, which is installed inside the heat-conducting hole and located on the outside of the heat-conducting element.

[0012] The endoscope according to this utility model also includes a traction wire and a traction device, wherein the traction wire is disposed in the heat transfer cavity and the traction device is disposed in the heat dissipation cavity;

[0013] One end of the traction line is connected to the probe, and the other end is connected to the traction device; the traction device is used to pull the traction line to drive the probe to adjust its direction.

[0014] The endoscope according to this utility model also includes a control harness, a harness interface, and a control unit;

[0015] The control harness is disposed inside the heat transfer cavity, the harness interface is disposed inside the heat dissipation cavity, and the control unit is disposed inside the control box; one end of the control harness is connected to the probe, the other end is connected to the harness interface, and the harness interface is communicatively connected to the control unit.

[0016] According to the endoscope of this utility model, the control box is further configured with an installation cavity that is separated from the heat dissipation cavity, and the control unit is installed in the installation cavity.

[0017] According to the endoscope of this utility model, a heat insulation layer is provided between the mounting cavity and the heat dissipation cavity.

[0018] According to the endoscope of this utility model, the control harness outer sleeve is provided with a heat insulation layer.

[0019] This invention relates to an endoscope that incorporates a heat dissipation cavity within a control box. A semiconductor cooler is housed within this cavity, and the cavity is connected to the probe's inner cavity via a heat transfer cavity within a pipeline. When powered on, the semiconductor cooler cools the gas within the heat dissipation cavity based on the Peltier effect. This allows for heat transfer through the flow of gas within the heat dissipation cavity, heat transfer cavity, and probe's inner cavity, thereby reducing the probe's internal temperature. Simultaneously, the main heat dissipation devices and structures are located within the pipeline and control box, eliminating the need for additional heat dissipation structures within the probe. This effectively solves the shortcomings of existing technologies where large space is occupied by heat dissipation devices, leading to larger probe sizes and affecting probe passability. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the endoscope provided in an embodiment of the present invention.

[0022] Figure label:

[0023] 1. Endoscope;

[0024] 11. Control box; 111. Heat dissipation cavity; 112. Semiconductor cooler;

[0025] 12. Probe;

[0026] 13. Pipelines; 131. Heat transfer chamber;

[0027] 14. Temperature detector; 15. Traction line; 16. Traction device; 17. Control harness; 18. Harness interface. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0029] The following is combined with Figure 1 This invention describes the endoscope of the present invention.

[0030] like Figure 1 As shown, this utility model provides an endoscope 1, including: a control box 11, a probe 12, and a conduit 13. The control box 11 has a heat dissipation cavity 111, and a semiconductor cooler 112 is disposed within the heat dissipation cavity 111. The semiconductor cooler 112 is used to cool the gas within the heat dissipation cavity 111. The probe 12 is connected to the control box 11 via the conduit 13, which has a heat transfer cavity 131. The heat dissipation cavity 111 communicates with the inner cavity of the probe 12 through the heat transfer cavity 131.

[0031] In this embodiment, it can be understood that the control box 11 is typically equipped with control elements for the probe 12. These control elements are connected to the probe 12 via wiring harnesses and are used to control the probe 12 to extend into the space and area to be detected for detection.

[0032] In this embodiment, the control box 11 is connected to the probe 12 via a pipeline 13. The control box 11 contains a heat dissipation cavity 111, and the pipeline 13 contains a heat transfer cavity 131 that connects the heat dissipation cavity 111 and the probe 12, allowing the gas in the heat dissipation cavity 111, heat transfer cavity 131, and probe 12 to flow and transfer heat freely within the three cavities. Simultaneously, a semiconductor cooler 112 is installed within the heat dissipation cavity 111. When energized, the semiconductor cooler 112 cools the gas within the heat dissipation cavity 111 based on the Peltier effect, and reduces the temperature inside the probe 12 through the flow of heat and gas within the three cavities.

[0033] It is understandable that the heat dissipation end of the semiconductor cooler 112 can conduct heat to the outside of the control box 11 through the outer shell of the control box 11 or the heat-conducting structure provided inside the outer shell so as to dissipate heat to the external environment.

[0034] The endoscope 1 of this invention features a heat dissipation cavity 111 within a control box 11, a semiconductor cooler 112 within the heat dissipation cavity 111, and a connection between the heat dissipation cavity 111 and the inner cavity of the probe 12 via a heat transfer cavity 131 within a pipeline 13. When powered on, the semiconductor cooler 112 cools the gas within the heat dissipation cavity 111 based on the Peltier effect. This allows for heat transfer through the gas flow within the three cavities—the heat dissipation cavity 111, the heat transfer cavity 131, and the inner cavity of the probe 12—to reduce the temperature inside the probe 12. While achieving heat dissipation and cooling of the probe 12, the main heat dissipation devices and structures are located within the pipeline 13 and the control box 11, eliminating the need for additional heat dissipation structures inside the probe 12. This effectively solves the shortcomings of existing technologies where heat dissipation devices occupy large spaces, leading to larger probe sizes and affecting probe passability.

[0035] In some embodiments, such as Figure 1 As shown, the endoscope 1 also includes a temperature detector 14 and a controller (not shown in the figure). The temperature detector 14 is disposed in the inner cavity of the probe 12, and the controller is communicatively connected to both the thermoelectric cooler 112 and the temperature detector 14. The temperature detector 14 is used to detect the temperature of the inner cavity of the probe 12, and the controller is used to control the switching on and off of the thermoelectric cooler 112 based on the temperature information fed back by the temperature detector 14.

[0036] In this embodiment, a temperature detector 14 is installed in the inner cavity of the probe 12 to detect the temperature of the inner cavity of the probe 12 and feed the temperature information back to the controller. The controller is used to control the switching of the semiconductor cooler 112 according to the temperature information, so that the semiconductor cooler 112 can be turned off or put into hibernation when the temperature of the inner cavity of the probe 12 is within the normal operating temperature range of the probe 12, and then turned on to cool the probe 12 when the temperature of the inner cavity of the probe 12 exceeds the normal operating temperature, which can effectively reduce the energy consumption of the semiconductor cooler 112.

[0037] Furthermore, in some embodiments, the controller can also adjust the current through the thermoelectric cooler 112 based on the temperature feedback from the temperature detector 14, thereby adjusting the cooling capacity of the thermoelectric cooler 112 to achieve rapid cooling of the probe 12. For example, the higher the temperature feedback from the temperature detector 14, the greater the cooling capacity of the thermoelectric cooler 112 adjusted by the controller, so that the temperature of the probe 12 can be quickly reduced to the normal operating temperature.

[0038] Optionally, in some embodiments, the temperature detector 14 includes a thermistor or a thermocouple. A thermistor changes its resistance with temperature changes. By electrically connecting the thermistor and the controller to form a detection circuit, when the temperature inside the probe 12 changes, the resistance of the thermistor changes, causing a change in the current value within the detection circuit. The controller can then control the switching of the thermoelectric cooler 112 based on this current change. Similarly, a thermocouple converts temperature changes into electromotive force changes, and the controller can control the switching of the thermoelectric cooler 112 based on this current change.

[0039] Specifically, the thermistor can be an NTC thermistor (Negative Temperature Coefficient). The resistance of an NTC thermistor changes significantly with temperature, and it is commonly used in temperature sensors. It has the advantages of high sensitivity, fast response speed, and suitability for high-precision temperature measurement.

[0040] Specifically, in some embodiments, the control box 11 is provided with a heat conduction hole that connects the heat dissipation cavity 111 to the outside. A heat conduction element (not shown in the figure) is provided in the heat conduction hole, and one end of the heat conduction element is in contact with the heat dissipation end of the semiconductor cooler 112.

[0041] In this embodiment, a heat-conducting hole is opened on the control box 11 to connect with the heat dissipation cavity 111, so that a heat-conducting element is placed in the heat-conducting hole. The end of the heat-conducting element extends into the heat dissipation cavity 111 and contacts the heat dissipation end of the semiconductor cooler 112. When the semiconductor cooler 112 cools the air in the heat dissipation cavity 111, the heat from the cooling end of the semiconductor cooler 112 is transferred to the heat dissipation end and conducted to the outside of the control box 11 by the heat-conducting element, and dissipated to the external environment.

[0042] Specifically, the heat-conducting component can be a heat-conducting copper pipe.

[0043] In some embodiments, the endoscope 1 further includes a cooling fan (not shown in the figure), which is installed inside the heat conduction hole and located outside the heat conduction element.

[0044] In this embodiment, a cooling fan is installed inside the heat-conducting hole at a position outside the heat-conducting component. The cooling fan is used to accelerate the gas flow outside the heat-conducting component and dissipate the heat on the heat-conducting component through convection heat exchange, so that the heat can be continuously conducted and dissipated from the heat dissipation end of the semiconductor cooler 112 to the external environment through the heat-conducting component.

[0045] In some embodiments, such as Figure 1 As shown, the endoscope 1 also includes a traction cable 15 and a traction device 16. The traction cable 15 is disposed in the heat transfer cavity 131, and the traction device 16 is disposed in the heat dissipation cavity 111. One end of the traction cable 15 is connected to the probe 12, and the other end is connected to the traction device 16 for transmission. The traction device 16 is used to pull the traction cable 15 to drive the probe 12 to adjust its direction.

[0046] In this embodiment, the traction device 16 is connected to the probe 12 via the traction line 15, so that the probe 12 can be adjusted in direction by pulling the traction line 15, so that the probe 12 faces the direction to be detected. In this embodiment, by setting the traction line 15 and the traction device 16 in the heat transfer cavity 131 and the heat dissipation cavity 111 respectively, the space in the heat transfer cavity 131 is fully utilized, making the structure of the entire endoscope 1 more compact and occupying less space.

[0047] In some embodiments, such as Figure 1 As shown, the endoscope 1 also includes a control harness 17, a harness interface 18, and a control unit (not shown in the figure). The control harness 17 is disposed in the heat transfer cavity 131, the harness interface 18 is disposed in the heat dissipation cavity 111, and the control unit is disposed in the control box 11. One end of the control harness 17 is connected to the probe 12, and the other end is connected to the harness interface 18. The harness interface 18 is communicatively connected to the control unit.

[0048] In this embodiment, the control unit includes an electronic control element for controlling the probe 12. The control unit is connected to the probe 12 via a wiring harness interface 18 and a control wiring harness 17 to control the probe 12 for imaging and detection. Meanwhile, by placing the control wiring harness 17 and the wiring harness interface 18 within the heat transfer cavity 131 and the heat dissipation cavity 111 respectively, the space within the heat transfer cavity 131 is fully utilized, making the entire endoscope 1 more compact and space-saving.

[0049] Specifically, in some embodiments, the control box 11 is further configured with a mounting cavity separated from the heat dissipation cavity 111, and the control unit is installed in the mounting cavity. In this embodiment, by isolating the heat dissipation cavity 111 in the mounting cavity, the control unit and the heat dissipation cavity 111 are isolated, thus preventing the control unit and the heat dissipation cavity 111 from interfering with each other.

[0050] Furthermore, in some embodiments, a heat insulation layer is provided between the mounting cavity and the heat dissipation cavity 111. In this embodiment, by providing a heat insulation layer between the mounting cavity and the heat dissipation cavity 111, the heat insulation effect between the mounting cavity and the heat dissipation cavity 111 is enhanced, further isolating the heat transfer between the mounting cavity and the heat dissipation cavity 111.

[0051] Optionally, in some embodiments, the control harness 17 is covered with an insulation layer. In this embodiment, by covering the control harness 17 with an insulation layer, heat transfer between the gas in the heat transfer cavity 131 and the control harness 17 is isolated, so as to avoid mutual interference between the control harness 17 and the gas in the heat transfer cavity 131, thereby affecting the heat dissipation effect of the probe 12.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. An endoscope, characterized in that, include: A control box, wherein a heat dissipation cavity is constructed inside the control box, and a semiconductor cooler is disposed inside the heat dissipation cavity, the semiconductor cooler being used to cool the gas inside the heat dissipation cavity; The probe and the pipeline are connected to the control box through the pipeline. A heat transfer cavity is constructed inside the pipeline, and the heat dissipation cavity is connected to the inner cavity of the probe through the heat transfer cavity.

2. The endoscope according to claim 1, characterized in that, It also includes a temperature detector and a controller; The temperature detector is disposed in the inner cavity of the probe, and the controller is communicatively connected to both the thermoelectric cooler and the temperature detector. The temperature detector is used to detect the temperature of the inner cavity of the probe, and the controller is used to control the switching of the thermoelectric cooler based on the temperature information fed back by the temperature detector.

3. The endoscope according to claim 2, characterized in that, The temperature detector includes a thermistor or a thermocouple.

4. The endoscope according to claim 1, characterized in that, The control box is provided with a heat-conducting hole that connects the heat dissipation cavity to the outside. A heat-conducting element is provided in the heat-conducting hole, and one end of the heat-conducting element is in contact with the heat dissipation end of the semiconductor cooler.

5. The endoscope according to claim 4, characterized in that, It also includes a cooling fan, which is installed inside the heat-conducting hole and located on the outside of the heat-conducting component.

6. The endoscope according to claim 1, characterized in that, It also includes a traction line and a traction device, wherein the traction line is disposed in the heat transfer cavity and the traction device is disposed in the heat dissipation cavity; One end of the traction line is connected to the probe, and the other end is connected to the traction device; the traction device is used to pull the traction line to drive the probe to adjust its direction.

7. The endoscope according to claim 1, characterized in that, It also includes control harnesses, harness interfaces, and control units; The control harness is disposed inside the heat transfer cavity, the harness interface is disposed inside the heat dissipation cavity, and the control unit is disposed inside the control box; one end of the control harness is connected to the probe, the other end is connected to the harness interface, and the harness interface is communicatively connected to the control unit.

8. The endoscope according to claim 7, characterized in that, The control box also has a mounting cavity that is separated from the heat dissipation cavity, and the control unit is installed in the mounting cavity.

9. The endoscope according to claim 8, characterized in that, A heat insulation layer is provided between the mounting cavity and the heat dissipation cavity.

10. The endoscope according to claim 7, characterized in that, The control harness is covered with an insulation layer.

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