Gluing device for semiconductor silicon wafer production

Abstract

The utility model relates to the technical field of semiconductor chips, and discloses a gluing device for semiconductor silicon wafer production, which comprises an air blowing disc, the cross section of the air blowing disc is annular, the bottom end of the air blowing disc is communicated with a plurality of annularly distributed nozzles, two sides of the air blowing disc are communicated with air outlet pipes, and the air outlet pipes are communicated with the air blowing disc. The end, away from the air blowing disc, of the air outlet pipe communicates with an air cylinder, and a piston slides in the air cylinder in a sealed mode. The piston is fixedly connected to the clamping plate; when the electric push rod drives the two clamping plates to move away from each other, the piston extrudes air in the air cylinder, the air in the air cylinder is discharged out of the air blowing disc through the air outlet pipe, and finally the air is sprayed to the surface of the round semiconductor silicon wafer through the obliquely-arranged nozzle, so that colloid on the surface of the semiconductor silicon wafer is quickly dried. The semiconductor silicon wafer does not need to be taken out for drying, so that the subsequent processing time is saved, the subsequent drying step is reduced, and the working efficiency is higher.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip technology, and in particular to a coating device for semiconductor silicon wafer production. Background Technology

[0002] Photoresist coating and developing machines are commonly used equipment in semiconductor manufacturing, generally used for processes such as photoresist coating and developing. The photoresist coating and developing machine is the main body for carrying out photoresist coating and developing to remove the photoresist. The photoresist coating process generally includes placing the silicon wafer in the photoresist coating and developing machine, spraying photoresist onto the surface of the silicon wafer from the photoresist nozzles of the photoresist coating and developing machine, and making the photoresist on the silicon wafer evenly spread by rotating the silicon wafer.

[0003] Currently, existing developing machine coating devices can only remove the coating material after application and then dry it or let it air dry naturally. The drying speed of the coating material is slow, and it is impossible to dry it quickly after coating.

[0004] Therefore, it is necessary to provide a coating apparatus for semiconductor silicon wafer production to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this invention is to provide a coating device for semiconductor silicon wafer production, so as to solve the defects and other problems of the prior art mentioned in the background art.

[0006] Based on the above ideas, this utility model provides the following technical solution: it includes an air blowing plate, the cross-sectional shape of which is set as an annular shape. The bottom end of the air blowing plate is connected to a plurality of nozzles arranged in an annular pattern. Both sides of the air blowing plate are connected to air outlet pipes. The end of the air outlet pipe away from the air blowing plate is connected to an air cylinder. A piston is sealed and slidably mounted inside the air cylinder. The piston is fixedly connected to a clamping plate. An electric push rod drives the clamping plate to move back and forth, causing the piston to move simultaneously, so that the air inlet pipe connected to the air cylinder draws in air, and the nozzle sprays air onto the coated semiconductor silicon wafer.

[0007] As a further embodiment of this utility model: the cross-sectional shape of the air blowing plate is set to be circular, the top of the air blowing plate is provided with multiple air holes, the air blowing plate is set on the top of one of the clamps, and a rotating mechanism is provided on the side of the air blowing plate near the air outlet pipe; the air outlet pipe is made of soft material.

[0008] As a further embodiment of this utility model: the rotating mechanism includes a rack, the number of which is set to two, the two racks are respectively disposed at both ends of the support rod, the support rod is fixedly connected to the top end of the horizontal section of the clamping plate, the top of the rack is meshed with a gear, the end of the gear away from the clamping plate is rotatably connected to a reciprocating screw through a one-way damping bearing, and a reciprocating moving component is disposed on the outer side of the reciprocating screw.

[0009] As a further embodiment of this utility model: the reciprocating moving assembly includes a first slider, which is connected to the outside of the reciprocating lead screw via a nut pair, and a moving rod is fixedly connected to the top of the first slider; a limit rod is provided inside the first slider, and the first slider is slidably connected to the outside of the limit rod, the limit rod is fixedly connected to a support plate, and the support plate is installed on the top of the glue application table; the limit rod passes through the support plate and rotates with it, and one end of the moving rod passes through the support plate and slides with it.

[0010] As a further embodiment of this utility model: a rotating component is provided at one end of the moving rod near the clamping plate, the rotating component including a sleeve, the sleeve being fixedly connected to the outside of the air blowing plate; the end of the sleeve near the moving rod is rotatably connected to the support plate, and the sleeve and the moving rod are connected through a transmission component.

[0011] As a further embodiment of this utility model: the transmission component includes a second slider, the second slider is fixedly connected to the outside of the moving rod, the sleeve has a spiral groove inside, and one end of the second slider is disposed in the spiral groove and slides in cooperation with it.

[0012] As a further embodiment of this utility model: the cross-sectional shape of the clamping plate is set as an arc surface, and one end of the clamping plate is bent into a horizontal shape.

[0013] Compared with the prior art, the beneficial effect of this utility model is that when the electric push rod drives the two clamping plates to move away from each other, the piston squeezes the air in the air cylinder and discharges the air in the air cylinder into the air blowing plate through the air outlet pipe. Finally, the air is sprayed onto the surface of the circular semiconductor silicon wafer through the inclined nozzle, which quickly dries the colloid on the surface of the semiconductor silicon wafer. There is no need to remove the semiconductor silicon wafer for drying, which saves subsequent processing time, reduces subsequent drying steps, and improves work efficiency.

[0014] Compared with the prior art, the beneficial effect of this utility model is that when the two clamping plates are driven to move away from each other by the electric push rod, the movement of the clamping plates, in conjunction with the rotating mechanism, can drive the air blowing plate to rotate 180 degrees counterclockwise, so that the air blowing plate is directly above the semiconductor silicon wafer, so that the air holes on the air blowing plate are facing the semiconductor silicon wafer. Then the gas in the air cylinder is discharged through the air holes on the air blowing plate to the upper surface of the semiconductor silicon wafer, so that the colloid on the semiconductor silicon wafer can be fully covered by the blowing, which increases the contact area between the colloid and the airflow on the semiconductor silicon wafer, and further improves the drying speed of the colloid. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0016] Figure 1This is a schematic diagram of the main structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the air blowing plate structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the air cylinder structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the rotating mechanism structure of this utility model;

[0020] Figure 5 This is a cross-sectional structural diagram of the sleeve of this utility model.

[0021] In the diagram: 1. Air blowing plate; 2. Air outlet pipe; 3. Control valve; 4. Air cylinder; 5. Air inlet pipe; 6. Piston; 7. Clamping plate; 8. Electric push rod; 9. Rotating mechanism; 901. Rack; 902. Gear; 903. Reciprocating lead screw; 904. First slider; 905. Limiting rod; 906. Moving rod; 907. Sleeve; 908. Second slider. Detailed Implementation

[0022] Example 1, as Figures 1 to 2 As shown, a coating device for semiconductor silicon wafer production includes an air blowing plate 1. The cross-sectional shape of the air blowing plate 1 is set to an annular shape so as not to obstruct the coating assembly from coating the circular semiconductor silicon wafer. The bottom end of the air blowing plate 1 is connected to multiple nozzles arranged in an annular pattern. Both sides of the air blowing plate 1 are connected to air outlet pipes 2, which are made of stainless steel. The end of the air outlet pipe 2 away from the air blowing plate 1 is connected to an air cylinder 4. A piston 6 is sealed and slidably mounted inside the air cylinder 4. The piston 6 is fixedly connected to a clamping plate 7. The clamping plate 7 is driven to move back and forth by an electric push rod 8, which drives the piston 6 to move simultaneously, so that the air inlet pipe 5 connected to the air cylinder 4 draws in air and sprays air onto the coated semiconductor silicon wafer through the nozzles.

[0023] In this embodiment, a circular semiconductor silicon wafer is placed on the top of a workbench. A coating assembly is provided at the top of the workbench. The coating assembly includes a coating pump system, a coating head or nozzle, a lifting mechanism, a control system, and auxiliary components. Two symmetrically arranged electric push rods 8 are activated, which drive two clamping plates 7 to move towards each other, clamping the circular semiconductor silicon wafer at the top of the workbench. Since the cross-sectional shape of the clamping plates 7 is set to arc, the circular semiconductor silicon wafer is clamped more stably. Adhesive is applied to the surface of the circular semiconductor silicon wafer by the coating assembly.

[0024] When the electric push rod 8 drives the two clamping plates 7 to move closer to each other, one end of the clamping plate 7 is bent into a horizontal shape, and the piston 6 is fixedly connected to the horizontal section of the clamping plate 7. At this time, the movement of the clamping plate 7 drives the piston 6 to move, and the piston 6 moves to draw air. The outside air enters the air cylinder 4 through the air inlet pipe 5 connected to the air cylinder 4. A one-way air inlet control valve 3 is installed on the outside of the air inlet pipe 5, and a one-way air outlet control valve 3 is installed on the outside of the air outlet pipe 2. When the electric push rod 8 drives the two clamping plates 7 to move further away from each other, the piston 6 squeezes the air in the air cylinder 4 and discharges the air in the air cylinder 4 into the air blowing plate 1 through the air outlet pipe 2. Finally, the air is sprayed onto the surface of the circular semiconductor silicon wafer through the inclined nozzle, quickly drying the colloid on the surface of the semiconductor silicon wafer. There is no need to remove the semiconductor silicon wafer for drying, saving subsequent processing time, reducing subsequent drying steps, and improving work efficiency.

[0025] Example 2, as Figures 3 to 5 As shown, the cross-sectional shape of the air blowing plate 1 is circular, and multiple air holes are opened at the top of the air blowing plate 1. The air blowing plate 1 is set on the top of one of the clamping plates 7. A rotating mechanism 9 is provided on the side of the air blowing plate 1 near the air outlet pipe 2. The air outlet pipe 2 is made of soft material.

[0026] In this embodiment, when the electric push rod 8 drives the two clamping plates 7 to move away from each other, the movement of the clamping plates 7, in conjunction with the rotating mechanism 9, can drive the air blowing plate 1 to rotate 180 degrees counterclockwise, rotating the air blowing plate 1 to directly above the semiconductor silicon wafer, so that the air holes on the air blowing plate 1 are facing the semiconductor silicon wafer. Then, the gas in the air cylinder 4 is discharged through the air holes on the air blowing plate 1 to the upper surface of the semiconductor silicon wafer, so that the colloid on the semiconductor silicon wafer can be fully covered by the blowing, increasing the contact area between the colloid and the airflow on the semiconductor silicon wafer, and further increasing the drying speed of the colloid.

[0027] As a specific implementation structure of this embodiment, the rotating mechanism 9 includes a rack 901, and the number of racks 901 is set to two. The two racks 901 are respectively disposed at both ends of the support rod. The support rod is fixedly connected to the top of the horizontal section of the clamping plate 7. The top of the rack 901 is meshed with a gear 902. The end of the gear 902 away from the clamping plate 7 is rotatably connected to a reciprocating screw 903 through a one-way damping bearing. A reciprocating moving component is disposed on the outer side of the reciprocating screw 903.

[0028] In this embodiment, when the electric push rod 8 drives the two clamping plates 7 to move toward each other, the two racks 901 mesh with the gear 902 in sequence, and the two racks 901 drive the gear 902 to rotate in sequence. Since the gear 902 and the reciprocating screw 903 are rotatably connected through a one-way damping bearing, the rotation of the gear 902 does not drive the reciprocating screw 903 to rotate.

[0029] When the electric push rod 8 drives the two clamping plates 7 to move away from each other, the two racks 901 mesh with the gear 902 in sequence. When the gear 902 rotates, the two racks 901 can drive the reciprocating screw 903 to rotate. When the first rack 901 meshes with the gear 902, it drives the reciprocating moving assembly to move towards the air blowing plate 1. When the second rack 901 meshes with the gear 902, the reciprocating moving assembly moves away from the air blowing plate 1.

[0030] Furthermore, the reciprocating moving assembly includes a first slider 904, which is connected to the outside of the reciprocating lead screw 903 via a nut pair. A moving rod 906 is fixedly connected to the top of the first slider 904. A limit rod 905 is provided inside the first slider 904, and the first slider 904 is slidably connected to the outside of the limit rod 905. The limit rod 905 is fixedly connected to a support plate, and the support plate is installed on the top of the glue application table. The limit rod 905 passes through the support plate and rotates with it, and one end of the moving rod 906 passes through the support plate and slides with it.

[0031] In this embodiment, when the first rack 901 meshes with the gear 902, the reciprocating screw 903 rotates, causing the first slider 904 to move toward the air blowing plate 1 under the limiting action of the limiting rod 905. The movement of the first slider 904 causes the moving rod 906 to move. When the second rack 901 meshes with the gear 902, the reciprocating screw 903 rotates, causing the first slider 904 to move away from the air blowing plate 1, which means that the moving rod 906 moves with the first slider 904.

[0032] Furthermore, a rotating assembly is provided at one end of the moving rod 906 near the clamping plate 7. The rotating assembly includes a sleeve 907, which is fixedly connected to the outside of the air blowing plate 1. The end of the sleeve 907 near the moving rod 906 is rotatably connected to the support plate, and the sleeve 907 and the moving rod 906 are connected through a transmission assembly.

[0033] The transmission assembly includes a second slider 908, which is fixedly connected to the outside of the moving rod 906. A spiral groove is provided inside the sleeve 907, and one end of the second slider 908 is disposed in the spiral groove and slides in cooperation with it.

[0034] In this embodiment, the moving rod 906 moves towards the air blowing plate 1, causing the second slider 908 to slide within the spiral groove of the sleeve 907. Since the moving rod 906 can only move linearly under the limiting action of the limiting rod 905, when the moving rod 906 moves, it causes the sleeve 907 to rotate 180 degrees counterclockwise, rotating the air blowing plate 1 directly above the semiconductor silicon wafer. Air is then blown onto the colloid of the semiconductor silicon wafer through the air holes on the air blowing plate 1. When the moving rod 906 moves away from the air blowing plate 1, it causes the air blowing plate 1 to rotate 180 degrees clockwise to reset.

[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A coating apparatus for semiconductor silicon wafer production, characterized in that: Includes an air blowing plate (1), the cross-sectional shape of which is set as an annular shape. The bottom end of the air blowing plate (1) is connected to a plurality of nozzles arranged in an annular pattern. Both sides of the air blowing plate (1) are connected to an air outlet pipe (2). The end of the air outlet pipe (2) away from the air blowing plate (1) is connected to an air cylinder (4). A piston (6) is sealed and slidably inside the air cylinder (4). The piston (6) is fixedly connected to the clamping plate (7). The clamping plate (7) is driven to move back and forth by the electric push rod (8), which in turn drives the piston (6) to move at the same time, so that the air inlet pipe (5) connected to the air cylinder (4) draws in air and sprays air onto the coated semiconductor silicon wafer through the nozzle.

2. The coating apparatus for semiconductor silicon wafer production according to claim 1, characterized in that: The cross-sectional shape of the air blowing plate (1) is set to be circular. Multiple air holes are opened at the top of the air blowing plate (1). The air blowing plate (1) is set on the top of one of the clamps (7). A rotating mechanism (9) is provided on the side of the air blowing plate (1) near the air outlet pipe (2). The vent pipe (2) is made of a soft material.

3. The coating apparatus for semiconductor silicon wafer production according to claim 2, characterized in that: The rotating mechanism (9) includes a rack (901), and the number of racks (901) is set to two. The two racks (901) are respectively set at both ends of the support rod. The support rod is fixedly connected to the top of the horizontal section of the clamping plate (7). The top of the rack (901) is meshed with a gear (902). The end of the gear (902) away from the clamping plate (7) is rotatably connected to a reciprocating screw (903) through a one-way damping bearing. A reciprocating moving component is provided on the outside of the reciprocating screw (903).

4. The coating apparatus for semiconductor silicon wafer production according to claim 3, characterized in that: The reciprocating motion assembly includes a first slider (904), which is connected to the outside of the reciprocating lead screw (903) via a nut pair, and a moving rod (906) is fixedly connected to the top of the first slider (904). The first slider (904) is provided with a limiting rod (905) inside. The first slider (904) is slidably connected to the outside of the limiting rod (905). The limiting rod (905) is fixedly connected to the support plate. The support plate is installed on the top of the glue application table. The limiting rod (905) passes through the support plate and rotates with it, and one end of the moving rod (906) passes through the support plate and slides with it.

5. The coating apparatus for semiconductor silicon wafer production according to claim 4, characterized in that: The moving rod (906) is provided with a rotating component at one end near the clamping plate (7). The rotating component includes a sleeve (907), which is fixedly connected to the outside of the air blowing plate (1). The end of the sleeve (907) near the moving rod (906) is rotatably connected to the support plate, and the sleeve (907) and the moving rod (906) are connected by a transmission assembly.

6. The coating apparatus for semiconductor silicon wafer production according to claim 5, characterized in that: The transmission assembly includes a second slider (908), which is fixedly connected to the outside of the moving rod (906). A spiral groove is provided inside the sleeve (907), and one end of the second slider (908) is disposed in the spiral groove and slides in cooperation with it.

7. The coating apparatus for semiconductor silicon wafer production according to claim 1, characterized in that: The cross-sectional shape of the clamp (7) is set as an arc surface, and one end of the clamp (7) is bent into a horizontal shape.

Images