Static elimination structure and vacuum coating equipment
By setting conductive parts and elimination components on the substrate stage of the vacuum coating equipment, and using the movement of the movable seat to ground the substrate, the problem of static electricity residue on the substrate is solved, ensuring the smooth progress of the process and reducing costs.
Patent Information
- Application Number
- CN202423066156.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2034-12-12
AI Technical Summary
Electrostatic residue remains on the substrate after the vacuum coating process, which affects the normal operation of the process and leads to abnormal production quality.
A conductive part and an elimination component are set on the substrate stage. The elimination component includes a movable seat and a reset part. The substrate is grounded by the up and down movement of the movable seat. Combined with the grounding of the vacuum cavity, static electricity is eliminated.
It effectively eliminates static electricity residue on the substrate, ensures smooth process operation, simplifies structural design, and reduces production costs.
Smart Images
Figure CN223899378U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductor manufacturing equipment technology, specifically relating to an electrostatic elimination structure and vacuum coating equipment. Background Technology
[0002] In vacuum coating equipment, the substrate is placed on the substrate stage for processing. After several processes, there is a possibility of static electricity residue. When the substrate enters the next process, the residual static electricity will affect the normal operation of the process, causing abnormalities in the substrate and affecting the production quality. Utility Model Content
[0003] This application aims to at least solve one of the aforementioned technical problems existing in the prior art. To this end, in a first aspect, this application provides an electrostatic elimination structure capable of being applied in a vacuum coating apparatus to eliminate static electricity from a substrate.
[0004] Secondly, this application provides a vacuum coating apparatus that utilizes the above-described electrostatic elimination structure.
[0005] The static elimination structure according to the first aspect of this application includes:
[0006] A conductive portion is disposed on a substrate stage, the upper end of the conductive portion is flush with or protrudes from the upper end of the substrate stage, and the lower end of the conductive portion is exposed at the lower end of the substrate stage.
[0007] An elimination assembly is disposed inside the vacuum cavity and below the conductive part. The elimination assembly includes a movable seat and a reset part. The movable seat is adjustablely disposed on the elimination assembly and is grounded. The reset part acts on the movable seat to apply an upward force to the movable seat.
[0008] The electrostatic elimination structure according to the embodiments of this application has at least the following beneficial effects: Since the substrate is placed on the substrate stage, the upper end of the conductive part will contact the substrate and maintain an electrical connection with it. When the substrate stage descends, the lower end of the conductive part will abut against the movable seat to ground the substrate. Furthermore, the movable seat can move up and down to adjust without hindering the substrate stage from continuing to descend. Therefore, the electrostatic elimination structure of this application can effectively solve the problem of static electricity residue on the substrate.
[0009] According to some embodiments of this application, the vacuum cavity is grounded, and the movable seat is electrically connected to the vacuum cavity.
[0010] According to some embodiments of this application, the reset part includes a spring that abuts against the bottom of the movable seat between the vacuum cavity and the vacuum chamber.
[0011] According to some embodiments of this application, the spring is a conductive structure, and the movable seat is electrically connected to the vacuum cavity through the spring.
[0012] According to some embodiments of this application, the elimination component includes:
[0013] A mounting base is connected to the vacuum chamber;
[0014] A guide shaft, wherein the guide shaft is at least vertically disposed on opposite sides of the fixed base;
[0015] A guide portion, which is sleeved on the guide shaft and can move up and down along the guide shaft for adjustment;
[0016] The lower end of the movable seat is sleeved with the guide portion, and the reset portion abuts between the fixed seat and the movable seat.
[0017] According to some embodiments of this application, the guide portion is slidably connected to the guide shaft, and the movable seat is fixedly connected to the guide portion.
[0018] According to some embodiments of this application, the fixed seat and the movable seat are conductive structures. When the substrate stage is lowered, the conductive part presses down on the movable seat, causing the movable seat to abut against the fixed seat.
[0019] The vacuum coating apparatus according to a second aspect of this application includes the electrostatic elimination structure described in any of the above embodiments.
[0020] According to some embodiments of this application, the vacuum coating apparatus includes:
[0021] A vacuum cavity, wherein a vacuum chamber is provided inside the vacuum cavity;
[0022] A substrate stage is provided, which can be raised and lowered within the vacuum chamber. The substrate stage is vertically provided with mounting holes, and a pin is inserted through the mounting holes.
[0023] When the substrate stage is lowered, the lower end of the ejector pin abuts against the bottom of the vacuum chamber, causing the upper end to protrude upwards from the upper end of the substrate stage.
[0024] According to some embodiments of this application, the ejector pin includes a first segment, a second segment, and a third segment connected in sequence along a vertically downward direction. The second segment is an insulating structure, and the third segment has a greater weight than the first and second segments.
[0025] Additional aspects and advantages of this application will be set forth in part in the description which follows, and some of these additional aspects and advantages will become apparent from the description or may be learned by practice of this application. Attached Figure Description
[0026] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein:
[0027] Figure 1 This is a schematic diagram of an overall structure of this application;
[0028] Figure 2 This is a schematic diagram of one possible installation of the conductive part;
[0029] Figure 3 A structural diagram for eliminating components;
[0030] Figure 4 This is a schematic diagram showing a state in which the substrate stage descends to eliminate contact between the component and the movable seat.
[0031] Figure 5 This is a schematic diagram showing a state in which the substrate stage descends to the point where the ejector pins lift the substrate.
[0032] Figure 6 This is a schematic diagram of a type of thimble. Detailed Implementation
[0033] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0034] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0035] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0036] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.
[0037] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0038] Reference Figures 1 to 6 The embodiments of this application propose an electrostatic elimination structure that can be applied to a vacuum coating equipment to eliminate static electricity on a substrate, including a conductive part 302 and an elimination component 301.
[0039] The conductive portion 302 is disposed on the substrate stage 200. The upper end of the conductive portion 302 is flush with or protrudes from the upper end of the substrate stage 200, while the lower end of the conductive portion 302 is exposed at the lower end of the substrate stage 200. Since the substrate is placed on the substrate stage 200, the fact that the conductive portion 302 is flush with or protrudes from the upper end of the substrate stage 200 ensures contact with the substrate. It can be understood that the upper end of the conductive portion 302 is located in the area covered by the substrate.
[0040] The elimination assembly 301 is disposed inside the vacuum chamber 100 and located below the conductive part 302. The elimination assembly 301 includes a movable seat 3012 and a reset part 3015. The movable seat 3012 is adjustablely disposed on the elimination assembly 301 and is grounded. The reset part 3015 acts on the movable seat 3012 to apply an upward force to the movable seat 3012.
[0041] As the name suggests, the conductive part 302 is a conductive structure. Since the substrate is placed on the substrate stage 200, the upper end of the conductive part 302 is flush with or protrudes from the upper end of the substrate stage 200, which can ensure contact with the substrate and realize the electrical connection between the two.
[0042] During normal processing, the substrate stage 200 rises, with the lower end of the conductive part 302 suspended, not obstructing the substrate processing. After processing is complete, the substrate stage 200 descends. During descent, the lower end of the conductive part 302 abuts against the movable seat 3012, grounding the substrate and eliminating any residual static electricity. The movable seat 3012 is adjustable up and down, allowing the substrate stage 200 to continue descending without interference. When the substrate is replaced, the substrate stage 200 rises, and the movable seat 3012 resets upwards under the action of the reset part 3015. As the substrate stage 200 continues to rise, the conductive part 302 separates from the movable seat 3012 again, preventing the substrate from grounding.
[0043] In summary, the static elimination structure of this application can be applied to vacuum coating equipment, effectively solving the problem of residual static electricity on the substrate during the process.
[0044] In some embodiments of this application, the vacuum chamber 100 is grounded, and the movable seat 3012 is electrically connected to the vacuum chamber 100. Since the vacuum chamber 100 is a sealed structure, grounding the movable seat 3012 through the vacuum chamber 100 would increase the complexity of the structural design. In practical applications, the vacuum chamber 100 itself is generally grounded. This embodiment directly utilizes the electrical connection of the movable seat 3012 to the vacuum chamber 100 to achieve grounding of the movable seat 3012, which simplifies the structural design and controls production costs.
[0045] Reference Figure 1 and Figure 3 In some embodiments of this application, the reset part 3015 includes a spring that abuts against the bottom of the movable seat 3012 and the vacuum chamber 100.
[0046] It is understood that the conductive part 302 acts on the movable seat 3012 from top to bottom. In this embodiment, the movable seat 3012 is reset upward by setting a spring at the bottom, which can effectively ensure smooth reset. Compared with the tension spring design, it is more conducive to extending the working life of the reset part 3015. Furthermore, the bottom spring support method makes the structural design simple and the reset mechanism stable and reliable.
[0047] In some embodiments of this application, the spring is a conductive structure, and the movable seat 3012 is electrically connected to the vacuum cavity 100 through the spring. Since the movable seat 3012 is held abutted by the spring, the movable seat 3012 and the spring are always electrically connected. At the same time, the bottom of the spring abuts against the vacuum cavity 100, which can effectively ensure the grounding connection between the movable seat 3012 and the vacuum cavity 100.
[0048] Reference Figure 3In some embodiments of this application, the elimination component 301 includes a fixed base 3014, a guide shaft 3011, and a guide portion 3013. Specifically, the fixed base 3014 is fixedly connected to the vacuum chamber 100, and the fixed base 3014 is also a conductive structure. The guide shaft 3011 is vertically arranged on the left and right sides of the fixed base 3014, with at least one guide shaft 3011 on each side. The guide portion 3013 is sleeved on the guide shaft 3011 and can move up and down along the guide shaft 3011 for adjustment. The lower end of the movable base 3012 is sleeved with the guide portion 3013, and the reset portion 3015 abuts between the fixed base 3014 and the movable base 3012.
[0049] With the structural configuration of this embodiment, the movable seat 3012 uses the cooperation of the guide shaft 3011 and the guide part 3013 to perform vertical lifting and lowering adjustment, which can ensure the smoothness and stability of the lifting process.
[0050] Furthermore, in some embodiments of this application, the guide portion 3013 is slidably connected to the guide shaft 3011, and the movable seat 3012 is fixedly connected to the guide portion 3013. This embodiment utilizes the sliding of the guide portion 3013 and the guide shaft 3011 to guide the movable seat 3012 in raising and lowering. The movable seat 3012 and the guide portion 3013 can be fixed using methods such as interference fit, snap-fit, or screw connection.
[0051] In other embodiments, the guide portion 3013 and the guide shaft 3011 are connected by a thread, while the movable seat 3012 and the guide portion 3013 are slidably connected. Furthermore, a boss is provided at the upper end of the guide portion 3013, and the movable seat 3012 is fitted under the boss of the guide portion 3013. Under the action of a spring, the movable seat 3012 abuts against the boss. In this embodiment, the guide portion 3013 can be actively adjusted in height, thereby actively moving downwards to ensure the spring's retaining and restoring force on the movable seat 3012 when the spring's elasticity weakens.
[0052] In some embodiments of this application, the fixed seat 3014 and the movable seat 3012 are conductive structures. When the substrate stage 200 is lowered, the conductive part 302 presses down on the movable seat 3012, causing the movable seat 3012 to abut against the fixed seat 3014.
[0053] It is understandable that in this embodiment, grounding is achieved by direct contact between the movable seat 3012 and the fixed seat 3014, without the need for spring grounding. Combined with... Figure 3As shown, a first column is positioned at the bottom center of the movable base 3012, and a second column is positioned at the center of the fixed base 3014. When the substrate stage 200 descends to its lowest point, the first column abuts against the second column. The upper and lower ends of the spring are fitted onto the first and second columns. In this embodiment, the contact between the movable base 3012 and the fixed base 3014 is achieved through the first and second columns, which improves the installation stability of the spring.
[0054] Embodiments of this application also propose a vacuum coating apparatus, including the electrostatic elimination structure of any of the above embodiments.
[0055] Reference Figures 1 to 6 In some embodiments of this application, the vacuum coating equipment includes a vacuum chamber 100 and a substrate stage 200. The vacuum chamber 100 contains a vacuum cavity, and the substrate stage 200 is vertically movably positioned within the vacuum cavity. The substrate stage 200 has a vertically oriented mounting hole 201, through which a ejector pin 303 passes. The ejector pin 303 can move upwards under external force. When the substrate stage 200 descends, the lower end of the ejector pin 303 abuts against the bottom of the vacuum cavity, causing its upper end to protrude upwards from the upper end of the substrate stage 200. Since a substrate is placed on the substrate stage 200, it needs to be replaced when the substrate stage 200 descends. In this embodiment, the ejector pin 303 can lift the substrate from the substrate stage 200, facilitating substrate replacement.
[0056] Reference Figure 6 In some embodiments of this application, along the vertically downward direction, the ejector pin 303 includes a first segment 3031, a second segment 3032 and a third segment 3033 connected in sequence. The second segment 3032 is an insulating structure, and the weight of the third segment 3033 is greater than that of the first segment 3031 and the second segment 3032.
[0057] With the structural configuration of this embodiment, the downward reset of the ejector pin 303 can be achieved by utilizing the gravity of the third segment 3033. When the substrate stage 200 moves upward, causing the ejector pin 303 to separate from the vacuum chamber 100, the ejector pin 303 can fall smoothly under the action of gravity, avoiding the situation where the upper end protrudes from the substrate stage 200.
[0058] The second segment 3032 is set as an insulating structure to ensure that the substrate can be processed smoothly and to avoid the substrate stage 200 becoming electrified due to the ejector pin 303 during the process, which would affect the process effect and quality.
[0059] The first segment 3031 and the third segment 3033 are preferably made of metal to ensure structural strength. The weight of the third segment 3033 can be achieved by increasing its volume and length.
[0060] Reference Figure 1Furthermore, a support base 304 is provided at the bottom of the vacuum chamber of the vacuum cavity 100, and the support base 304 is vertically aligned with the ejector pin 303. This is used to abut the ejector pin 303 through the support base 304.
[0061] It is understood that the distance between the ejector pin 303 and the support base 304, and the distance between the movable base 3012 and the conductive part 302 in this embodiment need to maintain a certain correspondence, so as to ensure that the conductive part 302 has been grounded before the ejector pin 303 abuts against the support base 304 and lifts the substrate, thereby ensuring that static electricity is completely eliminated.
[0062] Reference Figure 2 In some embodiments of this application, the substrate stage 200 includes, from top to bottom, a first metal portion 202, an insulating layer 203, and a second metal portion 204, wherein the surface of the second metal portion 204 is insulated. Vertically, the length of the first segment 3031 matches the thickness of the first metal portion 202, the length of the second segment 3032 is greater than the thickness of the insulating layer 203, and the third segment 3033 extends downwards.
[0063] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.
Claims
1. A static electricity elimination structure, characterized in that, include: A conductive portion is disposed on a substrate stage, the upper end of the conductive portion is flush with or protrudes from the upper end of the substrate stage, and the lower end of the conductive portion is exposed at the lower end of the substrate stage. An elimination assembly is disposed inside the vacuum cavity and below the conductive part. The elimination assembly includes a movable seat and a reset part. The movable seat is adjustablely disposed on the elimination assembly and is grounded. The reset part acts on the movable seat to apply an upward force to the movable seat.
2. The static elimination structure according to claim 1, characterized in that, The vacuum chamber is grounded, and the movable seat is electrically connected to the vacuum chamber.
3. The static elimination structure according to claim 2, characterized in that, The reset part includes a spring that abuts against the bottom of the movable seat between the vacuum cavity and the vacuum chamber.
4. The static elimination structure according to claim 3, characterized in that, The spring is a conductive structure, and the movable seat is electrically connected to the vacuum cavity through the spring.
5. The static elimination structure according to claim 1, characterized in that, The elimination component includes: A mounting base is connected to the vacuum chamber; A guide shaft, wherein the guide shaft is at least vertically disposed on opposite sides of the fixed base; A guide portion, which is sleeved on the guide shaft and can move up and down along the guide shaft for adjustment; The lower end of the movable seat is sleeved with the guide portion, and the reset portion abuts between the fixed seat and the movable seat.
6. The static elimination structure according to claim 5, characterized in that, The guide portion is slidably connected to the guide shaft, and the movable seat is fixedly connected to the guide portion.
7. The static elimination structure according to claim 5, characterized in that, The fixed seat and the movable seat are conductive structures. When the substrate stage is lowered, the conductive part presses down on the movable seat, causing the movable seat to abut against the fixed seat.
8. A vacuum coating apparatus, characterized in that, Includes the static elimination structure as described in any one of claims 1 to 7.
9. The vacuum coating equipment according to claim 8, characterized in that, The vacuum coating equipment includes: A vacuum cavity, wherein a vacuum chamber is provided inside the vacuum cavity; A substrate stage is provided, which can be raised and lowered within the vacuum chamber. The substrate stage is vertically provided with mounting holes, and a pin is inserted through the mounting holes. When the substrate stage is lowered, the lower end of the ejector pin abuts against the bottom of the vacuum chamber, causing the upper end to protrude upwards from the upper end of the substrate stage.
10. The vacuum coating equipment according to claim 9, characterized in that, Along the vertically downward direction, the pin includes a first segment, a second segment, and a third segment connected in sequence. The second segment is an insulating structure, and the third segment has a greater weight than the first and second segments.