Printed circuit board and electronic device

Abstract

The utility model relates to the technical field of printed circuits, and provides a printed circuit board and an electronic device, the printed circuit board comprises a substrate, a bonding pad and a first channel, the bonding pad comprises at least two welding areas arranged on the surface of the substrate at intervals, the first channel is arranged between the welding area and the adjacent welding area, and the first channel is arranged on the surface of the substrate. A wire is arranged in the first channel, and an insulating coating is laid on the first channel. The printed circuit board provided by the utility model is used for overcoming the defect that a large bonding pad compresses available wiring space in the prior art, and the bonding pads are reasonably segmented, so that the first channel for laying wires is limited between the welding area and the adjacent welding area, thereby not only providing wiring space, but also reducing wiring detour caused by narrow space, and improving the wiring quality. Moreover, a high-density interconnection technology does not need to be introduced or the area of the substrate does not need to be enlarged, the wiring efficiency can be effectively improved, and the wiring cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit technology, and in particular to a printed circuit board and electronic equipment. Background Technology

[0002] With the rapid development of electronic technology, the demand for printed circuit board (PCB) design towards high speed, high density, and miniaturization is increasing. Due to the trend of high density and miniaturization, the layout and routing within the PCB space are facing increasingly severe challenges. PCBs often contain some large pad devices. The presence of these large pads further compresses the available space for traces and vias, resulting in a significant increase in crosstalk between signals. In severe cases, large pads may even prevent PCB traces and vias from being made. In such cases, it is necessary to introduce high-density interconnect (HDI) technology, which undoubtedly increases the complexity of the design and production costs. Utility Model Content

[0003] The first aspect of this utility model provides a printed circuit board to solve the defect of large pads compressing the available space for wiring in the prior art. By reasonably dividing the pads, a first channel for laying wires is restricted between the soldering area and the adjacent soldering area. This not only provides wiring space and reduces wiring detours caused by limited space, but also does not require the introduction of high-density interconnect technology or expansion of the substrate area, which can effectively improve wiring efficiency and reduce wiring costs.

[0004] A second aspect of this invention provides an electronic device.

[0005] The printed circuit board provided by this utility model includes a substrate, pads and a first channel. The pads include at least two soldering areas spaced apart on the surface of the substrate. The first channel is located between the soldering areas and adjacent soldering areas. The first channel contains a wire and an insulating coating is applied above the first channel.

[0006] The printed circuit board provided by this utility model also includes a second channel. The soldering area is provided with multiple channels, and the first channel and / or the second channel are restricted between any two adjacent soldering areas. The first channel and the second channel are used for gas flow.

[0007] According to the printed circuit board provided by this utility model, each of the soldering areas has an equal area, and the plurality of soldering areas are evenly spaced apart.

[0008] According to the printed circuit board provided by this utility model, the plurality of soldering areas are arranged in an array.

[0009] According to the printed circuit board provided by this utility model, the total area of ​​the plurality of soldering areas is greater than or equal to one-half of the area of ​​the solder pad.

[0010] According to the printed circuit board provided by this utility model, the insulating coating includes at least one of a green oil layer and a white oil layer.

[0011] The printed circuit board provided by this utility model further includes a solder paste layer, which is disposed on the surface of the soldering area and is used to fix the components.

[0012] The thickness of the insulating coating is less than or equal to the thickness of the solder paste layer.

[0013] The printed circuit board provided by this utility model also includes a via, which is disposed in the first channel and is used for signal transmission.

[0014] According to the printed circuit board provided by this utility model, the shape of the soldering area is square, and the soldering area is provided with chamfers or bevels.

[0015] The electronic device provided by this utility model includes the printed circuit board described in any of the preceding claims.

[0016] In the printed circuit board provided by this utility model, by dividing the pads into at least two soldering areas, a first channel can be defined by the two adjacent soldering areas. The bottom of the first channel is lower than the surface of the soldering area. In this way, space can be provided for the laying of wires without affecting the fixing of the components in the soldering area. When the wiring conflicts with the pads, this structure can make the wiring more orderly and avoid the confusion of line crossing. It can effectively improve the efficiency and accuracy of layout and wiring.

[0017] In existing technologies, traditional printed circuit boards (PCBs) often face limited space for routing and vias when dealing with large pad devices, resulting in low layout and routing efficiency and severe signal crosstalk between adjacent lines and between lines and pads. The PCB provided by this invention, through reasonable pad segmentation, restricts the first channel for laying conductors between the soldering area and adjacent soldering areas. This not only provides routing space and reduces routing detours caused by space constraints, but also eliminates the need to introduce high-density interconnect technology or increase the substrate area, effectively improving routing efficiency and reducing routing costs. Secondly, by wrapping and protecting the first channel and conductors with an insulating coating, a perfect insulating structure is formed between conductors and between conductors and pads. The insulating coating also acts as a protective layer, effectively protecting the conductors from corrosion and damage, and improving the stability and reliability of the conductors. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the printed circuit board provided in an embodiment of the present invention from a first-view perspective.

[0020] Figure 2 This is a schematic diagram of the printed circuit board provided in an embodiment of the present invention from a second perspective.

[0021] Figure 3 This is another schematic diagram of the layout of the welding area provided in this embodiment of the utility model.

[0022] Figure label:

[0023] 10: Substrate; 20: Pad; 21: Soldering area; 30: First channel; 40: Conductor; 50: Insulating coating; 51: Green solder mask layer; 52: White solder mask layer; 60: Second channel; 70: Solder paste layer; 80: Via; 90: Device. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0025] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0026] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0027] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0028] Figure 1 This is a schematic diagram of the printed circuit board provided in an embodiment of the present invention from a first-view perspective; Figure 2 This is a schematic diagram of the printed circuit board provided in an embodiment of the present invention from a second perspective.

[0029] See Figure 1 and Figure 2 The first aspect of this utility model provides a printed circuit board, which includes a substrate 10, pads 20 and a first channel 30; the substrate 10 is made of an insulating material, and copper foil is laid on the surface of the substrate 10; the pads 20 can be obtained by etching the copper foil, and specifically, can be adapted to the prior art.

[0030] The solder pad 20 includes at least two spaced soldering areas 21, that is, there can be two, three or more soldering areas 21. The shape of the soldering area 21 can be square, rectangle, circle or triangle, etc., and can be adapted to actual needs. The soldering area 21 is used to fix the device 90 by means of soldering, etc. The first channel 30 is located between two adjacent soldering areas 21. In other words, the first channel 30 is defined between two adjacent soldering areas 21.

[0031] The width of the first channel 30 can be adapted to the actual situation. The first channel 30 is used to lay the wire 40. After the wire 40 is laid, an insulating coating 50 can be laid on top of the first channel 30. The insulating coating 50 is used to isolate the wire 40 from the adjacent welding area 21 to avoid signal interference or short circuit between the wire 40 and the welding area 21.

[0032] See Figure 1 and Figure 2 It is understood that in the printed circuit board provided by this utility model embodiment, by dividing the pad 20 into at least two soldering areas 21, the first channel 30 can be defined by the two adjacent soldering areas 21. The bottom of the first channel 30 is lower than the surface of the soldering area 21. In this way, space can be provided for the laying of the wire 40 without affecting the fixing device 90 of the soldering area 21. When the wiring conflicts with the pad 20, this structure can make the wiring more regular and avoid the line crossing and confusion, which can effectively improve the efficiency and accuracy of layout wiring.

[0033] In the prior art, traditional printed circuit boards often face limited space for routing and drilling when dealing with large pad devices, resulting in low layout and routing efficiency and severe signal crosstalk between adjacent lines and between lines and pads. The printed circuit board provided in this embodiment of the utility model, by reasonably dividing the pads 20, restricts the first channel 30 for laying conductors 40 between the soldering area 21 and adjacent soldering areas 21. In this way, not only is routing space provided and routing detours caused by space constraints reduced, but it also does not require the introduction of high-density interconnect technology or an increase in the area of ​​the substrate 10, which can effectively improve routing efficiency and reduce routing costs. Secondly, by wrapping and protecting the first channel 30 and conductors 40 with an insulating coating 50, a perfect insulating structure can be formed between conductors 40 and between conductors 40 and pads 20. The insulating coating 50 can also serve as a protective layer, effectively protecting the conductors 40 from corrosion and damage, and improving the stability and reliability of the conductors 40.

[0034] Continue reading Figure 1 and Figure 2 In an optional embodiment of this utility model, a second channel 60 is also included. Correspondingly, multiple welding areas 21 are provided, and at least one of the first channel 30 and the second channel 60 is restricted between any two adjacent welding areas 21. In other words, the first channel 30 and the second channel 60 are both restricted by the welding area 21 and the adjacent welding area 21. The first channel 30 and the second channel 60 can be arranged in parallel intervals, cross each other, or be arranged in a collinear manner. When the two are arranged in a collinear manner, it is equivalent to the first channel 30 and the second channel 60 forming a through groove. The positions of the first channel 30 and the second channel 60 can be designed according to the actual wiring requirements.

[0035] Understandably, when it is necessary to solder the device 90 onto the printed circuit board, solder paste needs to be applied to the pads 20, i.e., the solder paste layer 70 mentioned later. However, the solder paste contains flux, and the organic matter in the flux decomposes to produce gas. During the reflow soldering process, large pads with larger areas often develop bubbles and pores, which seriously affect the reliability and stability of the soldering. In the printed circuit board provided by this embodiment, by restricting the first channel 30 and the second channel 60 between adjacent soldering areas 21, the gas from the decomposition of flux in the solder paste can be discharged through the first channel 30 and the second channel 60 and dispersed into the air. This can effectively reduce the number of bubbles and pores and effectively improve the reliability and quality of the soldering.

[0036] Secondly, during the solder paste forming process, there is a gathering and shrinking effect. In the prior art, the area of ​​the large pad is too large, which causes the center of the large pad to gather and shrink during solder paste forming, resulting in a relatively obvious bulge. This leads to poor flatness of the solder paste surface. In this embodiment of the present invention, the pad 20 is divided into multiple soldering areas 21 by the first channel 30 and the second channel 60. Each soldering area 21 is small and will not produce obvious bulges during solder paste forming. In this way, the flatness of the solder paste surface can be effectively improved, and the stability of the device 90 after bonding with the printed circuit board can be improved.

[0037] Figure 3 This is another schematic diagram of the layout of the welding area provided in this embodiment of the utility model.

[0038] See Figure 1 and Figure 3 In an optional embodiment of this utility model, each soldering area 21 has an equal area, and multiple soldering areas 21 are evenly spaced. It is understood that, as mentioned above, there will be a gathering and shrinking effect during the solder paste forming process. The area of ​​a single soldering area 21, i.e., the area of ​​a single solder paste, will also affect the final gathering effect of the solder paste. The larger the area of ​​a single soldering area 21, the higher the protrusion of the soldering area 21 after forming. From another perspective, the greater the difference in area of ​​each soldering area 21 on the pad 20, the greater the difference in height of the solder paste after forming on each soldering area 21. Secondly, the soldering area 21 with a large area dissipates heat quickly, while the soldering area 21 with a small area dissipates heat slowly. The soldering area 21 with a large area will also pull the device 90 in its direction during the soldering process, which will affect the flatness and stability of the final connection of the device 90.

[0039] In the printed circuit board provided by this utility model embodiment, by limiting the area of ​​each soldering area 21 to be equal and these soldering areas 21 are evenly spaced on the solder pad 20, it can be ensured that the gathering height of the solder paste after forming on each soldering area 21 is equal, so that the overall heat melting of the solder pad 20 is relatively consistent, and the heat dissipation performance of each soldering area 21 is the same, thereby ensuring the stability of the connection between the device 90 and the printed circuit board and the soldering effect.

[0040] See Figure 3 In an optional embodiment of this utility model, if the wires 40 in the pads 20 cannot be evenly distributed, a portion of the soldering area 21 can be used as the area for laying the wires 40, that is, a portion of the soldering area 21 can be merged into the first channel 30. Specifically, it can be adapted according to the actual situation.

[0041] Continue reading Figure 1 In an optional embodiment of this utility model, multiple welding areas 21 are arranged in an array, which can specifically be a rectangular array, a circular array, or a triangular array, etc. Figure 1 The diagram shows a 3×3 rectangular array. The specific form of the array can be determined based on the shape of the device 90 to be connected.

[0042] In a non-array layout, uneven distribution of the soldering areas 21 may lead to varying degrees and directions of solder paste shrinkage, resulting in irregular protrusions. This can affect the fit between the device 90 and the soldering areas 21, as well as the stability of the electrical connection. It is understood that in the printed circuit board provided by this invention, based on the previously described embodiments where multiple soldering areas 21 are evenly spaced and have equal areas, this invention arranges multiple soldering areas 21 in an array. This ensures the uniformity of stress on the device 90 after the solder paste is connected to it, preventing excessive local stress and thus guaranteeing the stability and effectiveness of the soldering of the device 90. Furthermore, in the production process, the array arrangement better aligns with the operating logic of automated manufacturing equipment, reducing the processing difficulty of the soldering areas 21 and improving processing accuracy and production efficiency.

[0043] In an optional embodiment of this utility model, the total area of ​​the plurality of soldering areas 21 is greater than or equal to half the area of ​​the solder pad 20. It is understood that the soldering areas 21 are used to solder the device 90. During the soldering process, a large amount of heat is generated. In this embodiment of the utility model, by ensuring that the area of ​​the soldering areas 21 is within the above-mentioned range, the soldering areas 21 can effectively dissipate the heat accumulated during the soldering process. This good heat dissipation effect can prevent the substrate 10 and device 90 from being damaged by excessively high temperature. Secondly, in combination with the first channel 30 and the second channel 60 in the aforementioned embodiment, the soldering areas 21 can have a linkage effect with the first channel 30 and the second channel 60. The first channel 30 and the second channel 60 can conduct the heat of the soldering areas 21 from the middle of the solder pad 20 to the outside of the solder pad 20, which can further improve the heat dissipation effect of the soldering areas 21.

[0044] Continue reading Figure 2 In an optional embodiment of this utility model, the insulating coating 50 includes at least one of a green varnish layer 51 and a white varnish layer 52. In other words, only one layer of green varnish or only one layer of white varnish can be provided as the insulating coating 50. Figure 2 The image shows a case where both green and white oil are applied, with green oil on the bottom and white oil on the top.

[0045] Green solder mask and white solder mask are both coating materials used in the manufacturing process of electronic circuit boards. They are mainly used to protect the pads and lines on the circuit board. Green solder mask is usually a photosensitive resin with green as the main color. It has insulation, corrosion resistance and heat resistance. The main component of white solder mask is epoxy resin. It has good insulation and heat resistance. White solder mask can effectively prevent short circuits during the soldering process and improve the reliability of the soldering.

[0046] It is understood that in this embodiment of the present invention, when both the green solder mask layer 51 and the white solder mask layer 52 are provided, the green solder mask layer 51 itself is a solder resist, which can serve as insulation and prevent short circuits. The white solder mask layer 52 further enhances insulation protection. This dual protection can effectively prevent signal leakage and external interference, and maintain stable signal transmission.

[0047] Continue reading Figure 2In an optional embodiment of this utility model, a solder paste layer 70 is further included. The solder paste layer 70 is disposed on the surface of the soldering area 21 and is used to fix the device 90. The thickness of the insulating coating 50 is less than or equal to the thickness of the solder paste layer 70. In other words, the sum of the thicknesses of the white solder mask layer 52 and the green solder mask layer 51 is less than or equal to the thickness of the solder paste layer 70. It can be understood that if the thickness of the insulating coating 50 is greater than the thickness of the solder paste layer 70, the device 90 will be lifted by the insulating coating 50, thereby affecting the connection between the device 90 and the solder paste layer 70. In the printed circuit board provided by this utility model embodiment, by limiting the thickness of the insulating coating 50 to be less than or equal to the thickness of the solder paste layer 70, the stability and reliability of the connection between the printed circuit board and the device 90 can be guaranteed.

[0048] Continue reading Figure 1 and Figure 2 In an optional embodiment of this utility model, a via 80 is further included. The via 80 is disposed in the first channel 30. In this embodiment, when an insulating coating 50 is provided, the insulating coating 50 can also be applied above the via 80 to protect the via 80. The specific structure of the via 80 can be adapted to existing technology, and will not be described in detail here.

[0049] Understandably, via 80 can connect different power layers of the printed circuit board as well as the circuit components and conductors 40 on each layer, ensuring smooth signal interaction between layers. Secondly, the design of via 80 facilitates the flexible laying of conductors 40, allowing some conductors 40 to be transferred to inner layers, reducing congestion and cross-interference issues in surface wiring.

[0050] Continue reading Figure 1 and Figure 3 In an optional embodiment of this utility model, the welding area 21 is square in shape and has chamfers or bevels. The chamfers or bevels can be set at any of the four corners of the welding area 21. It is understood that the chamfer or bevel design can facilitate the turning of the wiring in the first channel 30, and at the same time reduce the etching difficulty of the welding area 21 and improve the processing efficiency of the welding area 21.

[0051] A second aspect of this utility model provides an electronic device, which includes the printed circuit board described in any of the foregoing embodiments. It is understood that the electronic device provided by this utility model, because it includes the printed circuit board in any of the foregoing embodiments, also has the technical effects of the printed circuit board in any of the foregoing embodiments. For specific effects, please refer to the foregoing description, which will not be repeated here.

[0052] It should be noted that the technical solutions in the various embodiments of this utility model can be combined with each other, but the basis for such combination is that they can be implemented by those skilled in the art. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist, that is, it is not within the protection scope of this utility model.

[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A printed circuit board, characterized in that, The device includes a substrate, pads, and a first channel. The pads include at least two soldering areas spaced apart on the surface of the substrate. The first channel is located between the soldering areas and adjacent soldering areas. The first channel contains a wire and has an insulating coating applied above it.

2. The printed circuit board according to claim 1, characterized in that, It also includes a second channel. The welding area is provided with multiple channels. The first channel and / or the second channel are restricted between any two adjacent welding areas. The first channel and the second channel are used for gas flow.

3. The printed circuit board according to claim 2, characterized in that, Each of the welding zones has an equal area, and the multiple welding zones are evenly spaced apart.

4. The printed circuit board according to claim 3, characterized in that, The multiple welding zones are arranged in an array.

5. The printed circuit board according to claim 2, characterized in that, The total area of ​​the plurality of said welding zones is greater than or equal to one-half of the area of ​​said solder pad.

6. The printed circuit board according to any one of claims 1 to 5, characterized in that, The insulating coating includes at least one of a green oil layer and a white oil layer.

7. The printed circuit board according to any one of claims 1 to 5, characterized in that, It also includes a solder paste layer, which is disposed on the surface of the soldering area and is used to fix the device; The thickness of the insulating coating is less than or equal to the thickness of the solder paste layer.

8. The printed circuit board according to any one of claims 1 to 5, characterized in that, It also includes vias, which are disposed in the first channel and are used for signal transmission.

9. The printed circuit board according to any one of claims 1 to 5, characterized in that, The welding area is square in shape and has chamfered or curved edges.

10. An electronic device, characterized in that, The printed circuit board includes any one of claims 1 to 9.

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