FPC and PCB connecting structure

Abstract

The utility model discloses an FPC and PCB connection structure comprising a PCB, the PCB is provided with a step, the step comprises a first welding zone, the first welding zone is provided with a first bonding pad, and the second welding zone is provided with a second bonding pad; the FPC board comprises a second welding area, a second welding pad is arranged on the second welding area, the size of the first welding pad is consistent with that of the second welding pad, and the second welding pad and the first welding pad are welded in a gold bonding mode. According to the FPC and PCB connecting structure of the embodiment of the utility model, the step and the FPC board are welded in a gold bonding manner, so that the FPC and PCB connecting structure is suitable for the step with a small welding area and has high connecting strength; and meanwhile, the FPC board realizes a bending function, so that the reliability is high.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to an FPC and PCB connection structure. Background Technology

[0002] With the increasing demand for lightweight terminal electronic products and industrial equipment, as well as high-speed signal output, customers' products are currently being upgraded to meet market demands.

[0003] Existing manufacturing processes for stepped PCBs cannot meet the increasingly demanding high-speed signal output requirements of products and the matching processing requirements of PCBAs. Currently, the soldering area at the stepped positions of PCB products is small, failing to meet the design requirements of high-density interconnection in PCBAs. Furthermore, there are reliability risks such as weak soldering, which cannot meet the high-density design requirements of customers' stepped PCB products, which require both rigidity and flexibility. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an FPC-PCB connection structure, in which the step and the FPC board are gold-welded, suitable for steps with small welding areas, and providing high connection strength; simultaneously, the FPC board enables bending functionality, resulting in high reliability.

[0005] The FPC-PCB connection structure according to an embodiment of the present invention includes: a PCB board, wherein a step is provided on the PCB board, the step including: a first soldering area, wherein a first pad is provided on the first soldering area; and an FPC board, wherein the FPC board includes: a second soldering area, wherein a second pad is provided on the second soldering area, the first pad and the second pad having the same size, and the second pad and the first pad being gold-plated.

[0006] According to the FPC and PCB connection structure of this utility model embodiment, the step and the FPC board are gold-welded, which is suitable for steps with small welding area and has high connection strength; at the same time, the FPC board realizes bending function and has high reliability.

[0007] According to some embodiments of the present invention, both the first pad and the second pad include: a nickel layer, a palladium layer disposed on the nickel layer, and a soft gold layer disposed on the palladium layer.

[0008] According to some embodiments of the present invention, the FPC-PCB connection structure further includes: a first insulating adhesive, wherein the first insulating adhesive is located between the first pad and the second pad.

[0009] According to some embodiments of the present invention, the first welding area includes: a first adhesive portion, which is disposed around the periphery of the first solder pad; the second welding area includes: a second adhesive portion, which is disposed around the periphery of the second solder pad, and the second adhesive portion is bonded to the first adhesive portion.

[0010] According to some embodiments of the present invention, the FPC-PCB connection structure further includes a second insulating adhesive, which is located between the first adhesive portion and the second adhesive portion.

[0011] According to some embodiments of the present invention, there are multiple steps and multiple FPC boards, and the multiple steps are respectively welded to multiple FPC boards.

[0012] According to some embodiments of this utility model, let the maximum length of the first pad and the second pad be A, where A satisfies the relationship: A≤200μm.

[0013] According to some embodiments of the present invention, the FPC-PCB connection structure further includes a package, which is disposed between the PCB board and the FPC board.

[0014] According to some embodiments of this utility model, the encapsulation component is epoxy resin.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0017] Figure 1 This is a schematic diagram showing the connection between the FPC board, PCB board, and wire bonding according to an embodiment of the present utility model;

[0018] Figure 2 This is an overall schematic diagram of the FPC and PCB connection structure according to an embodiment of the present utility model.

[0019] Figure label:

[0020] 100. FPC and PCB connection structure;

[0021] 10. PCB board; 11. Step; 12. First soldering area; 121. First solder pad;

[0022] 20. FPC board; 21. Second soldering area; 211. Second solder pad;

[0023] 30. Threading. Detailed Implementation

[0024] The embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present invention are described in detail below.

[0025] The following is for reference. Figures 1-2 The FPC and PCB connection structure 100 according to an embodiment of the present utility model is described.

[0026] like Figure 1 and Figure 2 As shown, the FPC-PCB connection structure 100 includes: PCB board 10 and FPC board 20, which are soldered together to connect the PCB board 10 and FPC board 20.

[0027] like Figure 1 As shown, a step 11 is provided on the PCB board 10. The step 11 includes a first soldering area 12, on which a first solder pad 121 is provided. Specifically, the first soldering area 12 is arranged opposite to the second soldering area 21. The first soldering area 12 is provided with the first solder pad 121. There can be multiple first solder pads 121. The number of first solder pads 121 and the position of multiple first solder pads 121 can be selected and adjusted according to the actual circuit design.

[0028] Furthermore, the FPC board 20 is provided with a second soldering area 21, and the second soldering area 21 is provided with second solder pads 211. Specifically, the second soldering area 21 on the FPC board 20 is provided with second solder pads 211. There can be multiple second solder pads 211, and the number of second solder pads 211 is the same as the number of first solder pads 121 and corresponds one-to-one. The multiple first solder pads 121 and the multiple second solder pads 211 are connected by wire bonding 30 to connect the step 11 of the PCB board 10 and the FPC board 20, forming the FPC and PCB connection structure 100.

[0029] The first pad 121 and the second pad 211 are the same size, and the second pad 211 and the first pad 121 are gold-plated. Specifically, the first pad 121 and the second pad 211 are gold-plated pads, and the first pad 121 and the second pad 211 are soldered together by wire bonding 30. By gold-plating multiple first pads 121 and multiple second pads 211, the step 11 is connected to the FPC board 20, so that the FPC and PCB connection structure 100 meets both bending and compression space requirements, as well as assembly matching requirements.

[0030] By using wire bonding 30, the size of the first pad 121 and the second pad 211 can be reduced, thereby reducing the size of the step 11. As a result, the FPC-PCB connection structure 100 is compact and occupies little space. The FPC board 20 enables the FPC-PCB connection structure 100 to have bending function and high reliability.

[0031] In some embodiments, both the first pad 121 and the second pad 211 include: a nickel layer, a palladium layer disposed on the nickel layer, and a soft gold layer disposed on the palladium layer. Specifically, the first pad 121 and the second pad 211 are gold bonding pads. In this embodiment, the gold bonding pads use chemical nickel-palladium gold bonding, that is, a palladium layer is added between the nickel layer and the soft gold layer. This eliminates the need to increase the thickness of the soft gold layer to prevent nickel corrosion, reducing costs. The material is soft, has good wire bonding performance, and the structure of the nickel-palladium gold bonding reduces the potential difference between the nickel layer and the soft gold layer, thereby improving the corrosion resistance of the surfaces of the first pad 121 and the second pad 211 and avoiding the black pad phenomenon caused by nickel corrosion.

[0032] Furthermore, the FPC-PCB connection structure 100 also includes a first insulating adhesive, which is located between the first pad 121 and the second pad 211. Specifically, after the first pad 121 and the second pad 211 are soldered together by the wire bonding 30, the first insulating adhesive is applied to the solder joint between the first pad 121 and the second pad 211 and the wire bonding 30 to prevent short circuits between the first pad 121 and the second pad 211, ensuring the insulation performance of the connection position between the PCB board 10 and the FPC board 20, and helping to improve the connection strength between the PCB board 10 and the FPC board 20.

[0033] Furthermore, the first soldering area 12 includes a first adhesive portion disposed around the periphery of the first solder pad 121; the second soldering area 21 includes a second adhesive portion disposed around the periphery of the second solder pad 211, and the second adhesive portion is bonded to the first adhesive portion. Specifically, the first adhesive portion is disposed around the periphery of the first solder pad 121, and the second adhesive portion is disposed around the periphery of the second solder pad 211, the first adhesive portion and the second adhesive portion correspond to each other, and the first adhesive portion and the second adhesive portion are bonded together to improve the connection strength of the first soldering area 12 and the second soldering area 21.

[0034] In some embodiments, the FPC-PCB connection structure 100 further includes a second insulating adhesive, which is located between the first bonding portion and the second bonding portion. Specifically, after the first pad 121 and the second pad 211 are soldered by the wire bonding 30, the second insulating adhesive is applied between the first bonding portion and the second bonding portion to further ensure the insulation performance of the connection position between the PCB board 10 and the FPC board 20 and improve the connection strength between the PCB board 10 and the FPC board 20.

[0035] The material of the first insulating adhesive can be the same as that of the second insulating adhesive.

[0036] In some embodiments, there are multiple steps 11 and multiple FPC boards 20, and the multiple steps 11 are respectively soldered to the multiple FPC boards 20. Specifically, the PCB board 10 may be provided with multiple steps 11, and multiple first soldering areas 12 are provided on the multiple steps 11. Correspondingly, the number of FPC boards 20 may be the same as the number of steps 11. The multiple steps 11 are respectively connected to the multiple FPC boards 20, and the second soldering areas 21 of the multiple FPC boards 20 are respectively soldered to the multiple first soldering areas 12, thereby realizing the connection between the multiple steps 11 on the PCB board 10 and the multiple FPC boards 20.

[0037] In some embodiments, the maximum length of the first pad 121 and the second pad 211 is denoted as A, where A satisfies the relationship: A ≤ 200 μm. Specifically, the first pad 121 and the second pad 211 have the same shape and size, and their shapes can be rectangular, circular, elliptical, etc. The maximum length of the first pad 121 and the second pad 211 is less than or equal to 200 μm, resulting in a small welding area. Gold bonding is used to ensure the connection strength between the first pad 121 and the second pad 211. If the maximum length of the first pad 121 and the second pad 211 is greater than 200 μm, the number of first pads 121 on the first welding area 12 is insufficient, and the number of second pads 211 on the second welding area 21 is insufficient, making it impossible to guarantee the connection strength between the step 11 and the FPC board.

[0038] In some embodiments, the maximum length of the first pad 121 and the second pad 211 can be 100 μm.

[0039] In some other embodiments, the maximum length of the first pad 121 and the second pad 211 can be 150 μm.

[0040] In some embodiments, the FPC-PCB connection structure 100 further includes a package, which is disposed between the PCB board 10 and the FPC board 20. Specifically, the package covers the first soldering area 12 and the second soldering area 21, isolating the first soldering area 12 and the second soldering area 21 from the outside world, thereby ensuring the soldering stability of the first soldering area 12 and the second soldering area 21.

[0041] In some embodiments, the encapsulation component is epoxy resin. Epoxy resin has low deformation, can withstand high temperatures up to 200 degrees Celsius, and is resistant to acids, alkalis, water, dust, and other environmental factors. Secondly, it is easy to use and can be applied as a component in various fields. Finished RFID modules can be injection molded or embedded into different shapes or materials according to the needs of the terminal. Applications include: medical, laundry, logistics, energy, retail, warehousing, etc. Furthermore, the thickness and size can be adjusted according to requirements. Manufacturing is flexible and customization is convenient.

[0042] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0043] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0044] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A connection structure between an FPC and a PCB, characterized in that, include: PCB board (10), the PCB board (10) is provided with a step (11), the step (11) includes: a first soldering area (12), the first soldering area (12) is provided with a first solder pad (121); FPC board (20), the FPC board (20) includes: a second soldering area (21), a second solder pad (211) is provided on the second soldering area (21), the first solder pad (121) and the second solder pad (211) have the same size, and the second solder pad (211) and the first solder pad (121) are soldered together.

2. The FPC-PCB connection structure according to claim 1, characterized in that, Both the first pad (121) and the second pad (211) include: a nickel layer, a palladium layer disposed on the nickel layer, and a soft gold layer disposed on the palladium layer.

3. The FPC-PCB connection structure according to claim 1, characterized in that, Also includes: The first insulating adhesive is located between the first pad (121) and the second pad (211).

4. The FPC-PCB connection structure according to claim 1, characterized in that, The first soldering area (12) includes: a first adhesive portion disposed around the periphery of the first solder pad (121); and, The second welding area (21) includes a second adhesive portion, which is disposed around the periphery of the second solder pad (211), and the second adhesive portion is bonded to the first adhesive portion.

5. The FPC-PCB connection structure according to claim 4, characterized in that, Also includes: A second insulating adhesive is located between the first adhesive portion and the second adhesive portion.

6. The FPC-PCB connection structure according to claim 1, characterized in that, There are multiple steps (11) and multiple FPC boards (20), and the multiple steps (11) are respectively welded to the multiple FPC boards (20).

7. The FPC-PCB connection structure according to claim 1, characterized in that, it is provided that... The maximum length of the first pad (121) and the second pad (211) is A, and A satisfies the relationship: A≤200μm.

8. The FPC-PCB connection structure according to claim 1, characterized in that, Also includes: A package is disposed between the PCB board (10) and the FPC board (20).

9. The FPC-PCB connection structure according to claim 8, characterized in that, The encapsulation component is made of epoxy resin.

Images