Protection circuit board and battery module

Abstract

The embodiment of the utility model provides a protection circuit board and a battery module. The protection circuit board comprises a circuit board body and a fusing assembly connected with the circuit board body, the fusing assembly comprises a fuse, a cover body and a carrier substrate, the cover body and the carrier substrate form a containing cavity, the fuse is arranged in the containing cavity, a through hole is formed in the top wall of the cover body, and the top wall is parallel to the plane where the circuit board body is located; and the plastic package colloid coats the fusing assembly and the circuit board main body. When the plastic package colloid is subjected to plastic package, a mold of the plastic package colloid can be attached to the top wall, namely, the effect of blocking the through hole through the mold of the plastic package colloid can be achieved, so that an additional hole blocking structure does not need to be arranged; therefore, the plastic package colloid with pressure can flow in the mold cavity and cannot enter the accommodating cavity formed by the cover body and the carrier substrate, so that the fuse is prevented from being damaged by the plastic package colloid, the fuse is protected, and the fusing effect of the fuse is ensured.

Description

Technical Field

[0001] This utility model relates to the field of battery manufacturing technology, and in particular to a protective circuit board and battery module. Background Technology

[0002] As smart products continue to develop, their battery capacities are also increasing. With this increase in capacity comes increased weight, making the protective circuit board at the battery tip more susceptible to damage during drops.

[0003] Based on this, in related technologies, the service life of the protection circuit board at the battery end is improved by encapsulating it with plastic and installing a fuse.

[0004] However, when the protective circuit board is encapsulated, the encapsulating material can flow into the fuse through the through-holes on the periphery of the fuse, thus affecting the fuse's fusing effect. Utility Model Content

[0005] To solve or partially solve the above problems, this utility model discloses a protective circuit board and battery module to solve the problem in the prior art that the encapsulating adhesive will flow into the fuse through the through hole opened on the periphery of the fuse, thereby affecting the fuse's fusing effect.

[0006] To address the aforementioned problems, in a first aspect, embodiments of the present invention provide a protective circuit board, the protective circuit board comprising:

[0007] The circuit board body and the fuse assembly connected to the circuit board body, the fuse assembly includes a fuse, a cover and a carrier substrate, the cover and the carrier substrate form a receiving cavity, the fuse is disposed in the receiving cavity, and the top wall of the cover is provided with a through hole, wherein the top wall is parallel to the plane on which the circuit board body is located;

[0008] A molding compound that encapsulates the fuse assembly and the circuit board body.

[0009] Optionally, electrical connection lines are provided on the surface of the circuit board body facing the carrier substrate, and solder pads are provided on the surface of the carrier substrate facing the circuit board body.

[0010] The pads and the electrical connection lines are electrically connected.

[0011] Optionally, a through groove is formed on the carrier substrate, the through groove penetrating the first surface and the second surface of the carrier substrate, wherein the first surface and the second surface are two surfaces of the carrier substrate opposite each other in a first direction, the first direction being perpendicular to the plane where the circuit board body is located;

[0012] The wiring in the fuse passes through the through slot and is connected to the pad;

[0013] The top wall of the cover, when projected onto the carrier substrate along the first direction, does not overlap with the area where the through groove is located.

[0014] Optionally, the edge positions of the through groove and the top wall have a first distance A between them in a second direction or in a third direction, wherein the first direction, the second direction, and the third direction are three directions that intersect each other.

[0015] Optionally, the first spacing is greater than 0.

[0016] Optionally, the through groove is located at the edge of the carrier substrate.

[0017] Optionally, the carrier substrate includes a first sidewall, a second sidewall, and a third sidewall;

[0018] The first sidewall, the second sidewall, and the third sidewall each have a through groove, wherein the first sidewall and the second sidewall are two opposite sidewalls, and the third sidewall intersects with the second sidewall.

[0019] Optionally, the number of through holes can be multiple.

[0020] Optionally, the plurality of through holes are arranged in a preset regular pattern, and the plurality of through holes are located near the edge of the top wall.

[0021] Secondly, this utility model embodiment also provides a battery module, the battery module including a battery cell and a protection circuit board as described in any embodiment of the first aspect;

[0022] The protection circuit is installed on the top of the battery cell.

[0023] In this embodiment of the invention, a circuit board body and a fuse assembly connected to the circuit board body are included. The fuse assembly includes a fuse, a cover, and a carrier substrate. The cover and the carrier substrate form a receiving cavity. The fuse is disposed in the receiving cavity. The top wall of the cover has a through hole. The top wall is parallel to the plane of the circuit board body. Therefore, when the encapsulating material is encapsulated, the mold of the encapsulating material and the top wall can be made to fit together, which can achieve the effect of blocking the through hole through the mold of the encapsulating material. In this way, there is no need to set an additional hole-blocking structure. The pressurized encapsulating material can flow in the mold cavity and cannot enter the receiving cavity formed by the cover and the carrier substrate, thereby preventing the encapsulating material from damaging the fuse and thus protecting the fuse and ensuring the fuse's fusing effect. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a protective circuit board provided in an embodiment of the present invention;

[0026] Figure 2 This is one of the top views of a protective circuit board provided in an embodiment of this utility model;

[0027] Figure 3 This is a second top view of a protective circuit board provided in an embodiment of this utility model;

[0028] Figure 4 This is a third top view of a protective circuit board provided in this embodiment of the present utility model;

[0029] Figure 5 This is the fourth top view of a protective circuit board provided in this embodiment of the present utility model;

[0030] Figure 6 This is a schematic diagram of a circuit board structure provided in an embodiment of the present invention.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1: Protective circuit board; 11: Circuit board body; 111: Electrical connection line; 12: Fuse assembly; 121: Fuse; 122: Cover; 1221: Top wall; 123: Carrier substrate; 1231: Solder pad; 1232: Through slot; 124: Through hole; 13: Accommodating cavity; 2: Plastic encapsulant; 3: Battery cell; 4: Top seal; 5: Hot melt adhesive; 6: Tab; 7: Nickel sheet. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0035] like Figures 1 to 5 As shown, this embodiment of the utility model provides a protective circuit board, which includes:

[0036] The circuit board body 11 and the fuse assembly 12 connected to the circuit board body 11 are included. The fuse assembly 12 includes a fuse 121, a cover 122 and a carrier substrate 123. The cover 122 and the carrier substrate 123 form a receiving cavity 13. The fuse 121 is disposed in the receiving cavity 13. The top wall 1221 of the cover 122 is provided with a through hole 124. The top wall 1221 is parallel to the plane on which the circuit board body 11 is located.

[0037] The encapsulating agent 2 encapsulates the fuse assembly 12 and the circuit board body 11.

[0038] As can be seen from the above embodiments, in this embodiment of the utility model, the circuit board body 11 and the fuse assembly 12 connected to the circuit board body 11 are included. The fuse assembly 12 includes a fuse 121, a cover 122 and a carrier substrate 123. The cover 122 and the carrier substrate 123 form a receiving cavity 13. The fuse 121 is disposed in the receiving cavity 13. The top wall 1221 of the cover 122 is provided with a through hole 124. The top wall 1221 is parallel to the plane of the circuit board body 11. Therefore, in the plastic When the encapsulant 2 is encapsulated, the mold of the encapsulant 2 and the top wall 1221 can be fitted together, which can achieve the effect of blocking the through hole 124 through the mold of the encapsulant 2. In this way, there is no need to set up an additional hole-blocking structure. The pressurized encapsulant 2 flows in the mold cavity and cannot enter the receiving cavity 13 formed by the cover 122 and the carrier substrate 123, thereby preventing the encapsulant 2 from damaging the fuse 121, thus protecting the fuse 121 and ensuring the fusing effect of the fuse 121.

[0039] In the above embodiments, the circuit board body 11 may include a printed circuit board and a flexible circuit board. The circuit board body 11 is mainly used to ensure that the battery operates within a safe range and protect the battery from damage, including but not limited to the following functions: limiting the minimum discharge voltage, controlling the maximum charging current, and monitoring the battery temperature during the charging process. In addition, the circuit board body 11 and the fuse assembly 12 can be stacked in the first direction Z, that is, the fuse assembly 12 can be disposed on the top of the circuit board body 11.

[0040] The fuse assembly 12 includes a cover 122, which is a shell structure with an inner cavity. The cover 122 and the carrier substrate 123 are connected to form a receiving cavity 13, which provides a certain receiving cavity 13 for the fuse 121. In some embodiments, the cover 122 can be a cylindrical shell structure, a square shell structure, or a shell structure of other shapes. For example, the cover 122 is a shell structure with an open bottom. The bottom of the cover 122 is fastened to the carrier substrate 123, so that a sealed space is formed between the cover 122 and the carrier substrate 123, thereby forming the receiving cavity 13.

[0041] Because the gas pressure inside the accommodating cavity 13 and other external pressures must be consistent during the fabrication and testing of the fuse 121, in this embodiment of the invention, a through hole 124 is provided on the cover 122. This allows external gas to pass through the cover 122 and reach the interior of the accommodating cavity 13. In this embodiment of the invention, to prevent the encapsulating material 2 from flowing into the accommodating cavity 13 through the through hole 124 during subsequent injection molding, the through hole 124 is provided on the top wall 1221 of the cover 122. The top wall 1221 is the outer wall of the cover 122 parallel to the plane where the circuit board is located. In other words, the outer wall of the cover 122 is the top wall 1221 of the cover 122. Thus, during the encapsulation of the encapsulating material 2, it is easy for the mold of the encapsulating material 2 to fit with the top wall 1221, achieving a temporary plugging effect. The number of the aforementioned through holes 124 can be one or more, and this embodiment of the utility model does not limit this.

[0042] The encapsulating colloid 2 simultaneously encapsulates the fuse component 12 and the circuit board body 11, thereby protecting the fuse component 12 and the circuit board assembly from external environmental influences, improving the safety of the protective circuit board, and ensuring the internal and external pressure balance of the protective circuit board.

[0043] In some embodiments, an electrical connection line 111 is provided on the surface of the circuit board body 11 facing the carrier substrate 123, and a pad 1231 is provided on the surface of the carrier substrate 123 facing the circuit board body 11; the pad 1231 and the electrical connection line 111 are electrically connected.

[0044] In this embodiment, since electrical connection lines 111 are provided on the surface of the circuit board body 11 facing the carrier substrate 123, and pads 1231 are provided on the surface of the carrier substrate 123 facing the circuit board body 11, and the pads 1231 and the electrical connection lines 111 are electrically connected, the electrical connection between the circuit board body 11 and the carrier substrate 123 can be indirectly achieved through the electrical connection between the pads 1231 and the electrical connection lines 111. It should be noted that the pads 1231 are the basic building blocks for electrically connecting the circuit board body 11 and the carrier substrate 123, used to form the pattern of the pads 1231 on the carrier substrate 123. The pattern of the pads 1231 can be circular, elliptical, square, etc., and this embodiment of the present invention does not limit this. Furthermore, the position of the pads 1231 needs to be opposite to the position of the electrical connection lines 111 on the surface of the circuit board body 11 facing the carrier substrate 123 to reduce the difficulty of soldering.

[0045] In some embodiments, a through groove 1232 is formed on the carrier substrate 123, the through groove 1232 penetrates the first surface and the second surface of the carrier substrate 123, wherein the first surface and the second surface are two opposite surfaces of the carrier substrate 123 in the first direction Z, the first direction Z is perpendicular to the plane where the circuit board body 11 is located; the line in the fuse 121 passes through the through groove 1232 and is connected to the pad 1231; the top wall 1221 of the cover 122 is projected onto the carrier substrate 123 along the first direction Z and does not overlap with the area where the through groove 1232 is located.

[0046] In this embodiment, since the through-slot 1232 penetrates the first and second surfaces of the carrier substrate 123, the circuit in the fuse 121 passes through the through-slot 1232 and connects to the pad 1231. Therefore, the fuse assembly 12 can be connected to the pad 1231 through the through-slot 1232, and then the electrical connection between the pad 1231 and the electrical connection line 111 is achieved through the electrical connection between the circuit board body 11 and the fuse 121. In addition, since the orthographic projection of the top wall 1221 of the cover 122 along the first direction Z on the carrier substrate 123 does not overlap with the area where the through-slot 1232 is located, the area covered by the cover 122 is not within the opening area of ​​the through-slot 1232, which ensures that there is no gap between the cover 122 and the carrier substrate 123, thereby ensuring the protective effect of the cover 122.

[0047] In some embodiments, the edge positions of the through groove 1232 and the top wall 1221 have a first spacing A in the second direction X or the third direction Y.

[0048] In this embodiment, the edges of the through groove 1232 and the top wall 1221 are separated by a first distance A in the second direction X or the third direction Y. This can be understood as the first distance A being between the edges of the top wall 1221 and the through groove 1232. Specifically, taking a square shell with a bottom opening as an example, the cover 122 may include four side walls, and the top wall 1221 is the shell surface opposite to the bottom. In this embodiment, this distance can also be understood as the distance between the side walls and the through groove 1232 in the second direction X, or the distance between the edges of the side walls and the top wall 1221. Thus, since the edges of the through groove 1232 and the top wall 1221 are separated by a first distance A in the second direction X or the third direction Y, it can be ensured that there is no gap between the cover 122 and the carrier substrate 123.

[0049] It should be noted that, according to Figure 1 Figure 2 As shown, in this embodiment of the invention, the X-axis and Z-axis intersect. For ease of explanation, the first direction is defined as the Z-axis, the second direction as the X-axis, and the third direction as the Y-axis. Further explanation: the definition of perpendicularity in the specification should be understood as perpendicular if it fluctuates by 10% within 90 degrees. That is, the angle between the first and second directions should be understood as perpendicular if it is between 80 and 90 degrees, the angle between the second and third directions should be understood as perpendicular if it is between 80 and 90 degrees, and the angle between the first and third directions should be understood as perpendicular if it is between 80 and 90 degrees.

[0050] In some embodiments, the first gap is greater than 0. This ensures that there is no gap between the cover 122 and the carrier substrate 123, further guaranteeing the protective effect of the cover 122.

[0051] In some embodiments, the through groove 1232 is located at the edge of the carrier substrate 123.

[0052] In this embodiment, since the fuse 121, pad 1231 and electrical connection line 111 need to be provided on the carrier substrate 123, and the overall size and structure of the protection circuit board are limited in the application scenario of lightweight battery module, the through groove 1232 can be provided at the edge of the carrier substrate 123 while ensuring that the carrier substrate 123 has sufficient electrical connection area. This facilitates the provision of the fuse 121, pad 1231 and electrical connection line 111 even when the size of the carrier substrate 123 is limited.

[0053] In some embodiments, the carrier substrate 123 includes a first sidewall, a second sidewall, and a third sidewall; each of the first sidewall, the second sidewall, and the third sidewall is provided with a through groove 1232, wherein the first sidewall and the second sidewall are two opposing sidewalls, and the third sidewall and the second sidewall intersect.

[0054] In this embodiment, since a through groove 1232 is provided on each of the first, second, and third side walls, the first and second side walls are two opposing side walls, and the third and second side walls intersect, the through groove 1232 is provided on the three side walls of the carrier substrate 123. That is, the through groove 1232 is provided at three positions on the carrier substrate 123. In this way, the circuit in the fuse 121 can also be threaded through the carrier substrate 123 at the three positions. This facilitates the electrical connection between the fuse 121 and the circuit board body 11, while avoiding the increase in process difficulty caused by the wire harness being threaded through the middle of the carrier substrate 123, thereby reducing the manufacturing cost of the protection circuit board.

[0055] In some embodiments, the number of through holes 124 is multiple.

[0056] In this embodiment, since there are multiple through holes 124, the fuse 121 inside the accommodating cavity 13 can release pressure through multiple through holes 124 when it is depressurizing, thereby improving the depressurization efficiency.

[0057] In some embodiments, the plurality of through holes 124 are arranged in a preset regular pattern, and the plurality of through holes 124 are disposed near the edge of the top wall 1221.

[0058] It should be noted that in this embodiment, the multiple through holes 124 can be arranged in a square, a circle, an ellipse, or other shapes. This embodiment of the present invention does not limit these shapes. For example, the multiple through holes 124 can be arranged in a square, that is, one through hole 124 is provided at each of the four corners of the top wall 1221. In this way, when the fuse 121 inside the accommodating cavity 13 is depressurized, the multiple through holes 124 can be used to depressurize, thereby improving the depressurization efficiency. It also makes the multiple through holes 124 form a regular pattern, which makes it easier for the mold of the encapsulating colloid 2 to simultaneously block the multiple through holes 124, thereby reducing the difficulty of blocking the mold of the encapsulating colloid 2. Furthermore, since the multiple through holes 124 are located close to the edge of the top wall 1221, the multiple through holes 124 can be distributed at the edge of the top wall 1221, thereby reducing the reduction in strength of the cover 122 caused by opening multiple through holes 124 on the same top wall 1221.

[0059] As can be seen from the above embodiments, in this embodiment of the utility model, the circuit board body 11 and the fuse assembly 12 connected to the circuit board body 11 are included. The fuse assembly 12 includes a fuse 121, a cover 122, and a carrier substrate 123. The cover 122 and the carrier substrate 123 form a receiving cavity 13. The fuse 121 is disposed in the receiving cavity 13. The top wall 1221 of the cover 122 is provided with a through hole 124. The top wall 1221 is parallel to the outer wall of the plane where the circuit board body 11 is located. When the encapsulating agent 2 is encapsulated, the mold of the encapsulating agent 2 and the top wall 1221 can be made to fit together, which can achieve the effect of blocking the through hole 124 through the mold of the encapsulating agent 2. In this way, there is no need to set up an additional hole-blocking structure. The pressurized encapsulating agent 2 flows in the mold cavity and cannot enter the receiving cavity 13 formed by the cover 122 and the carrier substrate 123, thereby avoiding damage to the fuse 121 by the encapsulating agent 2, thus protecting the fuse 121 and ensuring the fusing effect of the fuse 121.

[0060] In addition, such as Figure 6 As shown, this utility model embodiment also provides a battery module, which includes a battery cell 3 and a protection circuit board 1 of any of the above embodiments; the protection circuit board 1 is disposed on the top of the battery cell 3.

[0061] In this embodiment, since the battery module includes a battery cell 3 and a protection circuit board 1 as described in any of the above embodiments, and the protection circuit board 1 is disposed on the top of the battery cell 3, the protection strength of the fuse 121 included in the protection circuit board 1 assembly is improved, making the circuit protection function of the battery module through the fuse 121 more complete, and further ensuring the safety of battery use. Furthermore, hot melt adhesive 5, a top seal 4, a tab 6, a nickel sheet 7, a circuit board, and a fuse assembly 12 are sequentially disposed on the top of the battery cell 3. A plastic sealant simultaneously seals the hot melt adhesive 5, the top seal 4, the tab 6, the nickel sheet 7, the circuit board, and the fuse assembly 12. In the above embodiments, the battery cell 3 can be a single cell or a dual-cell battery cell. The battery cell 3 can be a cylindrical structure, a cuboid structure, or other shapes; this embodiment does not limit these. The battery cell 3 has a top surface, on which the top seal 4 can be connected. A tab 11 is connected to the top seal 4. The protection circuit board 1 contacts the top surface, and the tab 11 is electrically connected to the protection board 2.

[0062] The various embodiments in the specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0063] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0064] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0065] The present invention has been described in detail above. Specific examples have been used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A protective circuit board, characterized in that, The protection circuit board includes: The circuit board body and the fuse assembly connected to the circuit board body, the fuse assembly includes a fuse, a cover and a carrier substrate, the cover and the carrier substrate form a receiving cavity, the fuse is disposed in the receiving cavity, and the top wall of the cover is provided with a through hole, wherein the top wall is parallel to the plane on which the circuit board body is located; A molding compound that encapsulates the fuse assembly and the circuit board body.

2. The protective circuit board according to claim 1, characterized in that, Electrical connection lines are provided on the surface of the circuit board body facing the carrier substrate, and solder pads are provided on the surface of the carrier substrate facing the circuit board body. The pads and the electrical connection lines are electrically connected.

3. The protective circuit board according to claim 2, characterized in that, A through groove is formed on the carrier substrate, and the through groove penetrates the first surface and the second surface of the carrier substrate. The first surface and the second surface are two surfaces of the carrier substrate that are opposite each other in a first direction (Z). The first direction (Z) is perpendicular to the plane where the circuit board body is located. The wiring in the fuse passes through the through slot and is connected to the pad; The top wall of the cover does not overlap with the area where the through groove is located when projected onto the carrier substrate along the first direction (Z).

4. The protective circuit board according to claim 3, characterized in that, The edge of the through groove and the top wall have a first distance A in the second direction (X) or in the third direction (Y), wherein the first direction (Z), the second direction (X) and the third direction (Y) are three directions that intersect each other in pairs.

5. The protective circuit board according to claim 4, characterized in that, The first spacing is greater than 0.

6. The protective circuit board according to claim 3, characterized in that, The through groove is located at the edge of the carrier substrate.

7. The protective circuit board according to claim 6, characterized in that, The carrier substrate includes a first sidewall, a second sidewall, and a third sidewall; The first sidewall, the second sidewall, and the third sidewall each have a through groove, wherein the first sidewall and the second sidewall are two opposite sidewalls, and the third sidewall intersects with the second sidewall.

8. The protective circuit board according to claim 1, characterized in that, The number of through holes is multiple.

9. The protective circuit board according to claim 8, characterized in that, The multiple through holes are arranged in a preset regular pattern, and the multiple through holes are located near the edge of the top wall.

10. A battery module, the battery module comprising a battery cell and a protection circuit board as described in any one of claims 1 to 9; The protective circuit board is mounted on top of the battery cell.

Images