Power module and charging device

Abstract

The utility model provides a power module and charging equipment. Relates to the technical field of charging equipment. The power module comprises a shell, a circuit board, a power device and a heat dissipation piece, wherein the circuit board, the power device and the heat dissipation piece are arranged in the shell; the heat dissipation piece is provided with a mounting surface, an included angle is formed between the mounting surface and the circuit board, pins of the power device are electrically connected with the circuit board, a main body part of the power device is fixed on the mounting surface, and a first insulating piece is arranged between the mounting surface and the main body part of the power device. According to the power device module, the occupied space of the heat dissipation piece on the shell of the power module can be reduced.

Description

Technical Field

[0001] This application relates to the field of charging equipment technology, and in particular to a power module and a charging device. Background Technology

[0002] Power devices are semiconductor devices capable of handling high voltage and high current. They are widely used in charging equipment and are a crucial component for converting and controlling electrical energy. Power devices mainly include diodes, thyristors, metal-oxide-semiconductor field-effect transistors (MOSFETs), and insulated-gate bipolar transistors (IGBTs).

[0003] Power devices generate a significant amount of heat during operation and often operate under high voltage and high current conditions, making the design of their insulation and heat dissipation structures crucial. Common charging devices typically employ heat sinks for insulation and heat dissipation in power devices. However, existing power modules require relatively large heat sinks to achieve optimal heat dissipation, resulting in a large footprint and hindering the placement of more heat sinks or other electronic components within the power module's casing. Summary of the Invention

[0004] This application provides a power module and a charging device. The aim is to reduce the space occupied by heat sinks on the housing of the power module.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] On one hand, this application provides a power module, which includes a housing, a circuit board, a power device, and a heat sink. The circuit board, the power device, and the heat sink are disposed inside the housing. The heat sink has a mounting surface, which is set at an angle to the circuit board. The pins of the power device are electrically connected to the circuit board. The main body of the power device is fixed to the mounting surface. A first insulating member is disposed between the mounting surface and the main body of the power device.

[0007] This application arranges the mounting surface of the heat sink at an angle to the circuit board. This allows power devices mounted on the heat sink's mounting surface to be angled relative to the circuit board. Thus, when the circuit board is mounted parallel to the housing, the power devices can be tilted within the housing. Compared to mounting the power devices parallel to the housing, tilting them reduces the area occupied by the power devices on the housing. Firstly, it reduces the area occupied by the heat sink, allowing for a larger arrangement of heat sinks and power devices within a given housing area, or freeing up space for other electronic components. Secondly, the angled mounting surface of the heat sink and the circuit board effectively utilizes the angled surface of the heat sink for mounting the power devices. Compared to mounting the power devices on the side of the heat sink parallel to the circuit board, this approach reduces the area occupied by the heat sink on the housing while maintaining the same contact area.

[0008] In one feasible approach, the angle between the mounting surface and the circuit board is an acute angle.

[0009] This application sets the included angle between the mounting surface and the circuit board to an acute angle, so that the mounting surface can face the circuit board and face away from the first surface of the housing (the first surface is the side of the housing used to install heat sinks). This makes it easier to install the first insulating component and power devices on the mounting surface, and the assembly of the power module is more convenient.

[0010] In one possible implementation, the power module further includes a fastener, the main body of the power device is provided with a first through hole, the first insulating member is provided with a second through hole, and the fastener passes through the first through hole and the second through hole in sequence and is connected to the heat sink.

[0011] This application provides a first through hole in the main body of the power device and a second through hole in the first insulating component. This allows fasteners to pass through both holes and connect to the heat sink. In other words, by connecting the fasteners through the power device and the first insulating component to the heat sink, the overall power module is secured, while the space occupied by the power module is reduced, thus improving the power density of the charging device. Furthermore, compared to using adhesive to fix the power device, the first insulating component, and the heat sink, this application eliminates the need for a baking and curing process because it does not use adhesive. This reduces the manufacturing difficulty of the power module, improves the consistency of mass production, and ultimately enhances product quality.

[0012] In one possible implementation, the power module further includes a second insulating member, a portion of which is circumferentially disposed on the inner wall of the first through hole, and another portion of which is located on the side of the main body opposite to the first insulating member; the second insulating member is provided with a third through hole; the fastener includes a first portion and a second portion connected to the first portion, the first portion passing through the third through hole and connected to the heat sink, and the second portion abutting against the other portion of the second insulating member.

[0013] This application achieves insulation between the power device and the fastener by incorporating a second insulating element. A portion of the second insulating element is located within the power device and between the fastener and the fastener, while the other portion is located between the side of the power device facing away from the first insulating element and the fastener. This allows for the use of conventional fastening screws, eliminating the need for the fastener itself to possess insulating properties, simplifying selection and reducing production costs. Furthermore, the second insulating element between the fastener and the power device increases the creepage distance between them, making it easier to meet safety distance requirements.

[0014] In one possible implementation, the mounting surface is provided with a groove, and the side of the first insulating member facing the heat sink has a first protrusion extending into the groove; a second through hole penetrates the first protrusion.

[0015] This application provides a groove on the mounting surface of the heat sink and a first protrusion corresponding to the groove on the first insulating component, with the first protrusion extending into the groove. In this way, the fit between the groove and the protrusion facilitates the quick assembly of the first insulating component with the heat sink. It can also prevent the first insulating component from shifting relative to the heat sink to a certain extent, thereby improving the assembly reliability of the power device module.

[0016] In one possible implementation, the end of the second insulator facing the heat sink passes through the second through hole; the distance from the side of the first protrusion away from the power device to the power device is less than the distance from the side of the second insulator facing the heat sink to the power device.

[0017] This application allows a portion of the second insulating element to pass through the second through hole and extend beyond the second through hole on the side facing the heat sink, which can increase the creepage distance between the fastener and the power device, thereby improving the insulation effect of the fastener and the power device and ensuring that the fastener and the power device meet the safety distance requirements.

[0018] In one possible implementation, the side of the second insulator facing away from the power device has a second protrusion, which is arranged around the outer periphery of the second portion.

[0019] The second insulating member of this application has a second protrusion extending from the side opposite to the power device, and the second protrusion surrounds the outer periphery of the second portion of the fastener. In this way, the provision of the second protrusion can increase the surface area of ​​the second insulating member, thereby increasing the creepage distance between the fastener and the power device, and making the insulation performance between the fastener and the power device better.

[0020] In one possible implementation, the side of the second insulator facing away from the power device has a third protrusion, which is arranged around the outer periphery of the second protrusion.

[0021] The second insulating element of this application can further increase its surface area by providing a second protrusion and a third protrusion, thereby increasing the creepage distance of fasteners and power devices.

[0022] In one possible implementation, the surface of the third protrusion facing the second protrusion is fixedly connected to the second protrusion; the distance from the side of the second protrusion away from the power device to the power device is greater than the distance from the side of the third protrusion away from the power device to the power device.

[0023] By setting the distance from the side of the second protrusion away from the power device to the power device to be greater than the distance from the side of the third protrusion away from the power device to the power device, a height difference can be created between the second and third protrusions in the thickness direction of the power device. Compared to second and third protrusions of equal height, this application still achieves the same surface area and the same creepage distance. Furthermore, the height difference design between the second and third protrusions in this application can also save material for the second insulating component, thus reducing costs compared to second and third protrusions of equal height. Additionally, since the distance from the side of the second protrusion away from the power device to the power device is greater than the distance from the side of the third protrusion away from the power device, the distance from the second protrusion closest to the fastener to the power device is larger. This allows the formation of a certain depth of accommodating space within the second protrusion. This accommodating space can accommodate at least part of the second part and also protect the second part, preventing the fastener from loosening due to accidental contact.

[0024] In one possible implementation, the power devices include multiple power devices, all located on the side of the first insulator away from the heat sink, with a gap between adjacent power devices.

[0025] This application incorporates multiple power devices that can work collaboratively for more efficient power conversion, achieving higher energy efficiency. These power devices can be connected in parallel or series, significantly increasing the power output capability of the power device module. This allows the charging equipment to provide charging services for batteries or loads with higher power, meeting the needs of more application scenarios. Furthermore, by placing all power devices on the side of the first insulating component away from the heat sink, this application reduces the number of components in the power device module, thereby simplifying its structure and assembly process.

[0026] In one possible implementation, the power devices include multiple components, the first insulating components include multiple components, and the multiple power devices and the multiple first insulating components correspond one-to-one; each power device is located on the side of the corresponding first insulating component away from the heat sink, and there is a gap between two adjacent power devices.

[0027] This application sets up multiple power devices and multiple first insulating parts in a one-to-one correspondence. In this way, when a first insulating part is damaged, the first insulating part can be directly replaced, and the power device corresponding to the first insulating part can be located more quickly. Other power devices and first insulating parts will not be affected, which can improve the maintainability and reliability of the power device module.

[0028] In one feasible approach, the heat sink is made of metal.

[0029] This application uses metal as the material for the heat sink. Metal has high thermal conductivity, which allows it to quickly conduct heat to other parts of the heat sink and then dissipate it into the air. The efficient heat conduction achieved through a metal heat sink helps reduce the operating temperature of the power device module and improves its operational stability and reliability.

[0030] In one possible configuration, the heat sink and the housing are connected; or, the heat sink and the housing are a single unit.

[0031] The connection between the heat sink and the housing allows the heat from the power device to be conducted to the housing through the heat sink, thereby achieving effective heat dissipation. The heat sink and the housing are integrated into one piece, and the heat sink can be considered as part of the housing. This reduces the number of parts during the manufacturing process, thereby reducing costs.

[0032] In one possible implementation, the power module further includes a third insulating element located on the side of the circuit board facing the power device and connected to a heat sink; the third insulating element has a fourth through-hole through which one end of a pin of the power device is electrically connected to the circuit board.

[0033] This application provides a third insulating element, positioned on the side of the circuit board facing the power device and connected to a heat sink. This third insulating element isolates the circuit board and the power device, ensuring both meet safety regulations. The fourth through-hole on the third insulating element will not affect the connection between the power device's pins and the circuit board.

[0034] In one possible implementation, the third insulating member has a snap-fit ​​portion, and the heat sink has a snap-fit ​​groove corresponding to the snap-fit ​​portion, the snap-fit ​​portion being engaged within the snap-fit ​​groove.

[0035] This application achieves the fixation of the third insulating component and the heat sink by providing a fastening part on the third insulating component and a fastening groove on the heat sink. The fastening part can then engage within the fastening groove. This fastening method for connecting the third insulating component and the heat sink is simple and easy to assemble.

[0036] On the other hand, this application provides a charging device, which includes a device cabinet and a power module as described in any of the above implementations, the power module being connected inside the device cabinet.

[0037] Since the charging device includes the power module in any of the above implementations, the charging device can also reduce the space occupied by the heat sink on the housing of the power module, which is beneficial to improving the power density of the charging device. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the structure of the charging device provided in the embodiments of this application;

[0039] Figure 2 This is a schematic diagram of the power module provided in an embodiment of this application;

[0040] Figure 3 This is one of the structural schematic diagrams of the power device module provided in the embodiments of this application;

[0041] Figure 4 for Figure 3 A cross-sectional view of the power device module in the middle;

[0042] Figure 5 This is a schematic diagram of the structure of the heat sink provided in the embodiments of this application;

[0043] Figure 6 for Figure 5 A cross-sectional view of the heat sink component;

[0044] Figure 7 A schematic diagram of the structure of the first insulating member facing the power device, provided in an embodiment of this application;

[0045] Figure 8A schematic diagram of the structure of the first insulating member facing the heat sink in an embodiment of this application;

[0046] Figure 9 for Figure 8 A cross-sectional view of the first insulating element in the middle;

[0047] Figure 10 A schematic diagram of the power device facing the circuit board side as provided in an embodiment of this application;

[0048] Figure 11 A schematic diagram of the power device facing the first insulating member according to an embodiment of this application;

[0049] Figure 12 for Figure 11 A cross-sectional view of the power device in the image;

[0050] Figure 13 This is a schematic diagram of the structure of the second insulating element provided in an embodiment of this application;

[0051] Figure 14 for Figure 13 A cross-sectional view of the second insulating element in the structure;

[0052] Figure 15 This is the second schematic diagram of the power device module provided in the embodiments of this application;

[0053] Figure 16 for Figure 15 A cross-sectional view of the power device module in the middle;

[0054] Figure 17 for Figure 15 Side-view of the power device module in the image.

[0055] Figure label:

[0056] 100-Power Device Module;

[0057] 10-Heat sink; 11-Groove; 12-Mounting surface; 13-Snap-fit ​​groove;

[0058] 20 - First insulating element; 21 - First protrusion; 22 - Second through hole;

[0059] 30 - Power device; 31 - First through-hole; 32 - Pin;

[0060] 40 - Second insulating element; 41 - Third through hole; 42 - Second protrusion; 43 - Third protrusion; 44 - Fourth protrusion;

[0061] 50 - Fastener; 51 - Part 1; 52 - Part 2;

[0062] 60 - Third insulating component; 61 - Fifth through hole; 62 - Fastening part; 63 - Fourth through hole;

[0063] α - First included angle; L1 - First distance; L2 - Second distance; L3 - Third distance; L4 - Fourth distance;

[0064] 200 - Power module; 210 - Housing; 220 - Circuit board;

[0065] 300 - Charging equipment; 310 - Equipment cabinet; 320 - Charging gun. Detailed Implementation

[0066] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0067] The terms "first," "second," and similar terms used in this article do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "one" or similar terms do not indicate a quantity limitation, but rather indicate the existence of at least one.

[0068] In the embodiments of this application, the words "exemplarily" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of the words "exemplary" or "for example" is intended to present the relevant concepts in a specific manner. In the description of the embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0069] To facilitate understanding of the embodiments of this application, the technical terms involved in this application will be explained before the embodiments are described in detail.

[0070] 1. Safety Distance: This generally refers to the minimum distance that must be maintained between electrical equipment or components to ensure safety and prevent electrical faults or fires caused by factors such as electric arcs, short circuits, or overheating. Safety distances mainly include two parameters: electrical clearance and creepage distance.

[0071] 2. Electrical clearance: refers to the shortest spatial distance between two conductors or between a conductor and ground. In electrical equipment, the main purpose of setting electrical clearance is to prevent arcing caused by abnormal conditions such as overvoltage and overcurrent, thereby protecting the safety and stability of the equipment.

[0072] 3. Creepage distance: This refers to the shortest distance between two conductive parts or between a conductive part and the interface of a device, measured along the insulating surface. This parameter is also crucial for preventing leakage or short circuits caused by current flowing through the insulating surface.

[0073] 4. DFX, or Design for X, is a design methodology that addresses each stage of the product lifecycle. Here, "X" represents each stage of the product lifecycle. DFX is a concurrent engineering design concept that emphasizes fully considering the needs of each stage or specific attribute X of the product's entire lifecycle, from design to disposal, in the early stages of product design. These needs include manufacturability (DFM), assemblability (DFA), and reliability (DFR), aiming to achieve high-quality, high-reliability, and optimal total cost product design.

[0074] Figure 1 Please refer to the structural schematic diagram of the charging device provided in the embodiments of this application. Figure 1 As shown, this application embodiment provides a charging device 300. For example, the charging device 300 may be a charging pile for charging electric vehicles or other electric devices.

[0075] Figure 2 The schematic diagram of the power module provided in the embodiments of this application is shown in the reference diagram. Figure 1 and Figure 2 The charging device 300 may include a cabinet 310 and a power module 200, with the power module 200 connected within the cabinet 310. The power module 200 is a modular device integrating multiple power devices 30 and their driving circuits. The power module 200 is used to convert input electrical energy into power before outputting it. For example, the power module 200 may be used to convert input direct current (DC) into alternating current (AC); or, it may be used to convert input AC into DC; or, it may be used for voltage boosting or bucking.

[0076] The power device 30, as a key component for realizing power conversion and control, has a large current and voltage withstand capability. For example, the power device 30 can be an insulated-gate bipolar transistor, a metal-oxide-semiconductor field-effect transistor, or a diode, etc. This application does not impose any special restrictions on the specific type of the power device 30.

[0077] The equipment cabinet 310 may have a receiving cavity, and the power module 200 may be located in the receiving cavity of the equipment cabinet 310.

[0078] In one embodiment, the power module 200 may include an alternating current-to-direct current (AC-DC) module. For example, the charging device 300 may include an AC-DC module and at least one charging gun 320. The AC-DC module may be located inside the equipment cabinet 310, while the charging gun 320 may be located outside the equipment cabinet 310. The AC-DC module is electrically connected to the at least one charging gun 320 and is used to convert alternating current into direct current and output it to the at least one charging gun 320. The at least one charging gun 320 is used to provide direct current to electric vehicles or other electric devices for charging.

[0079] In one embodiment, the power module 200 may include an AC-DC module and a DC-DC converter. For example, the charging device 300 includes an AC-DC module, a DC-DC module, a DC bus, and at least one charging gun 320. The AC-DC module, DC-DC module, and DC bus may be housed within an equipment cabinet 310, while the charging gun 320 may be located outside the equipment cabinet 310. The AC-DC module is electrically connected to the input terminal of the DC-DC power module via the DC bus, and the output terminal of the DC-DC power module is electrically connected to at least one charging gun 320. The AC-DC module converts alternating current (AC) into direct current (DC) and outputs it to the DC bus. The DC-DC module performs power conversion on the DC power obtained from the DC bus and outputs it to at least one charging gun 320. The at least one charging gun 320 provides the converted DC power to electric vehicles or other electric devices for charging them.

[0080] For example, please refer to Figure 2 The power module 200 may include a housing 210, a circuit board 220, and a power device module 100, with the circuit board 220 and the power device module 100 respectively disposed within the housing 210. For example, the housing 210 may have a receiving cavity, and the circuit board 220 and the power device module 100 may be respectively disposed within the receiving cavity of the housing 210.

[0081] Figure 3 This is one of the structural schematic diagrams of the power device module provided in the embodiments of this application. Figure 4 for Figure 3 A cross-sectional view of the power device module in the image. Please refer to... Figure 3 and Figure 4 The power device module 100 may include a heat sink 10, a first insulating component 20 and a power device 30, wherein the first insulating component 20 is located between the heat sink 10 and the power device 30.

[0082] In one possible implementation, the first insulating element 20 can be located between the heat sink 10 and the power device 30. In this way, the first insulating element 20 serves two purposes: firstly, it provides electrical insulation between the heat sink 10 and the power device 30, preventing electrical short circuits or other circuit faults between the power device 30 and the heat sink 10; secondly, it conducts heat from the power device 30 to the heat sink 10, thereby facilitating the rapid dissipation of heat generated by the power device 30 during operation.

[0083] For example, the first insulating element 20 can be made of a material with good thermal conductivity and good insulation properties, such as a ceramic sheet or a silicone insulating sheet. Of course, the material selection for the first insulating element 20 described above is only an example, and other materials can be selected in other embodiments, as long as the material has good thermal conductivity and insulation properties.

[0084] The heat sink 10 is located on the side of the first insulating member 20 away from the power device 30. It can be used to conduct the heat of the power device 30 to the housing 210 of the power module 200 through the first insulating member 20, thereby accelerating the heat transfer of the power device 30.

[0085] The heat sink 10 can be a heat sink or part of the housing 210 of the power module 200. Alternatively, the heat sink 10 can be two independent components of the housing 210, or it can be part of the housing 210.

[0086] When the heat sink 10 is a separate component from the housing 210, the heat sink 10 can be connected to the housing 210. The connection between the heat sink 10 and the housing 210 allows the heat from the power device 30 to be conducted to the housing 210 through the heat sink 10, thereby achieving effective heat dissipation.

[0087] When the heat sink 10 is part of the housing 210, the heat sink 10 and the housing 210 can be considered as a single unit. Since the heat sink 10 and the housing 210 are considered as a single unit, the number of parts can be reduced during manufacturing, thereby lowering costs.

[0088] In addition, the heat sink 10 can be made of a metal with good thermal conductivity, such as aluminum and its alloys, or copper and its alloys. These metals have high thermal conductivity, which can effectively conduct the heat from the power device 30 to the heat sink 10 through the first insulating member 20, and dissipate the heat into the environment through air convection or cooling fans.

[0089] The heat dissipation method of the aforementioned heat sink 10 can be liquid cooling, natural cooling, or air cooling. That is, the heat sink 10 can be a liquid-cooled heat sink, a natural-cooled heat sink, or an air-cooled heat sink.

[0090] Furthermore, the heat sink 10 of the power device module 100 can be grounded, which allows the power device module 100 to quickly conduct current to the ground in the event of leakage or short circuit, thereby protecting personal and equipment safety. That is, the heat sink 10 of the power device module 100 of this application can also be used in scenarios connected to protective earth (PE).

[0091] In addition, the cross-section of the heat sink 10 can be square, triangular or other irregular shape. This application does not limit the specific shape of the heat sink 10, as long as it can play a heat dissipation role.

[0092] The power device module 100 can be connected to the housing 210. For example, the heat sink 10 can be connected to the housing 210.

[0093] Alternatively, a portion of the first insulating member 20 and the housing 210 can be connected, and the portion of the housing 210 connected to the first insulating member 20 can serve as the heat sink 10 of the power device module 100. That is, the heat sink 10 can be a part of the housing 210; or, the heat sink 10 and the housing 210 can be an integral part.

[0094] In short, the heat sink 10 can be a separate component from the housing 210, or it can be a single component.

[0095] The power device 30 of the power device module 100 can be connected to the circuit board 220. For example, the power device 30 of the power device module 100 is connected to the circuit board 220 via its pins 32. For instance, the pins 32 of the power device 30 are soldered to the circuit board 220 with the pins facing upward (or bent upward).

[0096] The circuit board 220 mentioned above can be a printed circuit board 220. In addition to connecting the power devices 30 of the power device module 100, the circuit board 220 can also connect other electronic components, such as at least one or more of resistors, inductors, diodes, thyristors and transistors.

[0097] For example, some electronic components in the charging device 300 can be disposed on one side of the circuit board 220, while other electronic components can be disposed on the other side of the circuit board 220. For instance, electronic components in the charging device 300 that require heat dissipation (such as the power device 30 of the power device module 100, and other diodes, thyristors, insulated-gate bipolar transistors, insulated-gate field-effect transistors, and transistors connected to the circuit board 220) can be disposed on one side of the circuit board 220, while electronic components that do not require heat dissipation can be disposed on the other side of the circuit board 220. For example, electronic components requiring heat dissipation can be flip-chip mounted on the circuit board 220, while electronic components that do not require heat dissipation can be mounted upright on the circuit board 220. Flip-chip mounting of electronic components requiring heat dissipation on the circuit board 220 allows them to be close to the housing 210 of the power module 200, facilitating the timely dissipation of heat from these components through the housing 210.

[0098] In this context, "flip-mount" refers to an assembly method where, after the electronic components are connected to one side of the circuit board 220, the circuit board 220 with the electronic components is flipped during the assembly process so that the side with the electronic components faces down. "Upright-mount" is a different assembly method compared to flip-mount. It refers to an assembly method where, after the electronic components are connected to one side of the circuit board 220, the circuit board 220 with the electronic components is not flipped during the assembly process.

[0099] In one feasible implementation method Figure 5 For a schematic diagram of the heat sink provided in the embodiments of this application, please refer to... Figure 2 and Figure 5 The heat sink 10 of the power device module 100 may have a mounting surface 12, and the power device 30 may be connected to the mounting surface 12. The pins 32 of the power device 30 are electrically connected to the circuit board 220, the main body of the power device 30 is fixed to the mounting surface 12, and a first insulating member 20 is provided between the mounting surface 12 and the main body of the power device 30.

[0100] The main body of the power device 30 is the part of the power device 30 excluding the pin 32.

[0101] In one feasible implementation, the mounting surface 12 of the heat sink 10 and the circuit board 220 can be set at an angle.

[0102] This application sets the mounting surface 12 of the heat sink 10 at an angle to the circuit board 220. This allows the power device 30 mounted on the mounting surface 12 of the heat sink 10 to be angled relative to the circuit board 220. Thus, when the circuit board 220 is mounted parallel to the housing 210, the power device 30 can be tilted within the housing 210. Compared to placing the power device 30 parallel to the housing 210, tilting the power device 30 reduces its footprint on the housing 210. This reduces the area occupied by the heat sink 10, allowing for a larger layout of power device modules 100 and power devices 30 on the heat sink 10 within a given housing area, or freeing up space for other electronic components. Furthermore, the angled mounting surface 12 of the heat sink 10 and the circuit board 220 effectively utilizes the angled surface of the heat sink 10 to mount the power device 30. Compared to mounting the power device 30 on the side of the heat sink 10 parallel to the circuit board 220, it is possible to reduce the area occupied by the heat sink 10 on the housing 210 while maintaining the same contact area.

[0103] In one possible implementation, the angle between the mounting surface 12 and the circuit board 220 is an acute angle. For example, the angle between the mounting surface 12 and the circuit board 220 can be referenced... Figure 2 The first included angle α in the middle.

[0104] This application sets the included angle between the mounting surface 12 and the circuit board 220 to an acute angle, thus, as... Figure 2 As shown, the mounting surface 12 can face the circuit board 220, and the mounting surface 12 of the heat sink 10 faces away from the first surface of the housing 210 (the first surface is the side of the housing 210 used to mount the heat sink 10). This makes it easier to mount the first insulating member 20 and the power device 30 on the mounting surface 12, and the assembly of the power device module 100 is more convenient.

[0105] In addition, the angle between the mounting surface 12 of the heat sink 10 and the circuit board 220 is an acute angle. This application does not limit the specific degree of the acute angle. For example, it can be 30°, 40°, 45°, 50°, 60° or 70°, etc. This application will not list them one by one.

[0106] In some examples, the heat sink 10, the first insulator 20, and the power device 30 can be fixed with adhesive. For example, the heat sink 10 and the first insulator 20 are bonded with adhesive, and the first insulator 20 and the power device 30 are bonded with adhesive. Using adhesive to fix the power device module 100 can eliminate other connecting parts, thereby reducing the number of components, shrinking the overall size of the power device module 100, and reducing the area occupied by the power device module 100 on the housing 210.

[0107] In other examples, the heat sink 10, the first insulator 20, and the power device 30 can also be secured by fasteners 50.

[0108] Combination Figure 2 and Figure 4 , Figure 10 This is a schematic diagram of the power device facing the circuit board according to an embodiment of this application. Figure 11 This is a schematic diagram of the power device facing the first insulating member according to an embodiment of this application. Figure 12 for Figure 11 A cross-sectional view of the power devices in the diagram. Please refer to... Figures 10 to 12 The main body of the power device 30 is provided with a first through hole 31.

[0109] Combination Figure 2 and Figure 4 , Figure 7 This is a schematic diagram of the structure of the first insulating member facing the power device, provided in an embodiment of this application. Figure 8 This is a structural schematic diagram of the side of the first insulating member facing the heat sink provided in an embodiment of this application. Figure 9 for Figure 8 A cross-sectional view of the first insulating element. For example, please refer to... Figures 7 to 9 The first insulating element 20 is provided with a second through hole 22.

[0110] In some examples, the power device module 100 may also include a fastener 50, which may pass through the first through hole 31 and the second through hole 22 in sequence and be connected to the heat sink 10.

[0111] This application provides a first through hole 31 in the main body of the power device 30 and a second through hole 22 in the first insulating member 20. This allows the fastener 50 to pass through the first through hole 31 and the second through hole 22 and connect to the heat sink 10. In other words, by connecting the fastener 50 to the heat sink 10 through the power device 30 and the first insulating member 20, this application not only secures the power device module 100 of the power module 200 but also reduces the space occupied by the power device module 100, thereby improving the power density of the charging device 300. Furthermore, compared to using adhesive to fix the power device 30, the first insulating member 20, and the heat sink 10, this application eliminates the need for a baking and curing process because it does not use adhesive. This reduces the manufacturing difficulty of the power device module 100, improves the consistency of mass production of the power device module 100, and ultimately improves product quality.

[0112] Furthermore, fastener 50 may be made of insulating material or have insulating properties itself.

[0113] Please refer to Figure 3 , Figure 4 and Figure 12 In some examples, the power device module 100 may also include a second insulating member 40. A portion of the second insulating member 40 may be disposed around the inner wall of the first through hole 31 of the power device 30, and another portion of the second insulating member 40 may be located on the side of the main body of the power device 30 opposite to the first insulating member 20.

[0114] In other words, the second insulating member 40 may include at least two parts, one part of which may pass through the first through hole 31 of the power device 30 and be disposed around the inner wall of the first through hole 31. The other part of the second insulating member 40 may be located on the side of the main body of the power device 30 opposite to the first insulating member 20.

[0115] Figure 13 For a schematic diagram of the structure of the second insulating member provided in the embodiments of this application, please refer to... Figure 4 and Figure 13 The second insulating member 40 may be provided with a third through hole 41. The fastener 50 may include a first portion 51 and a second portion 52 connected to the first portion 51. The first portion 51 may pass through the third through hole 41 and be connected to the heat sink 10, while the second portion 52 abuts against another portion of the second insulating member 40. This other portion of the second insulating member 40 is the part of the second insulating member 40 located on the side of the main body of the power device 30 opposite to the first insulating member 20.

[0116] That is, the fastener 50 includes a first part 51 and a second part 52, with the first part 51 connected to the second part 52. The first part 51 can pass through the second insulator 40 and be connected to the heat sink 10, while the second part 52 can abut against the side of the second insulator 40 away from the power device 30.

[0117] Thus, when the fastener 50 is connected to the heat sink 10 via the first part 51, since the second part 52 abuts against the side of the second insulator 40 away from the power device 30, the second part 52 can provide a force along the axial direction of the fastener 50 to the second insulator 40, the power device 30 and the first insulator 20 toward the heat sink 10, thereby allowing the second insulator 40, the power device 30, the first insulator 20 and the heat sink 10 to be fixed together by the fastener 50.

[0118] Among them, the fastener 50 can be a fastening screw, the first part 51 can be the shank of the fastening screw, and the second part 52 can be the head of the fastening screw.

[0119] Or, refer to Figure 4 , Figure 12 and Figure 13 The power device module 100 may also include a second insulating member 40. The diameter of the end of the fastener 50 away from the heat sink 10 is larger than the diameter of the first through hole 31. A portion of the second insulating member 40 is arranged in a ring between the inner wall of the first through hole 31 and the fastener 50. Another portion of the second insulating member 40 is disposed in the gap between the end of the fastener 50 and the main body of the power device 30.

[0120] In this way, the end of the fastener 50 away from the heat sink 10 can provide a force along the axial direction of the fastener 50 to the second insulator 40, the power device 30 and the first insulator 20 to move closer to the heat sink 10, so that the second insulator 40, the power device 30, the first insulator 20 and the heat sink 10 can be fixed together by the fastener 50.

[0121] Fastener 50 can be a fastening screw, and the end of fastener 50 away from heat sink 10 can be the head of the fastening screw.

[0122] It should be understood that the fastener 50, which is a fastening screw, is only one example of this application. In other embodiments, other fasteners 50 may also be used for fixing, such as connectors with external threads that can be adapted to the internal threads of the heat sink 10.

[0123] In addition, by providing a second insulating member 40, a portion of the second insulating member 40 is disposed within the first through hole 31 of the power device 30 and located between the fastener 50 and the inner wall of the first through hole 31, while the other portion of the second insulating member 40 is located between the side of the power device 30 away from the first insulating member 20 and the fastener 50, insulation between the power device 30 and the fastener 50 can be achieved, preventing circuit faults such as short circuits between the power device 30 and the fastener 50.

[0124] The second insulating element 40 can also increase the electrical clearance and creepage distance between the fastener 50 and the power device 30, making it easier for the fastener 50 and the power device 30 to meet safety distance requirements.

[0125] This application connects the fastener 50 to the heat sink 10 by passing it through the power device 30 and the first insulating member 20. A second insulating member 40 is provided between the outer periphery of the fastener 50 and the power device 30. The fastener 50, by directly passing through the power device 30, eliminates the need for a separate space on the power device module 100, thus reducing the space occupied by the power device module 100 and improving the power density of the charging device 300. Furthermore, since this application does not use adhesive for fixing, the baking and curing process is eliminated, reducing the manufacturing difficulty of the power device module 100, improving the consistency of mass production, and ultimately improving product quality, resulting in superior DFX. Moreover, due to the second insulating member 40, the fastener 50 can be made of ordinary metal screws, eliminating the need for special insulation features.

[0126] Figure 6 for Figure 5 A sectional view of the heat sink component. Please refer to... Figure 5 and Figure 6 The mounting surface 12 is provided with grooves 11. The number of grooves 11 can be determined according to the number of power devices 30 on the heat sink 10. For example, the number of grooves 11 can be the same as the number of power devices 30.

[0127] The position of the groove 11 on the heat sink 10 can correspond to the position of the first through hole 31 of the power device 30, which can improve the coaxiality of the first through hole 31 and the groove 11, and facilitate the insertion of the fastener 50 when fixing the power device module 100. The depth of the groove 11 is not limited in this application and can be determined according to the actual application requirements.

[0128] Please refer to Figures 7 to 9The first insulating member 20 has a first protrusion 21 extending into the groove 11 on the side facing the heat sink 10.

[0129] That is, the first insulating member 20 has a first protrusion 21, which extends toward the groove 11 of the first insulating member 20. In other words, the first protrusion 21 can extend into the groove 11. By providing a groove 11 on the heat sink 10 and providing a first protrusion 21 corresponding to the groove 11 on the first insulating member 20, and the first protrusion 21 can extend into the groove 11, the cooperation between the groove 11 and the protrusion can facilitate the quick assembly of the first insulating member 20 with the heat sink 10, and can also prevent the first insulating member 20 from shifting relative to the heat sink 10 to a certain extent, thereby improving the assembly reliability of the power device module 100.

[0130] The shape of the groove 11 and the shape of the first protrusion 21 are not limited in this application. For example, the cross-section of the groove 11 can be circular, square, polygonal, or other irregular shape, and the cross-section of the first protrusion 21 can be circular, square, polygonal, or other irregular shape. The cross-section of the groove 11 can be the same as or different from the cross-section of the first protrusion 21.

[0131] The inner diameter of the groove 11 can be the same as the outer diameter of the first protrusion 21; or, in order to facilitate assembly or to set a certain tolerance value, the inner diameter of the groove 11 can be slightly larger than the outer diameter of the first protrusion 21.

[0132] like Figure 4 and Figure 9 As shown, the second through hole 22 penetrates the first protrusion 21, and the first part 51 can pass through the second through hole 22 and connect to the heat sink 10. The first part 51 of the fastener 50 passes through the second through hole 22 and connects to the heat sink 10. In this way, the first protrusion 21 can, on the one hand, play a role in limiting the fit with the groove 11 of the heat sink 10, and on the other hand, it can facilitate the fastener 50 to pass through. The fastener 50 passes through the second through hole 22, which can effectively utilize the first protrusion 21.

[0133] In one possible implementation, the end of the second insulating member 40 facing the heat sink 10 passes through the second through hole 22; the distance from the side of the first protrusion 21 away from the power device 30 to the power device 30 is less than the distance from the side of the second insulating member 40 facing the heat sink 10 to the power device 30.

[0134] exist Figure 4 In the first part, the distance from the side of the first protrusion 21 away from the power device 30 to the power device 30 is the first distance L1, and the distance from the side of the second insulating member 40 facing the heat sink 10 to the power device 30 is the second distance L2. The first distance L1 is less than the second distance L2.

[0135] In other words, the second insulating member 40 can extend into the first protrusion 21 and extend from the first protrusion 21 toward the direction of the heat sink 10.

[0136] The distance from the side of the first protrusion 21 away from the power device 30 to the power device 30 is less than the distance from the side of the second insulating member 40 facing the heat sink 10 to the power device 30. That is, the end of the second insulating member 40 near the heat sink 10 protrudes beyond the first protrusion 21.

[0137] In this application, a portion of the second insulating member 40 passes through the second through hole 22 and extends beyond the second through hole 22. This increases the creepage distance between the fastener 50 and the power device 30, thereby improving the insulation effect between the fastener 50 and the power device 30 and ensuring that the safety distance meets the requirements.

[0138] The specific dimensions of the second insulating element 40 protruding from the first protrusion 21 are not limited in this application and can be selected according to safety distance requirements.

[0139] Figure 13 This is a schematic diagram of the structure of the second insulating member provided in an embodiment of this application. Figure 14 for Figure 13 A cross-sectional view of the second insulating element. In one possible implementation, please refer to... Figure 4 , Figure 13 and Figure 14 As shown, the side of the second insulating member 40 facing away from the power device 30 has a second protrusion 42, which is arranged around the outer periphery of the second part 52.

[0140] The second protrusion 42 has a certain height along a direction parallel to the axis of the fastener 50. That is, the second protrusion 42 extends from the side of the second insulating member 40 away from the power device 30 in a direction away from the power device 30. The presence of this second protrusion 42 can increase the surface area of ​​the second insulating member 40, thereby increasing the creepage distance between the fastener 50 and the power device 30.

[0141] The second protrusion 42 is disposed around the outer periphery of the second portion 52 of the fastener 50, that is, the second protrusion 42 is an annular protrusion. For example, the shape of the annular protrusion can be circular, square, polygonal, or irregular, and this application does not limit it in this way.

[0142] In one feasible approach, combining references Figure 4 , Figure 13 and Figure 14 As shown, the side of the second insulating member 40 facing away from the power device 30 may have a third protrusion 43, which is arranged around the outer periphery of the second protrusion 42.

[0143] That is, in addition to the second protrusion 42 extending from the side of the second insulating member 40 facing away from the power device 30, a third protrusion 43 may also extend therefrom.

[0144] The third protrusion 43 has a certain height along a direction parallel to the axis of the fastener 50. That is, the third protrusion 43 extends from the side of the second insulating member 40 away from the power device 30 in a direction away from the power device 30. Providing this third protrusion 43 can increase the surface area of ​​the second insulating member 40, thereby increasing the creepage distance between the fastener 50 and the power device 30.

[0145] The third protrusion 43 is disposed around the outer periphery of the second protrusion 42, that is, the third protrusion 43 is arranged around the outer periphery of the second protrusion 42, that is, the third protrusion 43 is an annular protrusion. For example, the shape of the annular protrusion can also be circular, square, polygonal or irregular, and this application does not limit it.

[0146] The second protrusion 42 surrounds the outer periphery of the second portion 52 of the fastener 50, and the third protrusion 43 surrounds the outer periphery of the second protrusion 42. By providing the second protrusion 42 and the third protrusion 43, the surface area of ​​the second insulating member 40 can be increased, thereby increasing the creepage distance between the fastener 50 and the power device 30.

[0147] It should be understood that the second insulating member 40 having a second protrusion 42 and a third protrusion 43 is merely an example. In other embodiments, more protrusions may be provided, such as a fourth protrusion 44 surrounding the outer periphery of the third protrusion 43 on the side of the second insulating member 40 facing away from the power device 30.

[0148] In one possible implementation, the third protrusion 43 can be fixed to the second protrusion 42; the distance from the side of the second protrusion 42 away from the power device 30 to the power device 30 is greater than the distance from the side of the third protrusion 43 away from the power device 30 to the power device 30.

[0149] Among them, Figure 4 In the middle, the distance from the side of the second protrusion 42 away from the power device 30 to the power device 30 is the third distance L3, and the distance from the side of the third protrusion 43 away from the power device 30 to the power device 30 is the fourth distance L4. The third distance L3 is greater than the fourth distance L4.

[0150] The third protrusion 43 and the second protrusion 42 can be fixed by having a gap between them and fixing their relative positions; or by directly connecting them to fix their positions. For example, the surface of the third protrusion 43 facing the second protrusion 42 can be fixedly connected to the second protrusion 42.

[0151] In other words, the side of the second protrusion 42 facing away from the power device 30 protrudes from the side of the third protrusion 43 facing away from the power device 30. That is to say, in the direction parallel to the axis of the fastener 50, the second protrusion 42 and the third protrusion 43 have a height difference.

[0152] This application, through the height difference design of the second protrusion 42 and the third protrusion 43, achieves the same surface area and the same creepage distance as a second protrusion 42 and the third protrusion 43 of equal height. Furthermore, the height difference design of the second protrusion 42 and the third protrusion 43 of this application also reduces material consumption compared to second protrusions 42 and the third protrusion 43 of equal height, thus saving material in the second insulating element 40 and reducing costs.

[0153] In addition, the distance from the side of the second protrusion 42 away from the power device 30 to the power device 30 is greater than the distance from the side of the third protrusion 43 away from the power device 30 to the power device 30. Thus, the distance from the second protrusion 42 near the fastener 50 to the power device 30 is larger, and a receiving space with a certain depth can be formed in the second protrusion 42. This receiving space can accommodate at least part of the second part 52 and can also play a protective role for the second part 52, preventing the fastener 50 from becoming loose due to accidental contact with the second part 52.

[0154] When the second insulating member 40 also includes other protrusions such as the fourth protrusion 44, the distance from the side of the protrusion closer to the second part 52 away from the power device 30 to the power device 30 is greater than the distance from the side of the protrusion away from the second part 52 away from the power device 30 to the power device 30.

[0155] In short, when the second insulating member 40 also includes other protrusions such as the fourth protrusion 44, the height of each protrusion of the second insulating member 40 gradually decreases in the direction away from the second part 52, such as... Figure 4 , Figure 13 and Figure 14 As shown.

[0156] In one feasible way, such as Figure 3 As shown, the power device module 100 may include multiple power devices 30, all of which are located on the side of the first insulating member 20 away from the heat sink 10, and there is a gap between two adjacent power devices 30.

[0157] The power device module 100 of this application sets up multiple power devices 30, which can work together to more effectively perform power conversion, such as DC to AC or AC to DC, and achieve higher energy efficiency.

[0158] In addition, multiple power devices 30 can be used in parallel or in series, which can significantly increase the power output capability of the power device module 100. In this way, the charging device 300 can provide charging services for batteries or loads with higher power, meeting the needs of more application scenarios.

[0159] The gap between two adjacent power devices 30 can prevent mutual interference between them, and the gap between two adjacent power devices 30 can also help dissipate heat during operation, thus facilitating heat dissipation.

[0160] Furthermore, multiple power devices 30 are located on the side of the first insulating member 20 away from the heat sink 10. In other words, multiple power devices 30 can share a first insulating member 20. Thus, there is only one first insulating member 20, and the number of components in the power device module 100 is reduced, which simplifies the overall structure of the power device module 100 and facilitates assembly.

[0161] In addition, the fact that multiple power devices 30 share a first insulating element 20 can increase the creepage distance between the heat sink 10 and the power device 30, thereby making it easier for the power device module 100 to meet safety distance requirements.

[0162] In another possible implementation, the power device 30 may include multiple components, and the first insulating component 20 may include multiple components, with a one-to-one correspondence between the multiple power devices 30 and the multiple first insulating components 20; each power device 30 is located on the side of the corresponding first insulating component 20 away from the heat sink 10, and there is a gap between two adjacent power devices 30.

[0163] In other words, in this implementation, there are multiple first insulating elements 20 and multiple power devices 30, and the multiple power devices 30 correspond one-to-one with the multiple first insulating elements 20.

[0164] The two adjacent first insulating elements 20 may or may not be connected. That is, the two adjacent first insulating elements 20 may be connected together or spaced apart, as long as the arrangement of the first insulating elements 20 meets the safety distance requirements.

[0165] This application sets up a one-to-one correspondence between multiple power devices 30 and multiple first insulating pieces 20. In this way, when a first insulating piece 20 is damaged, the first insulating piece 20 can be directly replaced, and the power device 30 corresponding to the first insulating piece 20 can be located more quickly. Other power devices 30 and first insulating pieces will not be affected, which can improve the maintainability and reliability of the power device module 100.

[0166] In one feasible approach, the heat sink 10 can be made of metal.

[0167] That is, the heat sink 10 can be made of a metallic material, such as copper, copper alloy, or aluminum alloy. The heat sink 10 and the housing 210 of the power module 200 can be integrally formed, which reduces the complexity of the assembly process of the power module 200, eliminates the need for the heat sink 10 installation process, and improves the production efficiency of the power module 200. For example, the heat sink 10 can be integrally formed at the bottom of the housing 210. For instance, both the heat sink 10 and the housing 210 are made of metallic materials; in this case, the heat sink 10 and the housing 210 can be manufactured using an integral forming method such as die casting or casting.

[0168] In some examples, the heat sink 10 can be a liquid-cooled heat dissipation structure (e.g., a liquid cooling plate) with channels for the circulation of coolant. The flow of coolant transfers heat from the power device 30 to the outside of the housing 210, thereby dissipating heat from the power device 30. Alternatively, the heat sink 10 can also employ a natural cooling structure, such as heat dissipation fins or ventilation holes, to increase the contact area between the heat sink and the air, thus dissipating heat more effectively.

[0169] Figure 15 This is the second schematic diagram of the power device module provided in the embodiments of this application. Figure 16 for Figure 15 A cross-sectional view of the power device module in the image. Please refer to... Figure 15 and Figure 16 The power device module 100 of this application may further include a third insulating member 60. The third insulating member 60 is located on the side of the circuit board 220 facing the power device 30, and the third insulating member 60 is connected to the heat sink 10. The third insulating member 60 has a fourth through hole 63, through which one end of the pin 32 of the power device 30 passes and is electrically connected to the circuit board 220.

[0170] This application provides a third insulating element 60, positioned on the side of the circuit board 220 facing the power device 30 and connected to the heat sink 10. This third insulating element 60 isolates the circuit board 220 and the power device 30, ensuring both meet safety regulations. The fourth through-hole 63 on the third insulating element 60 will not affect the connection between the pin 32 of the power device 30 and the circuit board 220.

[0171] Figure 17 for Figure 15 Please refer to the side-view diagram of the power device module in the image. Figure 16 and Figure 17The third insulating member 60 can be fastened together with the heat sink 10 via the fastening part 62. For example, the third insulating member 60 has a fastening part 62, and the heat sink 10 has a fastening groove 13 corresponding to the fastening part 62, and the fastening part 62 can be fastened into the fastening groove 13.

[0172] The pins 32 of the power device 30 pass through the fourth through hole 63 of the third insulator 60 and extend outside the third insulator 60. Different pins 32 of the power device 30 or the pins 32 of different power devices 30 can be insulated by the third insulator 60.

[0173] The third insulating member 60 may also have a fifth through hole 61 through which a portion of the heat sink 10 may be exposed. Thus, when the power device module 100 is mounted onto the housing 210 of the power module 200, screws can be passed through the fifth through hole 61 to fasten the heat sink 10 and the housing 210, thereby fixing the power device module 100 onto the housing 210 of the power module 200.

[0174] The fifth through hole 61 can have two or more, so that when the power device module 100 is installed onto the housing 210 of the power module 200, it can be fastened with multiple screws, making the installation more reliable.

[0175] In addition, the power device module 100 proposed in this application can be applied in scenarios involving heat dissipation and insulation of power devices 30, such as resonant converter topologies (also known as LLC topologies), series resonant topologies, phase-shifted full-bridge topologies, and bidirectional active bridge (DAB) topologies.

[0176] The power device module 100 proposed in this application can also be applied to various power supply equipment, such as switching power supplies, rectifier power supplies, charging pile power modules, and energy storage power modules.

[0177] The power device module 100 proposed in this application can also be applied to power electronic devices such as charging modules, inverters, frequency converters, uninterruptible power supplies (UPS) and on-board chargers (OBC).

[0178] That is, the power device module 100 of this application can be used not only in the charging device 300 mentioned above, but also in a variety of application scenarios such as power supply equipment, and this application does not limit it.

[0179] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples. The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power module, characterized in that, The power module includes a housing, a circuit board, power devices, and a heat sink, wherein the circuit board, the power devices, and the heat sink are disposed within the housing; The heat sink has a mounting surface that is angled to the circuit board. The pins of the power device are electrically connected to the circuit board. The main body of the power device is fixed to the mounting surface. A first insulating element is provided between the mounting surface and the main body of the power device.

2. The power module according to claim 1, characterized in that, The angle between the mounting surface and the circuit board is an acute angle.

3. The power module according to claim 1 or 2, characterized in that, The power module also includes fasteners. The main body of the power device is provided with a first through hole, and the first insulating component is provided with a second through hole. The fasteners pass through the first through hole and the second through hole in sequence and are connected to the heat sink.

4. The power module according to claim 3, characterized in that, The power module further includes a second insulating member, a portion of which is arranged around the inner wall of the first through hole, and another portion of which is located on the side of the main body opposite to the first insulating member; the second insulating member is provided with a third through hole; The fastener includes a first part and a second part connected to the first part. The first part passes through the third through hole and is connected to the heat sink. The second part abuts against another part of the second insulating member.

5. The power module according to claim 4, characterized in that, The mounting surface is provided with a groove, and the side of the first insulating member facing the heat sink has a first protrusion extending into the groove, and the second through hole penetrates the first protrusion.

6. The power module according to claim 5, characterized in that, The end of the second insulating member facing the heat sink passes through the second through hole; the distance from the side of the first protrusion away from the power device to the power device is less than the distance from the side of the second insulating member facing the heat sink to the power device.

7. The power module according to any one of claims 4-6, characterized in that, The side of the second insulating member facing away from the power device has a second protrusion, which is arranged around the outer periphery of the second portion.

8. The power module according to claim 7, characterized in that, The side of the second insulating member facing away from the power device has a third protrusion, which is circumferentially disposed around the outer periphery of the second protrusion.

9. The power module according to claim 8, characterized in that, The surface of the third protrusion facing the second protrusion is fixedly connected to the second protrusion; the distance from the side of the second protrusion away from the power device to the power device is greater than the distance from the side of the third protrusion away from the power device to the power device.

10. The power module according to any one of claims 1-9, characterized in that, The power devices include multiple devices, all of which are located on the side of the first insulating member away from the heat sink, and there is a gap between two adjacent power devices.

11. The power module according to any one of claims 1-9, characterized in that, The power devices include multiple components, and the first insulating components include multiple components. The multiple power devices and the multiple first insulating components correspond one-to-one. Each power device is located on the side of the corresponding first insulating component that is away from the heat sink, and there is a gap between two adjacent power devices.

12. The power module according to any one of claims 1-11, characterized in that, The heat sink is connected to the housing; or the heat sink and the housing are an integral part.

13. The power module according to any one of claims 1-12, characterized in that, The power module further includes a third insulating component, which is located on the side of the circuit board facing the power device and is connected to the heat sink. The third insulating element has a fourth through hole, through which one end of the pin of the power device passes and is electrically connected to the circuit board.

14. The power module according to claim 13, characterized in that, The third insulating member has a fastening portion, and the heat dissipation member has a fastening groove corresponding to the fastening portion, and the fastening portion is fastened into the fastening groove.

15. A charging device, characterized in that, include: Equipment cabinet; The power module as described in any one of claims 1-14, wherein the power module is connected inside the equipment cabinet.

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