Radiator and electronic equipment
By separating the base plate and heat sink components and using different materials and designs, the problems of high cost and low efficiency of heat sinks are solved, achieving a heat sink design with high-efficiency heat transfer and low cost, which can meet the functional requirements of different parts.
Patent Information
- Application Number
- CN202520462644.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-03-17
AI Technical Summary
Existing heat sinks suffer from low heat dissipation efficiency and high cost in high power density components. In particular, the use of the same material for the substrate and heat sink makes it impossible to simultaneously meet the requirements of high thermal conductivity and low cost. Furthermore, traditional designs cannot differentiate materials for the functional requirements of different parts.
The heat sink's base plate and heat sink components are separate components. The base plate is made of high heat transfer materials such as pure copper, while the heat sink components are made of low-cost materials such as aluminum. By designing the resistance distribution and shape differences in different parts, the material combination is optimized to improve the heat dissipation effect.
It achieves cost reduction while ensuring high heat transfer performance, improves the overall heat dissipation efficiency of the radiator and the flexibility of material selection, and adapts to the functional requirements of different parts.
Smart Images
Figure CN223899554U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat sink technology, and more particularly to a heat sink and electronic device. Background Technology
[0002] In recent years, the new energy vehicle industry has developed rapidly, and many automotive-related electronic and electrical devices involve heat dissipation issues. Furthermore, with the development of high-voltage platforms and fast-charging technologies in new energy vehicles, power density is constantly increasing, leading to increasingly stringent heat dissipation requirements. As a high-power-density component, the motor controller of a new energy vehicle inevitably generates a large amount of heat during the long-term operation of its IGBT (Insulated Gate Bipolar Transistor) power module. To ensure the stable operation of the IGBT power module, one of the core components is the heat sink. The heat sink effectively dissipates heat, ensuring the component operates within a suitable temperature range, extending its lifespan; simultaneously, it reduces power loss caused by high temperatures, improving efficiency.
[0003] The general manufacturing process of radiators in related technologies is as follows: blanking → forging → shaping and needle cutting → machining → sandblasting → cleaning → electroplating → arc pressing. A radiator includes a base plate and pins mounted on the base plate. During use, components are installed on the pinless side of the base plate. The pin side of the radiator has an inlet and an outlet, with the pins located between them. The heat exchange medium can enter the gap between the pins from the inlet and flow towards the outlet. Heat is conducted from the components to the base plate, and then from the base plate to the pins. As the heat exchange medium flows between the pins on the pin side...
[0004] The needle column contacts the heat exchange medium and absorbs its heat. After absorbing heat, the heat exchange medium can flow out from the outlet, realizing overall heat exchange. However, as the heat exchange medium flows from the inlet to the outlet, its temperature continues to rise, causing the heat exchange effect of the heat exchange medium to decrease significantly near the outlet, thus limiting the overall heat dissipation efficiency of the radiator.
[0005] Furthermore, as electronic devices evolve towards higher performance and miniaturization, the demands for heat sink thermal management performance are increasing, and the need for cost reduction is becoming increasingly urgent. Traditional heat sinks are typically manufactured using a single material through a one-piece molding process, where the substrate and heat sink components (such as pins or fins) are made of the same material. While this design simplifies the manufacturing process, it also has significant limitations: Firstly, due to material properties, it is difficult to simultaneously meet the requirements of high thermal conductivity and low cost. For example, existing heat sink components are usually made of pure copper or aluminum. Pure copper has excellent thermal conductivity but is expensive, while aluminum is cheaper but has relatively poor thermal conductivity. Secondly, the one-piece molding process limits the flexibility of material selection, making it impossible to design differentiated materials for different functional requirements of different parts of the heat sink. Therefore, how to achieve an optimized combination of materials for the heat sink substrate and heat sink components, effectively reducing costs while ensuring heat transfer performance, has become one of the urgent technical problems to be solved in the current heat sink design field. Utility Model Content
[0006] This application provides a heat sink and electronic device that helps to simultaneously achieve cost reduction and high-efficiency heat transfer performance, while ensuring heat dissipation effect.
[0007] A first aspect of this application provides a heat sink, including a substrate and a plurality of heat sink components. The substrate has an inlet end and an outlet end for a heat exchange medium to pass through. The plurality of heat sink components are separately disposed from the substrate, and the heat sink components are fixedly connected to the substrate. The plurality of heat sink components are arranged at intervals on the substrate, and some of the heat sink components are combined to form a heat exchange region. At least two heat exchange regions are formed between the inlet end and the outlet end of the substrate. When the heat exchange medium flows from the inlet end to the outlet end, it passes through the heat exchange regions. The resistance of the heat exchange region near the inlet end to the heat exchange medium is less than the resistance of the heat exchange region near the outlet end to the heat exchange medium.
[0008] In this application, the heat sink's substrate and heat sink components are independently designed, allowing for separate fabrication. This enables the substrate and heat sink components to be made from different materials. For example, the substrate can be made of pure copper or oxygen-free copper, which have good thermal conductivity, increasing the substrate's heat transfer effect. The heat sink component can be made of cost-effective materials such as aluminum. This approach ensures both good heat dissipation and low cost. In this application, the resistance to the heat exchange medium near the inlet end of the heat sink is less than the resistance near the outlet end. As a result, when the heat exchange medium flows to the area near the outlet end, its flow velocity slows down, allowing the heat exchange medium near the outlet end more time to absorb heat from the components near the heat sink outlet end, increasing its heat exchange effect and ensuring that the heat from the components is effectively removed.
[0009] In one possible implementation, a plurality of heat sinks are spaced apart along the width direction of the substrate to form a heat sink group, and a plurality of heat sink groups are spaced apart along the length direction of the substrate, with the heat sinks in adjacent heat sink groups being staggered.
[0010] In one possible implementation, the spacing between two adjacent heat sinks is 1.8-2.5 mm along the length direction of the substrate and the spacing between two adjacent heat sinks is 1.8-2.5 mm along the width direction of the substrate.
[0011] In one possible implementation, the areas of the plurality of heat exchange regions are equal, and the total projected area of the heat sink in each heat exchange region on the substrate accounts for 20%-40% of the area of the corresponding heat exchange region. In the direction from the inlet end to the outlet end, the projected area of the heat sink in the later heat exchange region on the substrate is greater than or equal to the projected area of the heat sink in the previous heat exchange region on the substrate.
[0012] In one possible implementation, the substrate is provided with three heat exchange regions, namely a first region, a second region, and a third region arranged from the inlet end to the outlet end. The total projected area of the heat sink in the second region on the substrate accounts for 25%-30% of the area of the second region. The total projected area of the heat sink in the first region on the substrate is less than or equal to 90% of the total projected area of the heat sink in the second region on the substrate. The total projected area of the heat sink in the third region on the substrate is greater than or equal to 120% of the total projected area of the heat sink in the second region on the substrate.
[0013] In one possible implementation, the heat sink includes a heat exchange medium contact surface facing the inlet end; wherein, in the heat exchange region near the inlet end, the heat exchange medium contact surface of the heat sink is a convex surface protruding towards the inlet end; and in the heat exchange region near the outlet end, the heat exchange medium contact surface of the heat sink is a concave surface recessed away from the inlet end.
[0014] In one possible implementation, in the heat exchange region near the inlet end, the heat exchange medium contact surface of the heat sink is a convex arc surface, and in the heat exchange region near the outlet end, the heat exchange medium contact surface of the heat sink is a concave arc surface. The chord length of both the convex and concave arc surfaces is 1.8-2.5 mm, and the arc height is 0.2-0.5 mm.
[0015] In one possible implementation, the heat dissipation components in different heat exchange zones are all of equal shape and size, and the number of heat dissipation components in the heat exchange zone near the outlet end is greater than the number of heat dissipation components in the heat exchange zone near the inlet end.
[0016] In one possible implementation, along the direction from the inlet to the outlet, the number of heat dissipation elements in the subsequent heat exchange region is equal to the number of heat dissipation elements in the preceding heat exchange region, and the projected area of a single heat dissipation element in the subsequent heat exchange region on the substrate is greater than the projected area of a single heat dissipation element in the preceding heat exchange region on the substrate.
[0017] A second aspect of this application provides an electronic device, including a device body and the heat sink described above. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 An exploded view of a heat sink provided according to some embodiments of this application is shown;
[0020] Figure 2 A schematic diagram of a first structure of a heat sink provided according to some embodiments of this application is shown;
[0021] Figure 3 A schematic diagram of a second structure of a heat sink provided according to some embodiments of this application is shown;
[0022] Figure 4 A schematic diagram of a heat sink provided according to some embodiments of this application is shown;
[0023] Figure 5 A schematic diagram of another structure of the heat sink provided in some embodiments of this application is shown;
[0024] Figure 6 A schematic diagram of a third structure of a heat sink provided according to some embodiments of this application is shown;
[0025] Figure 7 A schematic diagram of a fourth structure of a heat sink provided according to some embodiments of this application is shown;
[0026] Figure 8 A fifth structural schematic diagram of a heat sink provided according to some embodiments of this application is shown.
[0027] Figure label:
[0028] 10. Substrate; 11. Inlet end; 12. Outlet end; 20. Heat dissipation component; 21. Heat exchange medium contact surface; 30. Spacer. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0030] See Figure 1 As shown in the figure, this application provides a heat sink, which includes a substrate 10 and a plurality of heat dissipation elements 20 disposed on the substrate 10. The substrate 10 has an inlet end 11 and an outlet end 12 for the passage of heat exchange medium. The heat dissipation elements 20 are located between the inlet end 11 and the outlet end 12. The heat exchange medium can enter the heat sink from the inlet end 11 and can flow towards the outlet end 12. The heat dissipation elements 20 are located in the flow path of the heat exchange medium. During the flow process, the heat exchange medium will contact the surface of the heat dissipation elements 20 to absorb the heat on the heat dissipation elements 20. The heat exchange medium can be a gaseous heat exchange medium such as Freon or ammonia, or a liquid medium such as water or ethylene glycol aqueous solution. This application does not impose any limitations.
[0031] The heat sink 20 and the substrate 10 are separately disposed. The heat sink 20 of this application can be connected to the substrate 10 by welding or bonding. The heat sink 20 of this application can be a heat sink fin or a heat sink pin. This application will describe the heat sink 20 as a pin.
[0032] In this application, multiple heat sinks 20 are spaced apart on a substrate 10, and the heat exchange medium can flow through the gaps between the heat sinks 20. Some of the heat sinks 20 are combined to form heat exchange regions. Along the direction of the inlet end 11 and the outlet end 12 of the substrate 10, multiple heat sinks 20 form at least two heat exchange regions on the substrate 10, and the heat exchange medium can flow through these heat exchange regions as it flows from the inlet end 11 to the outlet end 12.
[0033] It should be noted that the resistance of the heat exchange medium in the heat exchange zone near the inlet end 11 is less than that in the heat exchange zone near the outlet end 12. This allows the heat exchange medium to flow at a slower speed in the heat exchange zone near the outlet end 12 than in the heat exchange zone near the inlet end 11.
[0034] In related technologies, during the production of radiators, the substrate 10 and the heat sink 20 are often integrally molded. This results in the substrate 10 and the heat sink 20 being made of the same material, such as pure copper, aluminum, or oxygen-free copper. Pure copper and oxygen-free copper have good heat transfer performance, but they are more expensive. When integrally molded radiators are made of pure copper or oxygen-free copper, the cost of the radiator is high. Although aluminum is cheaper than pure copper and oxygen-free copper, its heat transfer effect is worse, which can easily lead to insufficient heat transfer performance of the radiator. Therefore, integrally molded radiators cannot be reconciled in terms of cost reduction and ensuring heat transfer performance. In addition, the heat dissipation components 20 of the existing heat sink are evenly distributed on the substrate 10, and the shape and size of the heat dissipation components 20 are consistent. This makes the heat dissipation components 20 at all parts of the substrate 10 have the same obstruction effect on the heat exchange medium during the flow of the heat exchange medium, so that the flow velocity of the heat exchange medium is relatively uniform. However, the closer the heat exchange medium is to the outlet end 12 during the flow, the more heat it absorbs, resulting in a higher temperature of the heat exchange medium. Therefore, even with a uniform flow velocity, the heat exchange effect of the heat exchange medium is worse closer to the outlet end 12, resulting in a poor heat dissipation effect on the components near the heat sink outlet end 12.
[0035] The substrate 10 and heat sink 20 of the heat sink in this application are independently configured, allowing them to be manufactured separately. This enables the substrate 10 and heat sink 20 to be made of different materials. For example, the substrate 10 can be made of pure copper or oxygen-free copper, which have good thermal conductivity, thus increasing the heat transfer effect of the substrate 10. The heat sink 20 can be made of low-cost, high-performance materials such as aluminum. This ensures both good heat transfer effect and low cost. Moreover, the independent configuration of the substrate 10 and heat sink 20 allows for differentiated material design based on the functional requirements of different parts of the heat sink, making material selection more flexible.
[0036] In this application, the resistance of the heat exchange medium near the inlet end 11 of the heat exchanger is less than the resistance of the heat exchange medium near the outlet end 12. As a result, when the heat exchange medium flows to the vicinity of the outlet end 12, the flow velocity of the heat exchange medium slows down, allowing the heat exchange medium near the outlet end 12 to absorb the heat of the components near the outlet end 12 of the heat exchanger for a longer period of time, thereby increasing its heat exchange effect on the components near the outlet end 12 and increasing the overall heat dissipation efficiency of the heat exchanger.
[0037] In some feasible embodiments, the multiple heat sinks 20 are spaced apart, such that there is a gap between any two adjacent heat sinks 20. The multiple heat sinks 20 are arranged along the width and length directions of the substrate 10. For clarity, see [reference needed]. Figure 1 , Figure 1The X-axis is parallel to the length direction of the substrate 10, the Y-axis is parallel to the width direction of the substrate 10, and the Z-axis is parallel to the thickness direction of the substrate 10.
[0038] Combination Figure 2 As shown, some of the heat sinks 20 are spaced apart along the width direction of the substrate 10, forming a heat sink group. Multiple heat sinks 20 within a heat sink group are arranged in a straight line along the width direction of the substrate 10. Adjacent heat sinks 20 within the same heat sink group can be connected together by spacers 30. The substrate 10 has multiple heat sink groups spaced apart along its length, and these heat sink groups are arranged in parallel.
[0039] Along the length of the substrate 10, the heat sinks 20 in two adjacent heat sink groups are staggered, that is, as shown in the figure. Figure 2 As shown, when viewed from the top (Z-axis), any two adjacent heat sinks 20 are positioned differently in the width direction of the substrate 10. This means that they are arranged in a staggered pattern of high-low-high or low-high-low along the length of the substrate. This ensures that the heat exchange medium can contact each heat sink 20 during the flow process, thereby increasing the heat dissipation effect.
[0040] It should also be noted that, along the length of the substrate 10, the heat sinks 20 in the odd-numbered heat sink groups are arranged one-to-one, and the heat sinks 20 in the even-numbered heat sink groups are arranged one-to-one. That is, the number and arrangement of the heat sinks 20 in the odd-numbered heat sink groups are the same, and the number and arrangement of the heat sinks 20 in the even-numbered heat sink groups are the same.
[0041] In order to ensure that the heat sink 20 near the outlet end 12 has a greater resistance to the heat exchange medium than the heat sink 20 near the inlet end 11, the heat sink 20 can be arranged on the same substrate 10 in different ways. The following describes the arrangement of the heat sink 20 on the substrate 10.
[0042] See Figure 2 and Figure 3 As shown, in some feasible implementations, the heat exchange region is formed by multiple heat sinks 20 clustered within a region of the substrate 10, and the outer edge of the heat exchange region is composed of each heat sink 20 located at the outermost edge of that region. For example, as mentioned above, the heat sinks 20 are arranged along the length and width directions of the substrate 10, so the area enclosed by the outer edge of each heat exchange region is a square region, and the area of the substrate 10 occupied by this region is the area of the heat exchange region. Multiple heat exchange regions can be provided on the substrate 10. The areas of the multiple heat exchange regions can be all equal, partially equal, or all unequal, without any specific limitation. In this embodiment, the example of multiple heat exchange regions having equal areas is used for illustration.
[0043] It is worth mentioning that the side of the substrate 10 facing away from the heat sink 20 is the component mounting side. The component mounting position corresponds to the heat sink 20 in the heat exchange area. The blank area on the substrate 10 other than the heat exchange area is the heat sink and heat sink seal mounting area. The area of the blank area on the substrate 10 is related to the mounting and sealing design, while the specific area of the heat exchange area needs to be designed according to the size of the component.
[0044] In this application, adjacent heat sinks 20 are spaced apart. The spacing between adjacent heat sinks 20 can be interpreted in two ways: one is the spacing between two adjacent heat sinks 20 within the same heat sink group; the other is the spacing between two adjacent heat sinks 20 located within two adjacent heat sink groups. In this embodiment, whether it's two adjacent heat sinks 20 within the same heat sink group or two adjacent heat sinks 20 located in adjacent heat sink groups, the spacing between adjacent heat sinks 20 is 1.8-2.5 mm along the length direction of the substrate 10, and also 1.8-2.5 mm along the width direction of the substrate 10.
[0045] In some feasible implementations, the total projected area of the heat sink 20 in each heat exchange region on the substrate 10 accounts for 20%-40% of the area of the corresponding heat exchange region. This ratio is adopted because the heat sink is produced by forging, and the area of the heat sink 20 in the heat exchange region is 20%-40%, which can achieve good heat exchange effect while ensuring the strength of the forging die.
[0046] In this application, when the resistance of the heat exchange region near the outlet end 12 to the heat exchange medium is greater than that of the heat exchange region near the inlet end 11, the ratio of the total projected area of the heat dissipation element 20 on the substrate 10 to the area of the corresponding heat exchange region in each heat exchange region can be equal or unequal. When the ratio of the total projected area of the heat dissipation element 20 on the substrate 10 to the area of the corresponding heat exchange region in each heat exchange region is equal, for example, the total projected area of the heat dissipation element 20 can all be 20%, 25%, or 40% of the area of the corresponding heat exchange region, the resistance of the heat dissipation element 20 to the heat exchange medium can be changed by altering the shape of the surface in contact with the heat dissipation element 20.
[0047] Specifically, see Figures 2 to 5As shown, the heat sink 20 includes a heat exchange medium contact surface 21, which serves as the end face where the heat sink 20 and the heat exchange medium contact. When the heat sink 20 is installed, in the heat exchange region near the inlet end 11, the heat exchange medium contact surface 21 of the heat sink 20 faces the inlet end 11, and the heat exchange medium contact surface 21 is either a plane or a convex surface protruding towards the inlet end 11; in the heat exchange region near the outlet end 12, the heat exchange medium contact surface 21 of the heat sink 20 faces the inlet end 11, and the heat exchange medium contact surface 21 is a concave surface recessed away from the inlet end 11. In this way, when the heat exchange medium flows in the heat exchange area near the inlet end 11, the end face of the heat dissipation component 20 facing the heat exchange medium is convex or flat, while when the heat exchange medium flows in the heat exchange area near the outlet end 12, the end face of the heat dissipation component 20 facing the heat exchange medium is concave. Convex and flat surfaces are more conducive to the flow of the heat exchange medium than concave surfaces. Therefore, the flow velocity of the heat exchange medium in the heat exchange area near the outlet end 12 is slower than that in the heat exchange area near the inlet end 11. This can reduce the heat absorbed by the heat exchange medium when it flows to the heat exchange area at the outlet end 12, and also help to increase the residence time of the heat exchange medium in the heat exchange area near the outlet end 12, thereby increasing its heat absorption efficiency and ensuring the heat exchange effect.
[0048] In this embodiment, the heat exchange medium contact surface 21 of the heat exchange component 20 in the heat exchange area near the inlet end 11 is a convex arc surface, and the heat exchange medium contact surface 21 of the heat exchange component 20 in the heat exchange area near the outlet end 12 is a concave arc surface.
[0049] When the heat exchange medium contact surface 21 is a convex arc surface or a concave arc surface, the dimensions of the convex and concave surfaces can be the same or different. For ease of manufacturing, this application sets the dimensions of the convex and concave surfaces of the heat exchange medium contact surface 21 to be the same. For example, see... Figure 4 and Figure 5 As shown, Figure 4 The heat exchange medium contact surface 21 of the heat exchange component 20 shown is an outwardly convex arc surface, where the dashed line H1 is the chord length of the heat exchange medium contact surface 21 and the dashed line H2 is the arc height of the heat exchange medium contact surface 21. Figure 5 The heat exchange medium contact surface 21 of the heat sink 20 shown is a concave arc surface, where the dashed line L1 is the chord length of the heat exchange medium contact surface 21 and the dashed line L2 is the arc height of the heat exchange medium contact surface 21. L1 = H1, L2 = H2, H1 can be 1.8-2.5mm, and H2 can be 0.2-0.5mm.
[0050] For example, the chord length of the heat exchange medium contact surface 21 can be 1.8 mm, 2.1 mm or 2.5 mm, and the bow height of the heat exchange medium contact surface 21 can be 0.2 mm, 0.3 mm or 0.5 mm.
[0051] For example, in this embodiment, two heat exchange regions can be provided on the substrate 10. At this time, the two heat exchange regions are adjacent, one heat exchange region is close to the inlet end 11, and the other heat exchange region is close to the outlet end 12. The heat exchange medium contact surface 21 of the heat sink 20 in the heat exchange region close to the inlet end 11 is a convex surface that protrudes outward toward the inlet end 11, and the heat exchange medium contact surface 21 of the heat sink 20 in the heat exchange region close to the outlet end 12 is a concave surface that is recessed inward toward the inlet end 11.
[0052] For example, in this embodiment, the number of heat exchange regions provided on the substrate 10 can be greater than two, such as three heat exchange regions, specifically including a first region, a second region, and a third region. The second region is located between the first region and the third region. The first region is close to the inlet end 11, and the third region is close to the outlet end 12. The heat exchange medium contact surface 21 of the heat sink 20 in the first region is a convex surface convex outward toward the inlet end 11, and the heat exchange medium contact surface 21 of the heat sink 20 in the third region is a concave surface concave inward toward the inlet end 11. The heat exchange medium contact surface 21 of the heat sink 20 in the second region can be a plane, a concave surface concave inward toward the inlet end 11, or a convex surface convex outward toward the inlet end 11. When the heat exchange medium contact surface 21 of the heat sink 20 in the second region is a concave surface facing away from the inlet end 11, its bow height is less than that of the heat exchange medium contact surface 21 of the heat sink 20 in the third region; when the heat exchange medium contact surface 21 of the heat sink 20 in the second region is a convex surface facing outward from the inlet end 11, its bow height is less than that of the heat exchange medium contact surface 21 of the heat sink 20 in the first region.
[0053] See Figure 6 As shown, in some feasible implementations, when the area of each heat exchange region is equal, and the ratio of the total projected area of the heat sink 20 on the substrate 10 to the corresponding heat exchange region area in each heat exchange region is unequal, along the direction from the inlet end 11 to the outlet end 12 of the substrate 10, the total projected area of the heat sink 20 on the substrate 10 in the later heat exchange region is greater than that in the earlier heat exchange region. This relatively increases the heat absorption capacity of the heat sink 20 in the later heat exchange region. Furthermore, as the heat exchange medium flows from the inlet end 11 to the outlet end 12, the contact area between the heat sink 20 and the heat exchange medium in the heat exchange region gradually increases, increasing the heat absorbed by the heat exchange medium during flow, thus increasing the heat absorption efficiency and consequently improving the heat dissipation effect of the radiator. In addition, the increased contact area between the heat sink 20 and the heat exchange medium can also increase the resistance to the flow of the heat exchange medium, reduce the flow velocity of the heat exchange medium, further increase the heat absorption efficiency of the heat exchange medium, and enhance the heat exchange effect.
[0054] For example, in this embodiment, the projected area of the heat sink 20 on the substrate 10 can increase sequentially from the inlet end 11 to the outlet end 12. That is, the projected area of the heat sink 20 near the inlet end 11 on the substrate 10 is the smallest, and the projected area of the heat sink 20 near the outlet end 12 on the substrate 10 is the largest.
[0055] Specifically, in this embodiment, at least two heat exchange regions are provided on the substrate 10, such as two, three, or more. This embodiment uses three heat exchange regions on the substrate 10 as an example for explanation. The three heat exchange regions are a first region, a second region, and a third region provided from the inlet end 11 to the outlet end 12, respectively. See [link to documentation]. Figure 6 The dashed box areas shown are, from left to right, the first area, the second area, and the third area.
[0056] As described above, the total projected area of the heat sink 20 in a heat exchange region on the substrate 10 is 20%-40% of the corresponding heat exchange region. In this embodiment, the total projected area of the heat sink 20 in the second region on the substrate 10 accounts for 25%-30% of the area of the second region. The total projected area of the heat sink 20 in the first region on the substrate 10 is less than or equal to 90% of the total projected area of the heat sink 20 in the second region on the substrate 10, and is at least 20% of the area of the first region. The total projected area of the heat sink 20 in the third region on the substrate 10 is greater than or equal to 120% of the total projected area of the heat sink 20 in the second region on the substrate 10, and is at most 40% of the area of the third region. This application ensures the heat exchange effect at the outlet end 12 when the heat exchange medium flows from the inlet end 11 to the outlet end 12 of the substrate 10 by gradually increasing the projected area of the heat sink 20 from the first region to the third region.
[0057] For example, the total projected area of the heat sink 20 in the first region on the substrate 10 is 22.5% of the area of the first region, the total projected area of the heat sink 20 in the second region on the substrate 10 is 29% of the area of the second region, and the total projected area of the heat sink 20 in the third region on the substrate 10 is 37.5% of the area of the third region.
[0058] In some feasible implementations, the heat sinks 20 in different heat exchange zones have the same shape and size, but the number of heat sinks 20 in different heat exchange zones is different. For example, in this embodiment, the heat sinks 20 are all cylindrical in shape and have the same radius. The distance between two adjacent heat sinks 20 in the heat exchange zone near the outlet end 12 is smaller than the distance between two adjacent heat sinks 20 in the heat exchange zone near the inlet end 11.
[0059] For more details, see Figure 6As shown, in one embodiment, the spacing between two adjacent columns of heat sinks 20 in each heat exchange region is equal, that is, the spacing between the first column of heat sinks 20 and the second column of heat sinks 20 is equal to the spacing between the second column of heat sinks 20 and the third column of heat sinks 20. Taking the spacing between the first and third columns of heat sinks 20 in each heat exchange region as an example, the spacing between the first and third columns in the first region is S1, the spacing between the first and third columns in the second region is S2, and the spacing between the first and third columns in the third region is S3, where S1>S2>S3. Since the spacing between adjacent columns of heat sinks 20 in the first, second, and third regions is equal, along the length direction of the substrate 10, the spacing between two adjacent heat sinks 20 in the first region along the X-axis direction is greater than the spacing between two adjacent heat sinks 20 in the second region along the X-axis direction, and the spacing between two adjacent heat sinks 20 in the second region along the X-axis direction is greater than the spacing between two adjacent heat sinks 20 in the third region along the X-axis direction.
[0060] It should be noted that since the areas of the first region, the second region, and the third region are equal, when the heat sink 20 in the first region, the heat sink 20 in the second region, and the heat sink 20 in the third region satisfy that their shapes and sizes are equal and S1>S2>S3, the number of heat sink 20 in the first region, the number of heat sink 20 in the second region, and the number of heat sink 20 in the third region increase sequentially, thereby achieving a gradual increase in the total projected area of the heat sink 20 in the first region, the second region, and the third region on the substrate 10.
[0061] In another embodiment, the spacing between two adjacent rows of heat sinks 20 within the same heat exchange region is unequal. Specifically, along the direction from the inlet end 11 to the outlet end 12 of the substrate 10, the spacing between two adjacent rows of heat sinks 20 can decrease sequentially. That is, even if located within the same heat exchange region, the spacing between two adjacent heat sinks 20 decreases sequentially from the inlet end 11 to the outlet end 12 of the substrate 10.
[0062] See Figure 7 As shown, in some other possible implementations, the spacing between any two adjacent heat sinks 20 can be kept equal, so that the spacing between adjacent heat sinks 20 in different heat exchange areas is the same. Then, the total projected area of the heat sinks 20 on the substrate 10 in the heat exchange area can be changed by changing the size of the heat sinks 20.
[0063] Specifically, in this embodiment, the spacing between two adjacent heat sinks 20 refers to the spacing between the centers of the two adjacent heat sinks 20. Along the direction from the inlet end 11 to the outlet end 12, the projected area of a single heat sink 20 in the subsequent heat exchange region on the substrate 10 is greater than the projected area of a single heat sink 20 in the previous heat exchange region on the substrate 10. Furthermore, the number of heat sinks 20 in the first region, the number of heat sinks 20 in the second region, and the number of heat sinks 20 in the third region are all equal. Thus, the total projected area of the heat sinks 20 in the first region on the substrate 10 is less than the total projected area of the heat sinks 20 in the second region on the substrate 10, and the total projected area of the heat sinks 20 in the second region on the substrate 10 is less than the total projected area of the heat sinks 20 in the third region on the substrate 10.
[0064] See Figure 8 As shown, in some feasible methods, when the total projected area of the heat sink 20 in different heat exchange regions on the substrate 10 is changed, the shape of the heat exchange medium contact surface 21 of the heat sink 20 can also be changed. For example, when three heat exchange regions, namely a first region, a second region, and a third region, are sequentially arranged from the inlet end 11 to the outlet end 12 of the substrate 10, and the total projected area of the heat sink 20 in the first region, the second region, and the third region on the substrate 10 increases sequentially, the heat exchange medium contact surface 21 of the heat sink 20 in the first region faces the inlet end 11 and is a convex surface protruding towards the inlet end 11; the heat exchange medium contact surface 21 of the heat sink 20 in the third region faces the inlet end 11 and is a concave surface recessed away from the inlet end 11; the heat exchange medium contact surface 21 of the heat sink 20 in the second region is not limited.
[0065] Finally, it should be noted that the heat sink of this application has multiple heat exchange areas on the substrate 10. The heat sink components 20 in different heat exchange areas are either arranged differently, have different sizes, or have different shapes. When manufacturing the heat sink, if the substrate 10 and the heat sink components 20 of this application are integrally formed, then in addition to the need for different equipment for forming the substrate 10 and the heat sink components 20, each heat sink component 20 in each heat exchange area on the substrate 10 needs to be formed using different equipment to finally achieve the desired result. However, this application sets the substrate 10 and the heat sink components 20 independently, which allows the substrate 10 and the heat sink components 20 to be formed independently. This allows the substrate 10 and the heat sink components 20 to be processed simultaneously, shortening the processing time and increasing efficiency. In addition, only the heat sink components 20 need to be produced in a predetermined shape or size. When the heat sink components 20 are installed on the substrate 10, they can be arranged according to the requirements. This saves equipment costs and increases production efficiency compared to manufacturing a heat sink with the substrate 10 and the heat sink components 20 integrally formed.
[0066] This application also provides an electronic device applicable to fields including but not limited to the automotive industry. For example, if the electronic device of this application is applied to an automobile, it may include, but is not limited to, automotive IGBT power modules. The electronic device of this application includes a device body, components, and the aforementioned heat sink. The heat sink is mounted on the device body for dissipating heat from the components.
[0067] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0068] In the description of this application, it should be understood that the terms "comprising" and "having" and any variations thereof used in the embodiments of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.
[0069] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the connection within two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.
[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A radiator, characterized in that, include: A substrate having an inlet end and an outlet end for the passage of a heat exchange medium; as well as Multiple heat sinks are provided, and the heat sinks and the substrate are separately arranged. The heat sinks are fixedly connected to the substrate. The heat sinks are arranged at intervals on the substrate. Some of the heat sinks are combined to form a heat exchange region. At least two heat exchange regions are formed between the inlet end and the outlet end of the substrate. When the heat exchange medium flows from the inlet end to the outlet end, it passes through the heat exchange region. The resistance of the heat exchange region near the inlet end to the heat exchange medium is less than the resistance of the heat exchange region near the outlet end to the heat exchange medium.
2. The radiator according to claim 1, characterized in that, Multiple heat sinks are spaced apart along the width direction of the substrate to form a heat sink group. Multiple heat sink groups are spaced apart along the length direction of the substrate, and the heat sinks in adjacent heat sink groups are staggered.
3. The radiator according to claim 2, characterized in that, Along the length direction of the substrate, the spacing between two adjacent heat sinks is 1.8-2.5 mm, and along the width direction of the substrate, the spacing between two adjacent heat sinks is 1.8-2.5 mm.
4. The radiator according to claim 2, characterized in that, The areas of the multiple heat exchange regions are equal, and the total projected area of the heat dissipation components in each heat exchange region on the substrate accounts for 20%-40% of the area of the corresponding heat exchange region. In the direction from the inlet end to the outlet end, the projected area of the heat dissipation components in the later heat exchange region on the substrate is greater than or equal to the projected area of the heat dissipation components in the previous heat exchange region on the substrate.
5. The radiator according to claim 4, characterized in that, The substrate has three heat exchange zones, namely a first zone, a second zone, and a third zone, which are arranged from the inlet end to the outlet end. The total projected area of the heat sink in the second zone on the substrate accounts for 25%-30% of the area of the second zone. The total projected area of the heat sink in the first zone on the substrate is less than or equal to 90% of the total projected area of the heat sink in the second zone on the substrate. The total projected area of the heat sink in the third zone on the substrate is greater than or equal to 120% of the total projected area of the heat sink in the second zone on the substrate.
6. The radiator according to any one of claims 1-5, characterized in that, The heat sink includes a heat exchange medium contact surface facing the inlet end; wherein, in the heat exchange region near the inlet end, the heat exchange medium contact surface of the heat sink is a convex surface protruding towards the inlet end; in the heat exchange region near the outlet end, the heat exchange medium contact surface of the heat sink is a concave surface recessed away from the inlet end.
7. The radiator according to claim 6, characterized in that, In the heat exchange area near the inlet end, the heat exchange medium contact surface of the heat sink is a convex arc surface, and in the heat exchange area near the outlet end, the heat exchange medium contact surface of the heat sink is a concave arc surface. The chord length of both the convex and concave arc surfaces is 1.8-2.5 mm, and the arc height is 0.2-0.5 mm.
8. The radiator according to any one of claims 1-5, characterized in that, The heat dissipation components in different heat exchange zones have the same shape and size, and the number of heat dissipation components in the heat exchange zone near the outlet end is greater than the number of heat dissipation components in the heat exchange zone near the inlet end.
9. The radiator according to any one of claims 1-5, characterized in that, Along the direction from the inlet end to the outlet end, the number of heat dissipation components in the subsequent heat exchange area is equal to the number of heat dissipation components in the previous heat exchange area, and the projected area of a single heat dissipation component in the subsequent heat exchange area on the substrate is greater than the projected area of a single heat dissipation component in the previous heat exchange area on the substrate.
10. An electronic device, characterized in that, Includes the device body and the heat sink as described in any one of claims 1-9.