Strip-shaped clamp for MEMS device

Abstract

The utility model relates to the technical field of MEMS device packaging, and particularly discloses a strip-shaped clamp for an MEMS device, and the MEMS device comprises an MEMS sensor and a special integrated circuit needing to be subjected to an injection molding process; the strip-shaped clamp comprises a frame part and a central part; the central part comprises a plurality of parallel long strip parts which are arranged at intervals; the two ends of each long strip part in the plurality of long strip parts are respectively connected with the frame part so as to form a plurality of strip-shaped openings; the corners of the strip-shaped opening are arranged to be fillets; and under the condition that the MEMS device is arranged below the strip-shaped clamp, the strip-shaped opening is used for exposing an application-specific integrated circuit of the MEMS device so as to carry out an injection molding process, and the strip-shaped part is used for covering an MEMS sensor of the MEMS device. According to the strip-shaped clamp, the cleaning difficulty can be reduced, the manufacturing cost can be reduced, the influence of sputtered resin points in the injection molding process on the performance of the MEMS device can be effectively prevented, and the packaging yield of the MEMS device is effectively improved.

Description

Technical Field

[0001] This specification relates to the field of MEMS device packaging technology, and in particular to a strip clamp for MEMS devices. Background Technology

[0002] In MEMS (Micro-Electro-Mechanical System) device packaging technology, the epoxy resin jetting process is a critical packaging step, and its quality directly affects the reliability and yield of the device. In traditional processes, epoxy resin satellites generated during high-speed injection molding are randomly sputtered into the packaging area due to factors such as jet pressure fluctuations and material viscosity changes. The resulting defect rate has become a major bottleneck restricting the improvement of MEMS packaging yield.

[0003] In existing technologies, to prevent contamination of the packaging area of ​​MEMS devices, a fixture has been proposed. This fixture has multiple windows to expose the application-specific integrated circuits (ASICs) of the MEMS device that require injection molding. The fixture includes multiple staggered horizontal and vertical bars to cover the MEMS sensor and the protective ring surrounding the MEMS sensor and ASIC, preventing epoxy resin from sputtering onto the MEMS sensor and protective ring. However, the inventors have found that this fixture has many cleaning dead zones, making it difficult to clean, and its manufacturing process is complex and costly.

[0004] There is currently no effective solution to the above problems. Utility Model Content

[0005] This specification provides a strip fixture for MEMS devices to solve the problems of existing fixtures for MEMS devices having many hard-to-clean areas, complex manufacturing processes, and high costs.

[0006] This specification provides a strip fixture for MEMS devices, including MEMS sensors and application-specific integrated circuits (ASICs) that require injection molding.

[0007] The strip clamp includes a frame portion and a central portion; the central portion includes a plurality of parallel strip portions spaced apart; the two ends of each of the plurality of strip portions are respectively connected to the frame portion to form a plurality of strip-shaped openings;

[0008] When the MEMS device is positioned below the strip-shaped fixture, the strip-shaped opening exposes the dedicated integrated circuit of the MEMS device for injection molding, and the elongated portion is used to cover the MEMS sensor of the MEMS device.

[0009] In one embodiment, the corners of the strip-shaped opening are rounded.

[0010] In one embodiment, the plurality of strip-shaped openings includes a first strip-shaped opening, a second strip-shaped opening, and a third strip-shaped opening; the first strip-shaped opening and the second strip-shaped opening are strip-shaped openings located at both ends in a direction perpendicular to the elongated portion; the third strip-shaped opening is any other strip-shaped opening among the plurality of strip-shaped openings besides the first strip-shaped opening and the second strip-shaped opening; the width of the first strip-shaped opening and the second strip-shaped opening is greater than the width of the third strip-shaped opening;

[0011] When the MEMS device is positioned below the strip clamp, the first strip opening and the second strip opening are also used to expose reference points on the MEMS device for positioning.

[0012] In one embodiment, the strip clamp is made of 8407 mold steel and has a Rockwell hardness of HRC52 to HRC54.

[0013] In one embodiment, the surface of the strip clamp is blackened.

[0014] In one embodiment, the reflectivity of the blackened surface of the strip clamp is less than 10%.

[0015] In one embodiment, the central angle corresponding to the rounded corner is 10° to 20°.

[0016] In one embodiment, the ratio between the width of the elongated portion and the width of the MEMS sensor is 1.0 to 1.4.

[0017] In one embodiment, the MEMS device is a printed circuit board equipped with one or more MEMS microphones.

[0018] In one embodiment, the MEMS microphone includes a MEMS sensor, an application-specific integrated circuit (ASIC), and a protective ring surrounding the MEMS sensor and the ASIC.

[0019] With the MEMS microphone positioned below the strip clamp, the elongated portion covers the MEMS sensor and a pair of sides of the protective ring parallel to the elongated portion, while the application-specific integrated circuit and a pair of sides of the protective ring perpendicular to the elongated portion are exposed from the strip opening.

[0020] In one embodiment, the printed circuit board is provided with multiple rows of MEMS microphones corresponding to the elongated sections, and the number of MEMS microphones in each row is 30 to 40.

[0021] In one embodiment, the thickness of the border portion is greater than the thickness of the central portion;

[0022] The strip clamp has a recess formed on at least one surface at the central portion.

[0023] The strip clamp also includes a clamping block disposed in the recess, wherein when the MEMS device is disposed in the recess, the clamping block and the strip clamp clamp the MEMS device.

[0024] In one embodiment, there are multiple clamping blocks, which are disposed around the periphery of the central portion and do not cover the strip-shaped opening.

[0025] This specification provides a strip-shaped fixture for a MEMS device, including a MEMS sensor and an application-specific integrated circuit (ASIC) requiring injection molding. The strip-shaped fixture includes a frame portion and a central portion. The central portion includes a plurality of parallel elongated sections spaced apart. Each elongated section has its two ends connected to the frame portion to form a plurality of strip-shaped openings. The corners of the strip-shaped openings are rounded. When the MEMS device is positioned below the strip-shaped fixture, the strip-shaped openings expose the ASIC of the MEMS device for injection molding. The elongated sections cover the MEMS sensor of the MEMS device. Compared to fixtures in the prior art, the strip-shaped fixture in this embodiment only includes a plurality of parallel elongated sections spaced apart from each other in the central portion, without any perpendicular elongated sections. This significantly reduces the number of cleaning dead zones, thus greatly reducing the cleaning difficulty and improving the cleaning efficiency. Furthermore, compared to setting the angles, the corners of the multiple strip-shaped openings formed in the strip fixture in this embodiment are all rounded, making them easier to clean and further reducing cleaning difficulty and improving cleaning efficiency. In addition, compared to existing fixtures that include both horizontal and vertical strips, the strip fixture in this embodiment only includes multiple parallel elongated sections, which greatly simplifies the manufacturing process and reduces the required materials, thereby effectively reducing the manufacturing cost of the strip fixture. Moreover, for MEMS devices with large injection molding spaces, the probability of resin splashing onto the protective ring during the injection molding of the dedicated integrated circuit is inherently low. Therefore, the MEMS sensor area of ​​the MEMS device is a critical protection area. Using the strip fixture in this embodiment can cover the MEMS sensor area, effectively meeting the low contamination rate requirement of the MEMS packaging area, achieving good protection of the MEMS device packaging area, effectively preventing resin splashes during the injection molding process from affecting the performance of the MEMS device, and effectively improving the packaging yield of the MEMS device.

[0026] Specific embodiments of the present invention are disclosed in detail with reference to the following description and accompanying drawings, indicating how the principles of the present invention can be adopted. It should be understood that the embodiments of the present invention are not limited in scope. Features described and / or shown for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0027] It should be emphasized that the term "comprising / including" as used herein refers to the presence of a feature, part, step, or component, but does not exclude the presence or addition of one or more other features, parts, steps, or components. Attached Figure Description

[0028] The accompanying drawings described herein are for illustrative purposes only and are not intended to limit the scope of this invention in any way. Furthermore, the shapes and proportions of the components in the drawings are merely schematic to aid in understanding the invention and do not specifically limit the shapes and proportions of the components. Those skilled in the art, under the guidance of this invention, can select various possible shapes and proportions to implement this invention according to specific circumstances. In the drawings:

[0029] Figure 1 A schematic diagram of a strip clamp for MEMS devices according to one embodiment of this specification is shown;

[0030] Figure 2 A schematic diagram of a strip clamp for a MEMS device according to one embodiment of this specification is shown;

[0031] Figure 3 A schematic diagram of a strip clamp for a MEMS device according to one embodiment of this specification is shown;

[0032] Figure 4 A schematic diagram of a strip clamp for a MEMS device according to one embodiment of this specification is shown;

[0033] Figure 5 A schematic diagram of the structure of a MEMS microphone on a printed circuit board according to one embodiment of this specification is shown;

[0034] Figure 6 A partially enlarged view of the bar clamp for a MEMS device in one embodiment of this specification after being engaged with the MEMS device is shown.

[0035] The reference numerals in the above figures are as follows:

[0036] 100. Strip-shaped clamp; 101. Frame portion; 102. Central portion; 121. Long strip portion; 122. Strip-shaped opening; 1221. First strip-shaped opening; 1222. Second strip-shaped opening; 1223. Third strip-shaped opening;

[0037] 200. MEMS devices; 201. MEMS sensors; 202. Application-specific integrated circuits (ASICs); 203. Guard rings; 204. MEMS microphones. Detailed Implementation

[0038] The principles and spirit of this specification will now be described with reference to several exemplary embodiments. It should be understood that these embodiments are given merely to enable those skilled in the art to better understand and implement this specification, and are not intended to limit the scope of this specification in any way. Rather, these embodiments are provided to make this disclosure more thorough and complete, and to fully convey the scope of this disclosure to those skilled in the art.

[0039] The details of this utility model can be more clearly understood by referring to the accompanying drawings and the description of specific embodiments. However, the specific embodiments of this utility model described herein are only for explaining the purpose of this utility model and should not be construed as limiting this utility model in any way. Under the teachings of this utility model, those skilled in the art can conceive of any possible modifications based on this utility model, and these should all be considered to fall within the scope of this utility model. It should be noted that when an element is referred to as being "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there may be an intervening element. The terms "mounted," "connected," and "connected" should be interpreted broadly, for example, it can be a mechanical connection or an electrical connection, or it can be a connection within two elements, which can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this specification belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this specification. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0041] Existing fixtures have multiple windows to expose the application-specific integrated circuits (ASICs) of MEMS devices that require injection molding. The fixtures include multiple staggered horizontal and vertical bars to cover the MEMS sensors and the protective rings surrounding the MEMS sensors and ASICs, preventing epoxy resin from sputtering onto the MEMS sensors and protective rings. However, the inventors have found that traditional fixtures, with their interlaced grid structure of horizontal and vertical bars, create numerous intersecting corners, allowing resin residue to easily hide in the gaps between these intersections, creating cleaning blind spots that are difficult to clean. Furthermore, the manufacturing process is complex and costly. In addition, the inventors' research revealed that contamination in the protective ring area accounts for a very small percentage of total defects, while critical defects are mainly concentrated in the laterally arranged sensitive areas of the MEMS (i.e., the MEMS sensor area). In other words, lateral contamination is dominant. Therefore, the inventors propose selective protection for MEMS devices, focusing on protecting the laterally arranged MEMS sensor area. Moreover, for MEMS devices with a large spray area, during injection molding, due to the high precision of the nozzle, the probability of spraying onto the longitudinal protective ring is very small, thus allowing for focused protection of the transverse MEMS devices.

[0042] Based on the above, this specification provides a strip-shaped fixture for MEMS devices. MEMS devices include MEMS sensors and application-specific integrated circuits (ASICs) that require injection molding. Please refer to... Figures 1 to 4 This diagram illustrates a structural schematic of a strip clamp used for MEMS devices in an embodiment of this specification. Figures 1 to 4 As shown, the strip clamp 100 may include a border portion 101 and a central portion 102.

[0043] In some embodiments, the thickness of the border portion 101 is greater than the thickness of the central portion 102.

[0044] The border portion 101 serves as the main support structure. The central portion 102 may include a plurality of parallel elongated portions 121 spaced apart from each other. The two ends of each elongated portion 121 are respectively connected to the border portion 101 to form a plurality of strip-shaped openings 122, that is, to form an array of strip-shaped openings 122.

[0045] With the MEMS device positioned below the strip fixture 100, the strip opening 122 exposes the application-specific integrated circuit (ASIC) of the MEMS device for injection molding. The elongated section 121 is used to cover the MEMS sensor of the MEMS device.

[0046] MEMS sensors are extremely sensitive to contamination. Since the protective ring is located around the MEMS sensor and ASIC, the probability of resin splashing at satellite points decreases exponentially with distance when the injection molding space is large. Therefore, in this embodiment, the strip-shaped fixture 100 completely covers the MEMS sensor area through the elongated section 121, while the ASIC is exposed through the strip-shaped opening 122. This achieves precise shielding in terms of protection priority, avoiding the structural redundancy and cleaning difficulties caused by excessive protection of non-critical areas by traditional fixtures.

[0047] In the above embodiments, the central portion 102 of the strip clamp 100 includes only a plurality of parallel elongated portions 121 spaced apart from each other, without any perpendicular elongated portions 121. This greatly reduces the number of cleaning dead spots. Therefore, the cleaning difficulty of the strip clamp 100 in this embodiment is greatly reduced, the cleaning efficiency is greatly improved, and the service life of the strip clamp 100 can be effectively extended. In addition, compared with the clamps in the prior art that include both horizontal and vertical bars, the strip clamp 100 in this embodiment only includes a plurality of parallel elongated portions 121, which greatly simplifies the manufacturing process and reduces the required materials, thereby effectively reducing the manufacturing cost of the strip clamp 100. Furthermore, for MEMS devices with large injection molding spaces, the probability of resin splashing onto the protective ring during the injection molding of the dedicated integrated circuit is inherently low. Therefore, the MEMS sensor area of ​​the MEMS device is a critical protection area. The strip fixture 100 in this embodiment can cover the MEMS sensor area, which can effectively meet the requirement of low contamination rate in the MEMS packaging area, achieve good protection of the packaging area of ​​the MEMS device, effectively prevent resin splashes during the injection molding process from affecting the performance of the MEMS device, and effectively improve the packaging yield of the MEMS device.

[0048] In some embodiments of this specification, the strip clamp 100 is made of 8407 mold steel with a Rockwell hardness of HRC52 to HRC54. Using 8407 mold steel to manufacture the strip clamp 100 improves its bending resistance and stability, preventing it from bending downwards and damaging the MEMS device surface. Furthermore, compared to traditional materials (such as stainless steel) which require more frequent replacements due to bending deformation or surface wear, the use of 8407 mold steel with a Rockwell hardness of HRC52 to HRC54 in this embodiment significantly reduces the replacement frequency and extends the service life.

[0049] In some embodiments of this specification, the surface of the strip clamp 100 is blackened. By blackening the surface of the strip clamp 100, ambient light interference can be reduced when measuring the flatness of the strip clamp 100, making it easier for the machine to measure the flatness of the strip clamp 100 surface and improving the accuracy of the measurement.

[0050] In one embodiment, a blackening treatment can be achieved by forming an Fe3O4 oxide film of approximately 5-15 μm thickness on the surface of 8407 mold steel using an alkaline oxidation process, thereby reducing the surface reflectivity from 60%-70% of a metallic mirror finish to below 10%-15%.

[0051] In some embodiments of this specification, the reflectivity of the blackened surface of the strip clamp 100 is less than 10%. Reducing the reflectivity of the oxide film surface of the strip clamp 100 to below 10% (e.g., below 5%) through blackening significantly reduces ambient light interference, enabling the laser / structured light measurement system to accurately capture surface morphology features and improve measurement accuracy. Furthermore, the blackening process also provides rust prevention.

[0052] In some embodiments of this specification, the ratio between the width of the elongated portion 121 and the width of the MEMS sensor is 1.0 to 1.4. By setting the width of the elongated portion 121 to be 1 to 1.4 times the width of the MEMS sensor, the elongated portion 121 can protect not only the MEMS sensor but also the protective ring located around the MEMS sensor, thereby further improving protection efficiency, reducing contamination rate, and thus improving the packaging yield of MEMS devices. Through hierarchical protection of absolute protection of the sensor core area plus protection ring buffer coverage, an optimal solution is found between structural complexity, material usage, and protection effectiveness, which not only meets the protection requirements of MEMS devices but also avoids over-design while improving packaging yield.

[0053] In some embodiments of this specification, the MEMS device 200 is a printed circuit board provided with one or more MEMS microphones 204. Please refer to... Figure 5 As shown. Figure 5 As shown, multiple MEMS microphones 204 can be set on the printed circuit board.

[0054] like Figure 5 As shown, in some embodiments of this specification, the MEMS microphone 204 may include a MEMS sensor 201, an application-specific integrated circuit (ASIC) 202, and a protective ring 203 surrounding the MEMS sensor 201 and the ASIC 202. Please refer to... Figure 6 This diagram illustrates the structure of a MEMS device positioned beneath a strip clamp. Figure 6As shown, with the MEMS microphone 204 positioned below the strip clamp 100, the elongated portion 121 covers a pair of sides of the MEMS sensor 201 and the protective ring 203 parallel to the elongated portion 121, while the dedicated integrated circuit 202 and a pair of sides of the protective ring 203 perpendicular to the elongated portion 121 protrude from the strip opening 122. The strip clamp 100 not only protects the MEMS sensor 201 but also partially protects the protective ring 203, further improving protection efficiency, reducing contamination rate, and thus improving the packaging yield of the MEMS device 200.

[0055] The core sensitive area of ​​the MEMS microphone is the diaphragm structure (part of the MEMS sensor 201), and surface contamination directly affects the sound signal conversion efficiency. The protective ring 203 is typically a ring structure surrounding the sensor and ASIC. A pair of sides parallel to the elongated section 121 (set as the Y-axis direction) are adjacent to the sensor edge and are the main impact path for resin satellite points to splash along the long side of the fixture opening during injection molding. The other pair of sides perpendicular to the elongated section 121 (set as the X-axis direction) are close to the ASIC's solder pad area, requiring sufficient space to prevent the strip fixture 100 from obstructing the injection molding flow channel. The width of the elongated section 121 is set greater than the sensor width to ensure complete coverage of the sensor in the Y-axis direction and extends to the edge of the protective ring 203, forming a longitudinal protective band consisting of the core area of ​​the MEMS sensor 201 and the buffer zone of the protective ring 203. This gradient protection achieves efficient protection of the critical edges of the protective ring 203 with minimal structural redundancy.

[0056] Please refer to Figure 2 ,like Figure 2 As shown, in some embodiments of this specification, the corners of each of the plurality of strip-shaped openings 122 are rounded. The rounded corners of the strip-shaped openings 122 optimize the design from right angles, making residual resin at the rounded corners easier to clean due to a more uniform surface tension distribution, thus avoiding residual adsorption caused by stress concentration at right angles. Compared to setting them as right angles, the rounded corners of the plurality of strip-shaped openings 122 formed in the strip-shaped clamp 100 in this embodiment are easier to clean, further reducing cleaning difficulty and improving cleaning efficiency.

[0057] In some embodiments of this specification, biomimetic grooves can be provided on the rounded corner areas or elongated surfaces to reduce the adhesion of contaminants and achieve self-cleaning of the rounded corner areas or elongated surfaces. These biomimetic grooves can mimic the surface structures of natural organisms, such as the micro / nano structures of lotus leaves or the microstructure of the slip zones of pitcher plants, which possess self-cleaning properties. In one embodiment, a micron-scale array of protruding pillars (mimicking the superhydrophobic structure of lotus leaves) can be formed on the surface of the elongated section using laser micromachining. Combined with a roughened substrate treated with blackening, the epoxy resin droplet contact angle is greater than 150°, achieving a self-cleaning effect and significantly reducing satellite point residue compared to traditional smooth surfaces.

[0058] In some embodiments of this specification, the central angle corresponding to the rounded corner is 10° to 20°. By setting it to 10° to 20°, the difficulty of cleaning can be effectively reduced.

[0059] like Figures 1 to 4 As shown, in some embodiments of this specification, the plurality of strip-shaped openings 122 may include a first strip-shaped opening 1221, a second strip-shaped opening 1222, and a third strip-shaped opening 1223. The first strip-shaped opening 1221 and the second strip-shaped opening 1222 are strip-shaped openings 122 located at both ends in a direction perpendicular to the elongated portion 121. The third strip-shaped opening 1223 is any other strip-shaped opening 122 among the plurality of strip-shaped openings 122, excluding the first strip-shaped opening 1221 and the second strip-shaped opening 1222. The width of the first strip-shaped opening 1221 and the second strip-shaped opening 1222 is greater than the width of the third strip-shaped opening 1223. When the MEMS device 200 is disposed below the strip-shaped clamp 100, the first strip-shaped opening 1221 and the second strip-shaped opening 1222 are also used to expose reference points on the MEMS device 200 for positioning. By setting the width of the strip openings 122 at both ends to be greater than that of the middle strip opening 122, the reference points on the MEMS device 200 can be exposed to enable relative positioning of the MEMS device 200 and the fixture, thereby improving the positioning accuracy and thus improving the packaging yield of the MEMS device 200.

[0060] like Figure 5 As shown, in some embodiments of this specification, a plurality of long strips 121 corresponding to multiple rows of MEMS microphones 204 are provided on the printed circuit board. In some embodiments, the number of MEMS microphones 204 in each row is 30 to 40. When the number of MEMS microphones 204 in each row is 30-40, not only can the packaging of MEMS microphones 204 be achieved at a higher density, but also the number of resin droplets sprayed onto the protective ring 203 during injection molding is reduced.

[0061] In some embodiments of this specification, the thickness of the border portion 101 is greater than the thickness of the central portion 102. At least one surface of the strip clamp 100 has a recess at the central portion 102. The strip clamp 100 may further include a clamping block disposed in the recess, which, when the MEMS device 200 is disposed in the recess, clamps the MEMS device 200 with the clamping block and the strip clamp 100. By providing a recess in the central portion 102, it is convenient to mate the strip clamp 100 with the MEMS device 200 to be packaged, facilitating their positioning. Clamping the MEMS device 200 with the clamping block and the strip clamp 100 improves structural stability, thereby improving the stability of the package.

[0062] In some embodiments of this specification, multiple clamping blocks are used, positioned around the periphery of the central portion 102 without obstructing the strip-shaped opening 122. The force system of multiple clamping blocks eliminates torque deviation caused by single-point clamping, significantly improving displacement stability. Maintaining a safe distance between the clamping blocks and the strip-shaped opening 122 ensures reference point identification and the integrity of the injection molding flow channel. By using multiple clamping blocks to clamp the MEMS device 200 with the strip-shaped clamp 100, structural stability can be further improved.

[0063] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. For details, please refer to the foregoing descriptions of the relevant processing embodiments; they will not be repeated here.

[0064] It should be understood that the above description is for illustrative purposes and not for limitation. Many embodiments and applications beyond the provided examples will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of this specification should not be determined by reference to the above description, but rather by reference to the foregoing claims and the full scope of their equivalents.

[0065] The above description is merely a preferred embodiment of this specification and is not intended to limit this specification. Various modifications and variations can be made to the embodiments described herein by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this specification should be included within the scope of protection of this specification.

Claims

1. A strip clamp for MEMS devices, characterized in that, The MEMS device includes a MEMS sensor and a dedicated integrated circuit that requires an injection molding process; The strip clamp includes a frame portion and a central portion; the central portion includes a plurality of parallel strip portions spaced apart; the two ends of each of the plurality of strip portions are respectively connected to the frame portion to form a plurality of strip-shaped openings; When the MEMS device is positioned below the strip-shaped fixture, the strip-shaped opening exposes the dedicated integrated circuit of the MEMS device for injection molding, and the elongated portion is used to cover the MEMS sensor of the MEMS device.

2. The strip clamp according to claim 1, characterized in that, The strip clamp is made of 8407 mold steel, and / or the Rockwell hardness of the strip clamp is HRC52 to HRC54.

3. The strip clamp according to claim 2, characterized in that, The surface of the strip clamp is treated with a blackening process.

4. The strip clamp according to claim 3, characterized in that, The reflectivity of the surface of the strip clamp after blackening treatment is less than 10%.

5. The strip clamp according to claim 1, characterized in that, The corners of the strip-shaped opening are rounded.

6. The strip clamp according to claim 1, characterized in that, The ratio between the width of the elongated portion and the width of the MEMS sensor is 1.0 to 1.

4.

7. The strip clamp according to claim 1, characterized in that, The MEMS device is a printed circuit board equipped with one or more MEMS microphones.

8. The strip clamp according to claim 7, characterized in that, The MEMS microphone includes a MEMS sensor, an application-specific integrated circuit (ASIC), and a protective ring surrounding the MEMS sensor and the ASIC. With the MEMS microphone positioned below the strip clamp, the elongated portion covers the MEMS sensor and a pair of sides of the protective ring parallel to the elongated portion, while the application-specific integrated circuit and a pair of sides of the protective ring perpendicular to the elongated portion are exposed from the strip opening.

9. The strip clamp according to claim 7, characterized in that, The printed circuit board is provided with multiple rows of MEMS microphones corresponding to the elongated sections, with each row containing 30 to 40 MEMS microphones.

10. The strip clamp according to claim 1, characterized in that, The plurality of strip-shaped openings include a first strip-shaped opening, a second strip-shaped opening, and a third strip-shaped opening; the first strip-shaped opening and the second strip-shaped opening are strip-shaped openings located at both ends of the central portion in a direction perpendicular to the elongated portion; The third strip opening is any other strip opening among the plurality of strip openings besides the first strip opening and the second strip opening; The widths of the first and second strip-shaped openings are greater than the width of the third strip-shaped opening; When the MEMS device is positioned below the strip clamp, the first strip opening and the second strip opening are also used to expose reference points on the MEMS device for positioning.

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