Shielding plate mounting structure and vehicle-mounted controller
By using a shielding plate composed of a non-metallic substrate and a metallic layer, combined with a non-metallic pillar connecting the circuit board, the problems of heavy weight and high cost of metal cover plates in electric vehicle control systems are solved, achieving the effects of lightweighting and electromagnetic interference resistance.
Patent Information
- Application Number
- CN202423038636.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2034-12-09
AI Technical Summary
In existing electric vehicle control systems, metal covers are heavy, costly, and prone to electromagnetic interference crosstalk.
A shielding plate consisting of a non-metallic substrate and a metal layer is used to connect the circuit board via non-metallic pillars, replacing the traditional metal cover plate. The metal layer is attached using processes such as electroplating, spraying, and sputtering, and a screwless connection method is adopted to prevent electromagnetic interference and crosstalk.
It reduces the weight and cost of shielding plates and controllers, prevents electromagnetic interference and crosstalk, and improves the reliability of electrical control.
Smart Images
Figure CN223899558U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of new energy vehicle technology, specifically to a shielding plate mounting structure and an on-board controller. Background Technology
[0002] Currently, for the control system of electric vehicles, such as the power electronic unit (PEU) in the electric drive system, in order to prevent the high voltage electric field generated by the internal capacitors and filter components as well as external electromagnetic interference, at least one metal cover plate needs to be installed in the power electronic unit (PEU). The material of the metal cover plate is generally a common metal shielding material. Its function is to prevent the high voltage field strength and electromagnetic interference generated by the capacitor components from having an adverse effect on the electronic components of the PCBA and other circuit boards. Utility Model Content
[0003] This utility model provides a shielding plate mounting structure and a vehicle-mounted controller to solve the technical problems of existing metal cover plates being heavy and costly.
[0004] According to one aspect of the present invention, a shielding plate mounting structure includes:
[0005] A shielding plate, the shielding plate comprising a non-metallic substrate and a metal layer, the non-metallic substrate being plate-shaped, and the metal layer covering at least one of the sides of the non-metallic substrate;
[0006] A circuit board is disposed on one side of the shielding plate, and the circuit board and the shielding plate are connected and fixed by non-metallic pillars;
[0007] An interference device is disposed on the side of the shielding plate opposite to the circuit board.
[0008] In some embodiments, the non-metallic substrate and non-metallic pillars are made of plastic, and the metal layer is made of nickel, aluminum, copper, gold, or silver.
[0009] In some embodiments, the metal layer is applied to the non-metallic substrate by electroplating, spraying, sputtering, physical vapor deposition, printing, or integral injection molding of an aluminum film.
[0010] In some embodiments, the non-metallic pillar and the non-metallic matrix are integrally formed; and / or,
[0011] The non-metallic column is not covered by the metallic layer.
[0012] In some embodiments, the non-metallic post is connected to the circuit board by thermal riveting; and / or,
[0013] The interference device is a capacitor, a filter component, or a power device; and / or,
[0014] A second shielding plate is also provided on the side of the circuit board opposite to the shielding plate.
[0015] In some embodiments, the shielding plate has a metal plate on the side opposite to the circuit board, and the metal plate is connected to the shielding plate by a metal post.
[0016] In some embodiments, the shielding plate is provided with a hole, and a metal insert is disposed in the hole, and the metal post is connected to the shielding plate through the metal insert.
[0017] In some embodiments, the metal insert and the shielding plate are integrally formed;
[0018] The metal column is connected to the shielding plate by riveting; and / or
[0019] The metal column and the metal plate are integrally formed; and / or,
[0020] The interference device is mounted on the metal plate.
[0021] In some embodiments, the metal plate is a water-cooled plate; and / or,
[0022] The metal plate and metal column are made of aluminum, copper or stainless steel.
[0023] According to another aspect of the present invention, a vehicle controller is provided, the vehicle controller including a shielding plate mounting structure according to any one of the above embodiments.
[0024] Compared with the prior art, the present invention has the following advantages:
[0025] The shielding plate mounting structure proposed in this embodiment of the utility model uses a shielding plate composed of a non-metallic substrate such as plastic and a metal layer to replace the metal parts used for electromagnetic shielding in the existing electric drive system, thereby reducing weight and cost; and, through the connection of non-metallic pillars between the circuit board and the shielding plate, crosstalk is prevented. Attached Figure Description
[0026] Figure 1 This is a schematic diagram of the shielding plate mounting structure provided in some embodiments of this utility model;
[0027] Figure 2 This is a schematic diagram of the structure of the shielding plate provided in some embodiments of this utility model.
[0028] Attached image annotations:
[0029] 1. Non-metallic substrate; 2. Non-metallic pillar; 3. Metallic insert; 4. Metallic layer; 5. Circuit board; 6. Metallic pillar; 7. Metallic plate. Detailed Implementation
[0030] Many specific details are set forth in the following description to provide a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0031] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0032] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0033] In the description of this utility model, the reference to terms such as "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" means that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this utility model.
[0034] See Figure 1-2 As shown, one embodiment of this utility model discloses a shielding plate mounting structure, including:
[0035] The shielding plate includes a non-metallic substrate 1 and a metal layer 4. The non-metallic substrate 1 is plate-shaped, and the metal layer 4 covers at least one of the sides of the non-metallic substrate 1. Specifically, the plate-shaped non-metallic substrate 1 includes two main sides, an upper and a lower side, and the metal layer 4 is disposed on at least the upper side or the lower side. Preferably, the non-metallic substrate 1 is completely covered by the metal layer to obtain a better shielding effect.
[0036] Circuit board 5 is disposed on one side of the shielding plate, and the circuit board 5 and the shielding plate are connected and fixed by non-metallic pillar 2; wherein, one end of the non-metallic pillar 2 can be inserted into the hole of the shielding plate, or it can be integrally formed with the non-metallic substrate 1 of the shielding plate; the other end of the non-metallic pillar 2 is connected to the circuit board 5, and optionally, the other end of the non-metallic pillar 2 can pass through the through hole of the circuit board 5 and then be connected to the circuit board 5.
[0037] An interference device (not shown in the figure) is disposed on the side of the shielding plate away from the circuit board. Optionally, the interference device is a capacitor, filter component, or power device placed in a controller such as a PEU. The name of the interference device is relative to the interference effect on the circuit board. Its main function is not interference. In this embodiment, by setting the shielding plate, it is mainly used to prevent the electromagnetic field generated by the interference device from interfering with or affecting the circuit board 5.
[0038] Specifically, in combination Figure 1 As shown, in the shielding plate mounting structure of this embodiment, the circuit board 5, the shielding plate, and the interference device are arranged sequentially from top to bottom.
[0039] According to this embodiment, by using a shielding plate composed of a non-metallic substrate such as plastic and a metal layer to replace the metal parts used for electromagnetic shielding in the existing electric drive system, the weight and cost of the shielding plate and even the controller are reduced; and, by connecting the non-metallic pillars between the circuit board and the shielding plate, crosstalk is prevented.
[0040] In some embodiments, the non-metallic substrate 1 and the non-metallic pillar 2 are made of plastic, and the metal layer 4 is made of nickel, aluminum, copper, gold or silver. It is mainly able to adhere to the non-metallic substrate 1 and provide electromagnetic shielding function.
[0041] In some embodiments, the metal layer 4 is coated on the non-metallic substrate 1 by electroplating, spraying, sputtering, physical vapor deposition, printing, or integral injection molding of aluminum film.
[0042] It should be noted that the aluminum film integral injection molding method in this embodiment refers to first machining an aluminum film, then attaching the aluminum film to the inner surface of the injection mold, and then pouring a non-metallic hot solution into the mold, where the non-metallic hot solution and the aluminum film can melt together and form the aluminum film on the surface of the non-metallic material.
[0043] In some embodiments, the non-metallic pillar and the non-metallic substrate are integrally formed, for example, both are made of plastic, and then the non-metallic substrate and the non-metallic pillar are formed by integral injection molding. It should be noted that, to prevent crosstalk, the non-metallic pillar is not covered with the metal layer.
[0044] Specifically, when applying a metal layer to the non-metallic substrate 1, the non-metallic pillar 2 needs to be shielded. If it is not shielded, a metal layer will also be applied to the non-metallic pillar 2. Stray signals on the circuit board (PCBA board) will flow through the non-metallic pillar 2, through the non-metallic substrate 1, through the metal pillar 6, to the metal plate 7, and finally to ground. This path passes through the shielding plate, which does not meet the shortest grounding line principle and can easily cause crosstalk to the electronic components on the circuit board, thus affecting the electrical control effect. Since plastic is a good insulating material, the non-metallic pillar 2 is shielded to preserve its plastic body. Then the circuit board is directly grounded through other connection points to avoid crosstalk.
[0045] In some embodiments, the non-metallic pillar 2 is connected to the circuit board 5 by hot riveting. Hot riveting refers to raising the temperature to deform or even melt the connection between the two components. Hot riveting is not welding, but rather riveting the non-metallic pillar 2 to the circuit board 5 after heating it to a certain temperature. Since the plasticity of the non-metallic pillar 2 increases and its hardness decreases after heating, making it easier to shape, the external force required for hot riveting is much smaller than that for cold riveting.
[0046] It should be noted that the interference device is a capacitor, a filter component, or a power device, and it is placed on the metal water-cooled plate described below.
[0047] In addition, to prevent the circuit board from being interfered with by external electromagnetic signals, a second shielding plate can be provided on the side of the circuit board away from the shielding plate (i.e., the upper part of the circuit board). The second shielding plate can adopt the shielding plate structure mentioned above, that is, a structure of non-metallic substrate plus metal layer. Since the main body of the shielding plate is non-metallic, such as plastic, it can achieve the function of sound insulation and noise reduction without the need for additional sound insulation materials. The benefits are that the weight can be greatly reduced, the noise isolation effect can be improved, and the cost can be reduced without affecting the electromagnetic shielding capability.
[0048] In some embodiments, combined with Figure 1 As shown, the shielding plate has a metal plate 7 on the side opposite to the circuit board 5, and the metal plate 7 is connected to the shielding plate through a metal post 6.
[0049] In some embodiments, combined with Figure 1 and Figure 2 The shielding plate has holes, and metal inserts 3 are installed in the holes. The metal pillars 6 are connected to the shielding plate through the metal inserts 3.
[0050] In some embodiments, the metal insert and the shielding plate are integrally formed. Specifically, the metal insert can be placed in an injection mold and then a non-metallic hot solution can be injected to form the shielding plate.
[0051] The metal column 6 is connected to the shielding plate by riveting. First, the end of the metal column 6 that is connected to the shielding plate is melted, and then the molten end of the metal column is connected to the metal insert 3 on the shielding plate by spinning to achieve a reliable connection between the two.
[0052] The metal column 6 and the metal plate 7 are integrally formed. Optionally, they can be integrally formed by die casting. In this case, the metal column 6 and the metal plate 7 together constitute a metal water-cooled plate.
[0053] The interference device is disposed on the metal plate, for example, by means of bolts, clips or other means, to fix capacitors on the metal plate 7.
[0054] In some embodiments, the metal plate 7 is a water-cooled plate, and a water-cooling channel may be provided at its bottom; the materials of the metal plate 7 and the metal column 6 may be aluminum, copper or stainless steel.
[0055] When both are made of the same material, the metal plate 7 and the metal column 6 are more likely to be manufactured by integral die casting.
[0056] The following shows a specific embodiment of a shielding plate mounting structure:
[0057] Combination Figure 1 and Figure 2 As shown, Figure 1 The diagram shown is of a shielding plate. Figure 2 This is a schematic diagram of the shielding plate installation structure. In the diagram, 1 represents a non-metallic substrate, such as a plastic sheet; 2 represents a non-metallic pillar, such as a plastic pillar; 3 represents a metal insert that acts as a good conductor; the plastic pillar and metal insert can be integrally injection molded onto the plastic sheet; 4 represents a metal layer attached to the plastic sheet, mainly composed of materials such as nickel-iron, aluminum, or copper, which provides electromagnetic shielding; 5 represents a circuit board supported on the plastic pillar, which can be a PCBA board; and 6 represents the metal pillar supporting the shielding plate, which is integrally die-cast onto the metal sheet 7. In summary, the plastic sheet, plastic pillar, metal insert, and metal layer together constitute shielding plate I; the metal pillar and metal sheet together constitute metal water-cooled plate II.
[0058] The specific design details are twofold: the method of attaching the metal layer and the connection method between different components. For the metal layer attachment method, physical vapor deposition (PVD), electroplating, and integrated aluminum film injection molding can be used. These methods offer high production efficiency, strong metal layer adhesion, and are not prone to detachment. When attaching the metal layer to the plastic board, the plastic pillars must be shielded. If not shielded, the plastic pillars will also have a metal layer attached, and stray signals on the PCBA board will flow through the plastic pillars, through shielding plate I, through metal pillar 6, to the water-cooling plate, and finally to ground. This path passes through shielding plate I, which does not meet the shortest grounding line principle and can easily cause crosstalk to the electronic components on the PCBA board, thus affecting the electrical control effect. Since plastic is a good insulating material, the plastic pillars are shielded during metal layer attachment to preserve their plastic body. The PCBA board is then directly grounded through other connection points to avoid crosstalk.
[0059] For the connection between the boards, a screwless design is adopted in this specific embodiment. The plastic column is connected to the PCBA board by hot riveting, and the metal column is connected to the shielding plate I by screw riveting. The two connection methods are similar in principle. First, the heads of the plastic column and the metal column are melted by different methods, and the molten plastic or metal is pressed onto the connected parts to achieve a reliable connection between the two.
[0060] Another embodiment of this utility model provides a vehicle controller, which includes a shielding plate mounting structure according to any one of the above embodiments.
[0061] Optionally, the vehicle controller includes a power electronic unit (PEU), preferably, the power electronic unit (PEU) is mainly used to control the motor.
[0062] In summary, the shielding plate mounting structure disclosed in the above embodiments of this utility model can achieve the following technical effects:
[0063] The shielding plate mounting structure proposed in this embodiment of the utility model uses a shielding plate composed of a non-metallic substrate such as plastic and a metal layer to replace the metal parts used for electromagnetic shielding in the existing electric drive system, thereby reducing weight and cost and reducing the number of parts; and, through the connection of non-metallic pillars between the circuit board and the shielding plate, crosstalk is prevented.
[0064] Furthermore, by selecting processes such as electroplating, spraying, sputtering, physical vapor deposition, printing, or integrated aluminum film injection molding to attach the metal layer to the non-metallic substrate, the advantages of strong metal layer adhesion, low cost, simple process, and high production efficiency can be achieved.
[0065] In addition, a novel screwless connection method is adopted to reliably connect the plastic shielding plate to the metal water-cooling plate, thereby achieving grounding. Furthermore, the circuit board is fixed and supported above the shielding plate by non-metallic pillars such as plastic. The non-conductive properties of the plastic pillars prevent the circuit boards such as PCBA from being indirectly grounded through the shielding plate and the water-cooling plate, thus preventing crosstalk.
[0066] It should be noted that although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope defined in the claims of the present invention.
Claims
1. A shielding plate mounting structure, characterized in that, The shielding plate mounting structure includes: A shielding plate, the shielding plate comprising a non-metallic substrate and a metal layer, the non-metallic substrate being plate-shaped, and the metal layer covering at least one of the sides of the non-metallic substrate; A circuit board is disposed on one side of the shielding plate, and the circuit board and the shielding plate are connected and fixed by non-metallic pillars; An interference device is disposed on the side of the shielding plate opposite to the circuit board.
2. The shielding plate mounting structure according to claim 1, characterized in that, The non-metallic substrate and non-metallic pillars are made of plastic, and the metal layer is made of nickel, aluminum, copper, gold, or silver.
3. The shielding plate mounting structure according to claim 1, characterized in that, The metal layer is applied to the non-metallic substrate by electroplating, spraying, sputtering, physical vapor deposition, printing, or integral injection molding of aluminum film.
4. The shielding plate mounting structure according to any one of claims 1-3, characterized in that, The non-metallic column and the non-metallic matrix are integrally formed; and / or, The non-metallic column is not covered by the metallic layer.
5. The shielding plate mounting structure according to any one of claims 1-3, characterized in that, The non-metallic pillars are connected to the circuit board by thermal riveting; and / or The interference device is a capacitor, a filter component, or a power device; and / or, A second shielding plate is also provided on the side of the circuit board opposite to the shielding plate.
6. The shielding plate mounting structure according to claim 1, characterized in that, The shielding plate has a metal plate on the side opposite to the circuit board, and the metal plate is connected to the shielding plate by a metal post.
7. The shielding plate mounting structure according to claim 6, characterized in that, The shielding plate has holes, and metal inserts are placed inside the holes. The metal pillars are connected to the shielding plate through the metal inserts.
8. The shielding plate mounting structure according to claim 7, characterized in that, The metal insert and the shielding plate are integrally formed; The metal column is connected to the shielding plate by riveting; and / or The metal column and the metal plate are integrally formed; and / or, The interference device is mounted on the metal plate.
9. The shielding plate mounting structure according to any one of claims 6-8, characterized in that, The metal plate is a water-cooled plate; and / or, The metal plate and metal column are made of aluminum, copper or stainless steel.
10. A vehicle-mounted controller, characterized in that, The vehicle controller employs a shielding plate mounting structure according to any one of claims 1-9.