Optical coupler chip plastic package structure

Abstract

The utility model belongs to the technical field of optical coupler chip plastic packaging, and relates to an optical coupler chip plastic packaging structure which comprises a photomask composed of an upper photomask and a lower photomask, a sealing box is arranged in the upper photomask, one end of the sealing box is provided with an anode and a cathode, the other end of the sealing box is provided with an emitting electrode and a collecting electrode, and the emitting electrode and the collecting electrode are arranged in the sealing box. An LED chip is installed at one end, close to the anode and the cathode, in the sealing box, a light receiving chip is installed at one end, close to the emitting electrode and the collecting electrode, in the sealing box, and an injection molding hole is formed in one end of the upper light cover so that raw materials needed by plastic packaging can be injected into the light cover. According to the utility model, the sealing box is also arranged in the photomask, the LED chip connected with the anode and the cathode and the light receiving chip connected with the emitter and the collector are arranged in the sealing box, and then raw materials required by plastic packaging are injected into the photomask, so that the layering phenomenon between the plastic packaging layer and the chip or the substrate is avoided; therefore, the sealing performance and the stability of the plastic package structure are improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of plastic package of optical coupling chip, and relates to a plastic package structure of optical coupling chip. BACKGROUND

[0002] Optical coupling chip, also known as optical isolator, is a key electronic component, and its core function is to realize the transmission of electrical signals through optical means, thereby playing a crucial role in electrical isolation and signal transmission. Due to its unique performance advantages, this component is widely used in automation control, communication technology, power systems and household appliances, and has become an indispensable part of modern electronic equipment. However, in the manufacturing process of optical coupling chip, the plastic packaging technology, as a key link to protect the chip and ensure its stable operation, currently faces some technical problems. In the traditional plastic packaging process, specific plastic packaging materials need to be injected into the optical coupling chip to form a solid protective layer. However, in this process, the difference in thermal expansion coefficient between the plastic packaging material and the optical coupling chip itself and the substrate becomes a problem that cannot be ignored.

[0003] Due to the mismatch of thermal expansion coefficient, the plastic packaging material will produce different expansion or contraction amount than the chip and substrate when the temperature changes, which easily leads to delamination between the plastic packaging layer and the chip or substrate. Delamination not only destroys the integrity of the plastic packaging structure, but also may form small gaps inside the optical coupling chip. These gaps become potential invasion channels for external environmental factors such as water vapor. With the passage of time, the infiltration of water vapor will gradually lead to the decline of device performance, and in severe cases, may even cause the complete failure of the device.

[0004] Therefore, how to effectively solve the delamination problem in the plastic packaging process of optical coupling chip and improve the sealing performance and stability of the plastic packaging structure has become a technical problem that needs to be solved by technical personnel in this field. The existing technical solutions have not fully met this demand, and there is an urgent need for an innovative plastic packaging structure design to improve the sealing quality of optical coupling chip. UTILITY MODEL CONTENT

[0005] Therefore, the utility model aims to provide a plastic package structure of optical coupling chip, which improves the sealing performance and structural stability through the sealing box, injection hole and clamping fixing device, to solve the problem of insufficient sealing performance caused by delamination of the plastic package of optical coupling chip in the prior art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions:

[0007] The utility model discloses a light coupling chip plastic package structure, including the light cover of the upper light cover and the lower light cover, the upper light cover is equipped with the sealed box in, one end of sealed box is installed anode and cathode, the other end of sealed box is installed emitter and collector, the LED chip is installed in the sealed box near anode and cathode one end, and the light receiving chip is installed in the sealed box near emitter and collector one end, and the injection hole is seted up to the upper light cover one end, to inject the raw material required for plastic package into the light cover.

[0008] The utility model discloses a light coupling chip plastic package structure, including the light cover of the upper light cover and the lower light cover, the upper light cover is equipped with the sealed box in, one end of sealed box is installed anode and cathode, the other end of sealed box is installed emitter and collector, the LED chip is installed in the sealed box near anode and cathode one end, and the light receiving chip is installed in the sealed box near emitter and collector one end, and the injection hole is seted up to the upper light cover one end, to inject the raw material required for plastic package into the light cover.

[0009] Further, the lower light cover is provided with a first clamping groove at one end, and the upper light cover is provided with a first clamping block matched with the first clamping groove at one end.

[0010] Further, the lower light cover is provided with a second clamping groove at one end, and the upper light cover is provided with a second clamping block matched with the second clamping groove at one end.

[0011] Further, the sealed box is provided with a plurality of sealing grooves at the side surface, for mounting the anode, the cathode, the emitter and the collector respectively, and a sealing sleeve is mounted in the sealing groove to be in sealing connection with the anode, the cathode, the emitter and the collector.

[0012] Further, a plurality of mounting grooves are formed in the upper light cover and the lower light cover, for mounting the anode, the cathode, the emitter and the collector respectively.

[0013] 1) The utility model discloses a light coupling chip plastic package structure, including the light cover of the upper light cover and the lower light cover, the upper light cover is equipped with the sealed box in, one end of sealed box is installed anode and cathode, the other end of sealed box is installed emitter and collector, the LED chip is installed in the sealed box near anode and cathode one end, and the light receiving chip is installed in the sealed box near emitter and collector one end, and the injection hole is seted up to the upper light cover one end, to inject the raw material required for plastic package into the light cover.

[0014] 2)The utility model discloses through the first clamping block and second clamping block of upper light cover bottom, install in the corresponding first clamping groove and second clamping groove on lower light cover, make upper light cover and lower light cover carry out the clamping, fix one end of anode and cathode through the installation groove of one end on upper light cover and lower light cover, fix one end of emitter and collector through the installation groove of other end on upper light cover and lower light cover, and then fix the position of sealed box in upper light cover, the position of sealed box is fixed after the resin is injected from injection molding hole, and the applicability of overall structure is improved.

[0015] Other advantages, objects, and features of the present utility model will be in part apparent and in part pointed out hereinafter based on the accompanying description taken in connection with the accompanying drawings. Those skilled in the art will appreciate the present utility model fully from the practice of the present utility model with reference to the accompanying drawings. Therefore, the objects and other advantages of the present utility model can be realized and obtained by the means described in the following. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to make the purpose, technical scheme and advantage of the utility model more clearly, the preferred detailed description of the utility model will be combined with the drawings below, wherein:

[0017] Fig. 1 A three-dimensional structure schematic view of the plastic sealing structure of the optocoupler chip is provided for the utility model;

[0018] Fig. 2 A structure schematic view of the cathode and emitter in the plastic sealing structure of the optocoupler chip is provided for the utility model;

[0019] Fig. 3 A structure schematic view of the anode and collector in the plastic sealing structure of the optocoupler chip is provided for the utility model;

[0020] Fig. 4 A sectional structure schematic view of the sealed box and second clamping groove in the plastic sealing structure of the optocoupler chip is provided for the utility model.

[0021] Sign significance: 1-the upper light cover;2-the lower light cover;3-anode;4-cathode;5-emitter;6-collector;7-sealed box;8-LED chip;9-receiving light chip;10-injection molding hole;11-first clamping groove;12-second clamping groove;13-first clamping block;14-second clamping block;15-sealing groove;16-sealing sleeve. DETAILED DESCRIPTION

[0022] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this utility model. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0023] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual pictures. They should not be construed as limiting the present invention. To better illustrate the embodiments of the present invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual product dimensions. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0024] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," "right," "front," and "rear" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this utility model. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0025] Example 1

[0026] Please see Figs. 1-4 This embodiment provides an optocoupler chip encapsulation structure, including an upper photomask 1 and a lower photomask 2. The upper photomask 1 is provided with a sealing box 7. An anode 3 and a cathode 4 are installed at one end of the sealing box 7, and an emitter 5 and a collector 6 are installed at the other end of the sealing box 7. An LED chip 8 is installed at one end of the anode 3 and the cathode 4, and a light-receiving chip 9 is installed at one end of the emitter 5 and the collector 6. An injection hole 10 is opened at one end of the upper photomask 1. Multiple sealing grooves 15 are opened on the side of the sealing box 7 to install the anode 3, cathode 4, emitter 5 and collector 6 respectively. A sealing sleeve 16 is installed in the sealing groove 15. The multiple sealing sleeves 16 are respectively fitted onto the anode 3, cathode 4, emitter 5 and collector 6 so that the anode 3, cathode 4, emitter 5 and collector 6 are sealed and connected to the sealing groove 15.

[0027] Both the upper photomask 1 and the lower photomask 2 have multiple mounting slots, which are adapted to the anode 3, cathode 4, emitter 5, and collector 6. When the optocoupler chip needs to be encapsulated, one end of the anode 3 and cathode 4 is placed on one side of the sealed box 7, and one end of the emitter 5 and collector 6 is placed on the other side of the sealed box 7. The sealing sleeves 16 on the anode 3 and cathode 4 are installed at one end of the sealed box 7 to fix the position of the LED chip 8. The sealing sleeves 16 on the sides of the emitter 5 and collector 6 are installed at the other end of the sealed box 7. After fixing the position of the light-receiving chip 9 and sealing the gaps on the side of the sealing box 7, fix the positions of the LED chip 8 and the light-receiving chip 9. Then, place one end of the anode 3 and the cathode 4 into the mounting groove on the lower photomask 2, and at the same time, place one end of the emitter 5 and the collector 6 into the mounting groove at the other end of the lower photomask 2. Inject the material required for plastic encapsulation through the injection hole 10 to completely fix the sealing box 7 in the upper photomask 1 and the lower photomask 2, thus completing the plastic encapsulation of the optocoupler chip, reducing the possibility of delamination and improving the sealing quality of the optocoupler chip.

[0028] Example 2

[0029] like Figs. 2-4 As shown, a first snap-fit ​​groove 11 is provided at one end of the lower photomask 2, a first snap-fit ​​block 13 adapted to the first snap-fit ​​groove 11 is installed at one end of the upper photomask 1, a second snap-fit ​​groove 12 is provided at one end of the lower photomask 2, and a second snap-fit ​​block 14 adapted to the second snap-fit ​​groove 12 is installed at one end of the upper photomask 1. The first snap-fit ​​block 13 and the second snap-fit ​​block 14 on the upper photomask 1 are snapped into the first snap-fit ​​groove 11 and the second snap-fit ​​groove 12 on the lower photomask 2 respectively, fixing the position of the sealing box 7 in the upper photomask 1 and the lower photomask 2, forming a whole. The remaining features are the same as in Embodiment 1.

[0030] The working principle of this plastic encapsulation structure is as follows: When encapsulating the optocoupler chip, one end of the anode 3 and cathode 4 is placed on one side of the sealed box 7, and one end of the emitter 5 and collector 6 is placed on the other side of the sealed box 7. The sealing sleeve 16 on the anode 3 and cathode 4 is installed on one end of the sealed box 7 to fix the position of the LED chip 8. The sealing sleeve 16 on the side of the emitter 5 and collector 6 is installed on the other end of the sealed box 7 to fix the position of the light-receiving chip 9. After sealing the gap on the side of the sealed box 7, the positions of the LED chip 8 and the light-receiving chip 9 are fixed. Then, one end of the anode 3 and cathode 4... The emitter 5 and collector 6 are placed in the mounting slot at one end of the lower photomask 2, while the emitter 5 and collector 6 are also placed in the mounting slot at the other end of the lower photomask 2. The first locking block 13 and the second locking block 14 on the upper photomask 1 are correspondingly locked into the first locking groove 11 and the second locking groove 12 on the lower photomask 2, fixing the position of the sealing box 7 in the upper photomask 1 and the lower photomask 2, forming a whole. The material required for plastic encapsulation is injected through the injection hole 10, and the sealing box 7 is completely fixed in the upper photomask 1 and the lower photomask 2, completing the plastic encapsulation of the optocoupler chip, reducing the possibility of delamination, and improving the sealing quality of the optocoupler chip.

[0031] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of this technical solution, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A photomask structure for an optocoupler chip, comprising an upper photomask (1) and a lower photomask (2), characterized in that: The upper photomask (1) is provided with a sealed box (7). An anode (3) and a cathode (4) are installed at one end of the sealed box (7), and an emitter (5) and a collector (6) are installed at the other end of the sealed box (7). An LED chip (8) is installed at the end of the sealed box (7) near the anode (3) and the cathode (4), and a light-receiving chip (9) is installed at the end of the sealed box (7) near the emitter (5) and the collector (6). An injection hole (10) is provided at one end of the upper photomask (1) to inject the raw materials required for encapsulation into the photomask.

2. The optocoupler chip encapsulation structure according to claim 1, characterized in that: The lower photomask (2) has a first snap-fit ​​groove (11) at one end, and the upper photomask (1) has a first snap-fit ​​block (13) that is adapted to the first snap-fit ​​groove (11) at one end.

3. The optocoupler chip encapsulation structure according to claim 1, characterized in that: The lower photomask (2) has a second snap-fit ​​groove (12) at one end, and the upper photomask (1) has a second snap-fit ​​block (14) that is compatible with the second snap-fit ​​groove (12) at one end.

4. The optocoupler chip encapsulation structure according to claim 1, characterized in that: The sealing box (7) has multiple sealing grooves (15) on its side for installing the anode (3), cathode (4), emitter (5) and collector (6) respectively, and a sealing sleeve (16) is installed in the sealing groove (15) to seal and connect with the anode (3), cathode (4), emitter (5) and collector (6).

5. The optocoupler chip encapsulation structure according to claim 1, characterized in that: Multiple mounting slots are provided on both the upper photomask (1) and the lower photomask (2) for mounting the anode (3), cathode (4), emitter (5) and collector (6), respectively.

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