Cover plate sealing machine for semiconductor

Abstract

The utility model discloses a cover plate sealing machine for a semiconductor, and relates to the technical field of packaging equipment. The cover plate sealing machine for the semiconductor comprises a bottommost working panel, a fixing mechanism and a sealing mechanism are arranged on the working panel, and the fixing mechanism is used for fixing corresponding parts and comprises a position adjusting piece installed on the working panel and a fixing piece arranged on the position adjusting piece; the whole part is fixed on the operation table through the fixing mechanism, movement of the part is limited, the part is prevented from shaking or vibrating in the cutting process, the situation that a fracture at a sealing position is inclined is reduced, and therefore the rejection rate and the production cost are reduced. And meanwhile, parts of different sizes can be adapted by replacing the fixing mechanism, so that the applicability of the equipment is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of packaging equipment, in particular to a cover plate sealing machine for semiconductor. BACKGROUND

[0002] With the rapid development of mobile phone technology, the internal components of mobile phones are becoming thinner and more powerful. Thin VC (Vapol Chamber, vapor chamber) is a high-efficiency heat dissipation technology, and is used in smart phones that pursue thinness, high performance, and high power consumption, as well as new energy vehicles, electric vehicles, and electronic products such as tablets and laptops.

[0003] The sealing process is an important manufacturing process for forming an airtight cavity. VC vapor chamber is a two-phase heat conduction device that forms a vacuum cavity containing a small amount of working fluid. VC vapor chamber works in a gas phase phase change cycle, and the airtightness of the cavity ensures that the working fluid does not leak.

[0004] In the Chinese patent with publication number CN118824923B, a chip cover plate packaging device and its packaging process are disclosed. The device includes: a discharge conveyor belt with several parallel conveyor tracks; several air blowers are mirror set on both sides of the conveyor track. The air outlet of the air blower is parallel to the conveyor track and faces the top of the conveyor belt. When the chip passes through the air blower, the air blown by the air blower bounces back upward after passing through the conveyor belt to support the chip.

[0005] The device sets up air blowers to blow air to the discharge conveyor belt when discharging chips, so that the air flow bounces back to the chip after passing through the conveyor belt to generate an upward thrust, thereby supporting the chip to reduce the pressure of the chip on the conveyor belt, thereby reducing the friction between the conveyor belt and the chip to reduce the risk of scratches.

[0006] However, when the above-mentioned device is used to seal the cover plate and needs to cut off the sealing part, it is easy to move the parts, resulting in a skewed sealing part, which increases the scrap rate. Utility model content

[0007] The utility model overcomes the shortcomings of the prior art and provides a cover plate sealing machine for semiconductor.

[0008] To solve the above technical problems, the utility model provides a cover plate sealing machine for semiconductor.

[0009] Technical effect: In the sealing process, the fixing mechanism fixes the parts on the operation table as a whole, limits the movement of the parts, prevents them from shaking or vibrating when cutting, reduces the occurrence of skewed sealing part, thereby reducing the scrap rate and production cost; At the same time, it can also adapt to different sizes of parts by replacing the fixing mechanism, improving the applicability of the equipment.

[0010] The utility model further limits the technical scheme: a cover plate sealing machine for semiconductor, including work panel, be equipped with

[0011] Fixing mechanism, for fixing corresponding part, including position adjusting spare and fixed spare of being equipped with on position adjusting spare and being installed on work panel;

[0012] Sealing mechanism, including the body of being equipped with on work panel and the upper sealing disc and lower sealing disc of being equipped with on body, upper sealing disc and lower sealing disc are disc, two along circumference side edge and fit, for cutting section part sealing place;

[0013] Sealing mechanism still includes adjusting spare, be equipped with on work panel, for driving whole body activity.

[0014] Further, the body is fixed with the heating fixing block for installing the upper sealing disc and the lower sealing disc, the upper sealing disc and the lower sealing disc are all ceramic disc, and all are rotationally connected on the heating fixing block, and the heating fixing block is heated for two.

[0015] The cover plate sealing machine for semiconductor described above, the adjusting spare includes slide rail and lead screw, the body is slidably connected in the slide rail, the lead screw penetrates the body and is threadedly connected with it, for driving the body moves along the slide rail.

[0016] The cover plate sealing machine for semiconductor described above, the body includes bottom plate and top plate, the upper sealing disc and the lower sealing disc are all equipped between the bottom plate and the top plate, a plurality of hydraulic cylinders are equipped between the top plate and the bottom plate, for adjusting the distance of the upper sealing disc and the lower sealing disc.

[0017] The cover plate sealing machine for semiconductor described above, the position adjusting spare includes the adjusting bottom plate of being fixed on work panel, and the movable plate of being slidably connected on the adjusting bottom plate, the adjusting block and the movable block are respectively fixed on the adjusting bottom plate and the movable plate on the corresponding position, the screw rod is arranged between the adjusting block and the movable block, to adjust the distance of the adjusting bottom plate and the movable plate.

[0018] The cover plate sealing machine for semiconductor described above, the fixed spare includes the fixed disc for placing part and being fixed on the movable plate, the movable cylinder is equipped on one side of the movable plate, the press plate for pressing the positioning part is equipped on the output shaft of the movable cylinder.

[0019] The cover plate sealing machine for semiconductor described above, the fixed disc is detachably connected with the embedded plate for positioning part through bolt, the embedded plate is used for positioning part, the protruding block is equipped in the embedded plate, the protruding block is adapted to the recess on the corresponding part, for positioning part to prevent the activity of part.

[0020] The utility model has the advantages of:

[0021] (1) The utility model discloses, in the sealing process, the integral part is fixed on the operation table through the fixed mechanism, and the part activity is limited, prevents its when cutting off and occurs to shake or vibrate, reduces the broken place broken part skew situation and occurs, thereby reduces the rejection rate, reduces production cost, simultaneously still can pass through the mode of replacement fixed mechanism adaptation different size's part, improves the applicability of equipment, and the utility model discloses, in the sealing process, the integral part is fixed on the operation table through the fixed mechanism, and the part activity is limited, prevents its when cutting off and occurs to shake or vibrate, reduces the broken place broken part skew situation and occurs, thereby reduces the rejection rate, reduces production cost, simultaneously still can pass through the mode of replacement fixed mechanism adaptation different size's part, improves the applicability of equipment,

[0022] (2) The utility model discloses, in the working, first use movable cylinder to lift the press plate, and the corresponding panel is fixed on the fixed disc through bolt, at this moment, the part is embedded in the panel, and the movement of the part on the horizontal plane is limited through the cooperation of the convex block and the recess, then the press plate is put down through the movable cylinder, and the part is fixed, preventing the part from jumping during processing,

[0023] (3) The utility model discloses, the operator can adjust the distance between the adjusting block and the movable block through the rotation screw rod, the purpose of adjusting the position of the movable plate is reached, thereby the part is aligned with the processing position, further improves the processing accuracy, and reduces the rejection rate,

[0024] (4) The utility model discloses, the position of the upper sealing disc and the lower sealing disc can be adjusted through the cooperation of the lead screw and the slide rail, and the upper sealing disc and the lower sealing disc are moved to the best working position. In addition, the distance between the upper sealing disc and the lower sealing disc can be adjusted through the hydraulic cylinder, thereby adapting to parts of different thicknesses. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is the overall schematic view of example 1;

[0026] Figure 2 It is the structure diagram of position adjusting part in example 1;

[0027] Figure 3 It is the sealing principle diagram in the utility model.

[0028] Wherein: 1, working panel;2, position adjusting part;21, adjusting bottom plate;22, movable plate;23, adjusting block;24, movable block;25, screw rod;3, fixed part;31, fixed disc;32, movable cylinder;33, press plate;34, panel;35, convex block;4, sealing mechanism;41, upper sealing disc;42, lower sealing disc;43, heating fixed block;5, adjusting part;51, slide rail;52, lead screw;6, machine body;61, bottom plate;62, top plate;63, hydraulic cylinder. DETAILED DESCRIPTION

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, a detailed description is provided below in conjunction with the accompanying drawings and specific embodiments. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0032] This embodiment provides a structure as follows: Figures 1 to 2 As shown, the bottommost working panel 1 is provided with a fixing mechanism and a sealing mechanism 4. The fixing mechanism is used to fix the corresponding parts and includes a position adjustment member 2 installed on the working panel 1 and a fixing member 3 provided on the position adjustment member 2.

[0033] like Figure 1 and Figure 2 As shown, the position adjustment component 2 includes an adjustment base plate 21 fixed on the working panel 1 and a movable plate 22 slidably connected to the adjustment base plate 21. Adjustment blocks 23 and movable blocks 24 are fixed at corresponding positions on the adjustment base plate 21 and the movable plate 22, respectively. A screw 25 is provided between the adjustment block 23 and the movable block 24 to adjust the distance between the adjustment base plate 21 and the movable plate 22.

[0034] The fixing component 3 includes a fixing plate 31 for placing and fixing parts to the movable plate 22. A movable cylinder 32 is provided on one side of the movable plate 22, and a pressing plate 33 for pressing and positioning parts is provided on the output shaft of the movable cylinder 32. A mounting plate 34 with a shape adapted to the parts for positioning parts is detachably connected to the fixing plate 31 by bolts. The mounting plate 34 has a protrusion 35, which is adapted to the groove on the corresponding parts to position the parts and prevent them from moving.

[0035] The sealing mechanism 4 comprises a body 6 arranged on the working panel 1, and an upper sealing disc 41 and a lower sealing disc 42 arranged on the body 6, wherein the upper sealing disc 41 and the lower sealing disc 42 are disc-shaped, are attached along the circumferential side edges, and are used for sealing the sectioned parts; and the sealing mechanism 4 further comprises an adjusting part 5 arranged on the working panel 1 and used for driving the whole body 6 to move.

[0036] As shown in Figure 1 The body 6 is fixed with a heating fixing block 43 used for mounting the upper sealing disc 41 and the lower sealing disc 42, the upper sealing disc 41 and the lower sealing disc 42 are both ceramic discs, and are both rotationally connected to the heating fixing block 43, and the heating fixing block 43 is used for heating the two discs.

[0037] As shown in Figure 1 The body 6 comprises a bottom plate 61 and a top plate 62, the upper sealing disc 41 and the lower sealing disc 42 are arranged between the bottom plate 61 and the top plate 62, and a plurality of hydraulic cylinders 63 are arranged between the top plate 62 and the bottom plate 61 and used for adjusting the distance between the upper sealing disc 41 and the lower sealing disc 42.

[0038] As shown in Figures 1 to 3 During the working of the utility model, the pressing plate 33 is first lifted by the movable cylinder 32, and the corresponding panel 34 is fixed on the fixed disc 31 by bolts, at this time, the part is embedded in the panel 34, and the movement of the part in the horizontal plane is limited by the cooperation of the convex block 35 and the groove; then the pressing plate 33 is lowered by the movable cylinder 32, thereby playing a role of fixing the part and preventing the part from jumping during the machining process.

[0039] At this time, the operator can adjust the distance between the adjusting block 23 and the movable block 24 by rotating the screw rod 25, so as to adjust the position of the movable plate 22, thereby aligning the part with the machining position, further improving the machining accuracy, and reducing the waste rate.

[0040] After the position of the part is determined, the position of the upper sealing disc 41 and the lower sealing disc 42 can be adjusted by the cooperation of the screw rod 52 and the sliding rail 51, so as to move to the best working position. In addition, the distance between the upper sealing disc 41 and the lower sealing disc 42 can be adjusted by the hydraulic cylinder 63, so as to adapt to parts of different thicknesses.

[0041] In addition to the above-mentioned embodiments, the utility model can also have other implementation manners. Any technical solution formed by equivalent replacement or equivalent transformation falls within the protection scope required by the utility model.

Claims

1. A semiconductor cover sealing machine, comprising a working panel (1), characterized in that: The working panel (1) is provided with a fixing mechanism for fixing the corresponding parts, including a position adjustment member (2) installed on the working panel (1) and a fixing member (3) provided on the position adjustment member (2). The sealing mechanism (4) includes a body (6) on the working panel (1) and an upper sealing plate (41) and a lower sealing plate (42) on the body (6). The upper sealing plate (41) and the lower sealing plate (42) are disc-shaped and fit together along the circumferential side for cutting and sealing the parts. The sealing mechanism (4) also includes an adjusting component (5) located on the working panel (1) for driving the entire machine body (6) to move.

2. A semiconductor cover sealing machine according to claim 1, characterized in that: The body (6) is fixed with a heating fixing block (43) for installing the upper sealing plate (41) and the lower sealing plate (42). The upper sealing plate (41) and the lower sealing plate (42) are both ceramic plates and are rotatably connected to the heating fixing block (43). The heating fixing block (43) heats both of them.

3. A semiconductor cover sealing machine according to claim 1, characterized in that: The adjusting component (5) includes a slide rail (51) and a lead screw (52). The machine body (6) is slidably connected in the slide rail (51). The lead screw (52) penetrates the machine body (6) and is threadedly connected to it, for driving the machine body (6) to move along the slide rail (51).

4. A semiconductor cover sealing machine according to claim 3, characterized in that: The body (6) includes a bottom plate (61) and a top plate (62). The upper sealing plate (41) and the lower sealing plate (42) are both located between the bottom plate (61) and the top plate (62). A plurality of hydraulic cylinders (63) are provided between the top plate (62) and the bottom plate (61) for adjusting the distance between the upper sealing plate (41) and the lower sealing plate (42).

5. A semiconductor cover sealing machine according to claim 1, characterized in that: The position adjustment component (2) includes an adjustment base plate (21) fixed on the working panel (1) and a movable plate (22) slidably connected to the adjustment base plate (21). An adjustment block (23) and a movable block (24) are fixed at corresponding positions on the adjustment base plate (21) and the movable plate (22), respectively. A screw (25) is provided between the adjustment block (23) and the movable block (24) to adjust the distance between the adjustment base plate (21) and the movable plate (22).

6. A semiconductor cover sealing machine according to claim 5, characterized in that: The fixing member (3) includes a fixing plate (31) for placing parts and fixing them on the movable plate (22). A movable cylinder (32) is provided on one side of the movable plate (22). A pressing plate (33) for pressing and positioning parts is provided on the output shaft of the movable cylinder (32).

7. A semiconductor cover sealing machine according to claim 6, characterized in that: The fixed plate (31) is detachably connected by bolts to a plate (34) that is adapted to the shape of the part for positioning the part. The plate (34) has a protrusion (35) that is adapted to the groove on the corresponding part for positioning the part to prevent the part from moving.

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