Silicon wafer conveying device

Abstract

The utility model provides a silicon wafer conveying device, which comprises a rack, a conveying belt and a conveying belt, and is characterized in that the rack comprises a first rack body and a second rack body which are arranged side by side at an interval along the width direction; the first belt and the second belt are detachably arranged on the two sides of the first frame body; the third belt and the fourth belt are detachably arranged on the two sides of the second frame body; the first driving rod is arranged on the first frame body and arranged on the first belt and the second belt in a penetrating mode, and the first driving rod is used for driving the first belt and the second belt to rotate synchronously; the second driving rod is arranged on the second frame body and arranged on the third belt and the fourth belt in a penetrating mode, and the second driving rod is used for driving the third belt and the fourth belt to rotate synchronously; and the coupler is detachably connected with the first driving rod and the second driving rod. With the adoption of the scheme, the problems that the supporting performance on the ultrathin silicon wafer is insufficient, especially the middle part of the silicon wafer is easy to deform or damage in the prior art can be solved.

Description

Technical Field

[0001] This utility model relates to the field of transportation technology, and more specifically, to a silicon wafer transportation device. Background Technology

[0002] With the continuous advancement of technology, the mass production of ultrathin silicon wafers has become one of the industry's goals. However, the production of ultrathin silicon wafers (thickness ≤120um) faces many challenges, especially in the wafer transport process. Due to the thinness of the silicon wafer, existing transport devices do not provide sufficient support, particularly in the middle section, which can easily cause deformation or damage to the ultrathin silicon wafer. Utility Model Content

[0003] This invention provides a silicon wafer transport device to solve the problem in the prior art that the support for ultra-thin silicon wafers is insufficient, which easily causes deformation or damage to the ultra-thin silicon wafers.

[0004] To address the aforementioned problems, this utility model provides a silicon wafer transport device, comprising: a frame, including a first frame and a second frame arranged side-by-side at intervals along the width direction; a first belt and a second belt detachably disposed on both sides of the first frame; a third belt and a fourth belt detachably disposed on both sides of the second frame; a first drive rod disposed on the first frame and passing through the first and second belts, the first drive rod being used to drive the first and second belts to rotate synchronously; a second drive rod disposed on the second frame and passing through the third and fourth belts, the second drive rod being used to drive the third and fourth belts to rotate synchronously; and a coupling detachably connected to the first and second drive rods.

[0005] Furthermore, the silicon wafer transport device also includes a drive unit, which is mounted on the frame and is drivenly connected to the first drive rod and the second drive rod. The drive unit is used to drive the first belt, the second belt, the third belt and the fourth belt to rotate synchronously.

[0006] Furthermore, the silicon wafer transport device also includes a signal transceiver electrically connected to the drive unit, which is used to receive remote control signals and control the drive unit.

[0007] Furthermore, the silicon wafer transport device also includes wheel sets, which have multiple pulleys. Wheel sets are provided on both sides of the first frame and both sides of the second frame. The first belt, the second belt, the third belt and the fourth belt are respectively fitted onto the corresponding wheel sets.

[0008] Furthermore, the interval between the first belt and the second belt is equal to the interval between the third belt and the fourth belt.

[0009] Furthermore, the interval between the first belt and the second belt is greater than or less than the interval between the second belt and the third belt.

[0010] Furthermore, the first frame includes a first base plate and two first pillars, which are respectively disposed at both ends of the first base plate along the extension direction of the first base plate, and the first belt and the second belt are both disposed on the two first pillars.

[0011] Furthermore, the second frame includes a second base plate and two second pillars. The two second pillars are respectively located at both ends of the second base plate along the extension direction of the second base plate. The third belt and the fourth belt are both located on the two second pillars. The first base plate and the second base plate are connected to each other.

[0012] Furthermore, the silicon wafer transport device also includes: a first extension plate having a first end and a second end disposed opposite to each other, the first end of the first extension plate being connected to the downstream first pillar of the two first pillars, the second end of the first extension plate protruding from the frame in the length direction, and a first belt and a second belt both disposed on the two first pillars and the first extension plate; a second extension plate having a first end and a second end disposed opposite to each other, the first end of the second extension plate being connected to the downstream second pillar of the two second pillars, the second end of the second extension plate protruding from the frame in the length direction, and a third belt and a fourth belt both disposed on the two second pillars and the second extension plate.

[0013] Furthermore, the first belt, second belt, third belt, and fourth belt have the same width.

[0014] Applying the technical solution of this utility model, the frame consists of a first frame and a second frame, which are arranged side-by-side and spaced apart along the width direction of the transmission device, ensuring the structural stability of the entire device and the parallelism of the belts. The first and second belts are detachably installed on both sides of the first frame, and the third and fourth belts are also detachably installed on both sides of the second frame. This detachable structure allows for flexible adjustment of the number of belt sets to meet the transmission requirements of different silicon wafers, thereby reducing the contact area with the silicon wafers and minimizing belt marks. Furthermore, when the silicon wafers are thicker and harder, only the first and fourth belts are needed; when the silicon wafers are thinner, the first, second, third, and fourth belts move synchronously. The second and third belts provide support and lift, preventing the thinner silicon wafers from collapsing downwards in the middle due to insufficient hardness, which would affect transportation efficiency. The first drive rod is mounted on the first frame and passes through the first and second belts. Driving the first drive rod ensures that the first and second belts rotate synchronously. The second drive rod is located on the second frame and passes through the third and fourth belts, driving them to rotate synchronously, thus preventing jamming and slippage of the silicon wafers during transport. A coupling detachably connects the first and second drive rods, ensuring that the two drive rods remain synchronized during power transmission, thereby ensuring the synchronous rotation of all belts. Attached Figure Description

[0015] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0016] Figure 1 This invention provides a schematic diagram of the structure of a silicon wafer transport device during the transport of thin silicon wafers.

[0017] Figure 2 A front view of the silicon wafer transport device provided by this utility model is shown;

[0018] Figure 3 A left view of the silicon wafer transport device provided by this utility model is shown;

[0019] Figure 4 The diagram shows a top view of the silicon wafer transport device provided by this invention when transporting thick silicon wafers.

[0020] The above figures include the following reference numerals:

[0021] 11. First frame;

[0022] 111. First base plate;

[0023] 112. The First Pillar;

[0024] 12. Second frame;

[0025] 121. Second base plate;

[0026] 122. The Second Pillar;

[0027] 21. First belt;

[0028] 22. Second belt;

[0029] 23. Third belt;

[0030] 24. Fourth belt;

[0031] 30. Couplings;

[0032] 40. Signal transceiver;

[0033] 50. Belt pulley;

[0034] 61. First extension plate;

[0035] 62. Second extension plate. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0037] like Figures 1 to 4 As shown, this embodiment of the present invention provides a silicon wafer transport device, which includes a frame, a first belt 21, a second belt 22, a third belt 23, a fourth belt 24, a first drive rod, a second drive rod, and a coupling 30. The frame includes a first frame 11 and a second frame 12 arranged side-by-side at intervals along the width direction. The first belt 21 and the second belt 22 are detachably disposed on both sides of the first frame 11, and the third belt 23 and the fourth belt 24 are detachably disposed on both sides of the second frame 12. The first drive rod is disposed on the first frame 11 and passes through the first belt 21 and the second belt 22, and is used to drive the first belt 21 and the second belt 22 to rotate synchronously. The second drive rod is disposed on the second frame 12 and passes through the third belt 23 and the fourth belt 24, and is used to drive the third belt 23 and the fourth belt 24 to rotate synchronously. The coupling 30 is detachably connected to the first drive rod and the second drive rod.

[0038] Applying the technical solution of this utility model, the frame consists of a first frame 11 and a second frame 12. These two frames are arranged side-by-side and spaced apart along the width direction of the silicon wafer transport device, ensuring the structural stability of the entire device and the parallelism of the belts. The first belt 21 and the second belt 22 are detachably mounted on both sides of the first frame 11, and the third belt 23 and the fourth belt 24 are also detachably mounted on both sides of the second frame 12. This detachable structure allows the device to flexibly adjust the number of belt sets according to the transport requirements of different silicon wafers, thereby reducing the contact area with the silicon wafers and minimizing belt marks. Figure 4 As shown, when the silicon wafer is thicker, its hardness is greater, and only the first belt 21 and the fourth belt 24 are needed; as Figure 1 As shown, when the silicon wafer is thin, the first belt 21, the second belt 22, the third belt 23, and the fourth belt 24 move synchronously. The second belt 22 and the third belt 23 provide support and lift, preventing the thin silicon wafer from collapsing downwards in the middle due to insufficient rigidity, thus affecting transportation efficiency. A first drive rod is mounted on the first frame 11 and passes through the first belt 21 and the second belt 22. Driving the first drive rod ensures that the first belt 21 and the second belt 22 rotate synchronously. The second drive rod is located on the second frame 12 and passes through the third belt 23 and the fourth belt 24, driving them to rotate synchronously, preventing jamming and slippage of the silicon wafer during transport. A coupling 30 detachably connects the first drive rod and the second drive rod, ensuring that the two drive rods remain synchronized during power transmission, thereby ensuring the synchronous rotation of all belts.

[0039] Specifically, the second belt 22 and the third belt 23 are positioned between the first belt 21 and the fourth belt 24. The distance between the first belt 21 and the fourth belt 24 can be between 150 and 160 mm. In a specific embodiment, the distance between the first belt 21 and the fourth belt 24 is 150 mm, wherein the distances between the first belt 21 and the second belt 22, the second belt 22 and the third belt 23, and the third belt 23 and the fourth belt 24 are all equal, each being 50 mm, ensuring that the supporting force on the silicon wafers on the belts is equal and guaranteeing stable transport of the silicon wafers.

[0040] Furthermore, the silicon wafer transport device also includes a drive unit, which is mounted on the frame and is driven by a first drive rod and a second drive rod. The drive unit is used to drive the first belt 21, the second belt 22, the third belt 23, and the fourth belt 24 to rotate synchronously. In this embodiment, the drive unit is driven by the first drive rod and the second drive rod to ensure the synchronous operation of all belts.

[0041] Specifically, the drive unit can be a drive motor, and the synchronous operation of the belt can be controlled in real time by adjusting the speed and direction of the drive motor. A servo motor with appropriate power, fast response, and high precision should be selected as the drive motor to ensure that the speed and torque of the belt can be precisely controlled. The drive motor should be fixed on the frame, and its location should take into account its heat dissipation and ease of maintenance.

[0042] Specifically, the drive unit can also be equipped with overload protection and emergency stop functions to prevent belt damage or silicon wafer damage caused by external interference or equipment failure. Overload protection can be electronic or mechanical, and the emergency stop function should be easy to operate to ensure that the transmission system can be stopped quickly in an emergency.

[0043] Furthermore, the silicon wafer transport device also includes a signal transceiver 40, which is electrically connected to the drive unit. The signal transceiver 40 is used to receive remote control signals and control the drive unit. In this embodiment, the signal transceiver 40 can be disposed on the side of the rack to receive control signals, ensuring effective communication with the drive unit and thus realizing remote control.

[0044] like Figure 1 and Figure 2 As shown, the silicon wafer transport device also includes wheel sets, each with multiple pulleys 50. Wheel sets are provided on both sides of the first frame 11 and both sides of the second frame 12. The first belt 21, the second belt 22, the third belt 23, and the fourth belt 24 are respectively fitted onto the corresponding wheel sets. In this embodiment, the wheel sets consist of multiple pulleys 50, which are evenly distributed on both sides of the first frame 11 and the second frame 12, forming the start and end points of the belt transport path, as well as necessary support and guide points.

[0045] Specifically, the pulley 50 is made of a wear-resistant, low-friction material to reduce wear and resistance during belt operation. The diameter and width of the pulley 50 are precisely matched to the thickness and width of the belt to ensure stable belt operation and good tension on the pulley.

[0046] Specifically, a belt tensioning device can be installed on the pulley set. By adjusting the position of the pulley set or the pressure of the tensioning wheel, the tension of the belt can be adjusted to ensure that the belt can maintain optimal gripping force and stability when transmitting silicon wafers of different thicknesses.

[0047] Furthermore, the interval between the first belt 21 and the second belt 22 is equal to the interval between the third belt 23 and the fourth belt 24. In one embodiment provided in this application, setting the interval between the first belt 21 and the second belt 22 to be equal to the interval between the third belt 23 and the fourth belt 24 can prevent the silicon wafer from deforming or being damaged due to different supporting forces during transportation, thereby reducing the risk of silicon wafer misalignment and damage.

[0048] Specifically, if wafer misalignment is detected during transport, the support position or belt tension can be fine-tuned until the belt spacing and wafer stability during transport are optimal. Multiple wafer transport tests can be performed to ensure consistent belt spacing and smooth wafer transport. This allows for precise control of the spacing between the first belt 21 and the second belt 22, as well as between the third belt 23 and the fourth belt 24, ensuring they are equal. This design contributes to the stability and consistency of ultra-thin wafer transport, thereby improving wafer yield and production efficiency.

[0049] Of course, the interval between the first belt 21 and the second belt 22 can also be greater than or less than the interval between the second belt 22 and the third belt 23. In this embodiment, the interval between the second belt 22 and the third belt 23 can be flexibly adjusted according to the size of the silicon wafer.

[0050] The first belt 21 and the second belt 22 are detachably mounted on the first frame 11, and the third belt 23 and the fourth belt 24 are detachably mounted on the second frame 12. During transportation, when transporting thicker silicon wafers (i.e., wafer thickness > 120µm), such as 130µm, the first belt 21 is mounted on the first frame 11, and the fourth belt 24 is mounted on the second frame 12. The two belts rotate synchronously through the coupling 30. When transporting thinner silicon wafers (i.e., wafer thickness ≤ 120µm), such as 100µm, the coupling 30 is first disassembled, then the second belt 22 is mounted on the first frame 11, and the third belt 23 is mounted on the second frame 12. Finally, the coupling 30 is reinstalled. At this time, the four belts rotate synchronously and support the thinner silicon wafers, ensuring their safe transportation.

[0051] like Figure 1 and Figure 3 As shown, the first frame 11 includes a first base plate 111 and two first support columns 112. The two first support columns 112 are respectively disposed at both ends of the first base plate 111 along its extension direction. A first belt 21 and a second belt 22 are both disposed on the two first support columns 112. The second frame 12 includes a second base plate 121 and two second support columns 122. The two second support columns 122 are respectively disposed at both ends of the second base plate 121 along its extension direction. A third belt 23 and a fourth belt 24 are both disposed on the two second support columns 122. The first base plate 111 and the second base plate 121 are connected to each other. The first base plate 111 and the second base plate 121 can be fixedly connected by fasteners, welded together, or designed as a single integral structure.

[0052] In this embodiment, the height and spacing of the first support column 112 and the second support column 122 should be adjusted according to the actual needs of silicon wafer transmission. The two first support columns 112 are respectively fixed to both ends of the first base plate 111, and the two second support columns 122 are respectively fixed to both ends of the second base plate 121, and are usually connected by welding or bolts to ensure that the support columns are firmly fixed to the base plate.

[0053] Specifically, the first belt 21, the second belt 22, the third belt 23 and the fourth belt 24 are all made of materials with a moderate coefficient of friction, such as polyurethane belts, to ensure the stability of the ultra-thin silicon wafer during transmission.

[0054] Specifically, the first base plate 111 and the second base plate 121 are typically made of high-strength, corrosion-resistant metal materials, such as stainless steel or aluminum alloy, to ensure structural stability and durability. The surfaces may be treated with anti-slip materials, such as adding texture, to prevent slippage during installation and use. The two first supports 112 and the two second supports 122 are also made of high-strength metal materials, and internal reinforcing ribs may be incorporated to increase stability. Regardless of whether fasteners, welding, or integral molding are used, the connection between the first frame 11 and the second frame 12 must be sufficiently stable to prevent displacement or deformation during long-term operation. After installation, an alignment check can be performed to ensure the straightness of the transmission paths of the first belt 21, second belt 22, third belt 23, and fourth belt 24 to prevent misalignment or damage during silicon wafer transport.

[0055] Furthermore, the silicon wafer transport device also includes a first extension plate 61 and a second extension plate 62. The first extension plate 61 has a first end and a second end disposed opposite to each other. The first end of the first extension plate 61 is connected to the downstream first support column 112 of the two first support columns 112. The second end of the first extension plate 61 protrudes from the frame in the length direction. A first belt 21 and a second belt 22 are both disposed on the two first support columns 112 and the first extension plate 61. The second extension plate 62 has a first end and a second end disposed opposite to each other. The first end of the second extension plate 62 is connected to the downstream second support column 122 of the two second support columns 122. The second end of the second extension plate 62 protrudes from the frame in the length direction. A third belt 23 and a fourth belt 24 are both disposed on the two second support columns 122 and the second extension plate 62.

[0056] In this embodiment, the first end of the first extension plate 61 is connected to two downstream first pillars 112 to ensure a secure and aligned connection. The second end of the first extension plate 61 protrudes from the frame in the length direction to connect components of other devices and is positioned at a considerable distance from the first end to prevent vibrations of other device components from affecting the smoothness of transmission. Simultaneously, the first extension plate 61 cooperates with the pulley 50 to tension the belt, preventing belt slack from occurring due to prolonged operation and affecting transmission efficiency. Similarly, the first end of the second extension plate 62 is connected to two downstream second pillars 122 to ensure a secure and aligned connection. The second end of the second extension plate 62 protrudes from the frame in the length direction to connect components of other devices and is positioned at a considerable distance from the first end to prevent vibrations of other device components from affecting the smoothness of transmission. Simultaneously, the second extension plate 62 cooperates with the pulley 50 to tension the belt, preventing belt slack from occurring due to prolonged operation and affecting transmission efficiency.

[0057] Furthermore, the first belt 21, the second belt 22, the third belt 23, and the fourth belt 24 have the same width. In this embodiment, the first belt 21, the second belt 22, the third belt 23, and the fourth belt 24 are all selected with the same width, which improves the applicability of the belts, facilitates installation, eliminates the need for special selection, and improves the convenience of replacement.

[0058] Specifically, the width of the belt ranges from 20 to 25 mm, such as 20 mm, 22 mm, 25 mm, etc. The belt width can be determined according to the specific needs of the silicon wafer transport process. At the same time, the material, friction coefficient and load-bearing capacity of the belt are taken into account to ensure that the belt not only has the same width, but also has sufficient performance to support and transport ultra-thin silicon wafers, which can improve the efficiency of the transport process and the yield of silicon wafers, and reduce production costs.

[0059] Specifically, a first belt 21 and a second belt 22 are installed on the first support 112, and a third belt 23 and a fourth belt 24 are installed on the second support 122. During installation, it is essential to ensure that the position of each belt is aligned with its corresponding bracket to avoid inconsistent widths due to installation deviations. After installation, the four belts are adjusted synchronously to ensure they operate synchronously during transmission, preventing silicon wafer jamming or damage caused by differences in rotational speed or phase.

[0060] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0061] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0062] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0063] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0064] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0065] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A silicon wafer transport device, characterized in that, The silicon wafer transport device includes: The frame includes a first frame (11) and a second frame (12) arranged side by side at intervals along the width direction; The first belt (21) and the second belt (22) are detachably disposed on both sides of the first frame (11); The third belt (23) and the fourth belt (24) are detachably mounted on both sides of the second frame (12); The first drive rod is mounted on the first frame (11) and passes through the first belt (21) and the second belt (22). The first drive rod is used to drive the first belt (21) and the second belt (22) to rotate synchronously. The second drive rod is mounted on the second frame (12) and passes through the third belt (23) and the fourth belt (24). The second drive rod is used to drive the third belt (23) and the fourth belt (24) to rotate synchronously. The coupling (30) is detachably connected to the first drive rod and the second drive rod.

2. The silicon wafer transport device according to claim 1, characterized in that, The silicon wafer transport device also includes: A drive unit is mounted on the frame. The drive unit is driven to connect with the first drive rod and the second drive rod. The drive unit is used to drive the first belt (21), the second belt (22), the third belt (23) and the fourth belt (24) to rotate synchronously.

3. The silicon wafer transport device according to claim 2, characterized in that, The silicon wafer transport device also includes: A signal transceiver (40) is electrically connected to the drive unit. The signal transceiver (40) is used to receive remote control signals and control the drive unit.

4. The silicon wafer transport device according to claim 1, characterized in that, The silicon wafer transport device also includes a wheel set, which has multiple pulleys (50). The wheel set is provided on both sides of the first frame (11) and both sides of the second frame (12). The first belt (21), the second belt (22), the third belt (23) and the fourth belt (24) are respectively fitted on a corresponding set of the wheel sets.

5. The silicon wafer transport device according to claim 1, characterized in that, The interval between the first belt (21) and the second belt (22) is equal to the interval between the third belt (23) and the fourth belt (24).

6. The silicon wafer transport device according to claim 5, characterized in that, The interval between the first belt (21) and the second belt (22) is greater than or less than the interval between the second belt (22) and the third belt (23).

7. The silicon wafer transport device according to claim 1, characterized in that, The first frame (11) includes a first base plate (111) and two first pillars (112). The two first pillars (112) are respectively disposed at both ends of the first base plate (111) along the extension direction of the first base plate (111). The first belt (21) and the second belt (22) are both disposed on the two first pillars (112).

8. The silicon wafer transport device according to claim 7, characterized in that, The second frame (12) includes a second base plate (121) and two second pillars (122). The two second pillars (122) are respectively arranged at both ends of the second base plate (121) along the extension direction of the second base plate (121). The third belt (23) and the fourth belt (24) are both arranged on the two second pillars (122). The first base plate (111) and the second base plate (121) are connected to each other.

9. The silicon wafer transport device according to claim 8, characterized in that, The silicon wafer transport device also includes: The first extension plate (61) has a first end and a second end disposed opposite to each other. The first end of the first extension plate (61) is connected to the downstream first support column (112) of the two first support columns (112). The second end of the first extension plate (61) protrudes from the frame in the length direction. The first belt (21) and the second belt (22) are both disposed on the two first support columns (112) and the first extension plate (61). The second extension plate (62) has a first end and a second end that are disposed opposite to each other. The first end of the second extension plate (62) is connected to the downstream second support column (122) of the two second support columns (122). The second end of the second extension plate (62) protrudes from the frame in the length direction. The third belt (23) and the fourth belt (24) are both disposed on the two second support columns (122) and the second extension plate (62).

10. The silicon wafer transport device according to claim 1, characterized in that, The first belt (21), the second belt (22), the third belt (23), and the fourth belt (24) have the same width.

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