Two-triode packaging structure

By employing a cover connection and heat dissipation device design in the diode and transistor package structure, the problem of inconvenient disassembly of diode and transistor packages is solved, achieving convenient maintenance and rapid heat dissipation.

CN223899712UActive Publication Date: 2026-02-10SHENZHEN YUANYANGHONG ELECTRONICS CO LTD
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Patent Information

Application Number
CN202423180619.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-23
Publication Date
2026-02-10
Estimated Expiration
2034-12-23

AI Technical Summary

Technical Problem

The existing diode and transistor packaging structure is a single unit, which makes disassembly, inspection and maintenance inconvenient and has limitations.

Method used

The device is encapsulated using a cover-and-connect method. The collector and transmitter are fixed by setting a fixing groove and positioning post in the base plate, and equipped with a sealed top cover. Combined with a heat dissipation device, it can achieve quick disassembly and positioning, and the installation is precise and the fixing effect is good.

Benefits of technology

It enables convenient disassembly, inspection, and maintenance of diodes and transistors, ensuring accurate and secure installation, while also providing rapid heat dissipation to prevent overheating from affecting their lifespan.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a two-triode packaging structure in the technical field of electronic equipment, which comprises a bottom plate, a fixing groove is arranged in the bottom plate, a collector plate is fixedly connected in the fixing groove in a threaded manner, the upper end of the collector plate is fixedly connected with a current collection end, the upper end of the fixing groove is fixedly connected with a positioning column, and the upper end of the positioning column is fixedly connected with a current collection end. The lower end of the collector plate is fixedly connected with a transmitting end, the lower end of the fixing groove is fixedly connected with a same positioning column, the collector end and the transmitting end are sleeved with the positioning column, and the upper end of the bottom plate is connected with a sealing upper cover in a covering mode. According to the arrangement, packaging is carried out in a covering connection mode, disassembly, inspection and maintenance are convenient, meanwhile, good positioning can be carried out through the arrangement of the positioning assembly, installation is accurate, meanwhile, the overall fixing effect can be better, and falling is avoided.
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Description

Technical Field

[0001] This utility model belongs to the field of electronic equipment technology, specifically relating to a diode and transistor packaging structure. Background Technology

[0002] Diodes and transistors are semiconductor devices that control current. Their function is to amplify weak signals into electrical signals with larger amplitudes. They are also used as contactless switches and have current amplification capabilities. They are core components of electronic circuits. The middle part is the base region, and the two sides are the emitter region and collector region.

[0003] Existing diodes and transistors are usually packaged as a single unit, which makes it inconvenient to disassemble for inspection and repair when problems occur, thus presenting certain limitations. Utility Model Content

[0004] The purpose of this utility model is to provide a diode and transistor packaging structure to solve the problem mentioned in the background art that existing diodes and transistors are usually packaged as a single piece, which makes it inconvenient to disassemble for inspection and repair when problems occur, and has certain limitations.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a diode / transistor packaging structure, including a base plate, a fixing groove is provided inside the base plate, a collector plate is fixedly connected to the fixing groove by a thread, a collector terminal is fixedly connected to the upper end of the collector plate, a positioning post is fixedly connected to the upper end of the fixing groove, a transmitter terminal is fixedly connected to the lower end of the collector plate, and the same positioning post is fixedly connected to the lower end of the fixing groove. The collector terminal and the transmitter terminal are both sleeved inside the positioning post, and a sealing cover is attached to the upper end of the base plate.

[0006] Preferably, a heat dissipation device is fixedly connected to the surface of the sealing cover by a screw thread.

[0007] Preferably, the heat dissipation device includes a fixing plate, a heat-conducting plate, and heat dissipation fins. The fixing plate has threaded fixing holes at its four corners. The lower end of the fixing plate is fixedly connected to the heat-conducting plate, and the upper end of the heat-conducting plate is fixedly connected to the heat dissipation fins.

[0008] Preferably, the upper end of the collector terminal is provided with receiving slots on both sides.

[0009] Compared with the prior art, the beneficial effects of this utility model are:

[0010] 1. This utility model adopts a cover-fitting method for encapsulation, which facilitates disassembly, inspection and maintenance. At the same time, the positioning component can be set to achieve good positioning, accurate installation, and better overall fixation, preventing it from falling off.

[0011] 2. This utility model can dissipate heat quickly, thus effectively preventing excessive internal temperature and providing excellent protection. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model;

[0013] Figure 2 This is a schematic diagram of the internal structure of the base plate of this utility model;

[0014] Figure 3 This is a schematic diagram of the internal structure of the heat dissipation device of this utility model.

[0015] In the diagram: 1. Base plate; 2. Fixing groove; 3. Collector plate; 4. Transmitter; 5. Collector; 6. Positioning post; 7. Sealing cover; 8. Loading slot; 9. Heat dissipation device; 10. Fixing screw; 11. Fixing plate; 12. Heat-conducting plate; 13. Heat dissipation fins; 14. Threaded fixing hole. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-3 This utility model provides a technical solution: a diode and transistor packaging structure, including a base plate 1, a fixing groove 2 is provided inside the base plate 1, a collector plate 3 is fixedly connected to the inside of the fixing groove 2 by threads, a collector terminal 5 is fixedly connected to the upper end of the collector plate 3, a positioning post 6 is fixedly connected to the upper end of the fixing groove 2, a transmitter terminal 4 is fixedly connected to the lower end of the collector plate 3, and the same positioning post 6 is fixedly connected to the lower end of the fixing groove 2. The collector terminal 5 and the transmitter terminal 4 are both sleeved inside the positioning post 6, and a sealing cover 7 is covered on the upper end of the base plate 1.

[0018] In this embodiment, the collector plate 3 can be fixed by the fixing groove 2 opened in the base plate 1. At the same time, the positioning posts 6 set at the upper and lower ends of the fixing groove 2 can be used to position and limit the collector end 5 and the transmitter end 4. Then, the sealing cover 7 is closed to fix the collector plate 3, the transmitter end 4 and the collector end 5 as a whole. This design adopts the cover-close method for encapsulation, which is convenient for disassembly, inspection and maintenance. At the same time, the positioning component can be set to achieve good positioning and accurate installation, and can also make the overall fixing effect better and prevent it from falling off.

[0019] Specifically, the surface of the sealed cover 7 is fixedly connected to a heat dissipation device 9 by a fixing screw 10.

[0020] In this embodiment, the heat dissipation device 9 can dissipate heat from the heat collection area 3, preventing excessive temperature from affecting its service life.

[0021] Specifically, the heat dissipation device 9 includes a fixing plate 11, a heat-conducting plate 12, and heat dissipation fins 13. The four corners of the fixing plate 11 are fixedly provided with threaded fixing holes 14. The lower end of the fixing plate 11 is fixedly connected to the heat-conducting plate 12, and the upper end of the heat-conducting plate 12 is fixedly connected to the heat dissipation fins 13.

[0022] In this embodiment, after the fixing plate 11 is threaded, the heat-conducting plate 12 can abut against the upper end of the heat collection plate 3 to conduct heat. At the same time, the heat dissipation fins 13 dissipate heat from the heat-conducting plate 12, so that the heat collection plate 3 can dissipate heat quickly. This design can dissipate heat quickly, thereby effectively avoiding excessive internal temperature and providing good protection.

[0023] Specifically, the upper ends of the collector 5 are fixedly provided with receiving slots 8 on both sides.

[0024] In this embodiment, the mounting slot 8 facilitates power connection for power collection.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A diode / transistor packaging structure, comprising a base plate (1), characterized in that: The base plate (1) has a fixing groove (2) inside. A collection plate (3) is fixedly connected to the inside of the fixing groove (2) by a thread. A collection terminal (5) is fixedly connected to the upper end of the collection plate (3). A positioning post (6) is fixedly connected to the upper end of the fixing groove (2). A transmitting end (4) is fixedly connected to the lower end of the collection plate (3). The same positioning post (6) is fixedly connected to the lower end of the fixing groove (2). The collection terminal (5) and the transmitting end (4) are both sleeved inside the positioning post (6). A sealing cover (7) is attached to the upper end of the base plate (1).

2. The diode / transistor packaging structure according to claim 1, characterized in that: The surface of the sealed cover (7) is fixedly connected to a heat dissipation device (9) by a fixing screw (10).

3. The diode / transistor packaging structure according to claim 2, characterized in that: The heat dissipation device (9) includes a fixing plate (11), a heat-conducting plate (12) and heat dissipation fins (13). The four corners of the fixing plate (11) are fixedly provided with threaded fixing holes (14). The lower end of the fixing plate (11) is fixedly connected to the heat-conducting plate (12), and the upper end of the heat-conducting plate (12) is fixedly connected to the heat dissipation fins (13).

4. The diode / transistor packaging structure according to claim 1, characterized in that: The upper end of the collector (5) is fixedly provided with receiving slots (8) on both sides.