Transient suppression diode packaging structure with power enhancement function

Abstract

The utility model relates to the related field of diode packaging structures, in particular to a transient suppression diode packaging structure with a power enhancement function, which comprises a device body, an upper shell, a lower shell, a connecting assembly, a pin assembly, a boss and a chip are arranged in the device body, the upper shell and the lower shell are symmetrically arranged, and the connecting assembly is connected with the pin assembly. The connecting assembly is installed between the upper shell and the lower shell, the two pin assemblies are symmetrically located at the outer ends of the upper shell and the lower shell, bosses are arranged in the upper shell and the lower shell respectively, embedded grooves are formed in the inner sides of the bosses, and the chip is correspondingly connected between the two embedded grooves. The connecting assembly comprises an upper sleeve and a lower sleeve, and the pin assembly comprises a mounting plate and a hinge seat, so that folding and limiting of a pin piece can be realized, flexible use or storage of the pin piece is facilitated, convenient disassembly and assembly operation between the upper shell and the lower shell can be realized, and disassembly, maintenance or replacement of a chip is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of diode packaging structure, and in particular to a transient suppression diode packaging structure with power enhancement function. Background Technology

[0002] Transient voltage suppressor diodes (TVS diodes) are electronic components used to protect electrical equipment from voltage spikes. When a transient overvoltage occurs in a circuit, the TVS diode can quickly conduct and absorb the high-energy surge, thereby protecting the precision components in the circuit from damage. TVS diodes have the characteristic of fast response.

[0003] The utility model patent with publication number CN 206711899 U in the prior art proposes a transient suppression diode packaging structure with power enhancement function. By changing the boss of the shell to a square and embedding bosses on both sides of the chip, the contact area between the boss and the chip can be increased, thereby improving the surge capability. It can effectively improve the protection performance of electronic components. It is simple and practical, and has a small size and low cost, making it suitable for widespread promotion.

[0004] However, it lacks the ability to fold and store diode pins, as well as the ability to flexibly disassemble and assemble the package structure. It is inconvenient to inspect and maintain the chip during use, resulting in poor convenience for inspection and maintenance. It also fails to protect the pins, reducing the safety and lifespan of the pins. Therefore, we need to upgrade and modify the existing technology to overcome the existing problems and shortcomings. Utility Model Content

[0005] The purpose of this invention is to provide a transient suppression diode package structure with power enhancement function to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] Design a transient suppression diode package structure with power enhancement function, including a device body. The device body includes an upper shell, a lower shell, a connecting component, a pin assembly, a boss, and a chip. The upper shell and the lower shell are symmetrically arranged. The connecting component is installed between the upper shell and the lower shell. The pin assembly is provided in two sets and symmetrically located at the outer ends of the upper shell and the lower shell. The upper shell and the lower shell are respectively provided with a boss and an embedded groove is opened on the inner side of the boss. The chip is connected between the two sets of embedded grooves.

[0008] Furthermore, the connecting assembly includes an upper sleeve and a lower sleeve. The upper sleeve is fixed to the lower end of the upper housing and has a threaded groove inside. The lower sleeve is fixed to the upper end of the lower housing and has a threaded head at the top, which is connected to the threaded groove.

[0009] Furthermore, the pin assembly includes a mounting plate and a hinge base. A pin is rotatably provided on the inner side of the hinge base. A limiting hole is provided at the end of the pin. A movable groove is opened in the mounting plate. A spring is provided inside the movable groove. A movable shaft is connected to the outer end of the spring.

[0010] Furthermore, the threaded head and the lower sleeve are respectively provided with an inner sealing ring and an outer sealing ring, which are respectively attached to the inner side and bottom of the upper sleeve.

[0011] Furthermore, the mounting plate is fixed to the outer ends of the upper and lower housings, and the hinge seat is fixed to the side of the upper and lower housings.

[0012] Furthermore, a push-pull block is connected to the upper end of the movable shaft and the push-pull block is located at the upper end of the mounting plate, and the outer end of the movable shaft passes through the movable groove and is inserted into the corresponding limiting hole.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model has a device with a pin assembly, a mounting plate, a hinge seat, pin parts, a limiting hole, a movable groove, a spring, a movable shaft, and a push-pull block. The movable shaft is elastically extended and retracted by the push-pull block and the spring. The movable shaft is inserted or separated from the limiting hole, which can realize the rotation, extension and retraction of the pin parts and quick limiting operation. It is convenient for the flexible use or storage of the pin parts, prevents them from being exposed and bent or damaged, and improves the practicality of the device.

[0015] 2. This utility model has an upper housing, a lower housing, an upper sleeve, a lower sleeve, a threaded groove, a threaded head, an inner sealing ring, and an outer sealing ring. The threaded groove and the threaded head are screwed together, so that the inner sealing ring fits between the threaded head and the upper sleeve, and the outer sealing ring fits between the lower sleeve and the upper sleeve. This enables convenient disassembly and assembly of the upper and lower housings, making it easy to disassemble, maintain, or replace the chip, preventing the problem of difficult disassembly of the package housing, and improving the practicality of the device.

[0016] Specific embodiments of the present invention are disclosed in detail with reference to the following description and accompanying drawings, indicating how the principles of the present invention can be employed. It should be understood that the embodiments of the present invention are not limited in scope. Within the spirit and scope of the appended claims, the embodiments of the present invention include many changes, modifications, and equivalents. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 This is a schematic diagram of the overall structure of a transient suppression diode package structure with power enhancement function according to the present invention;

[0019] Figure 2 This is a schematic diagram of the working structure of a transient suppression diode package structure with power enhancement function according to the present invention;

[0020] Figure 3 This is an exploded view of the connection assembly of a transient suppression diode package structure with power enhancement function according to the present invention;

[0021] Figure 4 This is an exploded view of the pin assembly of a transient suppression diode package structure with power enhancement function according to the present invention.

[0022] In the diagram: 1. Device body; 2. Upper housing; 3. Lower housing; 4. Connecting assembly; 41. Upper sleeve; 42. Lower sleeve; 43. Threaded groove; 44. Threaded head; 45. Inner sealing ring; 46. Outer sealing ring; 5. Pin assembly; 51. Mounting plate; 52. Hinge seat; 53. Pin component; 54. Limiting hole; 55. Movable groove; 56. Spring; 57. Movable shaft; 58. Push-pull block; 6. Boss; 61. Embedded groove; 7. Chip. Detailed Implementation

[0023] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0024] like Figure 1 As shown in Figure 4, this embodiment provides a transient suppression diode package structure with power enhancement function, including a device body 1. The device body 1 includes an upper housing 2, a lower housing 3, a connecting component 4, a pin component 5, a boss 6, and a chip 7. The upper housing 2 and the lower housing 3 are symmetrically arranged. The connecting component 4 is installed between the upper housing 2 and the lower housing 3. Two sets of pin components 5 are provided and symmetrically located at the outer ends of the upper housing 2 and the lower housing 3. The upper housing 2 and the lower housing 3 are respectively provided with a boss 6 inside, and an embedded groove 61 is opened on the inner side of the boss 6. The chip 7 is correspondingly connected between the two sets of embedded grooves 61.

[0025] Preferably, the connecting assembly 4 includes an upper sleeve 41 and a lower sleeve 42. The upper sleeve 41 is fixed to the lower end of the upper housing 2 and has a threaded groove 43 inside. The lower sleeve 42 is fixed to the upper end of the lower housing 3 and has a threaded head 44 at the top, which is connected to the threaded groove 43. The threaded head 44 and the lower sleeve 42 are respectively provided with an inner sealing ring 45 and an outer sealing ring 46. The inner sealing ring 45 and the outer sealing ring 46 are respectively attached to the inner side and the bottom of the upper sleeve 41.

[0026] The upper sleeve 41 and the lower sleeve 42 are symmetrically fixed by screwing the threaded groove 43 and the threaded head 44 respectively, so that the inner sealing ring 45 fits between the threaded head 44 and the upper sleeve 41, and the outer sealing ring 46 fits between the lower sleeve 42 and the upper sleeve 41. This enables convenient disassembly and assembly of the upper housing 2 and the lower housing 3, facilitates the disassembly, maintenance or replacement of the chip 7, prevents the problem of difficult disassembly of the package housing, and improves the practicality of the device.

[0027] Preferably, the pin assembly 5 includes a mounting plate 51 and a hinge base 52. A pin 53 is rotatably provided on the inner side of the hinge base 52. A limiting hole 54 is provided at the end of the pin 53. A movable groove 55 is opened in the mounting plate 51. A spring 56 is provided inside the movable groove 55. A movable shaft 57 is connected to the outer end of the spring 56. The mounting plate 51 is fixed to the outer end of the upper housing 2 and the lower housing 3. The hinge base 52 is fixed to the side of the upper housing 2 and the lower housing 3. A push-pull block 58 is connected to the upper end of the movable shaft 57 and the push-pull block 58 is located at the upper end of the mounting plate 51. The outer end of the movable shaft 57 passes through the movable groove 55 and is inserted into the limiting hole 54.

[0028] The pin 53 is rotated by the hinge base 52, so that the pin 53 is folded on one side of the mounting plate 51. The movable shaft 57 is elastically extended and retracted by the push-pull block 58 and the spring 56. The movable shaft 57 is inserted into the corresponding limit hole 54, thereby realizing the folding, retraction and locking of the pin 53. This makes it easy to store or use the pin 53 flexibly, prevents it from being bent and damaged when it is extended outward, and improves the practicality of the device.

[0029] The working principle and process of this utility model are as follows: When in use, the chip 7 can be placed in the middle position and connected through the upper shell 2 and the lower shell 3 so that the chip 7 is inserted into the inner grooves 61 on both sides. At this time, rotate the upper shell 2 and the lower shell 3 so that the threaded head 44 is screwed into the threaded groove 43, so that the inner sealing ring 45 is attached between the threaded head 44 and the upper sleeve 41, and the outer sealing ring 46 is attached between the lower sleeve 42 and the upper sleeve 41. When the chip 7 needs to be inspected or replaced, the operation is reversed. Maintenance is flexible and convenient. Pull the push-pull block 58 backward. The push-pull block 58 drives the movable shaft 57 to disengage from the limiting hole 54 and retract into the movable groove 55. At this time, the pin 53 can be rotated to a vertical angle through the hinge seat 52 for use. Conversely, the pin 53 can be folded into the mounting plate 51.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

Claims

1. A transient suppression diode package structure with power enhancement function, characterized in that: The device includes a main body (1), which contains an upper housing (2), a lower housing (3), a connecting component (4), a pin component (5), a boss (6), and a chip (7). The upper housing (2) and the lower housing (3) are symmetrically arranged. The connecting component (4) is installed between the upper housing (2) and the lower housing (3). The pin component (5) is provided in two sets and is symmetrically located at the outer ends of the upper housing (2) and the lower housing (3). The upper housing (2) and the lower housing (3) are respectively provided with a boss (6) and an embedded groove (61) is opened on the inner side of the boss (6). The chip (7) is connected between the two sets of embedded grooves (61).

2. The transient suppression diode package structure with power enhancement function according to claim 1, characterized in that: The connecting assembly (4) includes an upper sleeve (41) and a lower sleeve (42). The upper sleeve (41) is fixed to the lower end of the upper housing (2) and has a threaded groove (43) inside. The lower sleeve (42) is fixed to the upper end of the lower housing (3) and has a threaded head (44) at the top, and the threaded head (44) is connected to the threaded groove (43).

3. The transient suppression diode package structure with power enhancement function according to claim 1, characterized in that: The pin assembly (5) includes a mounting plate (51) and a hinge base (52). A pin component (53) is rotatably provided inside the hinge base (52). A limiting hole (54) is provided at the end of the pin component (53). A movable groove (55) is provided inside the mounting plate (51). A spring (56) is provided inside the movable groove (55). A movable shaft (57) is connected to the outer end of the spring (56).

4. The transient suppression diode package structure with power enhancement function according to claim 2, characterized in that: The threaded head (44) and the lower sleeve (42) are respectively provided with an inner sealing ring (45) and an outer sealing ring (46), and the inner sealing ring (45) and the outer sealing ring (46) are respectively attached to the inner side and the bottom of the upper sleeve (41).

5. A transient suppression diode package structure with power enhancement function according to claim 3, characterized in that: The mounting plate (51) is fixed to the outer ends of the upper housing (2) and the lower housing (3), and the hinge seat (52) is fixed to the side of the upper housing (2) and the lower housing (3).

6. The transient suppression diode package structure with power enhancement function according to claim 3, characterized in that: The upper end of the movable shaft (57) is connected to a push-pull block (58), and the push-pull block (58) is located on the upper end of the mounting plate (51). The outer end of the movable shaft (57) passes through the movable groove (55) and is inserted into the limiting hole (54).

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