Laser processing machine

Abstract

The utility model provides a laser processing machine. The laser processing machine is integrated with a blue laser module and an infrared laser module, and laser processing of many materials can be achieved. A blue laser module, a first light guide structure, a galvanometer and a focus lens are arranged on a working head so as to move along with the working head. And the fixed light path length and the stable light spot size of the blue laser are kept. The output light beam of the blue laser module is transmitted to the galvanometer through the first light guide structure and is emitted to the workpiece through the galvanometer and the focus lens to achieve blue laser processing, and the processing effect is stable. The infrared laser beam is high in quality and small in divergence angle, and the stable light spot size can be kept during long-distance transmission. The infrared laser module is fixed on the rack. And an output light beam of the infrared laser module is transmitted to the galvanometer through the second light guide structure, and is emitted to a workpiece through the galvanometer and the focus lens to realize infrared laser processing. The working head drives the galvanometer and the focus lens to move for laser processing, the laser processing range is large, the processing efficiency is high, and the laser engraving effect is good.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of laser processing, and particularly relates to a laser processing machine. BACKGROUND

[0002] A laser processing machine in the related art moves a laser module by a work head, and laser generated by the laser module is irradiated on a workpiece. Heat generated by the laser beam projected on the surface of the workpiece material is used to realize laser processing of the workpiece, such as laser engraving, laser cutting and welding.

[0003] How to provide a laser processing machine capable of outputting blue laser and infrared laser to realize laser processing of many materials is a problem to be solved in the industry. CONTENT OF THE INVENTION

[0004] The application aims to provide a laser processing machine capable of outputting blue laser and infrared laser to realize laser processing of many materials.

[0005] The application provides a laser processing machine, which comprises a rack, a work head, a blue laser module, a first light guide structure, a galvanometer, a focusing mirror, an infrared laser module and a second light guide structure. The work head can be translated in a first plane relative to the rack. The blue laser module, the first light guide structure, the galvanometer and the focusing mirror are all installed on the work head. The first light guide structure is used to conduct the output beam of the blue laser module to the galvanometer. The infrared laser module is fixed on the rack, and the second light guide structure is used to conduct the output beam of the infrared laser module to the galvanometer. The galvanometer is used to deflect the emergent light of the first light guide structure and the emergent light of the second light guide structure. The focusing mirror is located on the light-emitting side of the galvanometer.

[0006] In an optional implementation, the blue laser module is a semiconductor laser module.

[0007] In an optional implementation, the infrared laser module is a fiber laser module or a carbon dioxide laser module.

[0008] In an optional implementation, the first light guide structure is a reflective light guide structure.

[0009] In an optional implementation, the second light guide structure is a reflective light guide structure.

[0010] In an optional implementation, the first light guide structure comprises a first reflector and a second reflector, the output end of the blue laser module and the first reflector are oppositely arranged along a first direction, the second reflector and the first reflector are oppositely arranged along a second direction, the second reflector and the light entrance side of the galvanometer are oppositely arranged along the first direction; the first direction and the second direction are perpendicular, and the first direction and the second direction are parallel to the first plane.

[0011] In an optional implementation, the work head is slidingly installed on a cross beam along the first direction, and the cross beam is slidingly installed on the rack along the second direction.

[0012] In an optional implementation, the second light guide structure comprises a third reflector and a fourth reflector, the third reflector is fixed to the rack, and the fourth reflector is fixed to the cross beam; the output end of the infrared laser module and the third reflector are oppositely arranged along the first direction, the fourth reflector and the third reflector are oppositely arranged along the second direction, the fourth reflector, the second reflector and the light entrance side of the galvanometer are sequentially arranged along the first direction, and the second reflector is a light combining mirror.

[0013] In an optional implementation, the work head is slidingly installed on a cross beam along the first direction, and the cross beam is slidingly installed on the rack along the second direction.

[0014] In an optional implementation, the output beam of the blue laser module and the output beam of the infrared laser module are located at the same height position.

[0015] In an optional implementation, the rack is provided with a first driving module, the work head is connected to the first driving module, and the first driving module is used to drive the work head to translate in the first plane.

[0016] In an optional implementation, the rack has a workbench, and the workbench can move up and down relative to the rack.

[0017] In an optional implementation, the rack is provided with a second driving module, the workbench is connected to the second driving module, and the second driving module is used to drive the workbench to move up and down.

[0018] The laser processing machine provided by the embodiment of the present application has the advantages that the laser processing machine is integrated with a blue laser module and an infrared laser module. Laser beams of different wavelengths can process workpieces of different materials. The processing material of the blue laser can be paper, wood, leather, organic soft material, etc. The processing material of the infrared laser can be metal, plastic, etc. The blue laser and the infrared laser are complementary, and can realize laser processing of many materials. The blue laser or the infrared laser is input to the galvanometer movable on the first plane, which improves the processing efficiency of the laser processing machine and expands the processing size. The flexibility of the laser processing machine is improved in two dimensions of processing material and processing size.

[0019] In order to achieve the above object, the following aspects need to be considered: 1) the working head needs to be moved, and the weight and volume thereof need to be controlled; 2) the same focusing mirror processes laser beams of different wavelengths, and the refraction characteristics thereof are different. That is, the same focusing mirror processes blue light and infrared light beams, and the focal lengths thereof are different; 3) the same focusing mirror processes light beams of the same wavelength, and the sizes of the light spots input into the focusing mirror and the sizes of the focused light spots are different, and the size of the focused light spot directly affects the engraving and cutting effect of the light beam; 4) the beam quality of the blue laser and the infrared laser is different. The beam quality of the blue laser is poor, and the divergence angle thereof is relatively large, and the sizes of the light spots under different light path lengths are different. The beam quality of the infrared laser is high, and the divergence angle thereof is extremely small, and the size of the light spot changes little within a certain distance; 5) the volume and weight of the blue laser module and the infrared laser module. The weight of the blue laser module is relatively light, and the volume thereof is relatively small. The volume and weight of the infrared laser module are relatively large;

[0020] In view of the above design factors, the blue laser module, the first light guide structure, the galvanometer and the focusing mirror are arranged on the working head to move with the working head relative to the rack in the plane. The output light beam of the blue laser module is transmitted to the galvanometer and the focusing mirror through the first light guide structure, so that the length of the blue laser light path is relatively short and fixed, so that the size of the light spot is stable, and the consistency of the processing effect in the whole working range is high. The infrared laser module is fixed on the rack, and the light beam output by the infrared laser module is transmitted to the galvanometer and the focusing mirror through the second light guide structure. The high beam quality of the infrared laser can ensure the consistency of the processing effect, and the volume and weight of the working head are effectively controlled. The working head moves to drive the galvanometer and the focusing mirror to move for laser processing, and the laser processing range is large, the processing efficiency is high, the types of processable materials are many, and the consistency of the processing effect is high. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the accompanying drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can be obtained based on these drawings without creative labor.

[0022] Figure 1 A perspective view of the laser processing machine according to the present application when the door is closed;

[0023] Figure 2 A perspective view of the laser processing machine according to the present application when the door is opened; Figure 1

[0024] Figure 3 A perspective exploded view of the laser processing machine according to the present application; Figure 1

[0025] Figure 4 A structural view of the laser processing machine according to the present application after the partial rack structure is disassembled; Figure 3

[0026] Figure 5 An optical path schematic of the laser processing machine according to the present application; Figure 2 Figure 1

[0027] Figure 6 An optical path schematic of the laser processing machine according to the present application; Figure 2 Figure 2

[0028] Figure 7 A perspective exploded view of the working head related structure in the laser processing machine according to the present application; Figure 3

[0029] Figure 8 A further perspective exploded view of the working head related structure according to the present application, without the cover; Figure 7

[0030] A structural schematic of the working head and crossbeam in the laser processing machine according to the present application; Figure 9 Figure 4 A structural schematic of the first driving module and the second driving module in the laser processing machine according to the present application.

[0031] Figure 10 Figure 4 DETAILED DESCRIPTION

[0032] ​​​​​​​​​​​In order to make the technical problems, technical solutions and beneficial effects of the present application clearer, further detailed description will be made in combination with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not intended to limit the present application.

[0033] In the description of the embodiments of the present application, it should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0034] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features referred to. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0035] In the embodiments of the present application, unless otherwise specifically defined and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0036] Please refer to Figures 1 to 6 The embodiment of the present application provides a laser processing machine 100, which comprises a rack 10, a working head 21, a blue laser module 30, a first light guide structure 31, a galvanometer 40, a focusing mirror 90, an infrared laser module 50 and a second light guide structure 51. The working head 21 can translate in a first plane relative to the rack 10. The blue laser module 30, the first light guide structure 31 and the galvanometer 40 are all mounted on the working head 21. The first light guide structure 31 is used to guide the output beam L1 of the blue laser module 30 to the galvanometer 40. The infrared laser module 50 is fixed to the rack 10, and the second light guide structure 51 is used to guide the output beam L2 of the infrared laser module 50 to the galvanometer 40. The galvanometer 40 is used to deflect the exiting light of the first light guide structure 31 and the exiting light of the second light guide structure 51. The focusing mirror 90 is located on the light exit side of the galvanometer 40.

[0037] The first direction X and the second direction Y are parallel to the first plane. The up-down direction of the gantry 10 can be defined as a third direction Z.

[0038] The laser processing machine 100 provided by the embodiments of the present application integrates the blue laser module 30 and the infrared laser module 50. Different wavelengths of laser can process workpieces of different materials. The wavelength of the blue laser is relatively short, and the wavelength of the infrared laser is relatively long. The processing material of the blue laser can be paper, wood, leather, organic soft material, etc. The processing material of the infrared laser can be metal, plastic, etc. The blue laser and the infrared laser are complementary, and can realize laser processing of many materials. Inputting the blue laser or the infrared laser to the galvanometer 40 movable on the first plane improves the processing efficiency of the laser processing machine 100, and at the same time, expands the processing size. The flexibility of the laser processing machine 100 is improved in two dimensions of processing material and processing size.

[0039] In order to achieve the above objectives, the following aspects need to be considered: 1) the working head 21 needs to be moved, and the weight and volume thereof need to be controlled; 2) the laser beams of different wavelengths pass through the same focusing mirror 90, and the refraction characteristics thereof are different. That is, the same focusing mirror 90 processes the blue light and the infrared light beams, and the focal lengths thereof are different; 3) the same focusing mirror 90 processes the light beams of the same wavelength, the spot sizes of the light beams incident to the focusing mirror 90 are different, and the spot sizes of the focused light beams are also different, and the sizes of the focused light beams directly affect the engraving and cutting effects of the light beams; 4) the beam qualities of the blue laser and the infrared laser are different. The beam quality of the blue laser is poor, and the beam divergence angle is relatively large, and the spot sizes under different optical path lengths are different. The beam quality of the infrared laser is high, the divergence angle is very small, and the spot sizes within a certain distance change very little; 5) the volumes and weights of the blue laser module 30 and the infrared laser module 50. The weight of the blue laser module 30 is relatively light, and the volume is also relatively small. The volume and weight of the infrared laser module 50 are relatively large;

[0040] In consideration of the above design factors, the blue laser module 30, the first light guide structure 31, the galvanometer 40 and the focusing lens 90 are arranged on the working head 21 to move with the working head 21 relative to the rack 10 in the plane. The output beam L1 of the blue laser module 30 is conducted to the galvanometer 40 and the focusing lens 90 through the first light guide structure 31, so that the length of the blue laser light path is relatively short and fixed, which can realize stable spot size and high consistency of processing effect in the entire working range. The infrared laser module 50 is fixed on the rack 10, and the output beam L2 of the infrared laser module 50 is conducted to the galvanometer 40 and the focusing lens 90 through the second light guide structure 51. The high beam quality of the infrared laser can ensure the consistency of the processing effect, and effectively control the volume and weight of the working head 21. The working head 21 moves to drive the galvanometer 40 and the focusing lens 90 to move for laser processing. The laser processing range is large, the processing efficiency is high, the types of processable materials are various, and the consistency of the processing effect is high.

[0041] In some embodiments, referring to Figures 1 to 3 , the rack 10 is box-shaped and can be assembled by multiple plate members 11. The rack 10 has a closed working space, and devices such as the working head 21 can be arranged in the rack 10. The rack 10 has an opening 10a, and a switch door 12 is arranged at the position of the opening 10a. For example, the switch door 12 can be a flip cover that can rotate relative to the rack 10 to switch the opening and closing of the opening 10a. The switch door 12 can be a transparent member, so that the inside of the rack 10 can be seen from the outside when the switch door 12 is closed. The laser processing machine 100 can be used as a desktop laser processing machine.

[0042] In some embodiments, referring to Figure 2 , Figure 3 , the wall of the rack 10 has an air inlet (not shown) and an air outlet 10b. A fan (not shown) can be arranged at the air outlet 10b to generate an air flow from the air inlet to the air outlet 10b. The air outlet 10b can be connected to an exhaust duct extending to the outside. The smoke generated by laser processing can follow the air flow through the air outlet 10b and the exhaust duct, and be discharged to the outside of the rack 10 to improve the air environment inside the rack 10. The air inlet can be arranged at the bottom side wall of the rack 10 or other positions. The air outlet 10b can be arranged at the rear side wall 13 of the rack 10 or other positions.

[0043] In some embodiments, referring to Figure 7 , the working head 21 can be provided with a cover 21a that covers part of the devices on the working head 21, such as the blue laser module 30, the first light guide structure 31, the galvanometer 40, etc., to protect these devices and improve reliability.

[0044] In some embodiments, referring to Figure 7 , Figure 8The working head 21 is equipped with a circuit board 27, which can be electrically connected to electrical components on the working head 21 (such as the control motor of the galvanometer 40). The circuit boards 27 can be arranged in layers at intervals to accommodate a variety of components. The circuit boards 27 can be provided with clearance holes 271 to avoid obstructing related components (such as the control motor of the galvanometer 40), resulting in a small structural footprint.

[0045] In some embodiments, please refer to Figure 5 , Figure 6 The blue laser module 30 can be a semiconductor laser module that can output blue laser light and has a small structural size. The wavelength of the blue laser light output by the blue laser module 30 can be from 400 nanometers (nm) to 500nm, such as 450nm.

[0046] In some embodiments, please refer to Figure 5 , Figure 6 The infrared laser module 50 can be a fiber laser module or a carbon dioxide laser module, etc. The infrared laser wavelength output by the fiber laser module can be 1064 nanometers (nm). The infrared laser wavelength output by the carbon dioxide laser module can be 10600 nm. Radio frequency laser modules also belong to the category of carbon dioxide laser modules.

[0047] For example, see Figures 4 to 6 The infrared laser module 50 is a fiber laser module, which includes an infrared fiber light source 501 and an infrared collimator 502. The infrared fiber light source 501 and the infrared collimator 502 are coupled together by an optical fiber 503. The light-emitting side of the infrared collimator 502 serves as the output terminal 30a of the infrared laser module 50. The fiber laser module is fixed on the frame 10, rather than being mounted on the working head 21.

[0048] In some embodiments, please refer to Figure 5 , Figure 6 The first light guide structure 31 can adjust the propagation optical path of the blue laser module 30, so that the output beam L1 of the blue laser module 30 is guided to the galvanometer 40. The first light guide structure 31 is a reflective light guide structure, that is, a light guide structure with a reflector. This method is simple in structure, easy to arrange, and occupies less space.

[0049] In some embodiments, please refer to Figures 6 to 8 A shield 32 can be installed outside the first light guide structure 31 to reduce the amount of ambient light entering the galvanometer 40. The shield 32 has a light-transmitting area 321 for the output beam of the infrared laser module 50 to enter the galvanometer 40.

[0050] In some embodiments, please refer to Figure 5 , Figure 6The second light guide structure 51 can adjust the propagation path of the infrared laser module 50, so that the output light beam L2 of the infrared laser module 50 is conducted to the galvanometer 40. The second light guide structure 51 is a reflective light guide structure, that is, a light guide structure with a mirror. In this way, the structure is simple, easy to arrange, occupies less space, and weighs less. Avoiding the operation complexity of the related art laser processing machine using optical fiber to conduct infrared laser into the galvanometer in a small space. Avoiding the need for a larger arrangement space for the related art infrared laser using optical fiber transmission to meet the minimum bending radius requirement of arranging the optical fiber.

[0051] In some embodiments, referring to Figure 5 、 Figure 6 、 Figure 8 The first light guide structure 31 includes a first reflecting element 311 and a second reflecting element 312. The output end 30a of the blue laser module 30 and the first reflecting element 311 are oppositely arranged along a first direction X, the second reflecting element 312 and the first reflecting element 311 are oppositely arranged along a second direction Y, and the second reflecting element 312 and the light entrance side 40a of the galvanometer 40 are oppositely arranged along the first direction X. The first direction X and the second direction Y are perpendicular to each other, and both the first direction X and the second direction Y are parallel to the first plane.

[0052] The first light guide structure 31 with the first reflecting element 311 and the second reflecting element 312 has a simple structure, and the blue laser module 30 and the first light guide structure 31 are easy to arrange and occupy less space. The output light beam L1 of the blue laser module 30 can be incident to the light entrance side 40a of the galvanometer 40 after being reflected by the first reflecting element 311 and the second reflecting element 312 in turn. After the laser passes through the galvanometer 40 and the focusing lens 90, the laser is irradiated onto the workpiece, realizing precise laser processing. The first reflecting element 311 and the second reflecting element 312 can be a reflecting lens or a right-angle prism.

[0053] In other embodiments, the first light guide structure includes a second reflecting element without a first reflecting element. The output end of the blue laser module and the second reflecting element are oppositely arranged along a second direction, and the second reflecting element and the light entrance side of the galvanometer are oppositely arranged along a first direction. The first direction and the second direction are perpendicular to each other. The output light beam of the blue laser module can be incident to the light entrance side of the galvanometer after being reflected by the second reflecting element. After the laser passes through the galvanometer and the focusing lens, the laser is irradiated onto the workpiece, realizing precise laser processing.

[0054] In some embodiments, referring to Figure 4 、 Figure 6 The work head 21 is slidably installed on the cross beam 22 along the first direction X, and the cross beam 22 is slidably installed on the rack 10 along the second direction Y. The cross beam 22 can realize the translation of the work head 21 relative to the rack 10 in the first plane. The cross beam 22 can extend substantially along the first direction X.

[0055] In some embodiments, referring to Figures 4 to 6 , the second light guide structure 51 comprises a third reflecting member 511 and a fourth reflecting member 512, the third reflecting member 511 is fixed to the rack 10, and the fourth reflecting member 512 is fixed to the crossbeam 22; the output end 50a of the infrared laser module 50 and the third reflecting member 511 are oppositely arranged along the first direction X, the fourth reflecting member 512 and the third reflecting member 511 are oppositely arranged along the second direction Y, and the fourth reflecting member 512, the second reflecting member 312 and the light entrance side 40a of the galvanometer 40 are sequentially arranged along the first direction X. The second reflecting member 312 is a light combining mirror.

[0056] The second light guide structure 51 with the third reflecting member 511 and the fourth reflecting member 512 has a simple structure, and the infrared laser module 50 and the second light guide structure 51 are easy to arrange and occupy a small space. The output light beam L2 of the infrared laser module 50 is reflected by the third reflecting member 511 and the fourth reflecting member 512 in turn, and then passes through the second reflecting member 312 and is incident to the light entrance side 40a of the galvanometer 40. After the laser passes through the galvanometer 40 and the focusing lens 90, the laser is irradiated to the workpiece, and precise laser processing is realized. The third reflecting member 511 and the fourth reflecting member 512 can be a reflecting lens or a right-angle prism.

[0057] The second reflecting member 312 is a light combining mirror, which can realize the reflection of blue laser and the transmission of infrared light, so that the blue laser and the infrared laser are smoothly incident to the light entrance side 40a of the galvanometer 40.

[0058] In other embodiments, the second light guide structure comprises a fourth reflecting member without a third reflecting member, the output end of the infrared laser module and the fourth reflecting member are oppositely arranged along the second direction, the fourth reflecting member and the light entrance side of the galvanometer are oppositely arranged along the first direction, and the first direction and the second direction are perpendicular. After the output light beam of the infrared laser module is reflected by the fourth reflecting member, it can be incident to the light entrance side of the galvanometer. After the laser passes through the galvanometer and the focusing lens, the laser is irradiated to the workpiece, and precise laser processing is realized.

[0059] In some embodiments, referring to Figure 4 , Figure 9 , the first guiding mechanism 24 and the second guiding mechanism 25 are further included; the work head 21 is installed on the crossbeam 22 through the first guiding mechanism 24, so that the work head 21 is slidingly installed on the crossbeam 22 along the first direction X; and the crossbeam 22 is installed on the rack 10 through the second guiding mechanism 25, so that the crossbeam 22 is slidingly installed on the rack 10 along the second direction Y. The first guiding mechanism 24 can make the work head 21 stably slide along the first direction X relative to the crossbeam 22. The second guiding mechanism 25 can make the crossbeam 22 stably slide along the second direction Y.

[0060] In some embodiments, referring to Figure 4 ,Figure 9 The crossbeam 22 extends generally along the first direction X. The first guide mechanism 24 includes a first slide rail 241 and a first slider 242, with the first slider 242 slidably mounted on the first slide rail 241. The first slide rail 241 is fixed to the crossbeam 22, and the first slider 242 is fixed to the working head 21. This allows the working head 21 to be slidably mounted on the crossbeam 22 along the first direction X. Furthermore, the positions of the first slide rail 241 and the first slider 242 can be interchanged, also allowing the working head 21 to be slidably mounted on the crossbeam 22 along the first direction X.

[0061] In some embodiments, please refer to Figure 4 The crossbeam 22 extends generally along the first direction X. The second guiding mechanism 25 includes a pair of guide rods 252 and a pair of guide seats 251. The two guide rods 252 extend along the second direction Y and are respectively fixed on opposite sides of the frame 10 along the first direction X. The two guide seats 251 are respectively installed at opposite ends of the crossbeam 22. The two guide rods 252 and the two guide seats 251 are matched one-to-one, so that the crossbeam 22 is slidably installed on the frame 10 along the second direction Y. A linear bearing may be provided between the guide seats 251 and the guide rods 252.

[0062] In some embodiments, please refer to Figure 4 The infrared laser module 50 can be installed on the rear side wall 13 of the frame 10. This creates a larger working space within the frame 10, facilitating the placement of larger workpieces within the frame 10. The infrared laser module 50 can also be installed in other locations within the frame 10.

[0063] In some embodiments, please refer to Figures 4 to 5 The output beam L1 of the blue laser module 30 and the output beam L2 of the infrared laser module 50 are located at the same height. This facilitates the installation of different components and ensures that the blue laser and infrared laser are on the same plane, allowing them to be smoothly incident on the incident side 40a of the galvanometer 40.

[0064] In some embodiments, please refer to Figure 7 , Figure 8 The galvanometer 40 can deflect the laser beam in two directions. The galvanometer 40 includes an X-reflector, a Y-reflector, a first control motor 41, and a second control motor 42. The first control motor 41 controls the X-reflector to rotate around a first direction X, and the second control motor 42 controls the Y-reflector to rotate around a second direction Y. When the laser beam is incident on the incident side 40a of the galvanometer 40, the X-reflector and Y-reflector work together to reflect the laser beam sequentially through the X-reflector and Y-reflector, changing the direction of the laser beam to guide it onto the workpiece for precise and efficient laser processing.

[0065] In some embodiments, the focusing mirror 90 can include a plurality of lenses arranged along the optical axis. The focusing mirror 90 can focus the light emitted from the galvanometer 40 to concentrate the laser to the processing region, to increase the energy density and processing efficiency, and to achieve high-quality laser processing.

[0066] In some embodiments, referring to Figure 4 、 Figure 10 , the gantry 10 is provided with a first driving module 70, and the work head 21 is connected to the first driving module 70. The first driving module 70 is configured to drive the work head 21 to translate in the first plane. The translation of the work head 21 is achieved by the first driving module 70, and the devices (such as the blue laser module 30, the galvanometer 40, etc.) mounted on the work head 21 move with the work head 21.

[0067] In the first driving module 70 configured to output the in-plane translation motion, there are various optional implementation manners.

[0068] For example, referring to Figure 4 、 Figure 10 , the first driving module 70 can be a conventional core XY motion structure, which is a conventional driving scheme of the laser processing machine 100. The core XY motion structure adopts two control motors 71, two synchronous belts 72, and a plurality of synchronous pulleys 73 to drive the work head 21 to translate in the first plane (XY plane). When the two control motors 71 rotate in the same direction, the work head 21 can be driven to move in the first direction X. When the two control motors 71 rotate in opposite directions, the work head 21 can be driven to move in the second direction Y.

[0069] For example, the first driving module 70 can include an X-axis linear module and a Y-axis linear module. The X-axis linear module can output displacement in the first direction X, and the Y-axis linear module can output displacement in the second direction Y. The X-axis linear module is mounted on the Y-axis linear module, and the worktable 26 is mounted on the X-axis linear module. The X-axis linear module and the Y-axis linear module are combined to achieve the translation of the work head 21 in the first plane (XY plane). The X-axis linear module and the Y-axis linear module can be in the form of a lead screw transmission and a synchronous belt transmission.

[0070] In some embodiments, referring to Figure 2 、 Figure 3 , the gantry 10 is provided with a worktable 26, and the worktable 26 can move up and down relative to the gantry 10. By adjusting the height position of the worktable 26, it is convenient to place workpieces of different height sizes in the gantry 10. It is also convenient to focus the optical system of the laser processing machine 100.

[0071] In some embodiments, referring to Figure 4 、 Figure 10, The rack 10 is provided with a second driving module 80, and the workbench 26 is connected to the second driving module 80. The second driving module 80 is used to drive the workbench 26 to move up and down. The workbench 26 moves up and down through the second driving module 80, so that the workpiece on the workbench 26 moves along.

[0072] When the second driving module 80 that outputs the up-down movement is arranged, there are various optional implementation manners.

[0073] For example, refer to Figure 4 、 Figure 10 The second driving module 80 includes a control motor 81, a synchronous belt mechanism 82 and a screw sliding block mechanism 83. The synchronous belt mechanism 82 includes a first pulley 821, a second pulley 822 and a synchronous belt 823. The synchronous belt 823 is arranged around the first pulley 821 and the second pulley 822. The screw sliding block mechanism 83 includes a screw 831 and a nut 832. The screw 831 extends along the third direction Z. The screw 831 and the nut 832 are threadedly connected. The nut 832 is fixed to a sliding piece 833. The sliding piece 833 is slidingly installed on the rack 10 along the third direction Z. The nut 832 and the workbench 26 are fixedly connected through a connecting frame 84. One end of the screw 831 is connected to the second pulley 822. The control motor 81 drives the first pulley 821 to rotate. The synchronous belt 823 drives the second pulley 822 and the screw 831 to rotate, thereby driving the nut 832, the connecting frame 84 and the workbench 26 to move up and down synchronously.

[0074] For example, the second driving module 80 can include a Z-axis linear module. The Z-axis linear module can output the displacement of the third direction Z. The workbench 26 is installed on the Z-axis linear module, so as to realize the up-down movement of the workbench 26.

[0075] The above only describes the preferred embodiments of the present application and is not used to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A laser processing machine, characterized in that, The machine frame, the working head, the blue laser module, the first light guide structure, the galvanometer, the focusing mirror, the infrared laser module and the second light guide structure are included. The working head can translate in a first plane relative to the machine frame. The blue laser module, the first light guide structure, the galvanometer and the focusing mirror are all mounted on the working head; the first light guide structure is used to conduct the output beam of the blue laser module to the galvanometer. The infrared laser module is fixed on the machine frame, and the second light guide structure is used to conduct the output beam of the infrared laser module to the galvanometer. The galvanometer is used to deflect the exiting light of the first light guide structure and the second light guide structure. The focusing mirror is located on the light exit side of the galvanometer. The blue laser module is a semiconductor laser module.

2. The laser processing machine according to claim 1, wherein And / or, the infrared laser module is a fiber laser module or a carbon dioxide laser module. And / or, the first light guide structure is a reflective light guide structure. And / or, the second light guide structure is a reflective light guide structure. The first light guide structure includes a first reflecting element and a second reflecting element, the output end of the blue laser module and the first reflecting element are oppositely arranged along a first direction, the second reflecting element and the first reflecting element are oppositely arranged along a second direction, and the second reflecting element and the light entrance side of the galvanometer are oppositely arranged along the first direction; the first direction and the second direction are perpendicular, and the first direction and the second direction are parallel to the first plane.

3. The laser processing machine according to claim 1, wherein A cross beam is further included, the working head is slidingly mounted on the cross beam along the first direction, and the cross beam is slidingly mounted on the machine frame along the second direction.

4. The laser processing machine according to claim 3, wherein The second light guide structure includes a third reflecting element and a fourth reflecting element, the third reflecting element is fixed on the machine frame, and the fourth reflecting element is fixed on the cross beam; the output end of the infrared laser module and the third reflecting element are oppositely arranged along the first direction, the fourth reflecting element and the third reflecting element are oppositely arranged along the second direction, the fourth reflecting element, the second reflecting element and the light entrance side of the galvanometer are sequentially arranged along the first direction, and the second reflecting element is a light combining mirror.

5. The laser processing machine according to claim 4, wherein A first guide mechanism and a second guide mechanism are further included.

6. The laser processing machine according to claim 4, wherein The working head is mounted on the cross beam through the first guide mechanism, so that the working head is slidingly mounted on the cross beam along the first direction. The cross beam is mounted on the machine frame through the second guide mechanism, so that the cross beam is slidingly mounted on the machine frame along the second direction. The output beam of the blue laser module and the output beam of the infrared laser module are located at the same height position.

7. The laser processing machine according to any one of claims 1 to 6, wherein The machine frame is provided with a first driving module, the working head is connected to the first driving module, and the first driving module is used to drive the working head to translate in the first plane.

8. The laser processing machine according to any one of claims 1 to 6, wherein The machine frame has a workbench, and the workbench can move up and down relative to the machine frame.

9. The laser processing machine according to any one of claims 1 to 6, wherein The machine frame is provided with a second driving module, the workbench is connected to the second driving module, and the second driving module is used to drive the workbench to move up and down.

10. The laser processing machine of claim 9, wherein ​

Images