Limiting mechanism for semiconductor part processing

Abstract

The utility model discloses a limiting mechanism for processing semiconductor parts. The limiting mechanism comprises a workbench, the placing groove is formed in the workbench; the two strip-shaped channels are oppositely arranged on the side wall of the containing groove. The two sliding blocks are slidably mounted in the workbench and located on the two sides of the containing groove. The clamping plate is arranged on the sliding block, and the clamping end of the clamping plate extends into the strip-shaped channel; the electric cylinder is arranged on the workbench and located below the containing groove. The lifting platform is arranged at the output end of the electric cylinder; two pairs of L-shaped connecting plates are arranged, one pair of L-shaped connecting plates is movably connected between the sliding block and the lifting platform, and the corners of the L-shaped connecting plates are rotationally installed on the workbench; a plurality of jacking columns are uniformly distributed on the lifting platform; and the plurality of circular through holes are uniformly distributed at the bottom of the placement groove and are arranged in one-to-one correspondence with the plurality of jacking columns. The semiconductor chip clamping device relates to the technical field of semiconductor processing, and is convenient for automatically clamping, pushing out and taking semiconductor chips.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, and specifically to a limiting mechanism for semiconductor part processing. BACKGROUND

[0002] Semiconductors are widely used and have a very close connection with the core units in most current electronic products. In the process of semiconductor chip processing, a limiting mechanism is needed to fix and limit the chip to avoid deviation during chip processing, thereby causing processing errors.

[0003] However, the existing limiting mechanism is not convenient for automatic clamping and pushing out of the semiconductor chip during use. Therefore, a limiting mechanism for semiconductor part processing is provided. SUMMARY

[0004] The utility model aims at providing a limiting mechanism for semiconductor part processing to solve the problem that the existing limiting mechanism is not convenient for automatic clamping and pushing out of the semiconductor chip during use.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a limiting mechanism for semiconductor part processing, comprising:

[0006] a workbench;

[0007] a placing groove arranged on the workbench;

[0008] two strip-shaped channels arranged on the side walls of the placing groove;

[0009] two sliding blocks slidingly installed in the workbench and located on both sides of the placing groove;

[0010] a clamping plate arranged on the sliding block, with the clamping end of the clamping plate extending into the strip-shaped channel;

[0011] an electric cylinder arranged on the workbench below the placing groove;

[0012] a lifting platform arranged on the output end of the electric cylinder;

[0013] two pairs of L-shaped connecting plates, one pair of L-shaped connecting plates movably connected between the sliding block and the lifting platform, with the corner of the L-shaped connecting plate rotatably installed on the workbench;

[0014] a plurality of jacking columns evenly distributed on the lifting platform;

[0015] The circular through hole is arranged with a plurality of strip-shaped through holes which are evenly arranged on the bottom of the placing groove and correspond to the plurality of jacking columns.

[0016] Preferably, the two ends of the L-shaped connecting plate are provided with strip-shaped through holes, and the side walls of the sliding block and the lifting platform are provided with sliding rods which extend into the strip-shaped through holes.

[0017] Preferably, the electric cylinder is provided with a pressure sensor.

[0018] Preferably, the top of the jacking column is provided with a buffer pad.

[0019] Preferably, guide rods which extend through the sliding block are arranged between the inner walls of the workbench.

[0020] Compared with the prior art, the semiconductor part machining limiting mechanism has the advantages that when limiting, the electric cylinder is started to drive the lifting platform to descend, the lifting platform drives the L-shaped connecting plate to rotate, the rotating L-shaped connecting plate drives the two sliding blocks and the clamping plate to approach each other to clamp the semiconductor material, after machining, the electric cylinder is started to drive the lifting platform to ascend, the lifting platform drives the L-shaped connecting plate to rotate reversely, the rotating L-shaped connecting plate drives the two sliding blocks and the clamping plate to move away from each other to cancel the limiting, and meanwhile, the jacking column is driven to ascend by the lifting platform to pass through the circular through hole and push the semiconductor material out of the placing groove, one electric cylinder is arranged as a driving source to realize automatic clamping and pushing out of the semiconductor chip, the structure is simple, complicated operation is avoided, and automatic clamping and pushing out of the semiconductor chip are facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a main sectional view structure diagram of the utility model.

[0022] In the figure: 1, workbench; 2, placing groove; 3, strip-shaped through hole; 4, sliding block; 5, clamping plate; 6, electric cylinder; 7, lifting platform; 8, L-shaped connecting plate; 9, jacking column; 10, circular through hole; 11, strip-shaped through hole; 12, sliding rod; 13, pressure sensor; 14, buffer pad; 15, guide rod. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0024] Please refer to Figure 1The utility model provides a technical scheme: a limiting mechanism for semiconductor part processing, including work table 1, the placing groove 2 sets up in work table 1, strip passageway 3 is provided with two, opposite setting in the lateral wall of placing groove 2, slider 4 is provided with two, slidingly installed in work table 1, and located the both sides of placing groove 2, clamping plate 5 sets up in slider 4, and the clamping end of clamping plate 5 extends into strip passageway 3, and electric jar 6 sets up in work table 1, and located the below of placing groove 2, and lifting platform 7 sets up in the output of electric jar 6, L-shaped connecting plate 8 is provided with two pairs, and a pair of L-shaped connecting plate 8 swing joint is between slider 4 and lifting platform 7, and the corner of L-shaped connecting plate 8 rotationally installs in work table 1, and jacking column 9 is provided with several, evenly distributed in lifting platform 7, and circular pass 10 is provided with several, evenly distributed in the bottom of placing groove 2, and with several jacking column 9 one one correspondence setting, when limiting, through the starting electric jar 6 drive lifting platform 7 drop, lifting platform 7 drive L-shaped connecting plate 8 rotate, and the L-shaped connecting plate 8 of rotating drive two sliders 4 and clamping plate 5 are close to each other and clamp semiconductor material, after processing, through the starting electric jar 6 drive lifting platform 7 rise, lifting platform 7 drive L-shaped connecting plate 8 reverse rotation, and the L-shaped connecting plate 8 of rotating drive two sliders 4 and clamping plate 5 are far from each other and cancel the limiting, simultaneously with the rise of lifting platform 7 drive jacking column 9 rise and pass through circular pass 10 and push out placing groove 2 with semiconductor material, through setting one electric jar 6 as drive source, realize automatic clamping and pushing out for semiconductor chip, simple structure avoids the tedious operation, it is convenient to automatic clamping and pushing out for semiconductor chip and take.

[0025] Specifically, both ends of the L-shaped connecting plate 8 are provided with strip passageways 11, and the side walls of the slider 4 and the lifting platform 7 are both provided with slide rods 12 extending into the strip passageways 11. During the up-down movement of the lifting platform 7 driven by the electric jar 6, the slide rods 12 on the lifting platform 7 slide relatively in the strip passageways 11 of the L-shaped connecting plate 8, thereby driving the L-shaped connecting plate 8 to rotate, so that the other strip passageway 11 of the L-shaped connecting plate 8 slides relatively with the slide rod 12 on the slider 4, thereby driving the slider 4 to move horizontally.

[0026] Specifically, the electric jar 6 is provided with a pressure sensor 13, which is used to control the clamping force of the two clamping plates 5 on the semiconductor material.

[0027] Specifically, the top of the jacking column 9 is provided with a buffer pad 14, which avoids damage caused by the jacking column 9 colliding with the semiconductor material.

[0028] Specifically, guide rods 15 are arranged between the inner walls of the work table 1 and extend through the sliders 4. The guide rods 15 are provided with two, which ensure the stability of the two sliders 4 during movement.

[0029] Working principle: the utility model discloses in working, first place the semiconductor material in the placing groove 2, start electric jar 6 and drive lifting platform 7 to descend, lifting platform 7 drive L-shaped connecting plate 8 rotates, and the L-shaped connecting plate 8 of rotating drive two sliders 4 and clamping plate 5 are close to each other to semiconductor material and carry out clamping, after processing, start electric jar 6 and drive lifting platform 7 to ascend, lifting platform 7 drive L-shaped connecting plate 8 reverse rotation, and the L-shaped connecting plate 8 of rotating drive two sliders 4 and clamping plate 5 are far from each other and cancel the spacing, simultaneously with the lifting of lifting platform 7 drive jacking column 9 and ascend through the circular mouth 10 and push out the semiconductor material placing groove 2.

[0030] In the description of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through intermediate medium, can be the communication of two elements or the interaction of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0031] The standard parts used in the present application can be purchased from the market, and the special-shaped parts can be ordered according to the description and the drawings. The specific connection mode of each part adopts the conventional means such as bolt, rivet and welding in the prior art. The mechanical parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection mode in the prior art, which will not be described in detail here.

[0032] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A limiting mechanism for processing semiconductor parts, characterized in that, Include: Workbench (1); Placement slot (2), provided on the workbench (1); Strip-shaped channel (3), provided with two, oppositely arranged on the side wall of the placement slot (2); Sliding block (4), provided with two, slidingly installed in the workbench (1), and located on both sides of the placement slot (2); Clamping plate (5), provided on the sliding block (4), the clamping end of the clamping plate (5) extends into the strip-shaped channel (3); Electric cylinder (6), provided on the workbench (1), and located below the placement slot (2); Lifting platform (7), provided on the output end of the electric cylinder (6); L-shaped connecting plate (8), provided with two pairs, one pair of L-shaped connecting plates (8) is movably connected between the sliding block (4) and the lifting platform (7), and the corner of the L-shaped connecting plate (8) is rotatably installed on the workbench (1); Jacking column (9), provided with several, uniformly distributed on the lifting platform (7); Circular through port (10), provided with several, uniformly distributed on the bottom of the placement slot (2), and corresponding to the several jacking columns (9).

2. The position limiting mechanism for semiconductor part processing according to claim 1, characterized in that: Both ends of the L-shaped connecting plate (8) are provided with strip-shaped through ports (11), and the side wall of the sliding block (4) and the side wall of the lifting platform (7) are provided with slide rods (12) extending into the strip-shaped through ports (11).

3. The position limiting mechanism for semiconductor part processing according to claim 1, characterized in that: The electric cylinder (6) is provided with a pressure sensor (13).

4. The position limiting mechanism for semiconductor part processing according to claim 1, characterized in that: The top of the jacking column (9) is provided with a buffer pad (14).

5. The position limiting mechanism for semiconductor part processing according to claim 1, characterized in that: The inner wall of the workbench (1) is provided with a guide rod (15) penetrating the sliding block (4).

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