Multi-application-scene aluminum-based composite copper-aluminum foil

Abstract

The utility model relates to the technical field of composite materials, and discloses a multi-application-scene aluminum-based composite copper aluminum foil which comprises an aluminum base body, high-frequency shielding layers attached to the two sides of the aluminum base body through the magnetron sputtering plating technology, and flexible extension layers attached to the two opposite sides of the two sets of high-frequency shielding layers through the magnetron sputtering plating technology. Thermal expansion matching layers are attached to the sides, opposite to the high-frequency shielding layer, of the two groups of flexible extension layers through a magnetron sputtering plating process; through the cooperation of the flexible extension layer, the thermal expansion matching layer, the high-conductivity copper layer, the weldability plating layer, the grain boundary strengthening layer and the gradient Cu-Cr-CrN layer, the problem that a copper-aluminum interface is fractured when the LED light bar plate is curled and bent is solved, the problem of deformation layering caused by the difference of thermal expansion coefficients of the copper-aluminum layer is solved, the thermal expansion synchronism of the copper-aluminum layer is guaranteed, and the service life of the LED light bar plate is prolonged. And the bending resistance and the shielding effectiveness of the aluminum-based composite copper-aluminum foil as well as the peel strength of a copper-aluminum bonding interface are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to composite material technical field, concretely is a kind of multi-application scene aluminum base composite copper-aluminum foil. BACKGROUND

[0002] Both copper material and aluminum material have good conductivity, are widely used in current collector of photovoltaic power generation, charging battery, LED and other products and signal shielding and bimetallic connection, aluminum base composite copper foil has become the most commonly used, the most important new type senior material due to its outstanding mechanics, physical performance, other comprehensive special performance and economy etc., the process method of copper-aluminum composite material that has been mass-produced mainly has hydrostatic extrusion, continuous casting rolling, double-mold casting, explosion composite etc., magnetron sputtering+electroplating method is less, but in performance, stability, economy, feasibility etc., all have advantages and disadvantages;

[0003] A kind of copper-aluminum composite material, photovoltaic cell, charging battery and LED, copper layer is arranged on the surface of aluminum foil, the thickness of the aluminum foil is 6 μm-1000 μm, the thickness of the copper layer is 0.01 μm-50 μm, the heat conduction, conductivity of copper layer is superior to pure aluminum, increase copper layer on the surface of aluminum strip or aluminum foil, copper-aluminum composite material has the characteristics of good conductivity and heat conduction, low cost, small density, can be widely used in heat conduction, conductivity, shielding, bimetallic connection and other technical fields, expands the material selection range in this field.

[0004] However, the aluminum base composite copper-aluminum foil in the prior art cannot solve the problems of brittle copper-aluminum metallurgical bonding surface in flexible LED application scenarios, different step of copper-aluminum thermal expansion causing delamination and warping of composite layer, application scenario limitation of shielding performance of composite material, limitation of material conductivity, limitation of material weldability and limitation of material high temperature resistance, which only rely on the basic performance of existing copper-aluminum composite, without effective improvement and guarantee on the basis, the application of copper-aluminum composite material is limited in wider and higher application scenarios, and the basic application scenarios are not guaranteed, therefore, we need to propose a multi-application scene aluminum base composite copper-aluminum foil. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of multi-application scene aluminum base composite copper-aluminum foil, complete based on magnetron sputtering processing and water electroplating line, solve the problem of copper-aluminum interface fracture when LED strip plate is curled and bent, optimize conductivity, weldability, thermal expansion synchronism and peel strength, and improve shielding efficiency, to solve the problems raised in the above background technology.

[0006] To achieve the above object, the utility model provides the following technical scheme: a kind of multi-application scene aluminum base composite copper-aluminum foil, comprising:

[0007] Aluminum base, and high-frequency shielding layer attached on both sides of the aluminum base by magnetron sputtering plating process, and flexible ductile layer attached on the opposite sides of the two groups of high-frequency shielding layer by magnetron sputtering plating process, the opposite sides of the two groups of flexible ductile layer and high-frequency shielding layer are attached with thermal expansion matching layer by magnetron sputtering plating process, the opposite side of the thermal expansion matching layer and flexible ductile layer is attached with high-conductive copper layer by water plating process, the opposite side of the high-conductive copper layer and thermal expansion matching layer is provided with weldable plating layer by water plating or magnetron sputtering plating process, and the opposite side of the weldable plating layer and high-conductive layer is provided with passivation layer;

[0008] The high-conductive copper layer comprises a conductive copper layer, and the surface of the conductive copper layer is provided with a mixed layer of nano silver particles and graphene.

[0009] The flexible ductile layer comprises a nano Cu layer, and the nano Cu layer is provided with a nano micropore cluster.

[0010] Preferably, a grain boundary strengthening layer is arranged between the weldable plating layer and the high-conductive copper layer by water plating process, and a gradient Cu-Cr-CrN layer is arranged between the thermal expansion matching layer and the flexible ductile layer by magnetron sputtering plating.

[0011] Preferably, the surface of the grain boundary strengthening layer is provided with a boric acid layer, and the gradient Cu-Cr-CrN layer is composed of an outer high-hardness CrN layer and a Cu-Cr transition layer in the middle.

[0012] Preferably, the weldable plating layer is a Sn nano plating layer or an Ag nano plating layer, and the thermal expansion matching layer is an Al-Zn-Cr-Mg quaternary alloy layer.

[0013] Preferably, the thickness of the aluminum base is 9-200 mu m, the purity of the aluminum base is greater than or equal to 95%, and the surface roughness Ra of the aluminum base is less than or equal to 0.15 mu m.

[0014] Preferably, the porosity of the flexible ductile layer is 20-30%, and the pore diameter of the nano micropore cluster is 10-50 microns.

[0015] Compared with the prior art, the utility model has the advantages of:

[0016] The utility model mainly through the cooperation between flexible ductile layer, thermal expansion matching layer, high-conductive copper layer, weldable plating layer, grain boundary strengthening layer and gradient Cu-Cr-CrN layer solves the problem of copper-aluminum interface fracture when LED light bar board is curled and folded, and the problem of deformation and delamination caused by the difference of copper-aluminum layer thermal expansion coefficient, guarantees the synchronism of copper-aluminum layer thermal expansion, improves the bending resistance and shielding effectiveness of aluminum base composite copper-aluminum foil, and the peeling strength of copper-aluminum combination interface, and improves the conductivity and weldability. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 The plane structure schematic diagram of the utility model.

[0018] In the figure: 1, passivation layer; 2, weldability plating layer; 3, high-conductivity copper layer; 4, thermal expansion matching layer; 5, flexible extension layer; 6, aluminum base; 7, grain boundary strengthening layer; 8, gradient Cu-Cr-CrN layer; 9, shielding layer. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be apparently and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0020] Embodiment 1

[0021] Aluminum-based composite copper aluminum foil is applied to LED flexible lamp strip plate:

[0022] The thickness of the aluminum base 6 is set to 50 μm, the porosity of the nano-porous Cu layer of the flexible extension layer 5 is set to 25%, and an O-state pure aluminum foil is used.

[0023] Please refer to Figure 1 The utility model provides a technical scheme: a kind of multi-application scene aluminum-based composite copper aluminum foil, comprising:

[0024] Aluminum base 6, and high-frequency shielding layer 9 attached to both sides of aluminum base 6 by magnetron sputtering plating process, and flexible extension layer 5 attached to opposite sides of two groups of high-frequency shielding layer 9 by magnetron sputtering plating process, the opposite side of two groups of flexible extension layer 5 and high-frequency shielding layer 9 is all attached with thermal expansion matching layer 4 by magnetron sputtering plating process, the opposite side of thermal expansion matching layer 4 and flexible extension layer 5 is attached with high-conductivity copper layer 3 by water plating process, the opposite side of high-conductivity copper layer 3 and thermal expansion matching layer 4 is provided with weldability plating layer 2 by water plating or magnetron sputtering plating process, the opposite side of weldability plating layer 2 and high-conductivity layer is provided with passivation layer 1;

[0025] Thermal expansion matching layer 4 effectively reduces thermal stress problems caused by mismatching of thermal expansion coefficients, thermal expansion matching layer 4 can prevent materials from deforming or cracking due to thermal expansion and contraction, passivation layer 1 effectively prevents oxidation and corrosion of materials in humid or corrosive environments, ensures the use effect of materials and prolongs the service life of materials;

[0026] The high-conductivity copper layer 3 comprises a conductive copper layer, and the surface of the conductive copper layer is provided with a mixed layer of nano-silver particles and graphene. The addition of the mixed layer of nano-silver particles and graphene not only improves the electrical conductivity, but also enhances the mechanical strength and wear resistance of the material.

[0027] The flexible and ductile layer 5 comprises a nano-Cu layer, and the nano-Cu layer is provided with a nano-microporous cluster. The nano-microporous cluster structure further enhances the flexibility and ductility of the material, enabling it to adapt to complex bending and folding scenarios.

[0028] The weldable coating layer 2 and the high-conductivity copper layer 3 are provided with a grain boundary strengthening layer 7 by water plating process, and the thermal expansion matching layer 4 and the flexible and ductile layer 5 are provided with a gradient Cu-Cr-CrN layer 8 by magnetron sputtering plating.

[0029] The surface of the grain boundary strengthening layer 7 is provided with a boric acid layer, and the gradient Cu-Cr-CrN layer 8 is composed of an outer CrN layer with high hardness and a Cu-Cr transition layer in the middle. This further optimizes the thermal expansion matching, enhances the mechanical strength and thermal stability of the material, and at the same time, the Cr content of the gradient Cu-Cr-CrN layer 8 decreases to 0 by gradient, containing 8-12% CrN nanoparticles (particle size ≤10 nm), which inhibits brittle phases. The boric acid layer in the grain boundary strengthening layer 7 can enhance the grain boundary strength of the material, prevent cracks or fractures during welding, and further improve the welding reliability.

[0030] Specifically, by providing the flexible and ductile layer 5 (nano-porous Cu layer) on both sides of the aluminum substrate 6, the flexibility and ductility of the material are significantly improved. The porosity of the nano-porous Cu layer is 25%. This porous structure not only enhances the flexibility of the material, but also reduces the overall weight, making it more suitable for application in flexible electronic devices. The bending performance of the copper-aluminum foil can reach 5000 times without cracks during the bending process, and the resistivity is 1.58 μΩ·cm. 2 The welding wetting angle is 18°.

[0031] The weldable coating layer 2 is a Sn nano-coating layer or an Ag nano-coating layer, and the thermal expansion matching layer 4 is an Al-Zn-Cr-Mg quaternary alloy layer. The weldable coating layer 2 improves the welding performance of the material, which is very important for the assembly and production of LED light bars, and can improve the production efficiency and welding reliability.

[0032] The thickness of the aluminum substrate 6 is 9-200 μm, the purity of the aluminum substrate 6 is ≥95%, and the surface roughness Ra of the aluminum substrate 6 is ≤0.15 μm.

[0033] The porosity of the flexible and ductile layer 5 is 20-30%, and the pore size of the nano-microporous cluster is 10-50 microns.

[0034] Example 2

[0035] The difference between the embodiment and example 1 is that the aluminum-based composite copper aluminum foil of the embodiment is applied to 5G communication shielding:

[0036] By adding a high-frequency shielding layer on the aluminum base 6 by magnetron sputtering plating or water plating, the high-frequency shielding layer is provided with a wave-absorbing filter layer, the high-frequency shielding layer is an Ag-Cu nano alloy plating layer (Ag 5-10wt%, thickness 100-300nm), and the shielding effectiveness of 1GHz is greater than or equal to 65dB, and the wave-absorbing transition layer is a Fe-Si-Al soft magnetic alloy+carbon nanotube (1-3wt%), and the porosity gradient design is (10%-30%), and the shielding effectiveness of 40GHz is greater than or equal to 60dB.

[0037] Specifically, the high-frequency shielding layer realizes the shielding effectiveness of 28GHz of 78dB by the Ag-Cu nano alloy (Ag-8wt%, thickness 100-200μm) and the wave-absorbing transition layer (Fe-Si-Al soft magnetic alloy and 3wt% CrN), and the attenuation after bending 5000 times is less than or equal to 3%.

[0038] The 5G communication shielding disclosed in the embodiment has the same part of the technical solution as example 1, please refer to example 1, which will not be repeated here.

[0039] Example 3

[0040] The difference between the embodiment and example 1 is that the aluminum-based composite copper aluminum foil of the embodiment is applied to a new energy automobile battery current collector, the thickness of the aluminum base 6 is set to 200μm, and the thickness of the high-conductivity copper layer 3 is set to 15μm.

[0041] Specifically, the peel strength after 300℃ / 500h thermal aging is greater than or equal to 145MPa, and the resistivity change is less than or equal to 1.2%.

[0042] The new energy automobile battery current collector disclosed in the embodiment has the same part of the technical solution as example 1, please refer to example 1, which will not be repeated here.

[0043] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A multi-application scenario aluminum-based composite copper-aluminum foil, characterized in that, The application relates to an aluminum substrate (6), high-frequency shielding layers (9) attached to two sides of the aluminum substrate (6) by a magnetron sputtering plating process, flexible ductile layers (5) attached to opposite sides of the two high-frequency shielding layers (9) by a magnetron sputtering plating process, a thermal expansion matching layer (4) attached to the side, opposite to the flexible ductile layer (5), of each of the two high-frequency shielding layers (9) by a magnetron sputtering plating process, a high-conductivity copper layer (3) attached to the side, opposite to the thermal expansion matching layer (4), of each of the two flexible ductile layers (5) by a water plating process, a weldable plating layer (2) arranged on the side, opposite to the high-conductivity copper layer (3), of the thermal expansion matching layer (4) by a water plating or magnetron sputtering plating process, and a passivation layer (1) arranged on the side, opposite to the weldable plating layer (2), of the high-conductivity copper layer (3). The high-conductivity copper layer (3) comprises a conductive copper layer, and a mixed layer of nano silver particles and graphene is arranged on the surface of the conductive copper layer. The flexible ductile layer (5) comprises a nano Cu layer, and a nano micropore cluster is arranged on the nano Cu layer. A grain boundary strengthening layer (7) is arranged between the weldable plating layer (2) and the high-conductivity copper layer (3) by a water plating process, and a gradient Cu-Cr-CrN layer (8) is arranged between the thermal expansion matching layer (4) and the flexible ductile layer (5) by a magnetron sputtering plating process.

2. The multi-application scenario aluminum-based composite copper-aluminum foil according to claim 1, characterized in that: The surface of the grain boundary strengthening layer (7) is provided with a boric acid layer, and the gradient Cu-Cr-CrN layer (8) is composed of a high-hardness CrN layer on the outer layer and a Cu-Cr transition layer in the middle.

3. The multi-application scenario aluminum-based composite copper-aluminum foil according to claim 2, characterized in that: The weldable plating layer (2) is a Sn nano plating layer or an Ag nano plating layer, and the thermal expansion matching layer (4) is an Al-Zn-Cr-Mg quaternary alloy layer.

4. The multi-application-scenario aluminum-based composite copper-aluminum foil according to claim 3, characterized in that: The thickness of the aluminum substrate (6) is 9-200 mu m, the purity of the aluminum substrate (6) is greater than or equal to 95%, and the surface roughness Ra of the aluminum substrate (6) is less than or equal to 0.15 mu m.

5. The multi-application scenario aluminum-based composite copper-aluminum foil according to claim 4, characterized in that: The porosity of the flexible ductile layer (5) is 20-30%, and the pore diameter of the nano micropore cluster is 10-50 microns.

6. The multi-application scenario aluminum-based composite copper-aluminum foil according to claim 5, characterized in that: ​

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