Precise temperature control device of bonding wire plating line

Abstract

The utility model provides a precise temperature control device for a bonding wire electroplating line, which comprises an electroplating bath, a bath body used for electroplating a bonding wire is arranged in the electroplating bath, and the outer side of the bath body is fixedly connected with an outer heat preservation layer used for heat preservation. Compared with the prior art, the electroplating bath has the beneficial effects that the electroplating bath and the upper cover assembly are additionally arranged, the four corners in the bath body are respectively provided with a group of optical fiber sensors I, and the middle position of the inner side of the bath body is provided with a group of optical fiber sensors II, so that multi-point temperature detection of electroplating liquid is realized, and the stirring frame rotates to stir the electroplating liquid to reduce local temperature difference; the cover body covers the upper portion of the tank body to reduce heat volatilization, the waste heat cover absorbs heat to assist in heat preservation of the tank body, and therefore precise temperature control can be improved, the upper cover assembly is additionally arranged and is of a lifting covering structure, the winding wheel rotates to complete lifting control through the lifting pull rope, and opening and closing control over the cover body can be conveniently achieved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of keying silk electroplating, and particularly relates to a precision temperature control device of keying silk electroplating line. BACKGROUND

[0002] Keying silk is a metal filament used for connecting a chip and an external lead frame in microelectronic packaging, and common materials include gold, silver, copper or aluminum, and the performance thereof directly influences the conductivity and reliability of electronic devices, and in the manufacturing process, the keying silk needs to be improved in surface properties (such as oxidation resistance and wear resistance) through electroplating process to meet the needs of high-precision electronic components. The temperature stability of electroplating solution is crucial to the quality of plating layer, and temperature fluctuation may result in uneven plating layer thickness, coarse crystallization or poor bonding force, and further influence the performance of keying silk, and although the common electroplating tank for keying silk electroplating is provided with a structure for monitoring and adjusting temperature inside, most of them are provided with a single set, which cannot realize common monitoring of multiple points, and the electroplating solution at different positions may have temperature difference, resulting in large deviation of temperature monitoring and delay of temperature adjustment, and further increasing temperature fluctuation and influencing the electroplating quality of keying silk.

[0003] In summary, the keying silk electroplating tank with single-point temperature monitoring and temperature adjustment structure has some problems in use, and therefore a new structure is expected to be proposed to solve the above technical problems. UTILITY MODEL CONTENT

[0004] In view of the deficiencies in the prior art, the utility model aims to provide a precision temperature control device of keying silk electroplating line to solve the problems in the background art.

[0005] The utility model realizes the following technical scheme: a precision temperature control device of keying silk electroplating line, comprising: an electroplating tank, a tank body for keying silk electroplating is arranged in the electroplating tank, an external insulation layer for insulation is fixedly connected to the outer side of the tank body, an upper cover assembly for covering the tank body is arranged above the tank body, a cover body for assisting temperature control is arranged in the upper cover assembly, a waste heat cover for absorbing waste heat is fixedly connected to the upper surface of the cover body, a group of corner supports are fixedly connected to the inner side of the tank body at the four corners, a fiber sensor one for monitoring the temperature of electroplating solution is fixedly connected to the upper surface of the corner support, a stirring frame for stirring electroplating solution to reduce local temperature difference is arranged in the inner side of the tank body, and a group of fiber sensors two for monitoring the temperature of electroplating solution are fixedly connected to the inner side of the tank body at the middle position.

[0006] As a preferred embodiment, a support plate is fixedly connected to the inner side of the tank body at the front and rear positions, and a stirring motor for driving the stirring frame to rotate is arranged at the middle position of the inner side of the support plate.

[0007] As a preferred embodiment, the stirring motor is connected with the stirring frame through a coupling, and a center heating pipe is fixedly connected to the inside of the stirring frame near the tank body.

[0008] As a preferred embodiment, a center cooling pipe is fixedly connected to the inside of the center heating pipe near the tank body, and the center heating pipe and the center cooling pipe are both arranged in a spiral structure, so that the spiral center heating pipe and the spiral center cooling pipe increase the heating and cooling range and reduce the local temperature difference of the electroplating liquid stirred by the stirring frame.

[0009] As a preferred embodiment, an angle heating pipe for heating the electroplating liquid at the corner is fixedly connected to the inside of the angle bracket, and an angle cooling pipe for cooling the electroplating liquid at the corner is also fixedly connected to the inside of the angle bracket, so that the optical fiber sensor monitors the temperature of the corners of the tank body and the angle heating pipe and the angle cooling pipe control the temperature of the electroplating liquid from the corners.

[0010] As a preferred embodiment, a heat preservation cover for assisting in heat preservation is fixedly connected to the left and right sides of the tank body, and a waste heat guide pipe for guiding the waste heat is fixedly connected to the top of the heat preservation cover, and the outer heat preservation layer is in an open structure at the position of the heat preservation cover.

[0011] A group of connecting flanges are fixedly connected to the end of the heat preservation cover away from the center of the electroplating tank and the lower end of the waste heat guide pipe, the two groups of connecting flanges are in close contact with each other and are fixed by bolts, and a heat preservation cavity is formed in the inside of the body and is in communication with the heat preservation cover.

[0012] As a preferred embodiment, one end of the waste heat guide pipe is a flexible hose, a support is fixedly connected to the lower part of the cover body, and an electroplating wheel for winding the bonding wire to assist in electroplating is arranged at the lower end of the support. In the use of electroplating, part of the heat is dissipated from the cover body and collected by the waste heat cover, and then introduced into the heat preservation cover through the waste heat guide pipe to assist in heat preservation of the tank body.

[0013] As a preferred embodiment, a guide column for assisting in linear lifting is fixedly connected to the left end of the upper surface of the cover body, a lifting column is arranged above the guide column, and the guide column and the lifting column are movably embedded in each other.

[0014] As a preferred embodiment, a carabiner is fixedly connected to the center of the upper surface of the cover body, a hook is sleeved on the carabiner, a lifting pull rope is fixedly connected to the upper part of the hook, and the lifting pull rope is wound to the outside of the winding wheel. The upper cover assembly is a lifting cover structure, and the winding wheel is rotated to complete the lifting control through the lifting pull rope, so that the opening and closing control of the cover body can be facilitated.

[0015] After the above technical scheme is adopted, the beneficial effects of the present application are as follows:

[0016] 1. By increasing the electroplating tank and the upper cover assembly, a set of optical fiber sensors one is arranged at the four corners of the tank body, and a set of optical fiber sensors two is arranged at the middle position of the inner side of the tank body, so as to realize multi-point temperature detection of the electroplating solution, reduce the local temperature difference by rotating the stirring frame to stir the electroplating solution, reduce heat volatilization by covering the upper part of the tank body with the cover body, and absorb heat by the waste heat cover to assist the tank body in heat preservation, thereby improving the precision temperature control.

[0017] 2. By increasing the upper cover assembly, the upper cover assembly is a lifting cover structure, and the winding wheel is rotated to complete the lifting control through the lifting pull rope, so as to facilitate the opening and closing control of the cover body. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0019] Fig. 1 It is a whole structure schematic diagram of the precision temperature control device of the wire bonding electroplating line.

[0020] Fig. 2 It is a left side structure schematic diagram of the electroplating tank in the precision temperature control device of the wire bonding electroplating line.

[0021] Fig. 3 It is a right side structure schematic diagram of the electroplating tank in the precision temperature control device of the wire bonding electroplating line.

[0022] Fig. 4 It is a structure schematic diagram of the upper cover assembly in the precision temperature control device of the wire bonding electroplating line.

[0023] In the figure, 100 is an electroplating tank, 101 is a tank body, 102 is an outer heat preservation layer, 103 is an angle support, 104 is an angle heating pipe, 105 is an angle cooling pipe, 106 is an optical fiber sensor one, 107 is an optical fiber sensor two, 108 is a support plate, 109 is a stirring frame, 110 is a center heating pipe, 111 is a center cooling pipe, 112 is a heat preservation cover, and 113 is a connecting flange.

[0024] 200 is an upper cover assembly, 201 is a cover body, 202 is a hook and loop, 203 is a hook, 204 is a lifting pull rope, 205 is a guide column, 206 is a lifting column, 207 is a waste heat cover, 208 is a waste heat guide pipe, 209 is a telescopic hose, and 210 is an electroplating wheel. DETAILED DESCRIPTION

[0025] Clearly, the described embodiments are merely a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0026] Please refer to Figs. 1-4 The present application provides a technical scheme: a precision temperature control device for a bonding wire electroplating line, comprising: an electroplating tank 100, wherein a tank body 101 for electroplating of a bonding wire is arranged in the electroplating tank 100, and an external insulation layer 102 for insulation is fixedly connected to the outside of the tank body 101;

[0027] A cover assembly 200 is arranged above the tank body 101, wherein a cover body 201 for auxiliary temperature control of the tank body 101 is arranged in the cover assembly 200, and a waste heat cover 207 for absorbing waste heat is fixedly connected to the upper surface of the cover body 201;

[0028] A group of corner supports 103 are fixedly connected to the four corners of the inner side of the tank body 101, an optical fiber sensor one 106 for monitoring the temperature of the electroplating solution is fixedly connected to the upper surface of the corner support 103, a stirring frame 109 for stirring the electroplating solution to reduce local temperature difference is further arranged on the inner side of the tank body 101, and a group of optical fiber sensors two 107 for monitoring the temperature of the electroplating solution are further fixedly connected to the middle position of the inner side of the tank body 101.

[0029] Support plates 108 are fixedly connected to the front and rear positions of the inner side of the tank body 101, and a stirring motor for driving the stirring frame 109 to rotate is arranged at the middle position of the inner side of the support plate 108.

[0030] The stirring motor and the stirring frame 109 are connected through a shaft coupling, and a central heating pipe 110 is fixedly connected to the inner side of the stirring frame 109 and the tank body 101.

[0031] A central cooling pipe 111 is fixedly connected to the inner side of the stirring frame 109 and the tank body 101, and the central heating pipe 110 and the central cooling pipe 111 are both arranged in a spiral structure, so that the central heating pipe 110 and the central cooling pipe 111 improve the heating and cooling range, and the stirring frame 109 drives the electroplating solution to stir to reduce local temperature difference.

[0032] The corner heating pipe 104 for heating the electroplating solution at the corner is fixedly connected to the inner side of the corner support 103, and the corner cooling pipe 105 for cooling the electroplating solution at the corner is also fixedly connected to the inner side of the corner support 103, so that the optical fiber sensor one 106 monitors the temperature of the corner of the tank body 101, and the corner heating pipe 104 and the corner cooling pipe 105 control the temperature of the electroplating solution from the corner.

[0033] The heat preservation cover 112 is fixedly connected to the left and right sides of the tank body 101 for assisting heat preservation, and the waste heat guide pipe 208 is fixedly connected to the upper side of the waste heat cover 207 for guiding waste heat, and the outer heat preservation layer 102 is in an open structure at the position of the heat preservation cover 112;

[0034] A group of connecting flanges 113 are fixedly connected to the end, away from the center of the electroplating tank 100, of the heat preservation cover 112 and the lower end of the waste heat guide pipe 208, the two groups of connecting flanges 113 are mutually adhered and fixedly connected by bolts, and the inner side of the body 101 is provided with a heat preservation cavity and is in communication with the heat preservation cover 112.

[0035] One end of the waste heat guide pipe 208 is a flexible hose 209, a support is fixedly connected to the lower side of the cover body 201, and the electroplating wheel 210 for winding the bonding wire to assist electroplating is arranged at the lower end of the support, in the use of electroplating, the cover body 201 will dissipate part of the heat and collect the heat through the waste heat cover 207, and then guide the heat into the heat preservation cover 112 through the waste heat guide pipe 208 to assist the heat preservation of the tank body 101.

[0036] Please refer to Figs. 1-4 As a first embodiment of the utility model: first, the user installs the bonding wire through the electroplating wheel 210 and moves the cover assembly 200 downward to drive the bonding wire to be placed in the tank body 101 for electroplating, a group of optical fiber sensors one 106 are arranged at the four corners in the tank body 101, and a group of optical fiber sensors two 107 are arranged at the middle position of the inner side of the tank body 101, the temperature of the electroplating liquid is detected at multiple points, and the temperature is controlled from different positions through the central heating pipe 110, the central cooling pipe 111, the corner heating pipe 104 and the corner cooling pipe 105, secondly, the stirring frame 109 can rotate to stir the electroplating liquid to reduce the local temperature difference, in the use of electroplating, the cover body 201 will dissipate part of the heat and collect the heat through the waste heat cover 207, and then guide the heat into the heat preservation cover 112 through the waste heat guide pipe 208 to assist the heat preservation of the tank body 101, so that the precise temperature control can be improved.

[0037] The guide column 205 for assisting linear lifting is fixedly connected to the left end of the upper surface of the cover body 201, the lifting column 206 is arranged above the guide column 205, and the guide column 205 and the lifting column 206 are movably embedded.

[0038] The hook ring 202 is fixedly connected to the center of the upper surface of the cover body 201, the hook 203 is sleeved on the hook ring 202, the lifting pull rope 204 is fixedly connected to the upper side of the hook 203, the lifting pull rope 204 is wound to the outer side of the winding wheel, the cover assembly 200 is a lifting cover structure, and the lifting control is completed through the lifting pull rope 204 by the rotation of the winding wheel.

[0039] Please refer to Figs. 1-4As the second embodiment of the utility model: based on the above first embodiment, the sleeve connection of the hook 203 and the carabiner 202 in the upper cover assembly 200 makes the winding wheel rotate and completes the lifting control through the lifting pull rope 204, and makes the guide column 205 and the lifting column 206 mutually movable and embedded to assist the linear lifting of the cover body 201, so that the opening and closing control of the cover body 201 can be facilitated.

[0040] The above only is the preferred embodiment of the utility model, and does not use to limit the utility model, and any modification, equivalent replacement, improvement etc. that is made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A precision temperature control device for a bonded wire plating line, comprising: The utility model provides an electroplating tank (100), it is characterized by: the electroplating tank (100) is equipped with a tank body (101) for bonding wire electroplating, the tank body (101) outside fixedly connected with the outer insulation layer (102) for heat preservation, The tank body (101) is equipped with an upper cover assembly (200) for covering the tank body (101) above, the upper cover assembly (200) is equipped with a cover body (201) for covering the tank body (101) above to assist temperature control, the cover body (201) upper surface fixedly connected with the waste heat cover (207) for absorbing waste heat, The tank body (101) inner side four corners are all fixedly connected with a group of corner supports (103), the corner support (103) upper surface fixedly connected with the optical fiber sensor one (106) for monitoring the temperature of electroplating solution, the tank body (101) inner side is also equipped with a stirring frame (109) for stirring electroplating solution to reduce local temperature difference, the tank body (101) inner side middle position is also fixedly connected with a group of optical fiber sensor two (107) for monitoring the temperature of electroplating solution.

2. A precision temperature control device for electroplating wirebonds as defined in claim 1, wherein: The tank body (101) inner side front and back positions are fixedly connected with support plates (108), the support plate (108) inner side middle position is installed with a stirring motor for driving the stirring frame (109) to rotate.

3. A precision temperature control device for electroplating wirebonds as defined in claim 2, wherein: The stirring motor and the stirring frame (109) are connected through a shaft coupling, the stirring frame (109) inner side adjacent position and the tank body (101) are fixedly connected with a central heating pipe (110).

4. A precision temperature control device for electroplating wirebonds as defined in claim 3, wherein: The central heating pipe (110) inner side adjacent position and the tank body (101) are fixedly connected with a central cooling pipe (111), and the central heating pipe (110) and the central cooling pipe (111) are both provided in a spiral structure.

5. A precision temperature control device for electroplating wirebonds as defined in claim 4, wherein: The corner support (103) inner side is fixedly connected with a corner heating pipe (104) for heating electroplating solution at the corner, and the corner support (103) inner side is also fixedly connected with a corner cooling pipe (105) for cooling electroplating solution at the corner.

6. A precision temperature control apparatus for electroplating wirebonds as defined in claim 1, wherein: The tank body (101) left and right sides are both fixedly connected with heat preservation covers (112) for assisting heat preservation, the waste heat cover (207) upper surface is fixedly connected with a waste heat guide pipe (208) for guiding waste heat, and the outer insulation layer (102) is located at the heat preservation cover (112) position and is in an open structure; The heat preservation cover (112) remote electroplating tank (100) center one end and the waste heat guide pipe (208) lower end are both fixedly connected with a group of connecting flanges (113), the two groups of connecting flanges (113) are mutually adhered and fixedly connected by using bolts, and the tank body (101) inner side is provided with a heat preservation cavity and is in communication with the heat preservation cover (112).

7. A precision temperature control device for electroplating wirebonds as defined in claim 6, wherein: One end of the waste heat guide pipe (208) is a flexible hose (209), the cover body (201) lower surface is fixedly connected with a support column, and the support column lower end is provided with an electroplating wheel (210) for winding bonding wire to assist electroplating.

8. A precision temperature control device for electroplating wirebonds as defined in claim 1, wherein: The left end of the upper surface of the cover body (201) is fixedly connected with a guide column (205) for assisting linear lifting, and a lifting column (206) is arranged above the guide column (205), and the guide column (205) and the lifting column (206) are movably embedded with each other.

9. A precision temperature control device for electroplating wirebonds as defined in claim 7, wherein: The center of the upper surface of the cover body (201) is fixedly connected with a carabiner (202), the carabiner (202) is sleeved with a hook (203) above, the hook (203) is fixedly connected with a lifting pull rope (204) above, and the lifting pull rope (204) is wound to the outer side of the winding wheel.

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